KR101795116B1 - Light curing resin composition for adhesive film and adhesive layer - Google Patents
Light curing resin composition for adhesive film and adhesive layer Download PDFInfo
- Publication number
- KR101795116B1 KR101795116B1 KR1020140034047A KR20140034047A KR101795116B1 KR 101795116 B1 KR101795116 B1 KR 101795116B1 KR 1020140034047 A KR1020140034047 A KR 1020140034047A KR 20140034047 A KR20140034047 A KR 20140034047A KR 101795116 B1 KR101795116 B1 KR 101795116B1
- Authority
- KR
- South Korea
- Prior art keywords
- meth
- acrylate
- photo
- adhesive film
- resin composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/02—Polymerisation in bulk
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/12—Esters of monohydric alcohols or phenols
- C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
- C08L33/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
중량평균분자량이 3,000,000 내지 15,000,000 인 (메타)아크릴산 에스테르계 광경화성 수지를 포함하는 점착 필름용 광경화성 수지 조성물을 제공한다.(Meth) acrylate ester photo-curable resin having a weight average molecular weight of 3,000,000 to 15,000,000. The present invention also provides a photocurable resin composition for a pressure-sensitive adhesive film.
Description
점착 필름용 광경화성 수지 조성물 및 점착 필름에 관한 것이다.
A photo-curable resin composition for an adhesive film, and an adhesive film.
점착 필름은 전자 제품의 부품 간의 결합, 실내 인테리어용 부엌 가구 싱크대나 가구 등에 내장용품 또는 자동차 내·외장재의 접착용으로 널리 활용되고 있다.
대한민국 등록 특허 제10-0313188(이하, 특허문헌 1)는 열중합 방법으로 아크릴계 점착제를 제조하는 방법을 제안하고 있다.BACKGROUND ART Adhesive films have been widely used for joining parts of electronic products, interior furnishing for kitchen furniture sinks for furniture for interior decorations, and for bonding automotive interior and exterior materials.
Korean Patent No. 10-0313188 (hereinafter referred to as Patent Document 1) proposes a method of producing an acrylic pressure-sensitive adhesive by a thermal polymerization method.
본 발명의 일 구현예는 내구성이 향상된 점착 필름을 제조할 수 있는 광경화성 수지 조성물을 제공한다.An embodiment of the present invention provides a photocurable resin composition capable of producing a pressure-sensitive adhesive film having improved durability.
본 발명의 다른 구현예는 상기 광경화성 수지 조성물로부터 제조된 점착 필름을 제공한다.
Another embodiment of the present invention provides an adhesive film produced from the photo-curing resin composition.
본 발명의 일 구현예에서, 중량평균분자량이 3,000,000 내지 15,000,000 인 (메타)아크릴산 에스테르계 광경화성 수지를 포함하는 점착 필름용 광경화성 수지 조성물을 제공한다.In one embodiment of the present invention, there is provided a photocurable resin composition for a pressure-sensitive adhesive film comprising a (meth) acrylic ester-based photo-curable resin having a weight average molecular weight of 3,000,000 to 15,000,000.
상기 (메타)아크릴산 에스테르계 광경화성 수지의 다분산지수(PDI)가 1.5 내지 3.0일 수 있다.The polydispersion index (PDI) of the (meth) acrylate-based photo-curable resin may be 1.5 to 3.0.
상기 (메타)아크릴산 에스테르계 광경화성 수지는 (메타)아크릴산 에스테르계 모노머, 가교성 모노머 및 광흡수 가능 중합개시제를 포함하는 수지 중합용 조성물을 광중합하여 제조된 것일 수 있다.The (meth) acrylic ester type photo-curing resin may be one produced by photopolymerizing a composition for resin polymerization comprising a (meth) acrylic ester monomer, a crosslinkable monomer and a photoabsorbable polymerization initiator.
상기 수지 중합용 조성물은 용매를 포함하지 않는 벌크 중합용 조성물일 수 있다.The composition for resin polymerization may be a composition for bulk polymerization which does not contain a solvent.
상기 수지 중합용 조성물의 총 고형분 함량이 7 wt%로 한 경우, 광중합 후 점도가 25℃에서 5,000 cP 내지 40,000 cP 일 수 있다.When the total solid content of the resin composition for polymerization is 7 wt%, the viscosity after photopolymerization may be 5,000 cP to 40,000 cP at 25 캜.
상기 광흡수 가능 중합개시제는 광흡수 가능한 구조를 갖고, 광에 의해 중합을 개시할 수 있다.The light-absorbable polymerization initiator has a structure capable of absorbing light, and can initiate polymerization by light.
상기 수지 중합용 조성물은 분자량 조절제를 포함하지 않을 수 있다.The composition for resin polymerization may not contain a molecular weight modifier.
상기 (메타)아크릴산 에스테르계 모노머는 메틸 (메타)아크릴레이트, 에틸 (메타)아크릴레이트, n-프로필 (메타)아크릴레이트, 이소프로필 (메타)아크릴레이트, n-부틸 (메타)아크릴레이트, t-부틸 (메타)아크릴레이트, sec-부틸 (메타)아크릴레이트, 펜틸 (메타)아크릴레이트, 2-에틸헥실 (메타)아크릴레이트, 2-에틸부틸 (메타)아크릴레이트, n-옥틸(메타)아크릴레이트, 이소옥틸 (메타)아크릴레이트, 이소보닐 (메타)아크릴레이트, 이소노닐 (메타)아크릴레이트 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함할 수 있다.The (meth) acrylate monomer may be selected from the group consisting of methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, Butyl (meth) acrylate, sec-butyl (meth) acrylate, pentyl (meth) acrylate, 2-ethylhexyl Acrylate, isooctyl (meth) acrylate, isobonyl (meth) acrylate, isononyl (meth) acrylate, and combinations thereof.
