KR102644477B1 - Test apparatus for semiconductor package - Google Patents

Abstract

The test device for a semiconductor package according to the present invention includes an upper test socket mounted on a pusher, mounted on an upper semiconductor package and connected to a lower semiconductor package placed on the lower side, and a lower part mounted on a tester and connected to a lower semiconductor package placed on the upper side. For testing a package-on-package type (POP) semiconductor package, including a test socket and an adsorption pad that is movably coupled to a pusher and can absorb and pressurize the lower semiconductor package by receiving vacuum pressure through the pusher. As a test device for a semiconductor package, the upper test socket is composed of a plurality of conductive parts containing a plurality of conductive particles in an elastic material made of silicon, and an inelastic insulating pad that supports the conductive parts and insulates adjacent conductive parts, and includes a plurality of conductive parts. It has a conductive region portion where the conductive portion is located and an insulating peripheral region portion located around the conductive region portion, and a plurality of insertion holes formed on the lower surface of the peripheral region portion facing the lower semiconductor package protrude from the lower surface of the peripheral region portion. A buffer part is attached.

Description

Test device for semiconductor package {TEST APPARATUS FOR SEMICONDUCTOR PACKAGE}

The present invention relates to testing of semiconductor packages, and more specifically, to a semiconductor package testing device for checking whether a semiconductor package of the package-on-package type (POP), in which a lower semiconductor package and an upper semiconductor package are stacked vertically, operates normally. It's about.

Semiconductor packages are formed by high-density integration of fine electronic circuits, and during the manufacturing process, each electronic circuit goes through a test process to determine whether it is normal. The test process is a process that tests whether the semiconductor package operates normally and selects good and defective products.

To test a semiconductor package, a test device is used to electrically connect a terminal of the semiconductor package to a tester that applies a test signal. Test devices have various structures depending on the type of semiconductor package being tested.

Recently, as the use of semiconductor packages in the form of package-on-package (POP), which minimizes component size and enables fast signal transmission, has increased, demand for test devices to test such semiconductor packages continues to grow.

As shown in FIG. 1, a conventional test apparatus 100 for testing a semiconductor package in the package-on-package form includes a lower test socket 140 and an upper test socket 160 for transmitting electrical signals, and an upper test socket. It includes a pusher (150) that is coupled with. A suction pad 170 is formed on the pusher, which is movably coupled to the pusher and receives vacuum pressure from an external vacuum device through the pusher. The lower test socket 140 is installed on the tester 130 to be electrically connected to the lower semiconductor package 110, and the upper semiconductor package 121 is installed on the upper part of the upper test socket to be electrically connected to the upper test socket 160. It is mounted on the guide sheet 164.

In this test device, the suction pad 170 installed on the pusher 150 is lowered to pick the lower semiconductor package 110 to be inspected and placed on the lower test socket 140. By further lowering and pushing the lower semiconductor package 110, the second conductive portion 161 of the upper test socket 160 and the upper terminal 112 of the lower semiconductor package 110 are connected, thereby connecting the tester 130. ), the lower test socket 140, the lower semiconductor package 110, the upper test socket 160, and the upper semiconductor package 121 are electrically connected to conduct an electrical test.

In a typical conventional semiconductor package test device, a picker picks the semiconductor package to be inspected and places it on the test socket, then the picker moves to pick up another semiconductor package, and a pusher Electrical tests are being conducted by pushing the semiconductor package located on the test socket. That is, in a typical conventional semiconductor package test device, the picker and pusher operate separately, and the picker only performs a pick and place role, so the picker only adsorbs the semiconductor package for a short period of time.

On the other hand, in a test device that tests semiconductor packages in the package-on-package form, the picker and pusher are integrated, and the picker's suction pad picks the lower semiconductor package to be inspected, loads (places), and pressurizes it. Since it also performs a pushing role at the same time, the picker's suction pad has a structure that is in contact with the lower semiconductor package for a long period of time. Especially in the case of reliability testing, the suction pad remains in contact with the lower semiconductor package for a period of 1 to 2 weeks. It is currently being done.

