KR101695019B1 - Organic Light Emitting Device and Method For The Same - Google Patents

Abstract

The present invention relates to an organic light emitting display having a front encapsulation structure and a method of manufacturing the same. An organic light emitting display device according to the present invention includes: a display panel; A protective film covering the front surface of the display panel; An adhesive applied on the entire surface of the panel on the protective film; An encapsulation plate attached to the front surface of the panel via the adhesive; And a side sealing layer covering the adhesive on the side of the display panel. INDUSTRIAL APPLICABILITY The present invention effectively improves the reliability and service life of a product by effectively preventing moisture penetration in an organic light emitting display.

Description

Technical Field [0001] The present invention relates to an organic light emitting display,

The present invention relates to an organic light emitting display having a front encapsulation structure and a method of manufacturing the same. In particular, the present invention relates to an organic light emitting display having a front encapsulation structure having a side encapsulant for preventing moisture penetration through a side organic protective film in a front encapsulation structure, and a method of manufacturing the same.

2. Description of the Related Art In recent years, the importance of flat panel displays (FPDs) has been increasing with the development of multimedia. In response to this, various kinds of devices such as a liquid crystal display (LCD), a plasma display panel (PDP), a field emission display (FED), an organic light emitting display A planar display of a branch has been put into practical use.

Of these organic electroluminescent display devices, which are attracting attention as display devices, are display devices using organic electroluminescent phenomenon. Organic electroluminescence is a phenomenon in which electrons and holes injected through a cathode electrode and an anode electrode into an organic material (low molecular or polymer) thin film recombine in an organic material to form an excitation And a phenomenon in which light of a specific wavelength is generated by energy from excitons. The structure of the organic light emitting display using the above phenomenon and the manufacturing steps thereof will be described below.

The organic light emitting display device is roughly classified into two types according to the driving method. One is a passive matrix organic light emitting display (passive matrix OLED), and the other is an active matrix organic light emitting display (Active Matrix OLED). Among them, we will focus on active matrix OLED, which is a recent issue. 1 is a plan view schematically showing the structure of a panel for an active matrix organic light emitting display device. FIG. 2 is a cross-sectional view showing the structure of a panel for an organic light emitting display device cut along the cutting line A-A 'in FIG. 1;

1 and 2, a panel 10 for an organic light emitting display device is formed by arranging thin film transistors (TFT) 95 on a transparent substrate 1 in a matrix form. The TFT 95 includes pixel regions 9 formed by intersecting a gate line 91 extending in a first direction and a data line 93 extending in a second direction perpendicular to the first direction on the substrate 1, As shown in FIG. The TFT 95 includes a gate electrode 91a branched from the gate line 91, a gate insulating film 99 covering the entire substrate 1 on the gate electrode 91a, a gate electrode 91a on the gate insulating film 99, A source electrode 93a formed on the data line 93 and a drain electrode 93b formed on the semiconductor layer 97 so as to face the source electrode 93a are formed on the semiconductor layer 97, . A first electrode 3 connected to the drain electrode 93b of the TFT 95 is formed in each pixel region 9 and an organic light emitting layer (or "organic EL layer") 5 A second electrode 7 is formed on the organic EL layer 5. Here, the first electrode 3 serves as an anode electrode and the second electrode 7 serves as a cathode electrode. Or vice versa. Although not shown in the drawings, the organic EL layer 5 may be formed by laminating a hole transporting layer, a light emitting layer, and an electron transporting layer. The first electrode 3, the organic EL layer 5, and the second electrode 7 become the organic light emitting element 15.

The TFT 95 is connected to the switching TFT. A detailed description of the switching TFT is omitted here. The switching TFT can be formed simultaneously with the TFT 95.

The determination of the lifetime of the panel for such an organic light emitting display device can be roughly divided into two parts. One is the operation-lifetime in driving, which is caused by impurities in the organic material, the interface between the organic material and the electrode, the low glass transition temperature (Tg) of the organic material, and the oxidation of the device by oxygen and moisture. The other is a shelf-lifetime in which the light-emitting area gradually decreases due to moisture even if it is not driven. As a result, the lifetime of the organic electroluminescent device is determined by the small lifetime value of these two lifetimes.

