KR101377766B1 - Coating method and coating apparatus - Google Patents

Abstract

In the spinless coating method, the present invention prevents the influence of tolerances and errors of substrate size from appearing in the outline and film thickness profile of the coating film formed on the substrate. The alignment mechanism 200 contacts a plurality of substrates G, for example eight alignment pins 202A to 208B, at four corners of the substrate G carried in the carry-in region M ₁ of the stage 76. ) Is aligned. At that time, in the coating scanning direction (X direction), the distance δX at which the movable alignment pins 204A and 204B are moved until the substrate G is pushed and attached to the fixed alignment pins 202A and 202B in the existing position. The measured value of the length of the board | substrate G is calculated | required from this movement distance measured value. Then, the coating parameters are subjected to correction by applying a predetermined parameter based on the measured value of the substrate length to cancel the error of the substrate size during the coating scan.

Description

[0001] COATING METHOD AND COATING APPARATUS [0002]

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the structure of the application | coating development process system applicable of this invention.

2 is a flowchart showing a processing procedure in the coating and developing processing system.

3 is a plan view schematically illustrating the entire configuration of a resist coating unit and a reduced pressure drying unit in the coating and developing processing system.

4 is a perspective view showing the overall configuration of the resist coating unit.

Fig. 5 is a schematic front view showing the overall configuration of the resist coating unit.

Fig. 6 is a plan view showing an example of an arrangement pattern of the jet port and the suction port in the stage application area in the resist coating unit.

It is a partial cross-sectional side view which shows the structure of the board | substrate conveyance part in the said resist coating unit.

8 is an enlarged cross-sectional view illustrating the structure of a holding unit of the substrate transfer unit in the resist coating unit.

It is a perspective view which shows the structure of the pad part of the board | substrate conveyance part in the said resist coating unit.

It is a perspective view which shows one modification of the holding part of the board | substrate conveyance part in the said resist coating unit.

It is a figure which shows the structure of the nozzle raising mechanism, the compressed air supply mechanism, and the vacuum supply mechanism in the said resist coating unit.

Fig. 12 is a block diagram showing the structure of a resist liquid supply mechanism in the resist coating unit.

It is a perspective view which shows the structure of the principal part of the alignment mechanism in the said resist coating unit.

It is a top view for demonstrating the effect | action of the substrate alignment and substrate length measurement in the said resist coating unit.

It is a side view which shows the structure and operation | movement (one step) of the pin drive part of the alignment mechanism in the said resist application unit.
It is a side view which shows the structure and operation | movement (one step) of the pin drive part of the alignment mechanism in the said resist application unit.

Fig. 16 is a block diagram showing the main configuration of the control system in the resist coating unit.

Fig. 17 is a flowchart showing the main procedure of the coating processing operation in the resist coating unit.

FIG. 18 is a waveform diagram showing a discharge pressure control waveform and a scan speed control waveform used for coating scan in the resist coating unit. FIG.

It is a side view which shows a state in which a resist coating film is formed in the coating scan of embodiment.

It is a top view which shows a state in which a resist coating film is formed in the coating scan of embodiment.

It is a perspective view which shows the state of each part on the stage at the time of the application | coating scan of embodiment.

It is a figure (side view and top view) which shows typically the pattern of the resist coating film on the board | substrate after the application | coating scan of embodiment is complete | finished.

<Explanation of symbols for the main parts of the drawings>

40: resist coating unit (CT)

75: nozzle lifting mechanism

76: stage

78: resist nozzle

78a: discharge port

84 substrate transfer unit

100: conveying drive unit

170: resist liquid supply mechanism

200: alignment mechanism

202A, 202B: Fixed alignment pin in X direction

204A, 204B: X-direction movable alignment pin

206A, 206B, 208A, 208B: Y-direction movable alignment pin

210: pin drive unit

220: position sensor

230: controller

The present invention relates to a coating method and a coating apparatus for forming a coating film of a processing liquid on a substrate to be treated using an elongated nozzle.

In the photolithography process in the manufacturing process of a flat panel display (FPD) such as an LCD, a spinless which scans an elongated resist nozzle having a slit-shaped discharge port and applies a resist liquid onto a target substrate (such as a glass substrate). The coating method of is used.

The spinless method is, for example, as described in Patent Literature 1, by horizontally loading a substrate on a mounting table or stage of an adsorption holding type, for example, between a substrate on a stage and a discharge port of an elongated resist nozzle. A small coating gap of is set, and the resist liquid is discharged and coated on the substrate in a strip shape while moving the resist nozzle in the scanning direction (usually a horizontal direction perpendicular to the nozzle longitudinal direction) above the substrate. The resist coating film can be formed on a board | substrate with a desired film thickness only by moving an elongate resist nozzle from one end of a board | substrate to the other end once.

In recent years, as a spinless method advantageous for large substrates, for example, as disclosed in Patent Literature 2, a stage for supporting a substrate is floated, and the substrate is conveyed in a horizontal direction with the substrate floating in the air on a stage, and a predetermined coating is performed. A floating conveying method has been prevalent in which a resist liquid is applied from one end on the substrate to the other end by discharging the resist liquid in a band toward the substrate passing directly below the elongated resist nozzle provided above the stage at the position.

In any of the above nozzle movement methods and floating conveyance methods, the substrate is positioned on the stage before the start of the coating scan in order to match the lines of the resist coating film formed on the substrate by one coating scan to the shape of the substrate. have. Regarding the rectangular substrate for FPD, the pressing members, such as pins, are pushed onto four sides of the substrate from all four directions in the horizontal plane to align the direction of the substrate in parallel in the direction of the coating scan, and the center of the substrate to the stage or the elongated resist nozzle. Can be centered (centered). By such an alignment function, the outline of the resist coating film enters only a predetermined distance from the edge of the substrate to be parallel to each side of the substrate.