In a test device that tests a semiconductor package in the package-on-package form, the suction pad 170 is made of silicon to protect the semiconductor package and increase vacuum suction performance, and the second conductive portion 161 of the upper test socket 160 is In order to prevent damage to the semiconductor package terminal through a smooth connection with the semiconductor package, it is formed in a form that contains a large number of conductive particles within an elastic material made of silicon. When compressed for a long time, the lower semiconductor package becomes an adsorption pad due to the characteristics of silicon. Alternatively, the so-called sticky phenomenon occurs where the product sticks to the upper test socket.

Figure 2 exemplarily shows silicone oil (O) being eluted from the suction pad and the second conductive portion of the upper test socket. As shown in (a) of FIG. 2, silicone oil (O) is eluted from the body portion 171 of the suction pad 170 made of silicon and forms the side surfaces of the body portion 171 and the vacuum hole 173. Silicone oil flows down and accumulates between the adsorption portion 172 of the adsorption pad 170 and the lower semiconductor package 110, and as shown in (b) of FIG. 2, the upper test socket 160 2 Silicone oil (O) is slightly eluted from the conductive portion 161 and accumulated between the second conductive portion 161 of the upper test socket 160 and the lower semiconductor package 110, and the suction pad or upper The lower semiconductor package sticks to the test socket, making it difficult to place the inspected lower semiconductor package in the loading device after testing.

In addition, in a test device for testing a semiconductor package in the package-on-package form, the suction pad 170 coupled to the central portion of the upper test socket 160 adsorbs and compresses the lower semiconductor package 110 with vacuum pressure to the upper test socket 160. Since the second conductive portion 161 of the structure is connected to the upper terminal 112 of the lower semiconductor package, the load is concentrated on the central portion where the suction pad 170 is located in the upper test socket 160, and the suction pad ( There was a problem in that the portion of the second conductive portion 161 located close to 170) was easily damaged due to a high load, thereby deteriorating the overall durability of the upper test socket.

Public Patent Publication No. 2015-0106848 (2015. 9. 22.) Registered Patent Publication No. 10-1555965 (2015. 9. 25.)

The present invention was conceived in consideration of the above-described points, and its purpose is to provide a semiconductor package test device that can precisely test a semiconductor package in the form of a package-on-package that operates at high speed.

Another object of the present invention is to provide a test device for a semiconductor package that can prevent the sticky phenomenon in which the semiconductor package sticks to the upper test socket and the suction pad.

Another object of the present invention is to provide a semiconductor package test device that improves the durability of the upper test socket by distributing the load transmitted to the upper test socket.

The test device for a semiconductor package according to the present invention for solving the above-described object is mounted on a pusher, has an upper test socket mounted on the upper semiconductor package and connects to the lower semiconductor package placed on the lower side, and is mounted on the tester and connects the upper semiconductor package to the upper semiconductor package. A package comprising a lower test socket connected to the lower semiconductor package placed on the lower semiconductor package, and a suction pad movably coupled to the pusher and capable of adsorbing and pressing the lower semiconductor package by receiving vacuum pressure through the pusher. In a semiconductor package test device for testing an on-package type (POP) semiconductor package, the upper test socket includes a plurality of conductive parts containing a plurality of conductive particles in an elastic material made of silicon, and the conductive part. It is made of an inelastic insulating pad that supports and insulates adjacent conductive parts, has a conductive area part where the plurality of conductive parts are located, and an insulating peripheral area part located around the conductive area part, and faces the lower semiconductor package. A buffer part that protrudes from the lower surface of the peripheral area may be attached to a plurality of insertion holes formed on the lower surface of the peripheral area.

The buffer unit may be composed of a buffer body made of silicon attached to the insertion hole, a contact pad having an outer diameter larger than that of the buffer body, the buffer body attached to the upper surface, and a contact pad made of a material harder than the buffer body. .

The contact pad may be made of any one of polyimide film, engineering plastic, or synthetic resin.

The buffer portion may have a width smaller than the width of the insertion hole and may protrude further downward than the conductive portion.