Moisture can be largely taken into consideration during the process of making a device, both existing inside and permeating from the outside. The biggest problem is the penetration from the outside. To solve this problem, the following sealing methods are used. 3 is a cross-sectional view showing the structure of an organic light emitting display device according to a conventional hollow sealing method.

Referring to FIG. 3, the organic light emitting display device 30 according to the hollow sealing method includes the organic electroluminescence panel 10 described with reference to FIG. 1 and FIG. The panel 10 is adhered to a shield cap 23 covering the elements in the panel 10 by a sealing material 21 such as a photocurable or thermosetting epoxy resin applied to the periphery. The shield cap 23 used to protect the elements formed on the panel 10 from the external environment such as moisture is made of a metal such as stainless steel or glass. A thin film type moisture absorptive material (also referred to as a getter) 25 is attached to the inner surface of the shield cap 23. The moisture absorbent 25 may remain in the space between the shield cap 23 and the panel 10 after the shield cap 23 is attached or may absorb moisture penetrating through the sealing material 21, Protect from being affected by.

In such a structure, since there is an empty space between the panel 10 and the shield cap 23, it is called a hollow sealing method. In the case of the hollow sealing method, even if a small amount of moisture penetrates into the bag through the sealing member 21 for attaching the shield cap 23 to the panel 10, the moisture absorbing member 25 for absorbing moisture therein is provided, There is little risk that the devices will be attacked by moisture. However, since the space between the panel 10 and the shield cap 23 is empty and is attached only by the thin sealing member 21, when an external impact or force is applied, the sealing member 21 is broken or the shield cap 23 May be bent to adversely affect the panel 10, or the display device itself may be damaged. That is, although damage due to moisture penetration can be prevented to near perfection, there is a fatal problem that the physical strength of the display device itself is weak.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of sealing a front surface of an organic light emitting display device, which prevents damages due to moisture penetrated through an adhesive material of display device elements in an organic light emitting display device having a front sealing structure. It is another object of the present invention to provide an organic electroluminescent display device having a front encapsulation structure, which comprises a side encapsulant for blocking the passage of moisture through the organic encapsulation layer exposed at the side, A display device and a method of manufacturing the same.

According to an aspect of the present invention, there is provided an organic light emitting display including: a display panel; A protective film covering the front surface of the display panel; An adhesive applied on the entire surface of the panel on the protective film; An encapsulation plate attached to the front surface of the panel via the adhesive; And a side sealing layer covering the adhesive on the side of the display panel.

The protective film may include a first protective film covering the entire surface of the display panel and having a crater portion scattered irregularly to expose a part of the display panel; And a second protective film covering the first protective film and covering a part of the display panel exposed through the crater.

The second protective film covering the crater portion further includes a step coverage portion along a crater shape.

At least one of the primary protective film and the secondary protective film has a thickness of 0.5 탆 to 1 탆.

At least one of the first protective film and second protective film includes at least any one of inorganic materials of SiNx, SiOx, SiON, and Al ₂ O _3.

The side sealing layer comprises any one of a resin material, a metal material and a waterproof epoxy material.

The side sealing layer may be formed by attaching the display panel through an adhesive material applied inside and corresponding to the side portion of the metal bowl having a bottom surface corresponding to the display panel area and a side portion corresponding to the thickness of the display panel .

A method of manufacturing an organic light emitting display device according to the present invention includes: forming a display panel; Forming a protective film on the entire surface of the display panel; Applying an adhesive to the entire surface of the display panel on which the protective film is formed; Bonding the sealing plate to the front surface of the display panel through the adhesive; And forming a side sealing layer covering the adhesive exposed on the side of the display panel.

The forming of the passivation layer may include: applying a first passivation layer to the entire surface of the display panel; Cleaning the entire surface of the display panel on which the primary protective film is formed to remove impurity particles; And applying a second protective film on the first protective film of the display panel from which the impurity particles have been removed.

The step of removing the impurity particles is an ultrasonic cleaning method using clean air or an inert gas.

At least one of the first protective film and the second protective film is formed by coating at least any one of SiNx, SiOx, SiON, and Al ₂ O ₃ to a thickness of 0.5 탆 to 1 탆.

The step of forming the side sealing layer may include the steps of: stacking a plurality of the display panels together with the separating plate; Depositing any one of a resin material, a metal material and a waterproof epoxy material on the side surfaces of the plurality of display panels stacked; And separating the plurality of display panels by using the separating plate.