상기 가교성 모노머는 상기 (메타)아크릴산 에스테르계 모노머와 함께 히드록시기 함유 단량체, 카복실기 함유 단량체 또는 질소 함유 단량체 및 이들의 조합으로 이루어진 군으로부터 선택된 적어도 하나를 포함할 수 있다.The crosslinkable monomer may include at least one selected from the group consisting of a hydroxyl group-containing monomer, a carboxyl group-containing monomer or a nitrogen-containing monomer and a combination thereof together with the (meth) acrylate monomer.
상기 가교성 모노머는 2-히드록시에틸 (메타)아크릴레이트, 2-히드록시프로필 (메타)아크릴레이트, 4-히드록시부틸 (메타)아크릴레이트, 6-히드록시헥실 (메타)아크릴레이트, 8-히드록시옥틸 (메타)아크릴레이트, 2-히드록시에틸렌글리콜 (메타)아크릴레이트, 2-히드록시프로필렌글리콜 (메타)아크릴레이트, 아크릴산, 메타크릴산, 2-(메타)아크릴로일옥시 아세트산, 3-(메타)아크릴로일옥시 프로필산, 4-(메타)아크릴로일옥시 부틸산, 아크릴산 이중체, 이타콘산, 말레산, 2-이소시아네이토에틸 (메타)아크릴레이트, 3-이소시아네이토프로필 (메타)아크릴레이트, 4-이소시아네이토부틸 (메타)아크릴레이트, (메타)아크릴아미드, N-비닐 피롤리돈, N-비닐 카프로락탐 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함할 수 있다.(Meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (Meth) acrylate, 2-hydroxypropylene glycol (meth) acrylate, acrylic acid, methacrylic acid, 2- (meth) acryloyloxyacetic acid Acrylate, 3- (meth) acryloyloxypropyl acid, 4- (meth) acryloyloxybutyl acid, acrylic acid dimer, itaconic acid, maleic acid, 2- isocyanatoethyl (Meth) acrylate, N-vinylpyrrolidone, N-vinylcaprolactam, and combinations thereof, from the group consisting of isocyanatoethyl (meth) acrylate, isocyanatoethyl And may include a selected one.
상기 점착 필름용 광경화성 수지 조성물은 광개시제 및 경화제를 더 포함할 수 있다.The photo-curing resin composition for a pressure-sensitive adhesive film may further comprise a photoinitiator and a curing agent.
상기 광개시제는 벤조인계 개시제, 히드록시 케톤계 개시제, 아미노 케톤계 개시제, 카프로락탐계 개시제 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함할 수 있다.The photoinitiator may include one selected from the group consisting of a benzoin-based initiator, a hydroxyketone-based initiator, an amino ketone-based initiator, a caprolactam-based initiator, and combinations thereof.
상기 점착 필름용 광경화성 수지 조성물은 광필러, 계면활성제, 점착부여제, 커플링제, 대전방지제, 염료, 안료, 자외선차단제, 항산화제, 가공유 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함하는 첨가제를 더 포함할 수 있다.The photo-curable resin composition for a pressure-sensitive adhesive film may contain additives such as a light filler, a surfactant, a tackifier, a coupling agent, an antistatic agent, a dye, a pigment, a UV- As shown in FIG.
본 발명의 다른 구현예에서, 상기 점착 필름용 광경화성 수지 조성물의 광경화물을 포함하는 점착 필름을 제공한다.
In another embodiment of the present invention, there is provided an adhesive film comprising a photo-cured product of the photo-curable resin composition for a pressure-sensitive adhesive film.
상기 광경화성 수지 조성물은 내구성이 개선된 점착 필름을 제조할 수 있다.
The photo-curable resin composition can produce an adhesive film having improved durability.
이하, 본 발명의 구현예를 상세히 설명하기로 한다. 다만, 이는 예시로서 제시되는 것으로, 이에 의해 본 발명이 제한되지는 않으며 본 발명은 후술할 청구항의 범주에 의해 정의될 뿐이다.Hereinafter, embodiments of the present invention will be described in detail. However, the present invention is not limited thereto, and the present invention is only defined by the scope of the following claims.
본 발명의 일 구현예에서, 중량평균분자량이 약 3,000,000 내지 약 15,000,000 인 (메타)아크릴산 에스테르계 광경화성 수지를 포함하는 점착 필름용 광경화성 수지 조성물을 제공한다.In one embodiment of the present invention, there is provided a photocurable resin composition for a pressure-sensitive adhesive film comprising a (meth) acrylate ester photo-curable resin having a weight average molecular weight of about 3,000,000 to about 15,000,000.
점착 필름용 광경화성 수지 조성물은 중량평균분자량이 약 3,000,000 내지 약 15,000,000의 고분자량의 (메타)아크릴산 에스테르계 광경화성 수지를 포함하여, 상기 점착 필름용 광경화성 수지 조성물로부터 제조된 점착 필름의 내구성을 향상시킬 수 있다.The photo-curable resin composition for a pressure-sensitive adhesive film includes a (meth) acrylate-based photo-curable resin having a weight average molecular weight of about 3,000,000 to about 15,000,000 and having a high molecular weight. The durability of the adhesive film produced from the photo- Can be improved.
상기 고분자량의 (메타)아크릴산 에스테르계 광경화성 수지는 광중합에 의해 합성될 수 있다.The high molecular weight (meth) acrylate ester photo-curable resin can be synthesized by photopolymerization.
구체적으로, 상기 (메타)아크릴산 에스테르계 광경화성 수지는 (메타)아크릴산 에스테르계 모노머, 가교성 모노머 및 광흡수 가능 중합개시제를 포함하는 수지 중합용 조성물을 광중합하여 제조될 수 있다.Specifically, the (meth) acrylic ester-based photo-curing resin can be produced by photopolymerizing a composition for resin polymerization comprising a (meth) acrylic acid ester monomer, a crosslinkable monomer and a photoabsorbable polymerization initiator.
상기 수지 중합용 조성물을 준비한 뒤, 광조사하면 상기 광흡수 가능 중합개시제가 광을 흡수하면서 중합반응을 개시하여 상기 (메타)아크릴산 에스테르계 광경화성 수지를 합성할 수 있다.After the composition for resin polymerization is prepared, the light-absorbable polymerization initiator may initiate a polymerization reaction while absorbing light to prepare the (meth) acrylic ester-based photo-curable resin.