Additionally, the conductive area portion may have a square shape, and the buffer portion may be disposed close to each corner of the conductive area portion.

The buffer portion may be formed in a shape that surrounds the edge.

Additionally, an oil leak prevention portion may be formed around the outer upper surface of the contact pad.

The oil leak prevention unit may have a fence shape.

The oil leak prevention portion may have a concave groove shape formed by etching a portion of the contact pad.

In the package-on-package (POP) type semiconductor package test device for testing the upper semiconductor package and the lower semiconductor package of the present invention, in addition to blocking the sticky phenomenon in which the lower semiconductor package sticks by the buffer portion formed in the upper test socket, By adding a means to prevent the sticky phenomenon to the suction pad, the sticky phenomenon where the inspected lower semiconductor package sticks to the upper test socket or suction pad can be almost completely prevented.

In addition, in the semiconductor package testing device according to an embodiment of the present invention, even when testing a semiconductor package in the package-on-package form, the semiconductor package does not stick to the upper test socket or suction pad, so the semiconductor package that has been inspected is loaded after the test. It can be easily placed on the device, allowing the entire testing process to proceed efficiently.

In addition, in the test device for testing a semiconductor package in the package-on-package form according to an embodiment of the present invention, the buffer unit is symmetrically placed on the outer lower surface of the upper test socket, so that the load concentrated in the center of the upper test socket is transferred to the upper test socket. By having the effect uniformly distributed throughout the socket, some conductive parts of the upper test socket where the load is concentrated are prevented from being easily broken or damaged, thereby improving the overall durability of the upper test socket.

Figure 1 schematically shows a test device for a conventional package-on-package type semiconductor package.
FIG. 2 is a diagram showing that silicon is eluted from the conductive portion of the suction pad and the upper test socket in a test device for a semiconductor package in the package-on-package type, resulting in a sticky phenomenon.
Figure 3 schematically shows a test device for a semiconductor package in the package-on-package form of the present invention.
Figure 4 shows an upper test socket with a buffer unit according to an embodiment of the present invention.
Figure 5 is for explaining the operation of a test device for a semiconductor package in the package-on-package type of the present invention.
Figure 6 shows various modifications of the buffer unit according to an embodiment of the present invention.
Figure 7 shows various modifications of the suction pad according to an embodiment of the present invention.

Hereinafter, a test device for a semiconductor package according to the present invention will be described in detail with reference to the drawings.

Figure 3 schematically shows a test device for a semiconductor package in the package-on-package form of the present invention, Figure 4 shows an upper test socket with a buffer portion according to an embodiment of the present invention, and Figure 5 shows a package of the present invention. It is intended to explain the operation of a test device for a semiconductor package in the form of an on-package, Figure 6 shows various modifications of the buffer unit according to an embodiment of the present invention, and Figure 7 shows a suction pad according to an embodiment of the present invention. It shows various modified examples of .

As shown in FIG. 3, the test device 200 for a semiconductor package in the package-on-package form of the present invention is a package-on-package test device that inspects the lower semiconductor package 10 using the upper semiconductor package 20 that has been previously selected as a good product. It is used to test a semiconductor package of the POP type, and can electrically communicate between the tester 30 that generates a test signal and the semiconductor package of the package-on-package type (POP).

The semiconductor package test device 200 includes a lower test socket 40 mounted on the tester 30, a socket housing 111 and guide housing 120 on which the lower test socket 40 is mounted, and an upper test socket ( 60) is mounted and can absorb the pusher 50, which can move by receiving a moving force from the driving unit (not shown), the upper test socket 60 coupled to the pusher 50, and the lower semiconductor package 10. It includes a suction pad 70 that is movably coupled to the pusher 50.

The lower test socket 40 is mounted on the tester 30 and electrically connects the tester 30 and the lower semiconductor package 10 located above. The lower test socket 40 is disposed within the socket housing 111 and includes a first conductive portion 41 and an insulating portion 42.

The first conductive portion 41 may be in the form of conductive particles aligned within an elastic insulating material made of silicon, or may be in the form of a pogo pin with a built-in spring.