The step of forming the side sealing layer may include preparing a metal container having a bottom surface corresponding to the surface area of the display panel and a side surface corresponding to the thickness of the display panel; Applying an adhesive material to the inside of the metal bowl; Inserting the display panel into the metal vessel; And curing the adhesive material.

The organic electroluminescent display device having the front encapsulation structure according to the present invention protects not only the front encapsulation plate but also the adhesive part exposed on the side by the side encapsulation film to block the penetration path of moisture. A method of manufacturing an organic light emitting display having a front encapsulation structure according to the present invention includes coating an inorganic protective film to prevent moisture penetration from the front surface, attaching a front encapsulation plate with an adhesive, A side sealing film is further formed to prevent moisture penetration through the adhesive. Therefore, the present invention effectively improves the reliability and service life of the product by effectively preventing moisture penetration in the organic electroluminescent display device.

Other objects and advantages of the present invention will be apparent from the following description of preferred embodiments of the present invention with reference to the accompanying drawings. 4 is a cross-sectional view illustrating a structure of an organic light emitting display device according to the present invention.

Referring to FIG. 4, the organic light emitting display 150 according to the front sealing method includes an organic light emitting display panel 110. The organic light emitting display panel 110 is formed by arranging thin film transistors 195 on a transparent substrate 101 in a matrix form. The TFT 195 includes pixel regions 109 formed by intersecting a gate line 191 extending in the first direction and a data line 193 extending in the second direction perpendicular to the first direction on the substrate 101, As shown in FIG. The TFT 195 includes a gate electrode 191a branched from the gate line 191, a gate insulating film 199 covering the entire substrate 101 on the gate electrode 191a, a gate electrode 191a on the gate insulating film 199, A source electrode 193a formed on the data line 193 and a drain electrode 193b formed on the semiconductor layer 197 so as to face the source electrode 193a are formed on the semiconductor layer 197, . A first electrode 103 connected to the drain electrode 193b of the TFT 195 is formed in each pixel region 109. An organic EL layer 105 and an organic EL layer 105, a second electrode 107 is formed.

In the organic light emitting display panel 110, a protective layer 131 for protecting the elements formed on the substrate 101 is applied to the entire surface of the display panel 110. The sealing plate 135 is attached by an adhesive 133 applied to the front surface of the display panel 110. In this case, the entire surface of the sealing plate 135 is completely in contact with the panel 110 with the adhesive 133 interposed therebetween.

In the front sealing method, the sealing plate 135 covers the entire upper surface of the panel 110 to prevent moisture from penetrating the inside of the panel 110. Further, unlike the hollow sealing method, since the empty space is filled with the adhesive material, the sealing plate 135 and the panel 110 are not easily damaged even when external force or impact is transmitted to the display device 150 .

On the other hand, moisture can penetrate through the adhesive 133 made of a resin material at the side surface of the panel 110. In general, the penetration rate of water through the resin is 100 g / m ² / day. That is, 100 g of water can be infiltrated through an area of 1 m ² during one day. As a result, most of the moisture infiltration path is blocked by the sealing plate 135, but moisture permeates through the side of the adhesive 133 in terms of structure. In order to prevent penetration of moisture that can be structurally generated, a protective film 131 is formed of an inorganic material on the element formed on the panel 110. In general, the moisture permeability of the inorganic protective film is 10 ^-3 to 10 ^-5 g / m ² / day. That is, the moisture penetrated through the adhesive 133 can be almost completely blocked by the inorganic protective film 131.

However, due to an environmental problem in the manufacturing process, the inorganic protective film 131 may not properly perform the function of preventing moisture permeation. This is a problem inevitably occurring in the manufacturing process which has been performed so far. To investigate the cause of the problem, the manufacturing process is as follows. Since the manufacturing method of the organic electroluminescence panel has been described above, the description will be focused on the sealing process by the front sealing method. 5A to 5D are cross-sectional views illustrating a method of fabricating an organic light emitting display device by a front sealing method according to the first embodiment. 5A to 5D are cross-sectional views showing the structure of the organic light emitting display device 150 by the front sealing method in order to show a problematic portion. FIG.