상기 광흡수 가능 중합개시제는 광흡수 가능한 구조를 갖고, 광조사에 의해 라디칼을 발생시켜, 중합 반응을 개시시킬 수 있는 것이라면, 특별히 한정되지 않는다. 예를 들어, 광개시제로 공지된 물질은 제한 없이 사용될 수 있고, 열개시제 중에서도 광흡수 가능한 구조를 갖는 물질이라면 사용할 수 있다. 예를 들어, 상기 광흡수 가능 중합개시제는 벤조인계 개시제, 히드록시 케톤계 개시제, 아미노 케톤계 개시제, 카프로락탐계 개시제 및 이들의 조합으로 이루어진 군으로부터 선택된 적어도 하나를 포함하는 광개시제를 사용할 수 있다The light-absorbable polymerization initiator is not particularly limited as long as it has a structure capable of absorbing light and can generate a radical by light irradiation to initiate a polymerization reaction. For example, a material known as a photoinitiator can be used without limitation, and a material having a structure capable of absorbing light among thermal initiators can be used. For example, the photoabsorbable polymerization initiator may use a photoinitiator comprising at least one selected from the group consisting of a benzoin-based initiator, a hydroxyketone-based initiator, an amino ketone-based initiator, a caprolactam-based initiator,
상기 (메타)아크릴산 에스테르계 광경화성 수지를 광중합으로 합성하기 때문에, 용매를 사용하지 않는 벌크 중합으로 진행하여 중합 효율을 높일 수 있다.Since the (meth) acrylate-based photo-curable resin is synthesized by photopolymerization, it can proceed to bulk polymerization without using a solvent to increase the polymerization efficiency.
상기 (메타)아크릴산 에스테르계 광경화성 수지를 용매를 사용하지 않는 벌크 중합으로 광중합하면 으로 합성하기 때문에, 상기 (메타)아크릴산 에스테르계 광경화성 수지의 다분산지수 (polydispersity index, PDI, PDI = Mw(중량 평균 분자량)/Mn(수 평균 분자량))가 낮아지는 경향이 있다. 예를 들어, 상기 (메타)아크릴산 에스테르계 광경화성 수지의 다분산지수(PDI)가 약 1.5 내지 약 3.0일 수 있다. 상기 다분산지수가 낮다는 의미는 좁고 균일한 분자량 분포를 가짐을 의미한다. The photopolymerization of the (meth) acrylate-based photo-curing resin is performed by bulk polymerization without using a solvent. Therefore, the polydispersity index (PDI) of the (meth) acrylate- Weight-average molecular weight) / Mn (number-average molecular weight)) tends to decrease. For example, the polydispersion index (PDI) of the (meth) acrylate-based photo-curing resin may be about 1.5 to about 3.0. The low polydispersity index means a narrow and uniform molecular weight distribution.
이와 같이 좁고 균일한 분포를 갖지면서 고분자량을 갖도록 합성된 (메타)아크릴산 에스테르계 광경화성 수지를 점착 필름용 광경화성 수지 조성물에 포함시켜 점착 필름을 제조하게 되면, 상기 점착 필름의 내구성이 향상된다.When a pressure-sensitive adhesive film is produced by incorporating a (meth) acrylate-based photo-curing resin having a narrow and uniform distribution and a high molecular weight in a photo-curable resin composition for a pressure-sensitive adhesive film, the durability of the pressure-sensitive adhesive film is improved .
또한, 상기 (메타)아크릴산 에스테르계 광경화성 수지를 광중합으로 합성하기 때문에, 상기 수지 중합용 조성물은 분자량 조절제(chain transfer agent)를 포함하지 않을 수 있다.Further, since the (meth) acrylate-based photo-curable resin is synthesized by photopolymerization, the resin-polymerizing composition may not contain a chain transfer agent.
열중합에 의하면서, 벌크 중합에 의해 수지를 합성하는 경우, 분자량 조절제를 사용하지 않으면 반응이 폭발적으로 일어나기 때문에, 이를 제어하기 위해 분자량 조절제를 필수적으로 사용한다.According to the thermal polymerization, when a resin is synthesized by bulk polymerization, the reaction occurs explosively unless a molecular weight regulator is used. Therefore, a molecular weight regulator is essentially used to control the reaction.
이에 반해, 상기 수지 중합용 조성물은 광중합되기 때문에 반응열을 제어할 필요가 없고, 따라서, 벌크 중합하더라도 분자량 조절제를 필요로 하지 않게 된다. 따라서, 상기 수지 중합용 조성물은 분자량 조절제를 포함하지 않음으로써 보다 더 고분자량의 수지 합성이 가능하다.On the other hand, since the composition for resin polymerization is photopolymerized, there is no need to control the heat of reaction, and therefore, even when bulk polymerization is performed, a molecular weight regulator is not required. Therefore, since the composition for resin polymerization does not contain a molecular weight modifier, it is possible to synthesize a resin having a higher molecular weight.
그에 따라서, 상기 수지 중합용 조성물을 중합하여 전술한 범위의 중량평균분자량이 약 3,000,000 내지 약 15,000,000 인 (메타)아크릴산 에스테르계 광경화성 수지를 합성할 수 있다.Accordingly, the (meth) acrylate ester photo-curable resin having a weight average molecular weight ranging from 3,000,000 to 15,000,000 within the above-mentioned range can be synthesized by polymerizing the resin polymerization composition.
상기 수지 중합용 조성물을 광중합하여 고분자량의 (메타)아크릴산 에스테르계 광경화성 수지를 합성하게 되면 수지의 분자량이 높기 때문에 높은 점도를 구현하기가 보다 용이해진다.When a high molecular weight (meth) acrylate-based photo-curable resin is synthesized by photopolymerizing the composition for resin polymerization, high molecular weight of the resin is high, so that it becomes easier to realize high viscosity.
