KR102035824B1 - Antenna apparatus and antenna module - Google Patents

Abstract

An antenna device according to an embodiment of the present invention, a ground layer, a wiring layer spaced above or below the ground layer, a plurality of feed lines electrically connected to corresponding wiring of the wiring layer, and transmitting or transmitting an RF signal A dipole antenna pattern configured to receive, a plurality of feed vias arranged to electrically connect each pole of the dipole antenna pattern and the plurality of feed lines, respectively, and to electrically connect each pole and the ground layer of the dipole antenna pattern. It may include a ground pattern.

Description

Antenna apparatus and antenna module

The present invention relates to an antenna device and an antenna module.

Data traffic of mobile communication is increasing rapidly every year. Active technology development is under way to support such breakthrough data in real time in wireless networks. For example, the content of Internet-based data (IoT) -based data, Augmented Reality (AR), Virtual Reality (VR), Live VR / AR combined with SNS, Autonomous driving, Sync View, Micro-camera Applications such as real-time video transmission require communication (eg, 5G communication, mmWave communication, etc.) to support large data exchange.

Therefore, recently, millimeter wave (mmWave) communication including 5G (5G) communication has been actively studied, and research for commercialization / standardization of an antenna module for smoothly implementing it has been actively conducted.

RF signals in high frequency bands (e.g., 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lost in the way they are delivered, so the quality of communication can drop dramatically. Therefore, the antenna for high frequency communication requires a different technical approach from the conventional antenna technology, and it is necessary to separate the antenna gain (Gain), the integration of the antenna and the RFIC, and the effective isotropic radiated power (EIRP). It may require development of special technologies such as power amplifiers.

Traditionally, antenna modules that provide millimeter-wave communication environments have coaxial cables by placing ICs and antennas on boards to satisfy high levels of antenna performance (eg transmit / receive, gain, directivity, etc.) at high frequencies. Has been using structure to connect. However, such a structure may cause insufficient antenna placement space, limited antenna type freedom, increased interference between the antenna and the IC, and increased size / cost of the antenna module.

Patent Publication 10-1195047

The present invention provides an antenna device and an antenna module that can have a structure that is advantageous for improving or miniaturizing antenna performance.

An antenna device according to an embodiment of the present invention, a ground layer; A wiring layer spaced apart above or below the ground layer; A plurality of feed lines electrically connected to corresponding wires of the wiring layer; A dipole antenna pattern configured to transmit or receive an RF signal; A plurality of feed vias arranged to electrically connect each pole of the dipole antenna pattern and the plurality of feed lines, respectively; And a ground pattern disposed to electrically connect each pole of the dipole antenna pattern and the ground layer. It may include.

An antenna module according to an embodiment of the present invention, a connecting member including a wiring layer and a ground layer; An IC disposed below the connecting member and electrically connected to the connecting member; A plurality of patch antenna patterns disposed above the connection member; A plurality of patch antenna feed vias electrically connecting the corresponding patch antenna pattern and the connection member among the plurality of patch antenna patterns; And a plurality of dipole antenna patterns disposed on side surfaces of the connection member and electrically connected to corresponding wires of the wire layer, respectively, to receive or transmit RF signals. The ground layer may have a form of electrically connecting the plurality of dipole antenna patterns to each other by connecting the poles of each of the plurality of dipole antenna patterns to each other.

Since the antenna device according to an embodiment of the present invention has a structure capable of reducing the influence on other adjacent antenna devices, it is possible to reduce the separation distance from other adjacent antenna devices. Accordingly, the antenna module according to an embodiment of the present invention can reduce the size of the antenna unit to the unit number or increase the number of the antenna unit to the unit size, so that antenna performance (eg transmission / reception rate, gain, bandwidth, It may have a structure that improves the directivity (such as directivity) or is advantageous for miniaturization.

The antenna device according to an embodiment of the present invention may have an improved design freedom because the design limitation due to the influence of another antenna device may be reduced when the antenna device is designed, and the antenna performance may be improved by utilizing the improved design freedom. Can be improved.

The antenna device and the antenna module according to an embodiment of the present invention can reduce the negative coupling of the ground pattern to the dipole antenna pattern while improving the isolation between the plurality of antenna devices according to the ground pattern, thereby further improving antenna performance. The size of the antenna module can be further reduced.

1A and 1B are perspective views illustrating an antenna device according to an embodiment of the present invention.
2A and 2B are side views illustrating an antenna device according to an embodiment of the present invention.
3A is a view illustrating a bottom surface of an antenna device according to an embodiment of the present invention.
3B is a view showing the top of the antenna device according to an embodiment of the present invention.
4A to 4C are plan views illustrating arrangements of respective layers of an antenna device and an antenna module according to an exemplary embodiment of the present invention.
5 is a plan view showing a modified form of the ground pattern of the antenna device and the antenna module according to an embodiment of the present invention.
6A to 6C are diagrams illustrating isolation depending on whether a ground pattern of an antenna device and an antenna module is connected according to an embodiment of the present invention.
7A and 7B are views illustrating a lower structure of a connection member of an antenna module including an antenna device according to an embodiment of the present invention.
8 is a side view showing a schematic structure of an antenna module including an antenna device according to an embodiment of the present invention.
9A and 9B are side views illustrating various structures of an antenna module including an antenna device according to an exemplary embodiment.
10A and 10B are plan views illustrating an arrangement in an electronic device of an antenna module according to an exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled. Like reference numerals in the drawings refer to the same or similar functions throughout the several aspects.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

1A and 1B are perspective views illustrating an antenna device according to an embodiment of the present invention, and FIGS. 2A and 2B are side views illustrating an antenna device according to an embodiment of the present invention. In Figs. 1A to 2B, the z direction represents the upper surface direction.