(Not shown) extending in a first direction on a transparent substrate 101, a data line (not shown) extending in a direction perpendicular to the gate line, and a data line A TFT 195 including a gate electrode 191a, a gate insulating film 199, a channel layer 197, a source electrode 193a, and a drain electrode 193b is formed at a corner portion. A first electrode 103 connected to the drain electrode 193b is formed in a pixel region formed by crossing the gate line and the data line on the substrate 101 on which the TFT 195 is formed. An organic EL layer 105 and a second electrode 107 are sequentially deposited on the first electrode 103 to form the organic light emitting device 115 to form the panel 110 for the organic light emitting display device. It completes. (Fig. 5A)

A protective film 131 is coated on the entire surface of the panel 110 with an inorganic material. At this time, since the vacuum state can not be completely maintained in the process, the process proceeds most of the time when the impurity particles 141 remain on the panel 110. In this case, the protective film 131 is coated with the impurity particles 141 remaining. (Fig. 5B)

Then, the adhesive 133 is applied to the entire surface of the panel 110, and the adhesive 133 is bonded to the sealing plate 135 to complete the organic light emitting display device 150 by the front sealing method. (Fig. 5C)

After the organic light emitting display device 150 having the front encapsulation structure is manufactured with the impurity particles 141 remaining on the panel 110, the moisture diffusion paths 151 Accordingly, a problem may occur that the impurities penetrate into the device on the panel 110 through the gap between the protective film 131 and the impurity particles 141.

Therefore, the side sealing layer 137 is formed on the side surface of the organic light emitting display device 150 with a waterproof material or a metallic material. A waterproof material may be deposited, or a metal layer may be attached. (Figure 5d)

A second embodiment of the present invention will be described with reference to Figs. 6A to 6F. 6A to 6F are cross-sectional views illustrating a method of fabricating an organic light emitting display device by a front sealing method according to a second embodiment of the present invention.

(Not shown) extending in a first direction on a transparent substrate 101, a data line (not shown) extending in a direction perpendicular to the gate line, and a data line A TFT 195 including a gate electrode 191a, a gate insulating film 199, a channel layer 197, a source electrode 193a, and a drain electrode 193b is formed at a corner portion. A first electrode 103 connected to the drain electrode 193b is formed in a pixel region (not shown) formed by crossing the gate line and the data line on the substrate 101 on which the TFT 195 is formed. An organic EL layer 105 and a second electrode 107 are sequentially deposited on the first electrode 103 to form the organic light emitting device 115 to form the panel 110 for the organic light emitting display device. It completes. Impurity particles 141 may be present on the surface of the panel 110. Since the present invention does not focus on manufacturing the panel 110 for an organic light emitting display device, detailed description of the structure and manufacturing method of the panel 110 will be omitted. Therefore, elements not shown in the drawings or the drawings may be further added. (Fig. 6A)

In the state where the material particles 141 are present, the inorganic material is applied to the entire surface to form a primary protective film 161 having a thickness of about 0.5 to 1 탆. It is most preferable to form about one-half of the entire protective film thickness set in the process design. This is because a secondary protective film is formed later in the same thickness as the primary protective film 161 because the thickness of the entire protective film must be the same as the thickness set in the process design so as not to affect the entire process tact time. (Fig. 6B)

In this state, the impurity particles 141 are removed on the entire surface of the panel 110 by a dry cleaning method. At this time, the dry cleaning method used is ultrasonic cleaning method (Ultrasonic Clean) in which clean air or an inert gas such as argon (Ar) is injected at a high frequency near the substrate. In the case of ultrasonic cleaning, more than 98% of most particles that may remain on the panel 110 can be removed. After the impurity particles 141 are removed as described above, the impurity particles 141 cause a crater 163, which is a defect portion to which the inorganic protective material is not applied. (Fig. 6C)

If the impurity particles 141 are cleaned by the ultrasonic cleaning method before forming the primary protective film 161, not only the impurity particles 141 but also the display elements formed on the panel 110 may fall off during the cleaning process have. The display elements are protected by the primary protective film 161 and only the impurity particles 141 are selectively removed by performing the ultrasonic cleaning method after the primary protective film 161 is formed in the state that the impurity particles 141 are present. .