[Patent Document 1] Japanese Patent Laid-Open No. 10-156255

[Patent Document 2] Japanese Patent Laid-Open No. 2005-244155

In general, a virtual region boundary line is formed at the periphery of the upper surface of the substrate (to-be-processed surface) dividing a product region and a non-product region or a margin region. In the resist coating process, the product area inside the area boundary line is a film thickness guarantee area which must guarantee the film thickness of the resist coating film. Therefore, the resist coating film in a product area | region may be formed in the film thickness within a specification or an allowable range, and it does not matter how a resist coating film deviates from an allowable range in the margin area outside an area boundary line. Above all, in the spinless method, the resist coating film tends to be active beyond the permissible range in the margin region, and is particularly easy to be greatly activated near the start end and end of the coating scanning direction. Therefore, the start position and the end position of the coating scan are set to the outside of the area boundary as much as possible to set the substrate edge set so that the solidity of such a resist coating film does not reach the product region.

However, there are tolerances in the external dimensions of the substrate, for example, a tolerance of ± 1 to 2 mm is obtained if the long side size is a substrate for FPD of more than 2 m. In addition, the warped state of the substrate also becomes an error in the external dimensions of the substrate. Conventionally, the outline and film thickness profile of a resist coating film were fully influenced by the tolerance and the error of such a board | substrate external dimension. In particular, in the coating scan direction, the starting position or the ending position of the coating scan is shifted by the tolerance or error of the substrate size so that the height exceeding the allowable value near the start end or near the end of the resist coating film as described above is a film thickness guarantee region. In some cases, the resist coating liquid protrudes out of the substrate edge to contaminate the stage.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems of the prior art, and in the spinless coating method, the coating treatment is performed so that the influence of the tolerances and errors of the substrate size does not appear in the outline or film thickness profile of the coating film formed on the substrate. It is an object of the present invention to provide a coating method and a coating apparatus, which are intended to improve the reliability and the product ratio.

In order to achieve the above object, in the coating method of the present invention, the nozzles of the processing target and the nozzle of the elongated shape face each other almost horizontally with a small gap, and the nozzles are discharged from the nozzles with respect to the substrate. Is a coating method of forming a coating film of the processing liquid on the substrate by carrying out a scanning scan to move the substrate in a relatively horizontal direction, wherein the substrate is moved in a one-dimensional direction parallel to the plate surface or at a predetermined place prior to the coating scanning; Moving the substrate in two-dimensional directions to perform the alignment of the substrate, measuring the size of the substrate in a predetermined direction at the time of positioning the substrate, and performing the coating scan according to the measured value of the substrate size. It has a process of correcting a predetermined parameter.

Moreover, the coating apparatus of this invention is the stage which supports a to-be-processed board | substrate substantially horizontally, and the alignment which performs the alignment of the said board | substrate by moving the said board | substrate on the said stage to the one-dimensional direction or two-dimensional direction parallel to the plate surface. A coating scan for opposing the mechanism and the ejected openings of the elongated nozzles to a position substantially horizontally with a slight gap with respect to the positioned substrate, and moving the nozzles in a relatively horizontal direction while discharging the processing liquid from the nozzles. And a coating processing unit for forming a coating film of the processing liquid on the substrate, a substrate size measuring unit measuring the size of the substrate in a predetermined direction when the substrate is aligned, and a measured value of the substrate size According to the predetermined parameters used in the coating processing unit for the coating scan It has a parameter correction part to correct.

In the present invention, prior to the spin scan coating application, the size of the substrate is measured in a predetermined direction by using one in which a portion of the substrate is aligned to a predetermined reference position when the substrate is aligned. Then, the coating scanning is executed after correcting the predetermined parameter for coating scanning on the basis of the substrate size measured value. Thereby, the tolerance and error of a board | substrate size can be canceled at the time of an application | coating scan, and a coating film can be formed on a board | substrate with a desired outline or film thickness profile.

In the present invention, the position of the start point or end point of the coating scan, the distance from the start point of the coating scan to the end point, and the substrate, which are suitably set on the substrate as a parameter for coating scan that is corrected based on the substrate size measurement value. The timing at which the nozzle starts or ends the discharge of the processing liquid and the discharge duration can be selected. Alternatively, the correction parameter may be a scanning speed control waveform that defines the time characteristic of the relative movement speed of the nozzle with respect to the substrate and a discharge pressure control waveform that defines the time characteristic of the pressure for discharging the processing liquid from the nozzle in the coating scan. Do.

In a very suitable aspect of the present invention, the substrate is rectangular, and the coating scan is performed from the first side of the substrate toward the second side opposite to the substrate, and at the time of alignment of the substrate, the substrate is scanned from at least the first side. The length to the side of 2 is measured as a board | substrate size. In this case, in alignment of a board | substrate, it is preferable not only not only to alignment but also to board | substrate size measurement to match one of the 1st side and the 2nd side of a board | substrate to a predetermined reference position.

In a very suitable aspect of the present invention, the alignment mechanism includes a substrate support for movably supporting the substrate in one or two-dimensional directions, and first and second contacts capable of contacting side surfaces of the first and second sides of the substrate, respectively. It has a contact member of 2 and a moving part which moves at least one of the 1st and 2nd contact members until either one of the 1st and 2nd sides of a board | substrate is positioned in a predetermined reference position. Moreover, the board | substrate size measuring part requests the measured value of a board | substrate size based on the position of the 1st and 2nd contact member in the state in which the alignment of the board | substrate was completed.

As a very suitable aspect, the board | substrate size measuring part has a position sensor which detects the position of the other side in the state in which one of the 1st and 2nd sides of a board | substrate was positioned at the predetermined reference position, and is calculated | required by the position sensor The measured value of the board size is obtained based on the lost position information. Or as another very suitable aspect, it has a movement distance sensor which measures the movement distance from the original position before the start of alignment of a board | substrate to the traveling movement position at completion with respect to at least one of the 1st and 2nd contact member. The measured value of the board | substrate size is calculated | required based on the travel distance measured value acquired by a distance sensor.