1A to 2B, the connection member 1200a includes IC ground layers 221a and 221b, ground layers 222a and 222b, second ground layers 223a and 223b, wiring layers 224a and 224b, and a second one. At least some of the three ground layers 225a and 225b may be included, and may further include an insulating layer disposed between the plurality of layers.

The IC ground layers 221a and 221b and the ground layers 222a and 222b may provide the IC and / or passive components with ground used in the circuits and / or passive components of the IC. Thus, IC ground layers 221a and 221b and ground layers 222a and 222b may be electrically connected to the IC and / or passive components. Here, the IC ground layers 221a and 221b may be omitted according to the ground demand of the IC and / or passive components.

The wiring layers 224a and 224b may be spaced apart from each other above or below the ground layers 222a and 222b, and may include a wiring through which a radio frequency (RF) signal flows and a wiring ground pattern surrounding the wiring. The wiring may be electrically connected to the IC through the wiring via. The boundary of the wiring ground pattern may overlap the boundary between the IC ground layers 221a and 221b, the ground layers 222a and 222b, and the second ground layers 223a and 223b in the vertical direction.

The wiring layers 224a and 224b may be disposed between the second ground layers 223a and 223b and the third ground layers 225a and 225b. The second ground layers 223a and 223b may improve the electromagnetic isolation between the wirings of the wiring layers 224a and 224b and the IC, and may provide ground as ICs and / or passive components. The third ground layers 225a and 225b may improve electromagnetic isolation between the wirings of the wiring layers 224a and 224b and the patch antenna pattern, and provide boundary conditions in view of the patch antenna pattern and By reflecting the RF signal transmitted and received by the focusing direction of the patch antenna pattern can be further concentrated.

1A to 2B, an antenna device according to an embodiment of the present disclosure may include a feed line 110a, a feed via 111a, a dipole antenna pattern 120a, a ground pattern 130a, and a ground layer 222a. , 222b and wiring layers 224a and 224b.

The feed line 110a may be electrically connected to the corresponding wiring of the wiring layers 224a and 224b, and thus may serve as a transmission path of the RF signal. The feed line 110a may be viewed as a component included in the wiring layers 224a and 224b according to the viewpoint. Since the dipole antenna pattern 120a may be disposed adjacent to the side of the connecting member 1200a, the feed line 110a extends from the corresponding wiring of the wiring layers 224a and 224b toward the side of the connecting member 1200a. It may have a structure.

The feed line 110a may include first and second feed lines. For example, the first feed line may be configured to transmit an RF signal to the dipole antenna pattern 120a, and the second feed line may be configured to receive an RF signal from the dipole antenna pattern 120a. For example, the first feed line may be configured to receive an RF signal from the dipole antenna pattern 120a or to transmit an RF signal to the dipole antenna pattern 120a, and the second feed line may be a dipole antenna pattern 120a. Can be configured to provide impedance.

For example, the first and second feed lines respectively transmit an RF signal to the dipole antenna pattern 120a and receive the RF signal from the dipole antenna pattern 120a, and phase difference (for example, 180 degrees and 90 degrees) from each other. It can be configured to have a differential feeding (differential feeding) method. The phase difference may be implemented through a phase shifter of the IC or an electrical length difference between the first and second feed lines.

According to the design, the feed line 110a may include a quarter wave converter or a balun to improve the RF signal transmission efficiency, but the quarter wave converter or the balun may be omitted.

The feed via 111a may be arranged to electrically connect the dipole antenna pattern 120a and the feed line 110a. The feed via 111a may be disposed perpendicularly to the dipole antenna pattern 120a and the feed line 110a.

Due to the feed via 111a, the dipole antenna pattern 120a may be disposed at a position higher or lower than the feed line 110a. Since the specific position of the dipole antenna pattern 120a may vary depending on the length of the feed via 111a, the radiation pattern direction of the dipole antenna pattern 120a may be slightly inclined in the vertical direction depending on the length of the feed via 111a. Can be.

Meanwhile, according to design, the feed via 111a may be surrounded by the insulating layer. That is, the insulating layer may be disposed above and / or below at least a portion of the feed line 110a, the dipole antenna pattern 120a, the director pattern 125a, and the ground pattern 130a.

The dipole antenna pattern 120a may be configured to be electrically connected to the feed line 110a to transmit or receive an RF signal. Here, one end of each pole of the dipole antenna pattern 120a may be electrically connected to the first and second lines of the feed line 110a.

The dipole antenna pattern 120a may have a frequency band (eg, 28 GHz, 60 GHz) according to at least one of pole length, pole thickness, gap between poles, gap between side of the pole and the connection member, and dielectric constant of the insulating layer.

The dipole antenna pattern 120a and the ground pattern 130a may be viewed as components included in the ground layers 222a and 222b according to the viewpoint. For example, the ground layers 222a and 222b may be connected to each other of the poles of the dipole antenna pattern 120a to be electrically connected to the dipole antenna patterns of the adjacent antenna devices.

The ground pattern 130a may be arranged to electrically connect the poles of the dipole antenna pattern 120a and the ground layers 222a and 222b. Accordingly, since the dipole antenna pattern 120a may share ground with an adjacent antenna device electrically connected to the ground layers 222a and 222b, electromagnetic isolation of the adjacent antenna device may be improved. This will be described later with reference to FIGS. 6A to 6C.

In addition, the ground pattern 130a may have a structure extending to the ground layers 222a and 222b between the poles of the dipole antenna pattern 120a. Between each pole of the dipole antenna pattern 120a is adjacent to the point where the transmission direction of the RF signal flowing through the feed line 110a and the feed via 111a is bent. The point can act as an electromagnetic coupling source for the director pattern 125a or adjacent antenna devices. Therefore, the isolation degree of the dipole antenna pattern 120a with respect to the adjacent antenna device may be further improved as the point is adjacent to the ground pattern 130a. Therefore, the ground pattern 130a can effectively improve the isolation of the dipole antenna pattern 120a with respect to the adjacent antenna device.