In this state, an inorganic material is applied to the entire surface of the panel 110 to form a second protective film 171 with a thickness of about 0.5 to 1 mu m. Most preferably, the remaining approximately one-half of the total thickness is formed to complete the entire protective film thickness set in the process design. Then, the portion of the crater 163, which is a defect portion in which the primary protective film 161 is not formed by the impurity particles 141, is covered and protected by the secondary protective film 171. On the other hand, the portion protected by the primary protective film 161 has a structure in which the secondary protective film 171 is further formed. Therefore, when the surface of the panel 110 formed up to the secondary protective film 171 is seen, a crater step coverage 173 is formed in the secondary protective film 173 covering the crater 163 . (Fig. 6D)

As described above, since the total coating thickness of the primary protective film 161 and the secondary protective film 171 is about 1 to 2 占 퐉, which is equal to the thickness of the protective film set in the process design, It does not affect. However, when the process is designed considering the dry time according to the dry cleaning process, the improved production yield can be obtained while maintaining the conventional process tact time.

Finally, the adhesive 133 is applied to the entire surface of the panel 110 and joined with the sealing plate 135 to complete the organic light emitting display device 150 according to the present invention. (Fig. 6E).

In Example 2, although the same problem as in Example 1 is solved, there is a small probability that impurities are not removed completely, but there is still a possibility that the same problem may occur. Therefore, the side sealing layer 137 is formed on the side surface of the organic light emitting display device 150 with a waterproof material or a metallic material. A waterproof material may be deposited, or a metal layer may be attached. (Figure 6f)

As described above, in the present invention, it is important to further form the side sealing layer on the side surface in the organic light emitting display device by the front sealing method. Accordingly, embodiments of a method of forming a side sealing layer in the present invention will be described in detail with reference to the accompanying drawings. 7A to 7C are cross-sectional views illustrating a process of forming a side-sealing layer according to a third embodiment of the present invention.

First, a plurality of organic light emitting display devices 150 are vertically stacked as shown in Figs. 5C and 6E. It is preferable to laminate them in the same direction. Further, between each unit organic light emitting display device 150, it is preferable to further include a separation layer 200 for facilitating individual separation later. (Fig. 7A)

A plurality of organic light emitting display devices 150 are deposited on a side surface of the stacked layer 200 with a resin material, a waterproof epoxy material, or a metal material. As a result, the side sealing layer 137 is formed on all the plurality of organic light emitting display devices 150. (Fig. 7B)

Now, the stacked organic light emitting display devices 150 are separated into individual display devices. At this time, the organic light emitting display devices 150 can be easily separated by the separation layer 200 interposed between the individual organic light emitting display devices 150. As a result, an organic light emitting display device including the side sealing layer 137 as shown in Fig. 5D or 6F can be obtained. (Fig. 7C)

Hereinafter, a method of forming the side sealing layer according to the fourth embodiment of the present invention will be described with reference to the accompanying drawings. 8A to 8B are cross-sectional views illustrating a process of forming the side sealing layer according to the fourth embodiment of the present invention.

First, an organic light emitting display device 150 as shown in Figs. 5C and 6E is completed. Then, a metallic bowl (Metal Can) 300 in the shape of a bowl capable of accommodating the organic light emitting display device 150 is prepared. The bottom surface of the metal container 300 may have a width corresponding to the bottom surface of the organic light emitting display device 150 and the height of the side surface may have a height corresponding to the thickness of the organic light emitting display device 150. (Fig. 8A)

An adhesive material (210) is applied to the inside of the metal bowl (300). The adhesive material 210 is preferably an adhesive material having moisture-proof and radiation-preventing properties. The side surface sealing layer 137 is formed on the side surface of the organic light emitting display device 150 by placing the organic light emitting display device 150 in the metal container 300 and curing the adhesive material 310. That is, it is a side portion of the metal bowl 300. At this time, it is preferable that the non-light emitting surface is made to adhere to the bottom surface of the metal vessel 300 so that the light emitting surface of the organic light emitting display device 150 is exposed. (Fig. 8B)

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

1 is a plan view schematically showing a structure of a panel for an active matrix organic light emitting display device;

2 is a cross-sectional view showing the structure of a panel for an organic light emitting display device cut along the cutting line A-A 'in FIG. 1;

3 is a sectional view showing a structure of an organic light emitting display device by a conventional hollow sealing method.

4 is a cross-sectional view illustrating the structure of an organic light emitting display device by a front sealing method according to the present invention.