The pusher 50 may receive a moving force from the driving unit to move closer to the lower test socket 40 or move away from the lower test socket 40. The pusher 50 is provided with a chamber 52 for accommodating the upper semiconductor package 20 inside and a vacuum passage 51 for transmitting vacuum pressure, and the vacuum passage 51 is provided with an external vacuum pressure generator ( (not shown) can transmit the vacuum pressure generated by the vacuum pressure generator to the adsorption pad 70.

Vacuum pressure or release pressure is transmitted to the suction pad 70 through the vacuum passage 51, chamber 52, and insulating pad hole 63 by the operation of the vacuum pressure generator. The suction pad 70 descends while maintaining a vacuum state to adsorb the lower semiconductor package 10 to be inspected, and further descends to pressurize the lower semiconductor package 10 or release the vacuum to absorb the lower semiconductor package 10 for which the inspection has been completed. ) can be placed in a loading device (not shown).

The upper test socket 60 is coupled to one side of the pusher 50 to seal the chamber 52. The upper test socket 60 is equipped with an upper semiconductor package 20 placed in the chamber 52 (the upper semiconductor package may be a pre-selected good quality package), and, during testing, a lower semiconductor package 10 placed on the lower side. is electrically connected to The upper test socket 60 includes an insulating pad 62 covering the chamber 52, a plurality of second conductive portions 61 supported and insulated by the insulating pad 62, and the upper surface of the insulating pad 62. A guide sheet 64 that guides the upper semiconductor package terminal 21 may be installed.

The insulating pad 62 may be made of a non-elastic insulating material. The insulating pad 62 made of a non-elastic insulating material is advantageous for pressing the lower semiconductor package 10 toward the lower test socket 40 when the upper test socket 60 is connected to the lower semiconductor package 10. When the insulating pad 62 of the inelastic insulating material stably presses the lower semiconductor package 10, the lower terminal 11 of the lower semiconductor package 10 is stably connected to the first conductive portion 41 of the lower test socket 40. can be connected. Polyimide, engineering plastic, or various other non-elastic insulating materials may be used as such inelastic insulating materials.

The insulating pad 62 is provided with an insulating pad hole 63. The insulating pad hole 63 is connected to the vacuum passage 51 of the chamber 52 so that the vacuum pressure of the chamber 52 can be transmitted.

The second conductive portion 61 is formed to penetrate the insulating pad 62 in the thickness direction and is supported by the inelastic insulating pad 62. The second conductive portion 61 is made of a plurality of conductive particles contained in an elastic insulating material made of silicon, and may be formed to protrude from the lower surface of the insulating pad 62. If the second conductive portion 61 is formed to protrude from the lower surface of the insulating pad, there is an advantage in that it can be more stably connected to the upper terminal 12 of the lower semiconductor package.

A plurality of buffer units 80 are provided on the lower surface of the insulating pad 62 of the upper test socket 60. Figure 4 shows an upper test socket with a buffer unit 80 according to an embodiment of the present invention. Figure 4 (a) is a cross-sectional view and Figure 4 (b) is a bottom view.

As shown in FIG. 4, in the test device for a semiconductor package in the package-on-package type of the present invention, the lower surface of the insulating pad 62 of the upper test socket 60 (i.e., the portion facing the upper surface of the lower semiconductor package 10) ) A plurality of buffer units 80 are formed on the outside of the .

As shown in (b) of FIG. 4, the upper test socket 60 has a conductive region portion A of approximately square shape where the plurality of second conductive portions 61 are located and a conductive region portion A surrounding the conductive region portion A. It can be divided into an insulating peripheral area portion (B) located around the conductive area portion. Here, the peripheral area portion (B) is a portion of the insulating pad 62 where the second conductive portion 61 is not disposed. A plurality of insertion holes 65 are formed on the lower surface of the peripheral area portion B at a position close to the conductive area portion A, and these insertion holes 65 are provided on the lower surface of the peripheral area portion B (i.e., insulated). The buffer portions 80 are each disposed in a manner that protrudes from the lower surface of the pad and protrudes from the lower surface of the second conductive portion 61.