When the isolation degree of the dipole antenna pattern 120a with respect to the adjacent antenna device decreases, the reference separation distance between the dipole antenna pattern 120a and the adjacent antenna device (eg, 0.5 times the RF signal wavelength) may be shorter.

Accordingly, the antenna device according to an embodiment of the present invention can have an improved design degree of freedom because it can reduce design limitations due to the influence of other antenna devices, and use antenna design (eg transmission / reception rate) by utilizing the improved design degree of freedom. , Gain, directivity, etc.). In addition, the antenna device according to an embodiment of the present invention can be more efficiently arranged in the antenna module, it is possible to reduce the size of the antenna device and / or antenna module.

In addition, the ground pattern 130a may have a structure extending to the ground layers 222a and 222b between each pole of the dipole antenna pattern 120a so as to be positioned between the feed lines 110a when viewed in the vertical direction. . Accordingly, the ground pattern 130a may be symmetrical with respect to the feed line 110a.

Since the RF signals flowing through the feed line 110a and the feed via 111a are symmetrically branched from the dipole antenna pattern 120a from side to side, the ground pattern 130a is arranged in the dipole antenna pattern 120a as the symmetry is greater. It can greatly reduce the negative effects that can be caused. Accordingly, the ground pattern 130a may provide ground to the dipole antenna pattern 120a while minimizing the influence on the antenna performance of the dipole antenna pattern 120a. That is, the antenna device according to an embodiment of the present invention may improve antenna performance by improving isolation of adjacent antenna devices without substantially degrading antenna performance.

Meanwhile, referring to FIGS. 1A and 2A, the antenna device and the antenna module according to an embodiment of the present invention are disposed at the same height as the dipole antenna pattern 120a and are spaced apart from the dipole antenna pattern 120a laterally. The director pattern 125a may be further included.

The director pattern 125a may be electromagnetically coupled to the dipole antenna pattern 120a to improve the gain or bandwidth of the dipole antenna pattern 120a. Since the director pattern 125a has a length shorter than the total dipole length of the dipole antenna pattern 120a and can improve the concentration of electromagnetic coupling of the dipole antenna pattern 120a, the gain of the dipole antenna pattern 120a can be improved. Or directivity can be further improved.

Meanwhile, referring to FIGS. 1A and 2A, an antenna device and an antenna module according to an embodiment of the present disclosure may include second and third ground patterns 135a spaced apart from the feed line 110a in a lower side and an upper side. It may further include.

The second ground pattern of the second and third ground patterns 135a may be electrically connected to the second ground layer 223a and may be viewed as a component included in the second ground layer 223a according to a viewpoint. . That is, the second ground layer 223a may have a protruding region protruding toward the dipole antenna pattern 120a when viewed in the vertical direction, and the protruding region may correspond to the second ground pattern.

The third ground pattern of the second and third ground patterns 135a may be electrically connected to the third ground layer 225a, and may be viewed as a component included in the third ground layer 225a according to a viewpoint. . That is, the third ground layer 225a may have a second protruding region protruding toward the dipole antenna pattern 120a when viewed in the vertical direction, and the second protruding region may correspond to the third ground pattern. .

The second and third ground patterns 135a may be electromagnetically coupled to the dipole antenna pattern 120a. The second and third ground patterns 135a may be in the form of the second and third ground patterns 135a (eg, width, length, thickness, and feed). It may affect the frequency characteristics of the dipole antenna pattern (120a) depending on the separation distance to the line, the electrical isolation to the antenna member, etc.).

For example, the second and third ground patterns 135a may provide an extended frequency band (for example, 38 GHz) as the dipole antenna pattern 120a, and the dipole when the extended frequency band is similar to an intrinsic frequency band. The bandwidth or gain of the intrinsic frequency band of the antenna pattern 120a may be improved.

Accordingly, the antenna device and the antenna module according to an embodiment of the present invention can improve the antenna performance of the dipole antenna pattern 120a or enable dual-band transmission and reception of the dipole antenna pattern 120a. have.

A second ground pattern of the second and third ground patterns 135a may be disposed between the feed line 110a and the ground pattern 130a. Accordingly, the second ground pattern may further reduce negative coupling to the feed line 110a or the dipole antenna pattern 120a of the ground pattern 130a.

In addition, the second ground pattern may have a larger area than the ground pattern 130a and overlap at least a portion of the ground pattern 130a and at least a portion of the feed line 110a when viewed in the vertical direction. Accordingly, negative coupling to the feed line 110a or the dipole antenna pattern 120a of the ground pattern 130a may be further reduced.

Meanwhile, referring to FIG. 1A, the IC ground layer 221a, the ground layer 222a, the second ground layer 223a, and the wiring layer 224a may be recessed in a direction opposite to the dipole antenna pattern 120a. . That is, the boundary may be closer to the inner center of the connecting member 1200a.

The boundary from the IC ground layer 221a, the ground layer 222a, the second ground layer 223a, and the wiring layer 224a toward the dipole antenna pattern 120a is a reflector in terms of the dipole antenna pattern 120a. Can work. Therefore, the distance from the boundary to the dipole antenna pattern 120a may affect the antenna performance of the dipole antenna pattern 120a. In order to satisfy the antenna performance required according to the design, the dipole antenna pattern 120a may be formed of an IC ground layer 221a, a ground layer 222a, a second ground layer 223a and a distance such that the distance is longer than a predetermined distance. It may be spaced apart from the wiring layer 224a.

