KR101582481B1 - Substrate processing apparatus, cover member therefor, tray therefor and substrate processing method - Google Patents
Substrate processing apparatus, cover member therefor, tray therefor and substrate processing method Download PDFInfo
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- KR101582481B1 KR101582481B1 KR1020100108960A KR20100108960A KR101582481B1 KR 101582481 B1 KR101582481 B1 KR 101582481B1 KR 1020100108960 A KR1020100108960 A KR 1020100108960A KR 20100108960 A KR20100108960 A KR 20100108960A KR 101582481 B1 KR101582481 B1 KR 101582481B1
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Abstract
The present invention provides a process chamber comprising: a process chamber for forming a processing space for substrate processing; A substrate support which is provided inside the process chamber and supports a tray in which a plurality of substrates are placed in a rectangular array of n × m (n, m is a natural number of 2 or more); And a cover portion including a cover plate having a plurality of openings formed in the upper and lower portions and spaced apart from the substrate to cover the substrate and a support portion for supporting the cover plate so as to be spaced apart from the substrate, The substrate processing apparatus according to any one of claims 1 to 3, wherein the substrate processing apparatus is configured such that: at a corner portion of a tray corresponding to a vertex of at least one of vertexes of a rectangular array formed by arranging a plurality of substrates, A dummy substrate is seated on the substrate processing apparatus.
Description
The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that performs substrate processing such as etching a substrate, a cover member used therein, a tray used therein, and a substrate processing method.
The substrate processing apparatus includes a process chamber that forms a closed process space, and a substrate support that is installed in the process chamber and on which the substrate is mounted. The surface of the substrate is etched by applying power while injecting the process gas into the process space And then performing the substrate processing.
The substrates to be processed by the substrate processing apparatus include semiconductor wafers, glass substrates for LCD panels, and solar cell substrates.
As an example of the above-mentioned substrate processing apparatus, a cover member having a plurality of openings formed on the upper side of a substrate by placing a plurality of substrates for a solar cell using a tray on the substrate support is dumped to form a fine concavo- There is a substrate processing apparatus that performs substrate processing so as to form a substrate, which may vary depending on the characteristics of the device, and in particular, to lower the reflectance of light by the substrate in order to increase the efficiency of the solar cell device.
As described above, the substrate processing apparatus for forming fine irregularities on the surface of the substrate by covering the cover member forms the irregularities on the surface of the substrate through the following steps.
The substrate processing apparatus according to the related art forms plasma in the processing space when power is applied while gas is being injected into the processing chamber, and a part of the plasma and the gas pass through the opening of the cover member to etch the surface of the substrate.
And some of the compounds formed by the substrate etching float in the clogging space between the bottom surface of the cover member and the substrate and some of the remaining compounds and suspended compounds adhere to the surface of the substrate and act as a mask in the substrate etching process Thereby promoting the formation of fine irregularities on the surface of the substrate.
Here, the cover member of the conventional substrate processing apparatus includes a cover plate having a plurality of openings formed therein, and a support portion provided at an edge of the cover plate so that the cover plate can be spaced apart from the substrate.
On the other hand, in the conventional substrate processing method of forming micro concavity and convexity using the cover member, a difference may occur in the density of the compound depending on the position such as the central portion and the edge portion of the cover member, especially near the vertex, Has a problem in that it affects the formation of fine concavities and convexities on the surface of the substrate, causing a color difference of the substrate.
Particularly, in the substrate processing method performed by the conventional substrate processing apparatus, as shown in FIG. 6A, a significant color difference occurs on the substrate surface after the substrate processing in the vicinity of the vertex among the substrates mounted in the rectangular arrangement.
The color difference of the substrate surface means a difference in reflectance, and the effect of reducing the reflectance due to the formation of fine irregularities of the substrate can not be sufficiently achieved, thereby lowering the efficiency of the solar cell device.
In addition, there is a problem that the substrate having a color difference is not easy to be sold in the market because it is visually bad and is mistaken as a defective product, which lowers the reliability of the product in the market and is distributed at a lower price than the colorless substrate.
It is an object of the present invention to provide a substrate processing apparatus capable of preventing a color difference from occurring on a surface of a substrate positioned at a vertex among substrates mounted on a tray in a rectangular array, And a tray and a substrate processing method used therefor.