EMBODIMENT OF THE INVENTION Hereinafter, the preferred embodiment of this invention is described with reference to an accompanying drawing.

1 shows a coating and developing treatment system as an example of the applicable structure of the coating method and the coating apparatus of the present invention. The present coating development processing system is installed in a clean room, for example, an LCD substrate is used as a substrate to be treated, and in the LCD manufacturing process, cleaning, resist coating, prebaking, developing, and postbaking in the photolithography process are performed. It is. Exposure processing is performed by an external exposure apparatus (not shown) provided adjacent to this system.

 The present coating development processing system is roughly divided into a cassette station (C / S) 10, a process station (P / S) 12, and an interface unit (I / F) 14.

The cassette station (C / S) 10 installed at one end of the system includes a cassette stage 16 capable of loading a predetermined number of cassettes C, which accommodate a plurality of substrates G, for example, up to four; The substrate (with respect to the cassette C on the stage 16 so as to be movable on the conveying path 17 and the conveying path 17 provided laterally on the cassette stage 16 and in parallel with the arrangement direction of the cassette C) The conveyance mechanism 20 which performs entry and exit of G) is provided. This conveyance mechanism 20 has a means which can hold | maintain the board | substrate G, for example, a conveyance arm, is operable by four axes of X, Y, Z, and (theta), and it is a process station (P / S) mentioned later ( The conveyance apparatus 38 and the board | substrate G of the 12 side can be transmitted.

The process station (P / S) 12 sequentially cleans the cleaning process unit 22, the coating process unit 24, and the development process unit 26 from the cassette station (C / S) 10 side. The relay unit 23, the chemical liquid supply unit 25, and the space 27 are provided in a horizontal line via (interposed).

The cleaning process unit 22 includes two scrubber cleaning units (SCRs) 28, two upper and lower ultraviolet irradiation / cooling units (UV / COL) 30, a heating unit (HP) 32, and cooling A unit (COL) 34 is included.

The coating process unit 24 includes a spinless resist coating unit (CT) 40, a reduced pressure drying unit (VD) 42, a top and bottom two-stage adhi- sion / cooling unit (AD / COL) 46, The upper and lower two-stage heating / cooling units (HP / COL) 48 and the heating units (HP) 50 are included.

The developing process unit 26 includes three developing units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 53, and heating units (HP) 55. have.

The conveyance paths 36, 51, 58 are provided in the center part of each process part 22, 24, 26 in the longitudinal direction, and the conveying apparatus 38, 54, 60 carries the conveyance paths 36, 51, 58, respectively. It moves along, and accesses each unit in each process part, and carries in / out of a board | substrate G, or conveys it. Moreover, in this system, the units (SCR, CT, DEV, etc.) of the liquid treatment system are disposed on one side of the conveyance paths 36, 51, 58 in each of the process units 22, 24, 26, and heat treated on the other side. System units (HP, COL, etc.) are arranged.

The interface unit (I / F) 14 provided at the other end of the system is provided with an extension (substrate transfer unit) 56 and a buffer stage 57 on the side adjacent to the process station 12, and the exposure apparatus. The conveyance mechanism 59 is provided in the side which adjoins. This conveyance mechanism 59 is movable on the conveyance path 19 extending in a Y direction, and performs the entry | exit of the board | substrate G with respect to the buffer stage 57, and the extension (substrate delivery part) 56 and the vicinity The exposure apparatus and the substrate G are transferred.

2 shows a procedure of the process in the present coating and developing treatment system. First, in the cassette station (C / S) 10, the conveyance mechanism 20 takes out one board | substrate G out of the predetermined | prescribed cassette C on the cassette stage 16, and the process station P / S 12 Is passed to the conveying apparatus 38 of the washing process part 22 (step S1).

In the cleaning process section 22, the substrate G is first brought into the ultraviolet irradiation / cooling unit (UV / COL) 30 in order, and the first ultraviolet irradiation unit UV performs dry cleaning by ultraviolet irradiation. In the next cooling unit COL, it cools to predetermined temperature (step S2). In this ultraviolet cleaning, the organic substance of the surface of a board | substrate is mainly removed.

Subsequently, the substrate G is subjected to a scrubbing cleaning process with one of the scrubber cleaning units (SCRs) 28 to remove particulate dirt from the substrate surface (step S3). After scrubbing cleaning, the substrate G is subjected to a dehydration process by heating in the heating unit (HP) 32 (step S4), and then cooled to a constant substrate temperature in the cooling unit (COL) 34 (step S5). ). Preprocessing by the cleaning process part 22 is complete | finished by this, and the board | substrate G is conveyed to the application | coating process part 24 via the board | substrate delivery part 23 by the conveying apparatus 38. As shown in FIG.

In the coating process part 24, the board | substrate G is first carried in to the adhigen / cooling unit (AD / COL) 46 one by one, and receives the hydrophobization process (HMDS) in the first adhigen unit AD (step S6). ), And is cooled to a constant substrate temperature by the next cooling unit COL (step S7).

Subsequently, the substrate G is coated with the resist liquid by the resist coating unit on the resist coating unit (CT) 40, and then subjected to a drying process under reduced pressure by the vacuum drying unit (VD) 42. (Step S8).

Next, the board | substrate G is carried in to heating / cooling unit (HP / COL) 48 one by one, and baking (prebaking) after application | coating is performed in the first heating unit HP (step S9), and then a cooling unit It cools to the constant substrate temperature by (COL) (step S10). In addition, a heating unit (HP) 50 may be used for baking after the coating.