As the boundary between the IC ground layer 221a, the ground layer 222a, the second ground layer 223a, and the wiring layer 224a becomes closer to the inner center of the connecting member 1200a, the dipole antenna pattern 120a becomes an antenna. It may be disposed closer to the inner center of the connecting member 1200a without substantially sacrificing performance. Accordingly, the antenna device according to an embodiment of the present invention can be more efficiently arranged in the antenna module, it is possible to reduce the size of the antenna module.

Referring to FIG. 1A, the third ground layer 225a may cover recessed areas of the IC ground layer 221a, the ground layer 222a, the second ground layer 223a, and the wiring layer 224a in the vertical direction. Can be. Accordingly, the recessed area may form a cavity. The cavity may provide boundary conditions that are advantageous for securing antenna performance of the dipole antenna pattern 120a. In addition, since the third ground layer 225a may block between the antenna device and the patch antenna pattern according to an exemplary embodiment of the present invention, isolation of the patch antenna pattern of the antenna device may be improved.

Referring to FIG. 1A, an antenna device and an antenna module according to an embodiment of the present invention may be formed on at least one of an IC ground layer 221a, a ground layer 222a, a second ground layer 223a, and a wiring layer 224a. The display device may further include a plurality of shielding vias 245a electrically connected to and arranged to surround at least a portion of the recessed area or the cavity when viewed in the vertical direction. Since the plurality of shielding vias 245a are arranged to block at least a portion of the interlayer gap, it is possible to suppress the RF signal from counting into the interlayer gap. Accordingly, the plurality of shielding vias 245a may improve antenna performance of the dipole antenna pattern 120a and may improve isolation between the dipole antenna pattern 120a and the wiring of the wiring layer 224a.

2A and 2B, the director pattern 125a, the second and third ground patterns 135a, the plurality of shielding vias 245a, and the recessed area may be omitted according to design.

3A is a view showing the bottom of the antenna device according to an embodiment of the present invention, Figure 3b is a view showing the top of the antenna device according to an embodiment of the present invention.

3A and 3B, the second and third ground patterns 135a may protrude more toward the dipole antenna pattern 120a than the third ground layer 225a. Accordingly, the negative influence on the dipole antenna pattern 120a of the ground pattern 130a may be further reduced.

In addition, the ground pattern 130a may be disposed not to deviate from the feed line 110a when viewed in the vertical direction, and may be disposed perpendicularly to the dipole antenna pattern 120a. The greater the left and right symmetry, the ground pattern 130a can greatly reduce the negative effects that can be exerted on the dipole antenna pattern 120a, and the dipole antenna pattern 120a can be minimized while minimizing the influence on the antenna performance of the dipole antenna pattern 120a. Can provide ground.

4A to 4C are plan views illustrating arrangements of respective layers of an antenna device and an antenna module according to an exemplary embodiment of the present invention.

4A to 4C, an antenna module according to an embodiment of the present invention may include a plurality of antenna devices corresponding to the antenna devices shown in FIGS. 1A to 3B.

Referring to FIG. 4A, the wiring layer 224b may include a plurality of wirings 224c through which an RF signal flows and a wiring ground pattern 227b surrounding the plurality of wirings 226b, respectively. The plurality of wires 226b may electrically connect one end of the plurality of feed lines 110a and the wire vias 230b. The plurality of feed vias 111a may be electrically connected to the other ends of the plurality of feed lines 110a, respectively.

Referring to FIG. 4B, the second ground layer 223b may be disposed under the wiring layer 224b and include a plurality of shielding vias 245b arranged adjacent to a boundary of the second ground layer 223b. Can be. The plurality of second ground patterns 135b may be connected to the second ground layer 223b and may be disposed under the plurality of feed lines.

Referring to FIG. 4C, the ground layer 222b may be disposed below the second ground layer 223b. The plurality of dipole antenna patterns 120a may be electrically connected to the plurality of feed vias 111a, respectively. Each of the plurality of ground patterns 130a may extend from the center of the dipoles of the plurality of dipole antenna patterns 120a to the ground layer 222b.

Accordingly, the plurality of dipole antenna patterns 120a may share ground, thereby reducing electromagnetic coupling to each other. That is, the plurality of antenna apparatuses may be spaced apart from each other at shorter separation distances than the reference separation distance (for example, 0.5 times the RF signal wavelength) when the plurality of ground patterns 130a are omitted without substantial deterioration of antenna performance. . Therefore, the antenna module according to an embodiment of the present disclosure may increase the number of arranging a plurality of antenna apparatuses relative to the unit size.

5 is a plan view showing a modified form of the ground pattern of the antenna device and the antenna module according to an embodiment of the present invention.

Referring to FIG. 5, the ground layer 222c may have a form in which the plurality of dipole antenna patterns 120b are electrically connected to each other by connecting the poles of each of the plurality of dipole antenna patterns 120b to each other.

In addition, each of the plurality of dipole antenna patterns 120b may have a structure of a folded dipole.

In addition, the plurality of feed lines 110b may have a structure in which a plurality of wirings and a plurality of feed lines of the wiring layer illustrated in FIG. 4A are integrated. Therefore, one end of the plurality of feed lines 110b may be electrically connected to the wiring via 230b. The wiring via 230b may be electrically connected to an IC.

6A to 6C are diagrams illustrating isolation depending on whether a ground pattern of an antenna device and an antenna module is connected according to an embodiment of the present invention.

Referring to FIG. 6A, when the distance between the first antenna device Ant1 and the second antenna device Ant2 is d1, electromagnetic coupling between the first antenna device Ant1 and the second antenna device Ant2. Coupling may be about -5 dB at the resonance frequency, and efficiency (EFF.) May be about 40% at the resonance frequency. Coupling may be defined as an S parameter between the first antenna device Ant1 and the second antenna device Ant2.