The buffer unit 80 according to an embodiment of the present invention is disposed close to the four corners of the conductive area portion A and may be formed in a shape that surrounds the corners. The buffer unit 80 may be placed close to each corner of the square-shaped conductive area portion A so that four buffer units are formed in the upper test socket 60, or may be placed close to the corners facing each other. It is also possible to form two buffer units. In this way, the buffer unit 80 is preferably disposed in areas symmetrical to each other with respect to the suction pad 70 so that the load applied to the upper test socket 60 can be uniformly distributed, and the upper test socket 60 It is more desirable to provide a buffer portion 80 at each corner of the conductive area portion ( ) so that a more uniform load is applied to the conductive area portion ( ).

Therefore, in a test device for testing a semiconductor package in the package-on-package form according to an embodiment of the present invention, a plurality of buffer units 80 are placed on the outer lower surface of the upper test socket, so that the central portion of the upper test socket 60 is used during testing. By sharing the load concentrated in the plurality of buffer units 80 to distribute the load, the load is concentrated only in a part of the upper test socket 60, so that the second conductive part 61 disposed in the concentrated portion can easily be damaged. This has the advantage of improving the overall durability of the upper test socket by preventing breakage or damage.

As shown in (a) of FIG. 4, the buffer unit 80 has a buffer body 81 made of silicon attached to the insertion hole 65, an outer diameter larger than the buffer body, and the buffer body is attached to the upper surface. It consists of a contact pad (82). The contact pad 82 is made of an anti-adhesion material such as polyimide film, engineering plastic, or synthetic resin, which is a harder material than the buffer body 81, so that the lower semiconductor package 10 remains intact even if it is in contact with the lower semiconductor package 10 for a long time. It prevents it from sticking to the buffer unit 80.

The width w2 of the buffer portion is smaller than the width w1 of the insertion hole 65, and the buffer portion 80 is formed to protrude further than the lower surface of the second conductive portion 61 by “d”. Here, “d” may be greater than 0 and less than 1 mm. By configuring the buffer unit 80 in this way, when the upper test socket 60 is pressurized, the buffer body 81 made of silicon can be sufficiently compressed in the space within the insertion hole 65.

Figure 5 is for explaining the operation of a test device for a semiconductor package in the package-on-package form.

As shown in (a) of FIG. 5, the pusher 50 is moved by the driving unit and the suction pad 70 is lowered to adsorb the lower semiconductor package 10, and then the suction pad 70 absorbs the lower semiconductor package. (10) is carried over the lower test socket 40 so that the lower terminal 11 of the lower semiconductor package 10 is placed in contact with the first conductive portion 41 of the lower test socket 40.

Thereafter, as shown in (b) of FIG. 5, when the pusher 50 moves toward the lower test socket 40, the suction pad 70 further descends to press the lower semiconductor package 10, thereby causing the lower semiconductor package ( The lower terminal 11 of 10 is connected to the first conductive portion 41 of the lower test socket 40, and the second conductive portion 61 of the upper test socket 60 is compressed to form the lower semiconductor package 10. ) is connected to the upper terminal 12.

At this time, the buffer portion 80, which is formed to protrude further than the second conductive portion 61, is also compressed, and the buffer body 81 is compressed in the space within the insertion hole 65, and the lower surface of the contact pad 82 is exposed to the lower semiconductor package. It is in close contact with the upper surface of (10). The width w1 of the insertion hole 65 where the buffer unit 80 is disposed is larger than the width w2 of the contact pad 82, and the buffer body 81 is smaller than the outer diameter of the contact pad 82, so the buffer The body 81 can be sufficiently compressed within the space within the insertion hole 65. In addition, since the width (w2) of the contact pad is smaller than the width (w1) of the insertion hole, the buffer unit 80 can be compressed according to the degree to which the second conductive part 61 is compressed, and the buffer body 81 is compressed. The contact pad 82 does not interfere with this.