After the said coating process, the board | substrate G is conveyed to the interface part (I / F) 14 by the conveyance apparatus 54 of the application | coating process part 24, and the conveyance apparatus 60 of the image development process part 26, and From there, it is passed to an exposure apparatus (step S11). In the exposure apparatus, a predetermined circuit pattern is exposed to the resist on the substrate G. And the board | substrate G which finished pattern exposure is returned to the interface part (I / F) 14 from an exposure apparatus. The conveyance mechanism 59 of the interface portion (I / F) 14 passes the substrate G received from the exposure apparatus to the developing process portion 26 of the process station (P / S) 12 through the extension 56. We pass (step S11).

In the developing process part 26, the board | substrate G is subjected to the developing process by either one of the developing unit (DEV) 52 (step S12), and then heating / cooling unit (HP / COL) 53 It is carried in to one by one, and it post-bakes in the first heating unit HP (step S13), and then cools to a constant substrate temperature by the cooling unit COL (step S14). The heating unit (HP) 55 can also be used for this postbaking.

The board | substrate G in which the series process was completed in the image development process part 26 is a cassette station (C / S) 10 by the conveying apparatus 60, 54, 38 in the process station (P / S) 12. It returns to and is accommodated in one cassette C by either of the conveyance mechanisms 20 (step S1).

In the coating and developing treatment system, the present invention can be applied to, for example, a resist coating unit (CT) 40 of the coating process unit 24. 3 to 22, one embodiment to which the present invention is applied to the resist coating unit (CT) 40 will be described.

The whole structure of the resist coating unit (CT) 40 and the pressure reduction drying unit (VD) 42 in this embodiment is shown in FIG.

As shown in FIG. 3, the resist coating unit (CT) 40 and the pressure reduction drying unit (VD) 42 are arrange | positioned in the X direction on the support stand or the support frame 70. The new substrate G to be subjected to the coating treatment is carried into the resist coating unit CT 40 as indicated by the arrow F _A by the conveying apparatus 54 (FIG. 1) on the conveying path 51 side. The substrate G coated with the resist coating unit CT 40 is indicated by the arrow F _B by the transfer arm 74 which is movable in the X direction guided by the guide rail 72 on the support 70. As such, it is sent to the vacuum drying unit (VD) 42. A substrate (G) exiting the drying process under a reduced pressure drying unit (VD), (42) are steps down as shown by the arrow F _c by the conveying path 51, transfer device 54 (Figure 1) on the side.

The resist coating unit (CT) 40 has a stage 76 extending in the X direction and is disposed on the stage 76 above the stage 76 while flowing the substrate G in the same direction. The resist liquid is supplied onto the substrate G from the resist nozzle 78 having a shape, and a resist coating film having a predetermined film thickness is formed on the upper surface (to-be-processed surface) of the substrate by the spinless method. The construction and operation of each part in the unit (CT) 40 will be described later.

The lower pressure drying unit (VD) 42 has a lid-shaped upper chamber configured to be hermetically adhered or fitted to the upper surface of the lower chamber 80 and the lower chamber 80 of a tray or a lower container having an upper surface ( Not shown). The lower chamber 80 has a substantially rectangular shape, and a stage 82 for horizontally loading and supporting the substrate G is disposed at the center thereof, and an exhaust port 83 is provided at four corners of the bottom surface. Each exhaust port 83 communicates with a vacuum pump (not shown) through an exhaust pipe (not shown). The closed processing space in both chambers can be reduced to a predetermined degree of vacuum by the vacuum pump while the upper chamber is covered by the lower chamber 80.

4 and 5 show a more detailed overall structure in the resist coating unit (CT) 40 in one embodiment of the present invention.

In the resist coating unit (CT) 40 of the present embodiment, the stage 76 does not function as a mounting table for holding and holding the substrate G as in the related art, but floats the substrate G in the air by the force of air pressure. It serves as a substrate float for. Then, the linear movement substrate transfer part 84 disposed on both sides of the stage 76 holds the peripheral portions on both sides of the substrate G floating on the stage 76 in a detachable manner, and the stage longitudinal direction (X direction). ), The substrate G is conveyed.

In detail, the stage 76 is divided into _five regions M ', M2, M3, M' and M5 in the longitudinal direction (X direction) (Fig. 5). The region M 'at the left end is a carry-in area, and the new substrate G to be subjected to the coating process is carried in at a predetermined position in this region M'. In order to receive the board | substrate G from the conveyance arm of the conveying apparatus 54 (FIG. 1), and to load it on the stage 76 in the loading area M ', it raises and lowers between the original position of a stage below, and the traveling movement position of an upper stage. A plurality of lift pins 86 are provided at predetermined intervals. These lift pins 86 are lift-driven by the lift pin lifting part 85 (FIG. 16) for carrying in which an air cylinder (not shown) is used for a drive source, for example.

The import region (M₁) is part substrate feed is started also the area and, flying height or flying height for importing the substrate (G) on the top surface stage in the area (H _a) at a high pressure or compression of the static pressure in order to offset the common sense Many blower outlets 88 for blowing air are provided with a constant density. Here, the flying height of the substrate (G) in the carry region (M₁) (H _a), in particular without requiring high precision, for example, may be maintained when in the range of 250 ~ 350μm. Moreover, in the conveyance direction (X direction), it is preferable that the size of the carry-in area | region M 'exceeds the size of the board | substrate G. As shown in FIG. Moreover, the alignment mechanism 200 (FIGS. 13-15) mentioned later for positioning the board | substrate G on the stage 76 is also provided in loading area M '.