Referring to FIG. 6B, when the distance between the first antenna device Ant1 and the second antenna device Ant2 is d2 shorter than d1, the electrons between the first antenna device Ant1 and the second antenna device Ant2 are separated. The miraculous coupling may be about 0 dB at the resonant frequency and the efficiency EFF may be about 37% at the resonant frequency.

Referring to FIG. 6C, when the distance between the first antenna device Ant1 and the second antenna device Ant2 is d2, the electromagnetic coupling between the first antenna device Ant1 and the second antenna device Ant2. Coupling may be -20dB at the resonant frequency, and efficiency (EFF.) May be about 60% at the resonant frequency.

That is, the ground pattern of the antenna device and the antenna module according to an embodiment of the present invention may have an effect similar to that of a band stop filter.

Meanwhile, specific values of the coupling parameter and the efficiency (EFF.) Parameter illustrated in FIGS. 6A to 6C may vary according to design specifications of the antenna device and the antenna module according to an embodiment of the present invention.

7A and 7B are views illustrating a lower structure of a connection member of an antenna module including an antenna device according to an embodiment of the present invention.

Referring to Figure 7a, the antenna module according to an embodiment of the present invention, the connection member 200, the IC 310, the adhesive member 320, the electrical connection structure 330, the sealing material 340, passive components At least some of the 350 and the sub-substrate 410 may be included.

The connection member 200 may have a structure similar to that of the connection member illustrated in FIGS. 1A to 2B.

The IC 310 is the same as the above-described IC, and may be disposed under the connection member 200. The IC 310 may be electrically connected to a wiring layer of the connection member 200 to transmit or receive an RF signal, and may be electrically connected to a ground layer of the connection member 200 to receive ground. For example, the IC 310 may generate a converted signal by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation.

The adhesive member 320 may bond the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 may electrically connect the IC 310 and the connection member 200. For example, the electrical connection structure 330 may be arranged to electrically connect the wiring layer and the ground layer of the connection member 200, and may include solder balls, pins, lands, and pads. It can have a structure like (pad). The electrical connection structure 330 may have a lower melting point than the wiring layer and the ground layer of the connection member 200 to electrically connect the IC 310 and the connection member 200 through a predetermined process using the low melting point.

The encapsulant 340 may seal at least a portion of the IC 310, and may improve heat dissipation performance and impact protection performance of the IC 310. For example, the encapsulant 340 may be implemented with a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like.

The passive component 350 may be disposed on the bottom surface of the connection member 200, and may be electrically connected to the wiring layer and / or the ground layer of the connection member 200 through the electrical connection structure 330.

The sub-substrate 410 may be disposed under the connection member 200, and may receive an intermediate frequency (IF) signal or a base band signal from the outside and transmit the received signal to the IC 310 or from the IC 310. It may be electrically connected to the connection member 200 to receive the IF signal or the baseband signal to transmit to the outside. Here, the frequency (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) of the RF signal is greater than the frequency of the IF signal (eg, 2 GHz, 5 GHz, 10 GHz, etc.).

For example, the sub-substrate 410 may transfer an IF signal or a baseband signal to or from the IC 310 through a wire that may be included in the IC ground layer of the connection member 200. Since the second ground layer of the connection member 200 is disposed between the IC ground layer and the wiring layer, the IF signal or the baseband signal and the RF signal may be electrically isolated in the antenna module.

Referring to FIG. 7B, the antenna module according to the exemplary embodiment may include at least some of the shielding member 360, the connector 420, and the chip antenna 430.

The shielding member 360 may be disposed under the connection member 200 to confine the IC 310 together with the connection member 200. For example, the shielding member 360 may be arranged to cover (eg, conformal shield) the IC 310 and the passive component 350 together or to cover each other (eg, the compartment shield). For example, the shielding member 360 may have a shape of a hexahedron having one surface open, and may have a hexahedral receiving space through coupling with the connection member 200. The shielding member 360 may be made of a high conductivity material such as copper to have a short skin depth, and may be electrically connected to the ground layer of the connection member 200. Accordingly, the shielding member 360 may reduce electromagnetic noise that may be received by the IC 310 and the passive component 350.

The connector 420 may have a connection structure of a cable (eg, a coaxial cable, a flexible PCB), may be electrically connected to the IC ground layer of the connection member 200, and may play a role similar to that of the above-described sub substrate. have. That is, the connector 420 may receive an IF signal, a baseband signal and / or a power from a cable, or provide an IF signal and / or a baseband signal to a cable.

The chip antenna 430 may transmit or receive an RF signal in support of an antenna device according to an exemplary embodiment. For example, the chip antenna 430 may include a dielectric block having a dielectric constant greater than that of the insulating layer, and a plurality of electrodes disposed on both surfaces of the dielectric block. One of the plurality of electrodes may be electrically connected to a corresponding wiring of the wiring layer of the connecting member 200, and the other may be electrically connected to the ground layer of the connecting member 200.

8 is a side view showing a schematic structure of an antenna module including an antenna device according to an embodiment of the present invention.

Referring to FIG. 8, an antenna module according to an embodiment of the present invention may have a structure in which a patch antenna 10a, a dipole antenna 15a, and an IC 20a are integrated, and a patch antenna 10a and a dipole antenna. 15A, the chip antenna 16a, the IC 20a, the passive component 40a, the substrate 50a, and the sub-substrate 60a.

The patch antenna 10a may be disposed adjacent to an upper surface of the substrate 50a and transmit and receive an RF signal in a normal direction of the upper surface of the substrate 50a. The patch antenna 10a may have a structure in which a patch antenna pattern and a patch antenna feed via are combined.