일반적으로 고분자 조성물의 점도는 고분자의 중합도 (전환율이라고도 함), 총 고형분 함량 (TSC, total solid content), 분자량 등에 의해 결정된다. 따라서 동일한 분자량을 가지더라도 중합도가 달라지면 점도가 달라질 수는 있다. 또한 고분자를 구성하는 성분의 조성 비율이나 종류에 따라서도 달라지기 때문에 점도가 분자량에 의해서만 결정되는 것이라고 할 수는 없지만, 점도를 높이기 위해서 분자량을 높이는 것이 한 가지 방법이 될 수는 있다.In general, the viscosity of a polymer composition is determined by the degree of polymerization (also referred to as conversion) of the polymer, total solid content (TSC), molecular weight, and the like. Therefore, even if they have the same molecular weight, the viscosity may vary if the polymerization degree is changed. In addition, since it varies depending on the composition ratio and kind of the constituent components of the polymer, it can not be said that the viscosity is determined solely by the molecular weight. However, increasing the molecular weight in order to increase the viscosity may be one method.
상기 수지 중합용 조성물을 광중합 후 점도를 다양하게 구현이 가능하고, 예를 들어, 낮게는 25℃에서 약 10 cP로 구현할 수 있고, 높게는, 중량평균분자량 1,400,000 및 TSC=36.9 wt%의 경우로서 25℃에서 650,000 cP를 구현할 수도 있다. 예를 들어, 상기 수지 중합용 조성물의 TSC를 7 wt% 정도로 하여, 상기 수지 중합용 조성물을 광중합 후 점도가 약 5,000 cP 내지 약 40,000 cP일 수 있다.The viscosity of the resin composition for polymerization can be varied after photopolymerization. For example, the viscosity can be lowered to about 10 cP at 25 캜, and the weight average molecular weight is 1,400,000 and TSC = 36.9 wt% 650 < 0 > C cP at 25 [deg.] C. For example, the resin polymerization composition may have a viscosity of about 5,000 cP to about 40,000 cP after photopolymerization, with the TSC of the resin polymerization composition being about 7 wt%.
상기 수지 중합용 조성물 중 상기 (메타)아크릴산 에스테르 모노머는, 예를 들어, 알킬(메타)아크릴레이트일 수 있고, 이에 한정되지 않는다. 상기 알킬(메타)아크릴레이트의 알킬은 선형 또는 분지형 C1-C14 알킬일 수 있고, 구체적으로 C1-C8 알킬일 수 있다.The (meth) acrylic acid ester monomer in the resin composition for polymerization may be, for example, alkyl (meth) acrylate, but is not limited thereto. The alkyl of the alkyl (meth) acrylate may be linear or branched C1-C14 alkyl, specifically C1-C8 alkyl.
상기 (메타)아크릴산 에스테르 모노머는, 구체적으로, 메틸 (메타)아크릴레이트, 에틸 (메타)아크릴레이트, n-프로필 (메타)아크릴레이트, 이소프로필 (메타)아크릴레이트, n-부틸 (메타)아크릴레이트, t-부틸 (메타)아크릴레이트, sec-부틸 (메타)아크릴레이트, 펜틸 (메타)아크릴레이트, 2-에틸헥실 (메타)아크릴레이트, 2-에틸부틸 (메타)아크릴레이트, n-옥틸(메타)아크릴레이트, 이소옥틸 (메타)아크릴레이트, 이소보닐 (메타)아크릴레이트, 이소노닐 (메타)아크릴레이트 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함할 수 있다.Specific examples of the (meth) acrylate monomer include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, (Meth) acrylate, 2-ethylbutyl (meth) acrylate, sec-butyl (meth) acrylate, pentyl (Meth) acrylate, isooctyl (meth) acrylate, isobonyl (meth) acrylate, isononyl (meth) acrylate, and combinations thereof.
상기 (메타)아크릴산 에스테르계 광경화성 수지는 상기 (메타)아크릴산 에스테르계 모노머와 함께 가교성 모노머가 함께 공중합될 수 있다.The (meth) acrylate ester photo-curable resin may be copolymerized with the (meth) acrylic acid ester monomer together with the crosslinkable monomer.
상기 수지 중합용 조성물 중 상기 가교성 모노머는, 분자 구조 내에 공중합성 관능기 (예를 들어, 탄소-탄소 이중 결합) 및 가교성 관능기를 동시에 포함하는 단량체를 의미한다.The above-mentioned crosslinkable monomer in the resin composition for polymerization means a monomer which simultaneously contains a copolymerizable functional group (for example, carbon-carbon double bond) and a crosslinkable functional group in the molecular structure.
상기 가교성 모노머는, 예를 들어, 히드록시기 함유 모노머, 카복실기 함유 모노머 또는 질소 함유 모노머 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함할 수 있고, 이에 한정되지 않는다.The crosslinkable monomer may include, but is not limited to, for example, one selected from the group consisting of a hydroxyl group-containing monomer, a carboxyl group-containing monomer or a nitrogen-containing monomer, and combinations thereof.