The region M3, which is set to the center of the stage 76, is a resist liquid supply region or a coating region, and the substrate G is formed from the upper resist nozzle 78 when the resist liquid R passes through the coating region M₃. Receive the supply. The substrate floating amount H _b in the coating region M 3 defines the coating gap S (for example, 240 μm) between the lower end (discharge port) of the nozzle 78 and the upper surface of the substrate (to-be-processed surface). The coating gap S is an important parameter that influences the film thickness and resist consumption of the resist coating film and needs to be kept constant with high precision. From this, on the upper surface of the stage of the application region M3, compressed air of high pressure or static pressure is blown off, for example, in order to float the substrate G in a desired flotation amount H _{b in an} arrangement or distribution pattern as shown in FIG. A jet port 88 and a suction port 90 that suck air at negative pressure are provided in a mixed manner. Then, a vertical upward force by the compressed air is added from the jet port 88 to the portion passing through the coating area M3 of the substrate G, and at the suction port 90, the vertical downward direction is caused by the negative pressure suction force. and maintaining at that control the balance of the two-way power to the relative resistance in addition to strength, set the flying height (H _b) of the coating value (H _s) (e.g., 50μm). The size of the coating area M3 in the conveying direction (X direction) may be such that there is enough room to stably form the narrow coating gap S as described above immediately below the resist nozzle 78, and usually Silver may be smaller than the size of the substrate G, and may be about 1/3 to 1/4, for example.

As shown in FIG. 6, in the application | coating area | region M3, the jet port 88 and the suction port 90 are alternately arrange | positioned on the straight line C which forms a constant inclined angle with respect to a board | substrate conveyance direction (X direction), and The offset α appropriate to the pitch on the straight line C is provided between the adjacent columns. According to the related arrangement pattern, it is possible not only to uniformize the mixing density of the jet port 88 and the suction port 90 to equalize the substrate floating force on the stage, but also when the substrate G moves in the conveying direction (X direction). It is also possible to equalize the ratio of time facing the 88 and the suction port 90 in each part of the substrate, whereby the spray film 88 or the suction port 90 is formed in the coating film formed on the substrate G. Traces or transfer traces can be prevented from remaining. At the inlet of the coating area M₃, the ejection opening 88 and the suction port 88 arranged in the same direction (straight line J-phase) so as to stably receive the uniform floating force in the direction (Y direction) orthogonal to the conveyance direction at the inlet of the application region M₃. It is desirable to increase the density of the population 90. In addition, in the application area M3, it is preferable to arrange only the ejection opening 88 in both peripheral portions (straight line K phase) of the stage 76 in order to prevent both peripheral portions of the substrate G from sagging.

In again to Figure 5, the flying height in the import region (M₁) and the coating zone (M₃) the middle of the area (M₂) is brought region (M₁) the flying height position of the substrate (G) in the transport set between the (H _a ) Is a transition region for changing or transitioning to the floating amount H _b in the application region M 3. Even in the transition region M2, the ejection opening 88 and the suction opening 90 may be disposed on the upper surface of the stage 76 in a mixed manner. At that time, the density of the suction port 90 may be gradually increased along the conveyance direction, whereby the floating amount of the substrate G may gradually be transferred from H _a to H _b during conveyance. Or in the said transition area | region M2, the structure which does not include the suction port 90 but provides only the jet port 88 can also be provided.

The area M₄ near the downstream side of the coating area M₃ is the floating amount H _c for carrying out the floating amount of the substrate G from the floating amount H _b for coating during transportation. Transition region to ˜350 μm). In the transition region M ', the jet port 88 and the suction port 90 may be mixed on the upper surface of the stage 76, and the density of the suction port 90 may be gradually reduced along the conveyance direction. Alternatively, a configuration may be provided in which only the jet port 88 is provided without including the suction port 90. In addition, as shown in FIG. 6, the suction port 90 and the jet port 88 also prevent the transfer traces from remaining in the resist coating film formed on the substrate G in the transition area M₄ similarly to the coating area M₃. ) Is preferably arranged on a straight line E having a constant inclined angle with respect to the substrate conveyance direction (X direction), and a suitable offset β is provided at an arrangement pitch between adjacent rows.

The area M _{5 at} the downstream end (right end) of the stage 76 is a carrying out area. The substrate G subjected to the coating treatment by the resist coating unit CT 40 has a reduced pressure drying unit near the downstream side by the transfer arm 74 (FIG. 3) from a predetermined position or an ejecting position in the carrying out area M ₅ . It is carried out to VD) 42 (FIG. 3). The ejection area M _{5 is} provided with a plurality of ejection openings 88 for floating the substrate G to a floating amount H _c for carrying out at a constant density on the upper surface of the stage. The plurality of lift pins 92 which can be lifted and lowered are provided at predetermined intervals between the original position below the stage and the traveling movement position above the stage in order to unload them onto the transfer arm 74 (Fig. 3). . These lift pins 92 are lifted and lowered by a lift pin lifter 91 (FIG. 16) for carrying out, for example, using an air cylinder (not shown) as a drive source.

The resist nozzle 78 is slit-shaped at the lower end of the elongate nozzle main body which extends in the horizontal direction (Y direction) orthogonal to a conveyance direction by the length which can cover the board | substrate G on the stage 76 from one end to the other end. A resist liquid supply pipe 94 from the resist liquid supply mechanism 170 (FIGS. 12 and 16) having a discharge port 78a of the upper and lower sides thereof, and being mounted on the door support 130 having a gate or inverted shape. (FIG. 4).

As shown in FIG. 4, FIG. 7, and FIG. 8, the board | substrate conveyance part 84 has an axis | shaft on each guide rail 96 and the pair of guide rails 96 arrange | positioned in parallel to the left and right sides of the stage 76. FIG. The slider 98 movably mounted in the direction (X direction) and the conveyance drive unit 100 for moving the slider 98 straight on each guide rail 96 and from each slider 98 to the center of the stage 76. It has each holding part 102 which extends toward and detachably holding the left and right both peripheral parts of the board | substrate G. As shown in FIG.