The present invention has been made in order to achieve the above-mentioned object of the present invention, and it is an object of the present invention to provide a process chamber for forming a process space for processing a substrate, A substrate support which is provided inside the process chamber and supports a tray in which a plurality of substrates are placed in a rectangular array of n × m (n, m is a natural number of 2 or more); And a cover portion including a cover plate having a plurality of openings formed in the upper and lower portions and spaced apart from the substrate to cover the substrate and a support portion for supporting the cover plate so as to be spaced apart from the substrate, The substrate processing apparatus according to any one of claims 1 to 3, wherein the substrate processing apparatus is configured such that a corner portion of a tray corresponding to a vertex of at least one of vertices of a rectangular array formed by arranging a plurality of substrates, A dummy substrate is seated on the substrate processing apparatus.
The corner dummy substrate may be seated over at least one substrate with respect to the vertex.
A corner receiving groove into which a part of the corner dummy substrate is inserted in the depth direction of the tray may be formed on the upper surface of the tray so as to prevent the position of the corner dummy substrate from moving when the tray is moved.
At the edges of the rectangular array of the plurality of substrates, at least one outer dummy substrate including the same components as those of the substrate may be additionally provided.
An outer housing groove may be formed on an upper surface of the tray so that a part of the outer dummy substrate is inserted in the depth direction of the tray to prevent the outer dummy substrate from moving when the tray is moved.
The width of the outer dummy substrate may be 5 to 15% of the length of the short side of the substrate, and the width of the corner dummy substrate may be 10 to 80% of the length of the short side of the substrate.
The width of the corner dummy substrate may be 15 to 30% of the short side length of the substrate.
The width of the outer dummy substrate may be 5 to 20% of the length of the short side of the substrate.
The sum of the width of the outer dummy substrate and the width of the corner dummy substrate may be 15 to 100% of the short side length of the substrate.
The sum of the width of the outer dummy substrate and the width of the corner dummy substrate may be 15 to 35% of the short side length of the substrate.
The width of the corner dummy substrate may be 10 to 80% of the short side length of the substrate.
Wherein the supporting portion has a substantially rectangular shape corresponding to a rectangular array of the plurality of substrates, the inner surface of the supporting portion being equally spaced from the edge of the outer dummy substrate, And can be installed at a distance from the corner dummy substrate.
The outer dummy substrate may have a portion corresponding to the corner dummy substrate integrated with the corner dummy substrate.
The support portion may have a substantially rectangular shape corresponding to a rectangular array of the plurality of substrates, the inner surface of the support portion may be recessed outward at a portion corresponding to the corner dummy substrate.
The supporting portion may have a substantially rectangular shape formed on the outer surface, and a dummy substrate receiving groove may be formed in a portion corresponding to the corner dummy substrate and formed outwardly concave.
Crystalline silicon may be used for the substrate and the corner dummy substrate.
The present invention also discloses a cover member which is a cover portion of the substrate processing apparatus.
The present invention also discloses a tray of the substrate processing apparatus.
According to another aspect of the present invention, there is provided a substrate processing method for processing a substrate by the substrate processing apparatus, wherein the substrate processing method comprises the steps of: And the substrate processing is carried out while one or more corner dummy substrates including the same components are placed.
The substrate processing apparatus, the cover member, the tray used therein, and the substrate processing method according to the present invention are characterized in that the substrate processing apparatus according to the present invention includes a plurality of substrates By performing the substrate processing in a state in which the corner dummy member is seated, there is an advantage that the color difference of the substrate positioned at the corner of the tray can be improved and the quality, efficiency and productivity of the substrate can be greatly improved.
Particularly, in the substrate processing apparatus according to the present invention, the cover member used therein may be formed by forming a dummy substrate receiving groove formed outwardly concavely in a portion corresponding to the corner dummy substrate in the supporting portion constituting the cover portion, It is possible to greatly improve the quality, efficiency and productivity of the substrate without increasing the manufacturing cost of the apparatus.
1 is a cross-sectional view showing a substrate processing apparatus according to the present invention.
Fig. 2 is a plan view of the tray, the substrates mounted on the tray and the support of the cover in Fig. 1;
FIG. 3A is a partial plan view showing the supports in the cover portion and the substrates mounted on the tray, the tray in FIGS. 1 and 2. FIG.
FIG. 3B is a sectional view in the III-III direction in FIG. 3A.