상기 가교성 모노머는, 구체적으로, 2-히드록시에틸 (메타)아크릴레이트, 2-히드록시프로필 (메타)아크릴레이트, 4-히드록시부틸 (메타)아크릴레이트, 6-히드록시헥실 (메타)아크릴레이트, 8-히드록시옥틸 (메타)아크릴레이트, 2-히드록시에틸렌글리콜 (메타)아크릴레이트, 2-히드록시프로필렌글리콜 (메타)아크릴레이트 등과 같은 히드록시기 함유 단량체; 아크릴산, 메타크릴산, 2-(메타)아크릴로일옥시 아세트산, 3-(메타)아크릴로일옥시 프로필산, 4-(메타)아크릴로일옥시 부틸산, 아크릴산 이중체, 이타콘산, 말레산 등과 같은 카르복실기 함유 단량체; 2-이소시아네이토에틸 (메타)아크릴레이트, 3-이소시아네이토프로필 (메타)아크릴레이트, 4-이소시아네이토부틸 (메타)아크릴레이트, (메타)아크릴아미드, N-비닐 피롤리돈, N-비닐 카프로락탐 등과 같은 질소 함유 단량체; 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함할 수 있다.Specific examples of the crosslinkable monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl Hydroxy group-containing monomers such as acrylate, 8-hydroxyoctyl (meth) acrylate, 2-hydroxyethyleneglycol (meth) acrylate, 2-hydroxypropyleneglycol (meth) acrylate and the like; (Meth) acryloyloxypropionic acid, 4- (meth) acryloyloxybutyric acid, acrylic acid dimer, itaconic acid, maleic acid And the like; (Meth) acrylate, 2-isocyanatoethyl (meth) acrylate, 3-isocyanatopropyl (meth) acrylate, Nitrogen-containing monomers such as N, N-vinylcaprolactam and the like; And a combination thereof.
상기 수지 중합용 조성물은 전술한 바와 같이 광흡수 가능 중합개시제 이외에 광중합시 첨가되는 공지된 첨가제가 용도에 맞게 제한 없이 사용될 수 있다.As described above, the composition for resin polymerization may contain, in addition to the photoabsorbable polymerization initiator, known additives which are added at the time of photopolymerization, without limitation.
상기와 같이 고분자량으로 합성된 (메타)아크릴산 에스테르계 광경화성 수지를 점착 필름용 광경화성 수지 조성물을 제조하기 위해서 사용한다. 상기 점착 필름용 광경화성 수지 조성물은 이후 광경화되어 점착 필름을 형성할 수 있다.
The (meth) acrylic ester-based photo-curing resin synthesized as described above is used for producing a photo-curing resin composition for a pressure-sensitive adhesive film. The photo-curing resin composition for a pressure-sensitive adhesive film is then photo-cured to form an adhesive film.
상기 점착 필름용 광경화성 수지 조성물은 상기 (메타)아크릴산 에스테르계 광경화성 수지에 광개시제, 경화제 등을 더 첨가하고, 그 밖에도 광경화물을 형성하기 위해 공지된 첨가제를 용도에 맞추어 제한 없이 첨가할 수 있다. 예를 들어, 상기 첨가제로서, 필러, 계면활성제, 점착부여제, 커플링제, 대전방지제, 염료, 안료, 자외선차단제, 항산화제, 가공유 등 또는 이들의 조합을 포함할 수 있다.
The photo-curable resin composition for a pressure-sensitive adhesive film may further contain a photo-initiator, a curing agent and the like added to the (meth) acrylate-based photo-curable resin, and other known additives for forming photo- . For example, the additives may include fillers, surfactants, tackifiers, coupling agents, antistatic agents, dyes, pigments, ultraviolet screening agents, antioxidants, processing oils, or combinations thereof.
본 발명의 다른 구현예에서, 상기 점착 필름용 광경화성 수지 조성물의 광경화물을 포함하는 점착 필름을 제공한다.In another embodiment of the present invention, there is provided an adhesive film comprising a photo-cured product of the photo-curable resin composition for a pressure-sensitive adhesive film.
일 구현예에서, 상기 점착 필름은 상기 점착 필름용 광경화성 수지 조성물을 기재 상에 도포하거나 코팅한 뒤, 광경화시켜 성막된 점착 필름이다. 예를 들어, 기재로서 이형 필름 상에 점착 필름을 형성할 수 있고, 점착 필름을 구체적인 용도에 적용시 이형 필름을 제거하여 점착 필름을 사용할 수 있다.In one embodiment, the adhesive film is an adhesive film formed by applying or coating a photocurable resin composition for a pressure-sensitive adhesive film on a substrate, followed by photocuring. For example, an adhesive film can be formed on a release film as a base material, and an adhesive film can be used by removing the release film when the adhesive film is applied to a specific application.
상기 점착 필름은 전술한 바와 같이 고분자량을 갖는 (메타)아크릴산 에스테르계 광경화성 수지를 사용하여 제조되기 때문에 내구성이 우수하다.
As described above, the pressure-sensitive adhesive film is excellent in durability because it is produced using a (meth) acrylate-based photo-curable resin having a high molecular weight.
이하 본 발명의 실시예 및 비교예를 기재한다. 그러한 하기한 실시예는 본 발명의 일 실시예일뿐 본 발명이 하기한 실시예에 한정되는 것은 아니다.
Hereinafter, examples and comparative examples of the present invention will be described. The following embodiments are only examples of the present invention, and the present invention is not limited to the following embodiments.
(( 실시예Example ))
비교예 3Comparative Example 3
2-EHA(에틸헥실아크릴레이트) 91 중량부 및 가교성 모노머로서 아크릴산 9 중량부 및 광중합 개시제로서 1-하이드록시사이클로헥실페닐케톤 (Igacure 184, BASF 社 제조) 0.005 중량부를 1 리터 유리 반응기에 넣고 30분간 질소 가스로 퍼징시켜 용액 내부의 기체를 질소로 치환시켰다. 블랙 형광등을 이용하여 UV를 조사하여 (메타)아크릴산 에스테르계 광경화성 수지를 광중합하였다. 중합된 (메타)아크릴산 에스테르계 광경화성 수지의 중량평균분자량 및 PDI (GPC, Agilent 社 (USA), 모델명:1260 Infinity)를 사용하여 측정하였고, 측정된 중량평균분자량 및 PDI 값을 하기 표 1에 기재하였다.91 parts by weight of 2-EHA (ethylhexyl acrylate), 9 parts by weight of acrylic acid as a crosslinkable monomer and 0.005 part by weight of 1-hydroxycyclohexyl phenyl ketone (Igacure 184, manufactured by BASF) as a photopolymerization initiator were placed in a 1 liter glass reactor Purged with nitrogen gas for 30 minutes to replace the gas inside the solution with nitrogen. (Meth) acrylic ester-based photo-curable resin was photopolymerized by UV irradiation using a black fluorescent lamp. The weight average molecular weight and the PDI value of the polymerized (meth) acrylate ester photo-curable resin were measured using PDI (GPC, Agilent (USA), model name: 1260 Infinity) .