The dipole antenna 15a may correspond to the antenna device according to an embodiment of the present invention, and may be disposed adjacent to the side of the substrate 50a to transmit and receive the RF signal in the lateral direction. Since the antenna module according to the exemplary embodiment has a structure in which the patch antenna 10a and the dipole antenna 15a are integrated, the antenna module may form an omni-directionally radiation pattern.

The chip antenna 16a may correspond to the chip antenna illustrated in FIG. 7B and may be disposed adjacent to the top or bottom surface of the substrate 50a.

The IC 20a may correspond to the IC shown in FIGS. 7A and 7B, and the RF signal received from the patch antenna 10a, the dipole antenna 15a, and / or the chip antenna 16a may be an IF signal or baseband. A signal may be converted into a signal, and the converted IF signal or baseband signal may be transferred to an IF IC, a baseband IC, or a communication modem disposed outside the antenna module. In addition, the IC 20a may convert an IF signal or a baseband signal received from an IF IC, a baseband IC, or a communication modem disposed outside the antenna module into an RF signal, and convert the converted RF signal into an antenna 10a. It may be transmitted to the dipole antenna 15a and / or the chip antenna 16a. Meanwhile, depending on the design, the antenna module may further include an IF IC or a baseband IC disposed on the bottom surface of the substrate 50a.

The passive component 40a may be disposed adjacent to the lower surface of the substrate 50a and may correspond to the passive component illustrated in FIGS. 7A and 7B.

The substrate 50a may include at least one conductive layer 51a and at least one insulating layer 52a, and may include at least one via penetrating the insulating layer to electrically connect the plurality of conductive layers. have. The at least one conductive layer 51a may correspond to the wiring layer and the ground layer illustrated in FIGS. 1A to 2B and may also correspond to the patch antenna pattern.

For example, the substrate 50a may be implemented as a printed circuit board, and may have a structure in which an upper antenna package and a lower connection member are coupled to each other. For example, the antenna package may be designed in terms of transmission and reception efficiency of the RF signal, and the connection member may be designed in terms of wiring efficiency.

For example, a conductive layer relatively close to the top surface of the substrate 50a among the at least one conductive layer 51a may be used as the ground layer of the patch antenna 10a, and may be relatively smaller than the at least one conductive layer 51a. The conductive layer close to the lower surface of the substrate 50a includes a wiring layer through which an RF signal, an IF signal or a baseband signal passes, a ground layer for electromagnetic isolation of the wiring layer, and an IC ground layer providing ground to the IC 20a. Can be used as

The sub substrate 60a may be disposed on the bottom surface of the substrate 50a and may provide a path for an IF signal or a baseband signal. For example, the sub-substrate 60a may be implemented as a supporting member to be mounted on the outside of the antenna module to support the antenna module.

According to the design, the sub-substrate 60a may be replaced by a connector to which a coaxial cable is connected, or by a flexible insulating layer on which a signal transmission line electrically connecting the external set board and the IC 20a is disposed. Can be.

9A and 9B are side views illustrating various structures of an antenna module including an antenna device according to an exemplary embodiment.

Referring to FIG. 9A, an antenna module according to an exemplary embodiment may have a structure in which an antenna package and a connection member are coupled.

The connection member may include at least one wiring layer 1210b, at least one insulating layer 1220b, a wiring via 1230b connected to the at least one wiring layer 1210b, and a connection connected to the wiring via 1230b. The pad 1240b may be included, and may have a structure similar to a copper redistribution layer (RDL). An antenna package may be disposed on an upper surface of the connection member.

The antenna package includes at least one of a plurality of upper coupling members 1110b, a plurality of patch antenna patterns 1115b, a plurality of patch antenna feed vias 1120b, a meta member 1130b, a dielectric layer 1140b, and a finishing member 1150b. It may include a part and may correspond to the patch antenna shown in FIG. 8.

One end of the plurality of patch antenna feed vias 1120b may be electrically connected to the plurality of patch antenna patterns 1115b, respectively, and the other end of the plurality of patch antenna feed vias 1120b may each have at least one wiring layer 1210b of the connection member. May be electrically connected to the corresponding wiring.

The dielectric layer 1140b may be disposed to surround the sides of each of the plurality of feed vias 1120b. The dielectric layer 1140b may have a height longer than that of at least one insulating layer 1220b of the connection member. The antenna package may be advantageous in view of securing antenna performance as the height and / or width of the dielectric layer 1140b is increased, and boundary conditions (eg, small manufacturing tolerances and short electrical currents) that are advantageous for RF signal transmission / reception operations of the plurality of antenna patterns 1115b. Length, smooth surface, large size of dielectric layer, dielectric constant control, etc.).

The encapsulation member 1150b may be disposed on the dielectric layer 1140b and may improve durability against impact or oxidation of the plurality of patch antenna patterns 1115b and / or the plurality of upper coupling members 1110b. Can be. For example, the finishing member 1150b may be implemented as a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like, but is not limited thereto.

The IC 1301b, the PMIC 1302b, and the plurality of passive components 1351b, 1352b, and 1353b may be disposed on the bottom surface of the connection member. The IC 1301b may correspond to the IC shown in FIG. 8.

The PMIC 1302b generates power and may transfer the generated power to the IC 1301b through at least one wiring layer 1210b of the connection member.

The plurality of passive components 1351b, 1352b, and 1353b may provide an impedance to the IC 1301b and / or the PMIC 1302b. For example, the plurality of passive components 1351b, 1352b, and 1353b may include at least some of a capacitor (eg, a multi-layer ceramic capacitor (MLCC)), an inductor, and a chip resistor.

Referring to FIG. 9B, the IC package includes an IC 1300a, an encapsulant 1305a for sealing at least a portion of the IC 1300a, and a support member 1355a disposed so that the first side faces the IC 1300a. And a connection member including at least one wiring layer 1310a and an insulating layer 1280a electrically connected to the IC 1300a and the support member 1355a, and may be coupled to the connection member or the antenna package. .