Fig. 4 is a partial plan view showing a tray showing a case having another cover portion modified in the substrate processing apparatus of Fig. 1, substrates mounted on the tray, and supports of the cover portion. Fig.
FIG. 5 is a partial plan view showing a tray showing a case with another cover portion modified in the substrate processing apparatus of FIG. 1, substrates mounted on the tray, and supports of the cover portion.
6A and 6B are conceptual diagrams showing a silicon substrate subjected to substrate processing by a conventional substrate processing apparatus and a silicon substrate processed by a substrate processing apparatus according to the present invention, respectively.
Hereinafter, a substrate processing apparatus, a cover member, a tray used therein, and a substrate processing method according to the present invention will be described in detail with reference to the accompanying drawings. The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the general description, serve to explain the principles of the invention.
FIG. 1 is a cross-sectional view showing a substrate processing apparatus according to the present invention, and FIG. 2 is a plan view showing substrates mounted on a tray and a tray in FIG.
As shown in FIG. 1, a substrate processing apparatus according to the present invention includes a
The
When the
The
The
The
The
A
The
Here, the lower electrode is grounded to the
As shown in FIGS. 1, 2, 4 and 5, a
At this time, the
The distance between the bottom surface of the
The
The
Various materials may be used for the
The fine concavities and convexities formed on the surface of the
The
In addition, the
The
The
The
One or more anti-sagging posts (not shown) may be installed between the
The anti-sagging post may have any structure as long as it keeps the gap between the bottom surface of the
Meanwhile, the
The outer
It is preferable that the
As described above, the concavities and convexities formed on the surface of the
Therefore, as shown in FIGS. 2, 3A and 3B, the substrate processing apparatus according to the present invention includes a tray (not shown) corresponding to a vertex of at least one of vertexes of a rectangular array formed by disposing a plurality of
The
The
Of course, the
The reason why the
In contrast, by using the
The width W1 of the
The width W1 of the outer dummy substrate and the width of the corner dummy substrate W2 can be selected according to design and design.
That is, the width W1 of the outer dummy substrate may be 5 to 20% of the short side length W0 of the substrate.
The width W2 of the corner dummy substrate may be 10 to 80% of the short side length W0 of the
Further, the width W1 of the outer dummy substrate and the width of the corner dummy substrate W2 can be also determined by the sum.
That is, the sum of the width W1 of the outer dummy substrate and the width W2 of the corner dummy substrate is preferably 15 to 100% of the short side length W0 of the substrate, %.
Here, the numerical values of the widths W1 and W2 of the
However, the reason why the widths W1 and W2 of the
It is preferable that the widths W1 and W2 of the
The
The
3B, a portion of the
When the
However, if the size of the
2 to 3B, the supporting
In particular, as shown in FIGS. 2 and 3A, the
4, the
5, the supporting
At this time, each of the
As described above, the
Meanwhile, the substrate processing method performed by the substrate processing apparatus having the above-described configuration can be performed as follows.
That is, the substrate processing method according to the present invention is a method for processing a substrate on a plurality of
The
In addition, the substrate processing may be performed by forming at least one
As described above, the substrate can be processed in various ways, and it can be a process of forming a large number of fine irregularities on the surface of a crystalline silicon substrate, particularly a polycrystalline silicon substrate, used as a solar cell by reactive ion etching as described above.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.
10: substrate 30: tray
100: process chamber 200: cover part
210: cover plate 220:
310: outer dummy substrate 320: corner dummy substrate
Claims (19)
Wherein at least one outer dummy substrate is provided on the upper surface of the tray, the substrate including a component such as a component of the substrate outside the edge of the rectangular array of the plurality of substrates,
Wherein the substrate processing apparatus includes a plurality of substrates, a plurality of substrates arranged on the substrate, and a plurality of substrates arranged on the substrate, Wherein the corner dummy substrate is seated.
Wherein the corner dummy substrate is seated over at least one substrate with respect to the vertex of the tray.
And a corner receiving groove into which a part of the corner dummy substrate is inserted in a depth direction of the tray is formed on an upper surface of the tray so as to prevent the corner dummy substrate from moving when the tray is moved.
Wherein the upper surface of the tray is formed with an outer receiving groove into which a part of the outer dummy substrate is inserted in a depth direction of the tray so as to prevent a positional shift of the outer dummy substrate when the tray is moved.