5A to 5D are cross-sectional views illustrating a method of fabricating an organic light emitting display device by a front sealing method according to the first embodiment.

6A to 6F are cross-sectional views illustrating a method of fabricating an organic light emitting display device by a front sealing method according to a second embodiment of the present invention.

7A to 7C are cross-sectional views illustrating a process of forming a side-sealing layer according to a third embodiment of the present invention.

8A to 8B are cross-sectional views illustrating a process of forming the side-sealing layer according to the fourth embodiment of the present invention.

Description of the Related Art

10, 110: panel for organic electroluminescence display device

1, 101: transparent substrate 3, 103: first electrode

5, 105: organic EL layer 7, 107: second electrode

9: pixel region 15, 115: organic light emitting element

91: gate wiring 93: data wiring

91a and 191a: gate electrodes 93a and 193a: source electrodes

93b, 193b: drain electrode 95, 195: TFT

97, 197: semiconductor layer 99, 199: gate insulating film

30: Organic light emitting display device by a hollow sealing method

21: Seal material 23: Shield cap

25: moisture absorption material 31: protective film

150: organic electroluminescent display device by the front sealing method

133: adhesive 135: sealing plate

141: Impurity particle 151: Moisture diffusion path

161: primary protective film 163: crater

171: Secondary protective film 173: Crater step coverage

200: separation layer 137: side sealing layer

300: metal bowl 310: adhesive material

Claims (14)

Forming a display element on the substrate to form a display panel; Forming a protective film on the entire surface of the display panel; Applying an adhesive to the entire surface of the display panel on which the protective film is formed; Attaching an encapsulation plate to the front surface of the display panel through the adhesive to form a display device; Loading a plurality of the display devices with the separation layer interposed therebetween; And a waterproof epoxy material is deposited on the side surfaces of the plurality of display devices stacked together with the separation layer to form a side surface of the substrate, a side surface of the sealing plate, Forming a side-sealing layer so as to cover and contact with all; And separating the stacked plurality of display devices using the separation layer. delete delete delete delete Forming a display element on the substrate to form a display panel; Forming a protective film on the entire surface of the display panel; Applying an adhesive to the entire surface of the display panel on which the protective film is formed; Bonding the sealing plate to the front surface of the display panel through the adhesive; Preparing a metal container having a bottom surface corresponding to the surface area of the display panel and a side surface corresponding to the thickness of the display panel; Applying an adhesive material to the inside of the metal bowl; Inserting the display panel into the metal vessel; And curing the adhesive material to form a side sealing layer so as to cover and cover all of the side faces of the substrate, the side face of the sealing plate and the side face of the display panel, A method of manufacturing a display device. A display panel on which display elements are arranged on a substrate; A protective film covering the front surface of the display panel; An adhesive applied on the entire surface of the panel on the protective film; An encapsulation plate attached to the front surface of the panel via the adhesive; And a metal bowl having a bottom surface corresponding to the display panel area and a side surface portion corresponding to the display panel thickness, Wherein the side portion includes a side sealing layer which is in contact with and covers both sides of the substrate, side surfaces of the sealing plate, and side surfaces of the adhesive on the side of the display panel. 8. The method of claim 7, The protective film may be formed, A first protective layer covering the entire surface of the display panel and having a crater portion scattered irregularly to expose a part of the display panel; And a second protective layer covering the first protective layer and covering a part of the display panel exposed through the crater portion. 9. The method of claim 8, Wherein the second protective film covering the crater portion further includes a step coverage portion along the crater shape. 9. The method of claim 8, Wherein at least one of the first passivation layer and the second passivation layer has a thickness of 0.5 占 퐉 to 1 占 퐉. 9. The method of claim 8, The organic light emitting display device characterized in that at least one of the first protective film and second protective film comprises an inorganic material of SiNx, SiOx, SiON, and at least one of Al ₂ O _3. 9. The method of claim 8, Wherein the side sealing layer comprises any one of a resin material, a metal material, and a waterproof epoxy material. delete 9. The method of claim 8, The display panel comprising: An anode electrode extending in a first direction on the substrate; A cathode electrode extending in the second direction on the anode electrode; And an organic light emitting layer interposed between the anode electrode and the cathode electrode in a region where the anode electrode and the cathode electrode cross each other.

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