상기 합성된 (메타)아크릴산 에스테르계 광경화성 수지에 광개시제, 경화제 및 기타 첨가제를 혼합하여 광경화성 수지 조성물을 제조하고, 상기 광경화성 수지 조성물을 PET 이형필름 상에 도포한 뒤 UV 램프를 이용하여 자외선을 10 분 동안 조사하여 광경화시켜 점착 필름을 제조하였다.
A photocurable resin composition is prepared by mixing a photoinitiator, a curing agent and other additives with the synthesized (meth) acrylic acid ester photo-curable resin, applying the photo-curable resin composition onto a PET release film, Was irradiated for 10 minutes and photocured to prepare an adhesive film.
실시예Example 2 2
2-EHA(에틸헥실아크릴레이트) 90 중량부 및 가교성 모노머로서 아크릴산 10 중량부의 혼합비로 (메타)아크릴산 에스테르계 광경화성 수지를 광중합하여 사용한 점을 제외하고, 비교예 3과 동일한 방법으로 점착 필름을 제조하였다.Except that 90 parts by weight of 2-EHA (ethylhexyl acrylate) and 10 parts by weight of acrylic acid as a crosslinkable monomer were photopolymerized with a (meth) acrylate ester photo-curable resin, .
실시예Example 3 3
2-EHA(에틸헥실아크릴레이트) 89 중량부 및 가교성 모노머로서 아크릴산 11 중량부의 혼합비로 (메타)아크릴산 에스테르계 광경화성 수지를 광중합하여 사용한 점을 제외하고, 비교예 3과 동일한 방법으로 점착 필름을 제조하였다.Except that 89 parts by weight of 2-EHA (ethylhexyl acrylate) and 11 parts by weight of acrylic acid as a crosslinkable monomer were photopolymerized with a (meth) acrylate ester photo-curing resin. .
비교예Comparative Example 1 One
2-EHA(에틸헥실아크릴레이트) 89 중량부 및 가교성 모노머로서 아크릴산 11 중량부 및 분자량 조절제로서 n-도데실 머캅탄(n-DDM, n-dodecyl mercaptan) 0.001 중량부를 1 리터 유리 반응기에 넣고 30분간 질소 가스로 퍼징시켜 용액 내부의 기체를 질소로 치환시키면서 반응온도 80℃로 승온시켰다. 이후 2,2-아조비스-4-메톡시-2,4-디메틸발레로니트릴(Wako사 V-70) 0.015g을 투입시켜 즉시 반응을 시작하였다. 반응이 진행되다가 개시전의 반응온도로 하강하면 1시간 후 상온으로 냉각시켜, (메타)아크릴산 에스테르계 광경화성 수지를 열중합하였다. 중합된 (메타)아크릴산 에스테르계 광경화성 수지의 중량평균분자량 및 PDI (GPC, Agilent 社 (USA), 모델명:1260 Infinity)를 사용하여 측정하였고, 측정된 중량평균분자량 및 PDI 값을 하기 표 1에 기재하였다.89 parts by weight of 2-EHA (ethylhexyl acrylate), 11 parts by weight of acrylic acid as a crosslinkable monomer and 0.001 part by weight of n-dodecyl mercaptan (n-DDM, n-dodecyl mercaptan) Purged with nitrogen gas for 30 minutes to raise the temperature to 80 DEG C while the gas inside the solution was replaced with nitrogen. Then, 0.015 g of 2,2-azobis-4-methoxy-2,4-dimethylvaleronitrile (Wako V-70) was added thereto to immediately start the reaction. After the reaction was carried out, the temperature was lowered to the reaction temperature before initiation, and after one hour, the reaction system was cooled to room temperature, and the (meth) acrylate ester photo-curing resin was thermally polymerized. The weight average molecular weight and the PDI value of the polymerized (meth) acrylate ester photo-curable resin were measured using PDI (GPC, Agilent (USA), model name: 1260 Infinity) .
상기 합성된 (메타)아크릴산 에스테르계 광경화성 수지에 광개시제, 경화제 및 기타 첨가제를 혼합하여 광경화성 수지 조성물을 제조하고, 상기 광경화성 수지 조성물을 PET 이형필름 상에 도포한 뒤 UV 램프를 이용하여 자외선을 10 분 동안 조사하여 광경화시켜 점착 필름을 제조하였다.A photocurable resin composition is prepared by mixing a photoinitiator, a curing agent and other additives with the synthesized (meth) acrylic acid ester photo-curable resin, applying the photo-curable resin composition onto a PET release film, Was irradiated for 10 minutes and photocured to prepare an adhesive film.
비교예Comparative Example 2 2
분자량 조절제로서 n-도데실 머캅탄(n-DDM, n-dodecyl mercaptan) 0.002 중량부를 혼합하여 (메타)아크릴산 에스테르계 광경화성 수지를 열중합하여 사용한 점을 제외하고, 비교예 1과 동일한 방법으로 점착 필름을 제조하였다.
Except that 0.002 part by weight of n-dodecyl mercaptan (n-DDM) as a molecular weight modifier was mixed to thermally polymerize a (meth) acrylate ester photo-curing resin. A film was prepared.