The connection member may include at least one wiring layer 1210a, at least one insulating layer 1220a, a wiring via 1230a, a connection pad 1240a, and a passivation layer 1250a. The antenna package includes a plurality of upper coupling members 1110a, 1110b, 1110c, and 1110d, a plurality of antenna patterns 1115a, 1115b, 1115c, and 1115d, a plurality of feed vias 1120a, 1120b, 1120c, and 1120d, and a plurality of meta The members 1130a, 1130b, 1130c, and 1130d may include the dielectric layer 1140a and the finishing member 1150a.

The IC package may be coupled to the aforementioned connection member. The RF signal generated by the IC 1300a included in the IC package may be transmitted to the antenna package through at least one wiring layer 1310a and transmitted in the direction of the top surface of the antenna module. It may be transferred to the IC 1300a through the wiring layer 1310a.

The IC package may further include a connection pad 1330a disposed on an upper surface and / or a lower surface of the IC 1300a. The connection pads disposed on the upper surface of the IC 1300a may be electrically connected to at least one wiring layer 1310a, and the connection pads disposed on the lower surface of the IC 1300a may be supported by the lower wiring layer 1320a. Or it may be electrically connected to the core plating member 1365a. Here, the core plating member 1365a may provide a ground region to the IC 1300a.

The support member 1355a penetrates the core dielectric layer 1356a in contact with the connection member, the core wiring layer 1359a disposed on the top and / or bottom surfaces of the core dielectric layer 1356a, and passes through the core dielectric layer 1356a. At least one core via 1360a may be electrically connected to the connection 1359a and electrically connected to the connection pad 1330a. The at least one core via 1360a may be electrically connected to an electrical connection structure 1340a such as a solder ball, a pin, and a land.

Accordingly, the support member 1355a may receive a base signal or power from a lower surface to transfer the base signal and / or power to the IC 1300a through at least one wiring layer 1310a of the connection member.

The IC 1300a may generate an RF signal of a millimeter wave (mmWave) band using the base signal and / or the power source. For example, the IC 1300a may receive a low frequency base signal, perform frequency conversion, amplification, filtering phase control, and power generation of the base signal, and may include a compound semiconductor (eg, GaAs) in consideration of high frequency characteristics. It may be implemented as or may be implemented as a silicon semiconductor.

The IC package may further include a passive component 1350a electrically connected to a corresponding wiring of at least one wiring layer 1310a. The passive component 1350a may be disposed in the accommodation space 1306a provided by the support member 1355a, and may provide impedance to the IC 1300a and / or at least one dipole antenna pattern 1370a.

The IC package may include core plating members 1365a and 1370a disposed on side surfaces of the support member 1355a. The core plating members 1365a and 1370a may provide a ground area to the IC 1300a and may radiate heat from the IC 1300a to the outside or remove noise of the IC 1300a.

On the other hand, the IC package and the connecting member may be independently manufactured and combined, but may also be manufactured together according to the design. That is, a separate combining process between the plurality of packages may be omitted.

Meanwhile, the IC package may be coupled to the connection member through the electrical connection structure 1290a and the passivation layer 1285a, but the electrical connection structure 1290a and the passivation layer 1285a may be omitted according to design. .

10A and 10B are plan views illustrating an arrangement in an electronic device of an antenna module according to an exemplary embodiment of the present disclosure.

Referring to FIG. 10A, an antenna module including an antenna device 100g, a patch antenna pattern 1110g, and a dielectric layer 1140g may be disposed on the side boundary of the electronic device 400g on the set substrate 300g of the electronic device 400g. Can be arranged adjacently.

The electronic device 400g is a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer. ), Monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, etc. It is not limited.

The communication module 310g and the baseband circuit 320g may be further disposed on the set substrate 300g. The communication module 310g may include a memory chip such as a volatile memory (eg, DRAM), a non-volatile memory (eg, ROM), a flash memory, and the like to perform digital signal processing; Application processor chips such as central processors (eg, CPUs), graphics processors (eg, GPUs), digital signal processors, cryptographic processors, microprocessors, microcontrollers; It may include at least a portion of a logic chip, such as an analog-digital converter, an application-specific IC (ASIC).

The baseband circuit 320g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on the analog signal. The base signal input and output from the baseband circuit 320g may be transmitted to the antenna module through a cable.

For example, the base signal may be transmitted to the IC through the electrical connection structure, the core via, and the wiring layer. The IC may convert the base signal into an RF signal of a millimeter wave (mmWave) band.

Referring to FIG. 10B, a plurality of antenna modules each including an antenna device 100h, a patch antenna pattern 1110h, and a dielectric layer 1140h may be formed on the set substrate 300h of the electronic device 400h. The communication module 310h and the baseband circuit 320h may be further disposed on the one side boundary and the other side boundary. The communication module 310h and the baseband circuit 320h may be further disposed on the set substrate 300h.

Meanwhile, the conductive layer, the wiring layer, the ground layer, the feed line, the feed via, the dipole antenna pattern, the patch antenna pattern, the ground pattern, the shield via, the director pattern, and the electrical connection structure disclosed herein may be formed of a metal material (eg, copper ( Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or conductive materials such as alloys thereof). Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), Sputtering, Subtractive, Additive, Semi-Additive Process (SAP), Modified Semi-Additive Process (MSAP) It may be formed according to the plating method such as), but is not limited thereto.