In this way, the vacuum pressure of the suction pad 70 is transmitted to the lower semiconductor package 10 through the upper test socket 60, thereby connecting the tester 30, the lower test socket 40, and the lower semiconductor package 10. , the upper test socket 60 and the upper semiconductor package 20 are electrically connected. In this state, the test signal generated from the tester 30 is transmitted to the lower semiconductor package 10 and the upper semiconductor package 20 to determine whether the lower semiconductor package 10 is operating normally and whether the upper semiconductor package An electrical test can be performed to determine whether it is properly matched to (20).

After the test is completed, the suction pad 70 of the vacuum picker rises, and the lower semiconductor package 10 adsorbed on the suction pad 70 is released from the upper test socket 60 as the vacuum pressure provided to the suction pad 70 is released. ) is loaded into the loading device.

However, in a package-on-package (POP) type semiconductor package test device that tests the upper semiconductor package and the lower semiconductor package, the suction pad 70 plays the role of adsorbing (picking) and loading (place) the lower semiconductor package. It has a structure that serves to push the lower semiconductor package to the lower test socket and is in contact with the lower semiconductor package for a long time. Since the upper test socket 60 is also in contact with the lower semiconductor package for a long time, the suction pad made of silicon is used. The lower semiconductor package sticks to the suction pad 70 and the upper test socket 60 due to the silicone oil eluted from the second conductive portion 61 formed by containing a plurality of conductive particles in an elastic material made of silicon. Due to the sticking phenomenon, the inspected lower semiconductor package may not be properly seated on the loading device. However, in the present invention, the buffer portion 80 is disposed so that the lower semiconductor package can be easily separated by the expansion force of the buffer portion 80. We are solving the above problem.

That is, when the vacuum pressure provided to the suction pad 70 is released, the buffer portion 80 disposed in the upper test socket expands again, and the contact pad 82 of the buffer portion 80 is made of polyimide film, which is an anti-adhesion material. Since it is made of engineering plastic or synthetic resin, the repulsive force resulting from the expansion of the buffer unit 80 acts on the lower semiconductor package 10, separating the lower semiconductor package 10 from the upper test socket 60 and the suction pad 70. By pushing out, the lower semiconductor package 10 can be stably seated on the loading device.

Therefore, in the semiconductor package testing device according to an embodiment of the present invention, even when testing a semiconductor package in the package-on-package form, the lower semiconductor package does not stick to the suction pad or the upper test socket, so that the lower semiconductor package that has been inspected after the test is tested. It has the advantage of being able to be easily placed in a loading device, allowing the entire testing process to proceed efficiently.

Figure 6 shows various modifications of the buffer unit according to an embodiment of the present invention.

The buffer unit 80 according to an embodiment of the present invention must be compressed during testing and expanded when seated on a loading device, so it must have a buffer body 81 made of silicone. As shown in (b) of FIG. 6 during compression for the longest time, silicone oil may be eluted from the buffer body 81, so the lower semiconductor package ( 10) There is a risk that sticking may occur.

Therefore, the buffer unit 80 according to an embodiment of the present invention forms a contact pad 82 having a larger outer diameter than the buffer body 81, as shown in (a) of FIG. By ensuring that the eluted silicone oil is located on the wide upper surface of the contact pad, the silicone oil can be prevented from flowing to the lower surface of the contact pad 82.

In addition, an oil leak prevention portion 83 that traps silicone oil eluted from the buffer body 81 may be additionally formed around the outer upper surface of the contact pad 82.

The oil leak prevention portion 83 may be formed in the shape of a fence. The shape of the fence may be square or triangular in cross section, as shown in Figures 6 (c) and (d), or may have various other cross sectional shapes. The oil leak prevention unit 83 may be made of any one of silicone, polyimide film, engineering plastic, or synthetic resin. Since the oil leak prevention portion 83 is not a part that is pressed by vacuum pressure or the like, silicone oil does not elute, so silicone can be used as a material for the oil leak prevention portion 83.