평가evaluation
<고온 동적 전단강도 (Dynamic shear strength) 측정>≪ Dynamic Shear Strength Measurement >
실시예 2-3 및 비교예 1-3의 점착테이프에 대하여, SUS 판과 SUS 판 사이에 점착테이프가 접하도록 적층한 다음, 6kg 하중으로 30 초간 가압 후 15분 동안 상온에서 에이징(aging)하여 부착되게 하였다. 그리고 80℃의 고온 유지 챔버가 달린 만능시험기 (UTM, universal testing machine)를 이용하여, ASTM D 1002를 기본으로 하여, 80℃에서 기재의 양쪽을 12.7mm/min의 속도 (cross head speed)로 당기어 고온 동적 전단강도를 측정하였다. 결과를 하기 표 1에 기재하였다.The pressure-sensitive adhesive tapes of Example 2-3 and Comparative Example 1-3 were laminated so that an adhesive tape was in contact with the SUS plate and the SUS plate, then pressurized for 30 seconds at a load of 6 kg and then aged at room temperature for 15 minutes Respectively. Then, using a universal testing machine (UTM) equipped with a high-temperature holding chamber at 80 DEG C, the substrate was heated at 80 DEG C on both sides at a speed of 12.7 mm / min (crosshead speed) The gear high temperature dynamic shear strength was measured. The results are shown in Table 1 below.
상기 표 1의 결과로부터, 실시예 2-3의 점착 필름의 고온 동적 전단강도가 비교예 1-3 보다 우수하여, 내구성이 우수함을 확인할 수 있다. From the results in Table 1, it can be confirmed that the high temperature dynamic shear strength of the adhesive film of Example 2-3 is superior to that of Comparative Example 1-3, and the durability is excellent.
이상에서 본 발명의 바람직한 실시예들에 대하여 상세하게 설명하였지만 본 발명의 권리 범위는 이에 한정되는 것은 아니고 다음의 청구 범위에서 정의하고 있는 본 발명의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 발명의 권리 범위에 속하는 것이다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, And falls within the scope of the invention.
Claims (14)
상기 (메타)아크릴산 에스테르계 광경화성 수지는 (메타)아크릴산 에스테르계 모노머, 가교성 모노머 및 광흡수 가능 중합개시제를 포함하는 수지 중합용 조성물을 광중합하여 제조되며,
상기 수지 중합용 조성물은 분자량 조절제를 포함하지 않는
점착 필름용 광경화성 수지 조성물.
(Meth) acrylate ester photo-curable resin having a weight average molecular weight of 3,600,000 to 4,000,000 and a polydispersion index (PDI) of 1.8 to 2.0,
The (meth) acrylate-based photo-curable resin is prepared by photopolymerizing a composition for resin polymerization comprising a (meth) acrylic ester monomer, a crosslinkable monomer and a photoabsorbable polymerization initiator,
Wherein the composition for resin polymerization does not contain a molecular weight modifier
And a photo-curing resin composition for an adhesive film.
상기 수지 중합용 조성물은 용매를 포함하지 않는 벌크 중합용 조성물인
점착 필름용 광경화성 수지 조성물.
The method according to claim 1,
The composition for resin polymerization is a bulk polymerization composition containing no solvent
And a photo-curing resin composition for an adhesive film.
상기 수지 중합용 조성물의 총 고형분 함량이 7 wt%로 한 경우, 광중합 후 점도가 25℃에서 5,000 cP 내지 40,000 cP 인
점착 필름용 광경화성 수지 조성물.
The method according to claim 1,
When the total solid content of the resin composition for polymerization is 7 wt%, the viscosity after photopolymerization at 25 DEG C is 5,000 cP to 40,000 cP
And a photo-curing resin composition for an adhesive film.
상기 광흡수 가능 중합개시제는 광흡수 가능한 구조를 갖고, 광에 의해 중합을 개시하는
점착 필름용 광경화성 수지 조성물.
The method according to claim 1,
The light-absorbable polymerization initiator has a structure capable of absorbing light,
And a photo-curing resin composition for an adhesive film.
상기 (메타)아크릴산 에스테르계 모노머는 메틸 (메타)아크릴레이트, 에틸 (메타)아크릴레이트, n-프로필 (메타)아크릴레이트, 이소프로필 (메타)아크릴레이트, n-부틸 (메타)아크릴레이트, t-부틸 (메타)아크릴레이트, sec-부틸 (메타)아크릴레이트, 펜틸 (메타)아크릴레이트, 2-에틸헥실 (메타)아크릴레이트, 2-에틸부틸 (메타)아크릴레이트, n-옥틸(메타)아크릴레이트, 이소옥틸 (메타)아크릴레이트, 이소보닐 (메타)아크릴레이트, 이소노닐 (메타)아크릴레이트 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함하는
점착 필름용 광경화성 수지 조성물.
The method according to claim 1,
The (meth) acrylate monomer may be selected from the group consisting of methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, (Meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylbutyl (meth) acrylate, n-octyl (meth) (Meth) acrylate, isooctyl (meth) acrylate, isobonyl (meth) acrylate, isononyl (meth) acrylate and combinations thereof.
And a photo-curing resin composition for an adhesive film.
상기 가교성 모노머는 상기 (메타)아크릴산 에스테르계 모노머와 함께 히드록시기 함유 단량체, 카복실기 함유 단량체 또는 질소 함유 단량체 및 이들의 조합으로 이루어진 군으로부터 선택된 적어도 하나를 포함하는
점착 필름용 광경화성 수지 조성물.
The method according to claim 1,
The crosslinkable monomer includes at least one selected from the group consisting of a hydroxyl group-containing monomer, a carboxyl group-containing monomer or a nitrogen-containing monomer and a combination thereof together with the (meth) acrylic acid ester-based monomer
And a photo-curing resin composition for an adhesive film.
상기 가교성 모노머는 2-히드록시에틸 (메타)아크릴레이트, 2-히드록시프로필 (메타)아크릴레이트, 4-히드록시부틸 (메타)아크릴레이트, 6-히드록시헥실 (메타)아크릴레이트, 8-히드록시옥틸 (메타)아크릴레이트, 2-히드록시에틸렌글리콜 (메타)아크릴레이트, 2-히드록시프로필렌글리콜 (메타)아크릴레이트, 아크릴산, 메타크릴산, 2-(메타)아크릴로일옥시 아세트산, 3-(메타)아크릴로일옥시 프로필산, 4-(메타)아크릴로일옥시 부틸산, 아크릴산 이중체, 이타콘산, 말레산, 2-이소시아네이토에틸 (메타)아크릴레이트, 3-이소시아네이토프로필 (메타)아크릴레이트, 4-이소시아네이토부틸 (메타)아크릴레이트, (메타)아크릴아미드, N-비닐 피롤리돈, N-비닐 카프로락탐 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함하는
점착 필름용 광경화성 수지 조성물.