Here, the conveyance drive part 100 is comprised by the linear drive mechanism, for example, a linear motor. Moreover, the holding | maintenance part 102 supports the adsorption pad 104 which couples to the lower surface of the left and right peripheral parts of the board | substrate G by vacuum adsorption force, and the adsorption pad 104 in the front end part, and the base end part of the slider 98 side as a point. Each of the spring supporting pads 106 is elastically deformable so as to change the height position of the tip portion. The suction pads 104 are arranged in a row at a constant pitch, and the pad support portion 106 independently supports the respective suction pads 104. Thereby, the individual adsorption pad 104 and the pad support part 106 can hold | maintain the board | substrate G stably in independent height position (even in another height position).

As shown to FIG. 7 and FIG. 8, the pad support part 106 in this embodiment is attached to the plate-shaped pad lifting member 108 of which the board | substrate was mounted so that the inner side of the slider 98 could be elevated. The pad actuator 109 (FIG. 16) formed from the air cylinder, for example, mounted on the slider 98 causes the pad elevating member 108 to have its original position (retracted position) lower than the lift height position of the substrate G and the substrate G. It moves up and down among the traveling movement positions (coupling position) corresponding to the floating height position of ().

As shown in FIG. 9, each suction pad 104 is provided with the some suction port 112 in the upper surface of the pad main body 110 of a rectangular parallelepiped shape, for example with synthetic rubber. These suction ports 112 are slit-shaped long holes, but may be rings or spherical small holes. A strip-shaped vacuum tube 114 made of, for example, synthetic rubber is connected to the suction pad 104. The pipeline 116 of these vacuum tubes 114 communicates with the vacuum source of the pad adsorption control part 115 (FIG. 16), respectively.

As for the holding | maintenance part 102, as shown in FIG. 4, the structure of the separate type | mold or completely independent type which isolate | separates one row of the vacuum suction pad 104 and the pad support part 106 by one set is preferable. However, as shown in Fig. 10, a single piece of spring for which the notch portion 118 is provided to form a pad support portion 120 for one side, and the one-sided vacuum suction pad 104 is disposed thereon. The configuration of is also possible.

As described above, the application of a plurality of blow holes 88 formed on the upper surface of the stage 76 and the compressed air supply mechanism 122 (FIG. 11) for supplying compressed air for generating a floating force thereto, and also the stage 76. A plurality of suction ports 90 formed in the region M3, which are mixed with the jet port 88, and the vacuum supply mechanism 124 (Fig. 11) for supplying a vacuum pressure to them, the loading area M₁ and the discharge area ( In the case of M ₅ ), the substrate G is floated at an appropriate floating amount for carrying in and out and high-speed transfer, and in the coating area M₃, the substrate G is stabilized and at a set floating amount H _s suitable for accurate resist coating scanning. The stage substrate floating part 145 (FIG. 16) is comprised.

11, the structure of the nozzle elevating mechanism 75, the compressed air supply mechanism 122, and the vacuum supply mechanism 124 is shown. The nozzle elevating mechanism 75 is a pair of left and right mounted on the door-shaped frame 130 and the door-shaped frame 130, which are constructed to pass over the application area M₃ in a horizontal direction (Y direction) orthogonal to the conveying direction (X direction). It has a nozzle support 134 of the movable body (elevating body) which spans between the vertical movement mechanisms 132L and 132R of these, and these vertical movement mechanisms 132L and 132R. The drive part of each vertical movement mechanism 132L, 132R has the electric motors 138L and 138R which consist of a pulse motor, the ball screws 140L and 140R, and the guide members 142L and 142R, for example. The rotational force of the pulse motors 138L and 138R is converted into linear movement in the vertical direction by the ball screw mechanisms 140L and 142L; 140R and l42R, so that the resist nozzle 78 is vertically integral with the nozzle support 134 of the lifting body. Move up and down in the direction. The lifting amount and the height position of the left and right sides of the resist nozzle 78 can be arbitrarily controlled by the rotation amount and rotation stop position of the pulse motors 138L and 138R. The nozzle support 134 is made of, for example, a rigid body of an angled pillar, and the resist nozzle 78 is detachably attached to the lower surface or side by a flange, a bolt, or the like.

The compressed air supply mechanism 122 is, for example, compressed air of factory power to the positive pressure manifold 144 connected to the spout 88 and the positive pressure manifold 144 for each of a plurality of regions divided on the upper surface of the stage 76. It has the compressed air supply source 146 which sends compressed air from the supply source 146, and the regulator 150 provided in the middle of the compressed air supply source 146. As shown in FIG. The vacuum supply mechanism 124 is a vacuum source of, for example, factory power from the negative pressure manifold 152 and the negative pressure manifold 152 connected to the suction port 90 by a plurality of regions divided on the upper surface of the stage 76. The vacuum tube 156 which draws in air to 154 and the throttle valve 158 provided in the middle of the vacuum tube 156 are provided.

12, the structure of the resist liquid supply mechanism 170 is shown. The resist liquid supply mechanism 170 transfers the resist liquid R for at least one coating treatment (for one substrate) from the bottle 172 storing the resist liquid R through the suction pipe 174. To the resist nozzle 78 at a predetermined pressure through the discharge tube or the resist liquid supply pipe 94 at a resist pump 176 at the time of the coating process, The resist liquid R is discharged on the substrate G at a predetermined flow rate.

The bottle 172 is sealed, and a pressurized gas, for example, N ₂ gas, is supplied at a constant pressure from the gas pipe 178 toward the liquid level in the bottle. The gas pipe 178 is provided with an opening / closing valve 180 made of, for example, an air operated valve.