Additionally, the oil leak prevention portion 83 may be formed in a concave groove shape formed by etching a portion of the contact pad 82. The concave groove shape may have a square cross-section as shown in (e) of FIG. 6, but may have various cross-sectional shapes such as a triangle. The concave groove shape can be formed by etching with a laser or cutting tool.

Therefore, by adding the oil leak prevention part 83 to the buffer part 80, even if the amount of silicone oil eluted from the buffer body 81 increases, the silicone oil is confined by the oil leak prevention part 83, so the silicone oil By moving to the lower surface of the contact pad 82, the phenomenon of the lower semiconductor package 10 sticking to the buffer unit 80 is fundamentally prevented.

Additionally, an oil prevention portion that prevents oil from leaking may be installed on the suction pad 70. Figure 7 shows various modifications of the suction pad according to an embodiment of the present invention.

As shown in the drawing, the suction pad 70 according to an embodiment of the present invention has a vacuum hole 711, a body portion 710 made of silicon material, and a diameter larger than the body portion 710, It may be configured to include an adsorption hole 721 at a position corresponding to the vacuum hole 711 and an adsorption unit 720 made of any one of polyimide film, engineering plastic, or synthetic resin.

The body portion 710 forms the body of the suction pad 70, and has a vacuum hole 711 formed through it in the center. The vacuum pressure or release pressure provided by the operation of the vacuum pressure generator is transmitted to the vacuum hole 711 through the vacuum passage 51 of the pusher, the chamber 52, and the insulating pad hole 63. This body portion 710 is made of silicone material to increase vacuum adsorption performance.

The body portion 710 of the suction pad 70 is made of a silicon material. When the semiconductor package is adsorbed and pressed, vacuum pressure is transmitted to the body portion 710 of the suction pad 70 and is in a compressed state. In this compressed state, due to the nature of the silicone material, the silicone oil has no choice but to elute.

To solve this problem, in the test device according to an embodiment of the present invention, oil prevention portions 730 and 731 are installed on the suction pad 70 to trap oil eluted from the silicone material.

A body portion 710 is attached to the center of the upper surface of the suction portion 720 of the suction pad 70, and an outer oil prevention portion 730 is provided around the outer circumference to trap the silicone oil eluted from the body portion 710. , the suction hole 721 is formed to have a smaller diameter than the vacuum hole 711, and a portion of the upper surface of the suction part 720 is left at the interface between the vacuum hole 711 and the suction hole 721, An inner oil prevention portion 731 surrounding the suction hole can be provided at the same time around the inner circumference of the upper surface of the remaining suction portion. Of course, instead of forming the outer oil prevention part 730 and the inner oil prevention part 731 at the same time, it is also possible to provide only the outer oil prevention part or the inner oil prevention part.

The outer oil prevention portion 730 and the inner oil prevention portion 731 may be formed in the shape of a fence, and the fence shape may have a triangular or square cross section as shown in (a) and (b) of Figures 7, and various other shapes. It may be formed in the shape of a fence with a cross-sectional shape. Additionally, the outer oil prevention portion 730 and the inner oil prevention portion 731 may be formed in a concave groove shape formed by etching a portion of the adsorption portion 720. The concave groove shape may have a square cross-section as shown in (c) of FIG. 7, or may have various other cross-sectional shapes. The concave groove shape can be formed by etching with a laser or cutting tool.

Therefore, by additionally forming an oil prevention portion in the suction pad 70, even if the amount of silicone oil eluted from the body portion 710 of the suction pad 70 increases, the outer and inner circumferences of the suction portion 720 Since the outer oil prevention part 730 and the inner oil prevention part 731 that can trap silicone oil are formed, the silicone oil moves to the bottom of the adsorption part 720, causing the semiconductor package to stick to the adsorption pad 70. can be solved.

As such, in the package-on-package (POP) type semiconductor package test device for testing the upper semiconductor package and the lower semiconductor package of the present invention, the sticky phenomenon in which the lower semiconductor package sticks is blocked by the buffer portion formed in the upper test socket. In addition, by adding a means to prevent the sticky phenomenon to the suction pad, the sticky phenomenon in which the lower semiconductor package that has been inspected sticks to the upper test socket or the suction pad is almost completely prevented.