10. The method of claim 9,
(Meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (Meth) acrylate, 2-hydroxypropylene glycol (meth) acrylate, acrylic acid, methacrylic acid, 2- (meth) acryloyloxyacetic acid Acrylate, 3- (meth) acryloyloxypropyl acid, 4- (meth) acryloyloxybutyl acid, acrylic acid dimer, itaconic acid, maleic acid, 2- isocyanatoethyl (Meth) acrylate, N-vinylpyrrolidone, N-vinylcaprolactam, and combinations thereof, from the group consisting of isocyanatoethyl (meth) acrylate, isocyanatoethyl Containing the selected one
And a photo-curing resin composition for an adhesive film.
광개시제 및 경화제를 더 포함하는
점착 필름용 광경화성 수지 조성물.
The method according to claim 1,
Further comprising a photoinitiator and a curing agent
And a photo-curing resin composition for an adhesive film.
상기 광개시제는 벤조인계 개시제, 히드록시 케톤계 개시제, 아미노 케톤계 개시제, 카프로락탐계 개시제 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함하는
점착 필름용 광경화성 수지 조성물.
12. The method of claim 11,
Wherein the photoinitiator comprises one selected from the group consisting of a benzoin-based initiator, a hydroxyketone-based initiator, an amino ketone-based initiator, a caprolactam-based initiator,
And a photo-curing resin composition for an adhesive film.
필러, 계면활성제, 점착부여제, 커플링제, 대전방지제, 염료, 안료, 자외선차단제, 항산화제, 가공유 및 이들의 조합으로 이루어진 군으로부터 선택된 하나를 포함하는 첨가제를 더 포함하는
점착 필름용 광경화성 수지 조성물.
The method according to claim 1,
Further comprising an additive comprising one selected from the group consisting of fillers, surfactants, tackifiers, coupling agents, antistatic agents, dyes, pigments, sunscreens, antioxidants,
And a photo-curing resin composition for an adhesive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140034047A KR101795116B1 (en) | 2014-03-24 | 2014-03-24 | Light curing resin composition for adhesive film and adhesive layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140034047A KR101795116B1 (en) | 2014-03-24 | 2014-03-24 | Light curing resin composition for adhesive film and adhesive layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150110993A KR20150110993A (en) | 2015-10-05 |
| KR101795116B1 true KR101795116B1 (en) | 2017-11-08 |
Family
ID=54344305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140034047A KR101795116B1 (en) | 2014-03-24 | 2014-03-24 | Light curing resin composition for adhesive film and adhesive layer |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101795116B1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102076119B1 (en) * | 2016-03-25 | 2020-02-12 | 주식회사 엘지화학 | The adhesive composition and the adhesive tape |
| KR102190038B1 (en) * | 2016-04-06 | 2020-12-11 | 주식회사 엘지화학 | Photo curable adhesive composition and adhesive film |
| KR102119901B1 (en) * | 2016-04-06 | 2020-06-05 | 주식회사 엘지화학 | Photocurable adhesive composition, method for the same and adhesive film |
-
2014
- 2014-03-24 KR KR1020140034047A patent/KR101795116B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150110993A (en) | 2015-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2013181030A1 (en) | Liquid optical adhesive compositions | |
| JP7253903B2 (en) | Adhesive sheet, method for producing same, and method for producing image display device | |
| KR101736536B1 (en) | Adhesive composition, adhesive film and acryl foam adhesive tape | |
| TWI500666B (en) | Preparation method for acrylic film and acrylic film | |
| TW201726849A (en) | Pressure-sensitive adhesive sheet, process for producing laminate including pressure-sensitive adhesive layer, laminate including pressure-sensitive adhesive layer, image display device, and touch panel | |
| JP2018012751A (en) | Adhesive sheet | |
| KR101795116B1 (en) | Light curing resin composition for adhesive film and adhesive layer | |
| JP2019131681A (en) | Adhesive sheet, method for producing the same, and adhesive film | |
| KR101771774B1 (en) | Light curing resin composition for adhesive film and adhesive layer | |
| JP7335770B2 (en) | Adhesive film and surface protection film | |
| KR102049588B1 (en) | Photo curable adhesive and bonding composition and adhesive film | |
| KR101903906B1 (en) | Photocurable resin composition for protective layer, polarizing plate and image display apparatus comprising the same | |
| KR20170103079A (en) | Adhesive composition for optical use and adhesive sheet | |
| JP6697395B2 (en) | UV curable acrylic polymer and UV curable acrylic hot melt adhesive containing the same | |
| EP3733721B1 (en) | Photocurable acrylic resin, adhesive composition comprising same, and adhesive film formed by using same | |
| KR101804598B1 (en) | Method of solvent-type adhesive composition by photopolymerisation | |
| KR102076122B1 (en) | Adhesive composition with excellent heat-resistance and adhesive | |
| KR102087428B1 (en) | Photo curable adhesive and bonding composition and adhesive film | |
| KR101750589B1 (en) | Solvent-type adhesive composition by photopolymerisation | |
| TW202120650A (en) | Photocurable adhesive composition, double-sided adhesive sheet and method for producing same, and optical device and method for producing same | |
| JP2016210909A (en) | Photocurable resin composition and cured product | |
| WO2023074555A1 (en) | Photocurable adhesive sheet | |
| KR101419434B1 (en) | UV-curable Paint Varnish Composition Having Rubber-Acrylic Adhesive for Optical Film Coating | |
| EP3981851A2 (en) | Pressure sensitive adhesive sheet, pressure sensitive adhesive-equipped optical film and image display device | |
| JP2023107668A (en) | optical adhesive sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| AMND | Amendment | ||
| X701 | Decision to grant (after re-examination) | ||
| GRNT | Written decision to grant |