The filter 182, the degassing module 184, and the opening / closing valve 186 are provided in the middle of the suction pipe 174. The filter 182 removes foreign matter (garbage) in the resist liquid R sent from the bottle 172, and the degassing module 184 removes bubbles in the resist liquid. The opening / closing valve 186 is formed of, for example, an air operated valve, and turns on (expands conduction) or turns off (blocks) the flow of the resist liquid R in the suction pipe 174.

An open / close valve 188 is provided in the middle of the resist liquid supply pipe 94. No filter or color bag valves were installed. The on-off valve 188 turns on (development conduction) or off (blocks) the flow of the resist liquid R in the resist liquid supply pipe 94 which consists of an air operated valve, for example. The resist pump 176 is formed of, for example, a syringe pump, and includes a pump main body 190 having a pump chamber, a piston or plunger 192 for arbitrarily changing the volume of the pump chamber, and the present plunger 192. It has a pump drive 194 for reciprocating motion.

The resist liquid supply control unit 196 is a local controller, and according to instructions from the controller 230 (FIG. 16), each part in the resist liquid supply mechanism 170, in particular, the pump drive unit 194 or the angle of the resist pump 176 The on / off valves 180, 186, 188 and the like are controlled.

13-15, the structure of the alignment mechanism 200 provided in the carry-in area | region M 'of the stage 76 is shown. As shown in FIG. 13, the alignment mechanism 200 includes a plurality of, for example, eight alignment pins 202A, which may be in contact with four corners of the substrate G carried in the carry-in area M ′ of the stage 76. 202B, 204A, 204B, 206A, 206B, 208A, and 208B.

As shown in Figure 14, the front end sides of these eight alignment pin center, the coating region 2 of pins (202A, 202B) of (M₃) set a substrate (G) in a predefined reference position (P _a) (G _a ) So as to touch it. In addition, the fixing pins (202A, 202B) and two pins opposing (204A, 204B) includes a substrate (G) during the start of the movement towards the reference position (P _a), and from a predefined home position (P _b) It moves in the same direction while contacting the rear side G _b and functions to push the side G _a of the front end of the substrate G to the fixing pins 202A and 202B on the opposite side. The two pins 206A and 206B on the left side and the two pins 208A and 208B on the right side are each a line passing through the center of the stage 76 from the predetermined home positions P _c and P _d based on the coating scanning direction ( Virtual line) 76C moves simultaneously in a direction approaching each other, and contacts the left side G _c and the right side G _d of the substrate G, respectively (substrate G between the left and right sides) Operation] so that the center line of the substrate G is aligned (centered) with the stage center line 76C.

15A and 15B show an example of the configuration of the pin driver 210 for driving the X-direction movable alignment pins 204A and 204B. The same pin driver as the pin driver 210 can be used to drive the Y-direction movable alignment pins 206A, 206B, 208A, and 208B.

The pin driver 210 includes, for example, a horizontal drive plate 214 and a horizontal drive plate mounted on the horizontal support plate 214 coupled to the front end (top) of the vertical drive shaft of the lift drive unit 212 and the lift drive unit 212. Has 216 The pin drive shaft 218 of the horizontal drive unit 216 vertically supports the alignment pins 204A and 204B at its distal end to move forward or backward in a constant horizontal direction (X direction) to stop at any position within the movable range. It is supposed to be.

Although the horizontal drive part 216 is not shown in figure, for example, the motion conversion mechanism for converting the rotational force of an electric motor and an electric motor into the horizontal linear motion of the pin drive shaft 218, and controlling the operation (rotation and stop) of an electric motor are shown. It is provided with a control unit. If the load torque exceeds a certain value during the forward movement of the alignment pins 204A and 204B, the control unit stops the rotation of the electric motor and maintains the alignment pins 204A and 204B at their stop positions.

In this embodiment, the pin drive part 210 mounts the position (or moving distance) sensor 220 for measuring the length of the board | substrate G in an application | coating scanning direction (X direction) at the time of alignment. Position (movement distance) sensor 220 of the structural example of the figure is a horizontal linear scale, and the scale part 220A and the scale part 220A extended in parallel with the pin movement direction (X direction) fixed to the horizontal support plate 214 Has a scale reading part 220B attached to the pin drive shaft 218 so as to read optically from the alignment pins 204A and 204B side.

In alignment operation, when the board | substrate G is carried in from the upper direction to the carrying-in area | region M 'of the stage 76 by the fall of the lift pin 86, alignment pin 204A is first carried out by the lift drive of the cylinder 212. 204B rises vertically from a predetermined retracted position lower than the stage 76 to a predetermined traveling movement position at which the tip of the pin is higher than the substrate G. As shown in FIG. At this time, the alignment pins 204A and 204B are in the home position P _b in the moving direction (X direction) and face each other at an inverse distance from the rear side G _b of the substrate G.

Next, the horizontal drive unit 216 operates to advance the alignment pins 204A and 204B. The alignment pins 204A and 204B move forward while pressing the substrate G as they are in contact with the side surface of the rear side G _b of the substrate G during the forward movement. The board | substrate G is floated by the air pressure (floating force) given by the blowing port 88 of the stage 76, and can be moved to the horizontal direction flexibly. In this way, the substrate G is pushed by the alignment pins 204A and 204B to move in the pressing direction (X direction), and soon the side surfaces of the sides G _a on the front end face the fixed alignment pins 202A and 202B ( 14). Then, in the X direction, the substrate G is caught by the movable alignment pins 204A and 204B and the fixed alignment pins 202A and 202B, and cannot be moved, so that the driving of the horizontal drive unit 216 also stops due to the increase of the load torque. Alignment in the X direction is completed (FIG. 15B). On the other hand, in the Y direction, alignment is completed in a state where the left movable alignment pins 206A and 206B and the right movable alignment pins 208A and 208B are fitted with the substrate G from both the left and right sides.