In addition, in the semiconductor package testing device according to an embodiment of the present invention, even when testing a semiconductor package in the package-on-package form, the semiconductor package does not stick to the upper test socket or suction pad, so the semiconductor package that has been inspected is loaded after the test. It can be easily placed in the device, which has the effect of efficiently carrying out the entire testing process.

In addition, in the test device for testing a semiconductor package in the package-on-package form according to an embodiment of the present invention, the buffer unit is symmetrically placed on the outer lower surface of the upper test socket, so that the load concentrated in the center of the upper test socket is transferred to the upper test socket. By having the effect uniformly distributed throughout the socket, some conductive parts of the upper test socket where the load is concentrated are prevented from being easily broken or damaged, thereby improving the overall durability of the upper test socket.

Although the present invention has been shown and described in connection with preferred embodiments for illustrating the principles of the invention, the invention is not limited to the construction and operation as shown and described. Rather, those skilled in the art will understand that numerous changes and modifications can be made to the present invention without departing from the spirit and scope of the appended claims.

10, 110: lower semiconductor package 11: lower terminal
12, 112: upper terminal 20, 121: upper semiconductor package
21: upper semiconductor package terminal 30, 130: tester
40, 140: lower test socket 41: first conductive part
50, 150: Pusher 51: Vacuum passage
52: chamber 60, 160: upper test socket
61, 161: second conductive portion 62: insulating pad
63: Insulating pad hole 64, 164: Guide sheet
65: Insertion hole 70, 170: Suction pad
80: buffer part 81: buffer body
82: contact pad 83: oil leak prevention unit
100, 200: Test device for semiconductor package
710: Body 711: Vacuum hole
720: Suction part 721: Suction hole
730: outer oil prevention part 731: inner oil prevention part

Claims (9)

An upper test socket mounted on a pusher, mounted on an upper semiconductor package and connected to a lower semiconductor package placed on the lower side, a lower test socket mounted on a tester and connected to the lower semiconductor package placed on the upper side, and movable on the pusher In a semiconductor package test device for testing a package-on-package type (POP) semiconductor package, including a suction pad that is coupled and capable of adsorbing and pressurizing the lower semiconductor package by receiving vacuum pressure through the pusher. ,
The upper test socket is,
It consists of a plurality of conductive parts containing a large number of conductive particles in an elastic material made of silicon, and an insulating pad made of a non-elastic insulating material that supports the conductive parts and insulates adjacent conductive parts,
It has a conductive region portion where the plurality of conductive portions are located, and a peripheral region portion which is an insulating pad portion located around the conductive region portion in a form surrounding the outside of the conductive region portion,
A plurality of insertion holes are formed in the peripheral area of the lower surface of the upper test socket facing the upper surface of the lower semiconductor package, the plurality of insertion holes have a width smaller than the width of the insertion hole, and the plurality of insertion holes have a width lower than the conductive part. Each buffer part is attached to a shape that protrudes further,
A test device characterized in that the buffer unit has a buffer body made of silicon. According to paragraph 1,
The buffer unit is a buffer body attached to the insertion hole, has an outer diameter larger than the buffer body, the buffer body is attached to the upper surface, and is composed of a contact pad made of a material harder than the buffer body. Device. According to paragraph 2,
A test device wherein the contact pad is made of any one of polyimide film, engineering plastic, or synthetic resin. delete According to paragraph 1,
The test device is characterized in that the conductive area portion has a rectangular shape, and the buffer portion is disposed close to each corner of the conductive area portion. According to clause 5,
A test device characterized in that the buffer portion is formed in a shape that surrounds the edge. According to paragraph 2,
A test device for a semiconductor package, characterized in that an oil leak prevention part is formed around the outer upper surface of the contact pad. In clause 7,
A test device for a semiconductor package, wherein the oil leak prevention portion has a fence shape. In clause 7,
A test device for a semiconductor package, wherein the oil leak prevention portion has a concave groove shape formed by etching a portion of the contact pad.

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