Meanwhile, the dielectric layers and / or insulating layers disclosed herein may be FR4, liquid crystal polymer (LCP), low temperature co-fired ceramic (LTCC), thermosetting resins such as epoxy resins, thermoplastic resins such as polyimide, or these resins. Resin, prepreg, Ajinomoto build-up film (ABF), FR-4, Bisaleimide Triazine (BT), impregnated into core materials such as glass fiber, glass cloth, and glass fabric with inorganic fillers Photo Imagable Dielectric (PID) resin, Copper Clad Laminate (CCL), or glass or ceramic-based insulation may be implemented. The insulating layer may include a conductive layer, a wiring layer, a ground layer, a feed line, a feed via, a dipole antenna pattern, a patch antenna pattern, a ground pattern, a shield via, a director pattern, and an electrical connection structure in the antenna device and the antenna module described herein. It can be filled in at least a portion of the unplaced position.

On the other hand, RF signals disclosed herein are Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA +, HSDPA +, HSUPA +, EDGE, It may have a format in accordance with, but not limited to, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols designated.

Although the present invention has been described by specific embodiments such as specific components and the like, but the embodiments and the drawings are provided to assist in a more general understanding of the present invention, the present invention is not limited to the above embodiments. For those skilled in the art, various modifications and variations can be made from these descriptions.

110: feeding line
111: feeding via
120: dipole antenna pattern
125: director pattern
130: ground pattern
135: second and third ground patterns
200, 1200: connection member
221: IC ground layer
222: ground layer
223: second ground layer
224: wiring layer
225: third ground layer
230: wiring via
245: shielding via
310: integrated circuit (IC)
320: adhesive member
330: electrical connection structure
340: encapsulant
350: passive component
360: shielding member
410: sub substrate
420: connector
1115: patch antenna pattern
1120: patch antenna feed via

Claims (16)

Ground layer;
A wiring layer spaced apart above or below the ground layer;
A plurality of feed lines electrically connected to corresponding wires of the wiring layer;
A dipole antenna pattern configured to transmit or receive an RF signal;
A plurality of feed vias arranged to electrically connect each pole of the dipole antenna pattern and the plurality of feed lines, respectively; And
A ground pattern disposed to electrically connect each pole of the dipole antenna pattern and the ground layer; Antenna device comprising a.
The method of claim 1,
And the ground pattern extends from each pole of the dipole antenna pattern to the ground layer so as to be positioned between the plurality of feed lines when viewed in the vertical direction.
The method of claim 2,
The plurality of feed vias extend in the vertical direction,
The dipole antenna pattern extends in a first direction perpendicular to the vertical direction,
And the plurality of feed lines and the ground pattern extend in a vertical direction and in a second direction perpendicular to the first direction.
The method of claim 3,
And a director pattern disposed at the same height as the dipole antenna pattern and disposed such that the dipole antenna pattern is spaced apart in the second direction.
The method of claim 1,
A second ground layer disposed between the ground layer and the wiring layer; And
A second ground pattern electrically connected to the second ground layer and disposed between the plurality of feed lines and the ground pattern; Antenna device further comprising.
The method of claim 5,
And the second ground pattern has a larger area than the ground pattern, and overlaps at least a portion of the ground pattern and at least a portion of each of the plurality of feed lines when viewed in the vertical direction.
The method of claim 5,
A third ground layer; And
A third ground pattern electrically connected to the third ground layer; More,
The wiring layer is disposed between the second ground layer and the third ground layer,
And the plurality of feed lines is disposed between the second ground pattern and the third ground pattern.
The method of claim 7, wherein
The wiring layer, the ground layer and the second ground layer are recessed in a direction opposite to the dipole antenna pattern,
The third ground layer is disposed so as to cover the recessed areas of the wiring layer, the ground layer and the second ground layer when viewed in the vertical direction.
The method of claim 8,
And a plurality of shielding vias electrically connected to at least one of the ground layer and the second ground layer and arranged to surround at least a portion of the recessed areas of the wiring layer, the ground layer, and the second ground layer when viewed in the vertical direction. Antenna device.
A connection member including a wiring layer and a ground layer;
An IC disposed below the connecting member and electrically connected to the connecting member;
A plurality of patch antenna patterns disposed above the connection member;
A plurality of patch antenna feed vias electrically connecting the corresponding patch antenna pattern and the connection member among the plurality of patch antenna patterns; And
A plurality of dipole antenna patterns disposed on side surfaces of the connection member and electrically connected to corresponding wires of the wire layer to receive or transmit RF signals; Including,
The ground layer has a form in which the poles of each of the plurality of dipole antenna patterns are connected to each other to electrically connect the plurality of dipole antenna patterns to each other.
The method of claim 10,
The wiring layer is electrically connected to the IC to transmit or receive an RF signal to the plurality of dipole antenna patterns and the plurality of patch antenna patterns,
The ground layer is electrically connected to the IC to provide ground to the IC.
The method of claim 10,
And a passive component disposed below the connecting member and electrically connected to the connecting member,
And the ground layer is electrically connected to the passive component.
The method of claim 10,
A shielding member disposed below the connecting member and arranged to confine the IC together with the connecting member,
And the ground layer is electrically connected to the shielding member.
The method of claim 10,
A sub-board disposed under the connection member and electrically connected to the connection member to receive an IF signal or a baseband signal from an external device and transmit the received IF signal or a baseband signal to the IC or to receive an IF signal or a baseband signal from the IC and transmit the received signal to the external device. Antenna module further comprising.
The method of claim 10,
The connection member further includes a second ground layer disposed between the ground layer and the wiring layer,
The second ground layer has a plurality of projecting areas protruding toward the corresponding dipole antenna pattern of the plurality of dipole antenna patterns when viewed in the vertical direction.
The method of claim 15,
The connection member further includes a third ground layer,
The wiring layer is disposed between the second ground layer and the third ground layer,
The third ground layer has a plurality of second protruding regions protruding toward corresponding dipole antenna patterns among the plurality of dipole antenna patterns when viewed in the vertical direction.

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