Wherein the substrate has a rectangular shape, the width of the outer dummy substrate is 5 to 15% of the length of the short side of the substrate, and the width of the corner dummy substrate is 10 to 80% of the short side length of the substrate. / RTI >
Wherein the width of the corner dummy substrate is 15 to 30% of the short side length of the substrate.
Wherein the width of the outer dummy substrate is 5 to 20% of the length of the short side of the substrate.
Wherein the sum of the width of the outer dummy substrate and the width of the corner dummy substrate is 15 to 100% of the short side length of the substrate.
Wherein the sum of the width of the outer dummy substrate and the width of the corner dummy substrate is 15 to 35% of the short side length of the substrate.
Wherein a width of the corner dummy substrate is 10 to 80% of a length of the short side of the substrate.
Wherein the support portion has a rectangular shape corresponding to a rectangular array of the plurality of substrates,
The inner surface of the support portion has the same distance from the edge of the outer dummy substrate,
Wherein each corner dummy substrate is spaced apart from a neighboring corner dummy substrate.
Wherein a portion of the outer dummy substrate corresponding to the corner dummy substrate is provided integrally with the corner dummy substrate.
Wherein the support portion has a rectangular shape corresponding to a rectangular array of the plurality of substrates,
Wherein the recessed portion is recessed outward at a portion corresponding to the corner dummy substrate.
The supporting portion has a rectangular shape formed by the outer surface,
And a dummy substrate receiving groove formed outwardly concave at a portion corresponding to the corner dummy substrate.
Wherein the substrate and the corner dummy substrate are crystalline silicon.
The substrate processing method includes placing at least one corner dummy substrate including a component identical to a component of the substrate on a corner of a tray corresponding to at least one of apexes of a rectangular array formed by arranging a plurality of substrates Wherein the substrate processing is carried out in the substrate processing apparatus.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100108960A KR101582481B1 (en) | 2010-11-04 | 2010-11-04 | Substrate processing apparatus, cover member therefor, tray therefor and substrate processing method |
| CN201110317379.5A CN102569125B (en) | 2010-11-04 | 2011-10-18 | Substrate processing apparatus and substrate processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100108960A KR101582481B1 (en) | 2010-11-04 | 2010-11-04 | Substrate processing apparatus, cover member therefor, tray therefor and substrate processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120047413A KR20120047413A (en) | 2012-05-14 |
| KR101582481B1 true KR101582481B1 (en) | 2016-01-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100108960A KR101582481B1 (en) | 2010-11-04 | 2010-11-04 | Substrate processing apparatus, cover member therefor, tray therefor and substrate processing method |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101582481B1 (en) |
| CN (1) | CN102569125B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102084961B1 (en) * | 2013-10-10 | 2020-03-06 | 주식회사 디엠에스 | Tray assembly for dry etching and Dry etching apparatus using the same |
| JP6494443B2 (en) * | 2015-06-15 | 2019-04-03 | 東京エレクトロン株式会社 | Film forming method and film forming apparatus |
| CN112133654B (en) * | 2016-07-18 | 2024-07-09 | 圆益Ips股份有限公司 | Alignment module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005191118A (en) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | Etching apparatus |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5352294A (en) * | 1993-01-28 | 1994-10-04 | White John M | Alignment of a shadow frame and large flat substrates on a support |
| KR101444873B1 (en) * | 2007-12-26 | 2014-09-26 | 주성엔지니어링(주) | System for treatmenting substrate |
| KR20100004194A (en) * | 2008-07-03 | 2010-01-13 | 주성엔지니어링(주) | Tary and dry etching apparatus using the same |
| KR100903306B1 (en) * | 2008-10-08 | 2009-06-16 | 주식회사 아이피에스 | Vaccum processing apparatus |
| KR101522633B1 (en) * | 2009-04-08 | 2015-05-22 | 주식회사 원익아이피에스 | Vaccum processing apparatus |
-
2010
- 2010-11-04 KR KR1020100108960A patent/KR101582481B1/en active IP Right Grant
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2011
- 2011-10-18 CN CN201110317379.5A patent/CN102569125B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005191118A (en) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | Etching apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102569125A (en) | 2012-07-11 |
| CN102569125B (en) | 2015-04-01 |
| KR20120047413A (en) | 2012-05-14 |
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