In this manner, after the alignment is completed, the current position of the movable alignment pins 204A and 204B, that is, the traveling movement position P _b ′, is read through the position (moving distance) sensor 220. The controller 230 (FIG. 16) shows the traveling movement position P _b '(measured value) of the movable alignment pins 204A and 204B read by the position (travel distance) sensor 220 and the fixed alignment pins 202A and 202B. The distance interval D _G between the reference position P _a (the existing value) of () is calculated | required, and let distance distance D _c be the measured value of the board | substrate length of the said board | substrate G. Alternatively, the position (moving distance) sensors original position (P _b) driving the moving position (P _{b ')} in situ to obtain a movement distance (δX) to (P _b) from the movable alignment pins (204A, 204B) through 220 Moving distance (δX) from the reference distance (previously determined value) (D _x ) between (the existing value) and the reference position P _a (the existing value) on the fixed alignment pins 202A and 202B side It is also possible to subtract (measured value) and set the difference (D _x -δX) value as the measured value of the length of the substrate G.

It is also possible to be fixed to the alignment pins (202A, 202B) is good when moving only in the vertical direction from the reference point (P _a), not shown, but for example, directly connected to the lifting drive unit 212 (FIG. 15a, FIG. L5b).

The main structure of the control system in the resist coating unit (CT) 40 of this embodiment is shown in FIG. The controller 230 is a part of a unit consisting of a microcomputer, in particular, the resist liquid supply mechanism 170, the nozzle raising and lowering mechanism 75, the stage substrate floating portion 145, and the substrate conveying portion 84 (conveying driving portion 100). ), Pad adsorption control unit 115, pad actuator 109], lift pin lift unit 85 for carrying in, lift pin lift unit 91 for carrying out, alignment mechanism 200, position (moving distance) sensor 220 Control individual operations such as) and overall operation (sequence).

Next, the coating process operation in the resist coating unit (CT) 40 of this embodiment is demonstrated.

The controller 230 injects and executes a coating process program stored in a storage medium such as an optical disc into the main memory, for example, and controls a programmed series of coating process operations. The main procedure of this coating process operation is shown in FIG.

First, in the conveying apparatus 54 (FIG. 1), the unprocessed new board | substrate G is carried in to the loading area M 'of the stage 76. FIG. In this case, after the lift pin 86 receives the said board | substrate G in a travel movement position, and the conveying apparatus 54 is withdrawn, the lift pin 86 will descend | fall and the board | substrate G will be conveyed in the height position for conveyance, ie, down to the height position (Fig. 5) of the flying height (H _a) (step A₁).

Subsequently, the alignment mechanism 200 is operated and the substrate G is positioned on the stage 76 by pushing the alignment pins 202A to 208B from all directions to the floating substrate G as described above. (Step A ₂ ). At the time of the alignment, the length size of the substrate G in the conveying direction is measured via the position (moving distance) sensor 220 (step A 3).

The controller 230 corrects predetermined parameters for the coating scan on the substrate G based on the measured value of the substrate length size. As a related correction parameter, a start position, an end position, a scan distance, a scan time, a start timing of a resist liquid discharge, an end timing, a discharge duration and the like can be selected.

Alternatively, the waveforms of the discharge pressure control waveform SP (t) and the scan speed control waveform SV (t) as shown in FIG. 18 for controlling the discharge pressure of the resist nozzle 78 and the conveyance speed of the substrate G are varied. It can also be set as a correction parameter. These discharge pressure control waveforms SP (t) and scanning speed control waveform SV (t) are read by the controller 230 from the memory as waveform signals or pressure control signals and conveyance speed control signals in the coating scan, and the resist liquid supply mechanism ( 170 and the board | substrate conveyance part 84.

The discharge pressure control waveform SP (t) and the scan speed control waveform SV (t) are set on the time axis and can be replaced by the waveforms SP (x) and SV (x) on the X axis in the coating scan direction. In that case, in the scanning speed control waveform SV (t), the active start end corresponds to the start position of the application scan, and the end of inactivity corresponds to the end position of the application scan. In addition, an arbitrary time difference may be provided between the discharge pressure control waveform SP (t) and the scan speed control waveform SV (t), and for example, the scan speed control waveform SV with respect to the discharge pressure control waveform SP (t). The timing relationship between the two is set so that (t) is somewhat late.

In general, the discharge pressure control waveform SP (t) and the scan speed control waveform SV (t) are set based on the substrate length or the standard value. Therefore, when the board | substrate length of the board | substrate G deviates from a standard value by the tolerance of the external dimension, curvature, etc., application | coating scan is performed using standard discharge pressure control waveform SP (t) and scanning speed control waveform SV (t). When the substrate is misaligned (error), the start position of the coating scan or the end position of the coating scan is shifted. Usually, on the stage 76, the substrate G is subjected to the substrate length irrespective of the presence or absence of an error by matching the edge G _a of the front end of the substrate G to the reference position even in the coating scan as well as the above-described alignment. The start of the coating scan of the image can always be controlled at a certain position. In other words, if the substrate length is shifted from the standard value, the effect is generally observed at the end position of the coating scan. For example, if the substrate length of the substrate G is smaller than the standard value, and the degree of the error is large, the rear end of the substrate G is removed. In some cases, the resist liquid may flow out of the substrate G.

Therefore, in this embodiment, the discharge pressure in the controller 230 is based on the measured value of the board | substrate length calculated | required at the time of alignment of the board | substrate G in the loading area M 'of the stage 76 as mentioned above. The control waveform SP (t) and the scanning speed control waveform SV (t) are corrected (step A '). Specifically, the standard discharge pressure control waveform SP (t) and the scan speed control waveform SV (t) are replaced with the discharge pressure control waveform SP (x) and the scan speed control waveform SV (x) on the X-axis as described above. The two waveforms SP (x) and SV (x) are corrected according to the measured value of the substrate length, and both the waveforms SP (x) and SV (x) after the correction are controlled on the discharge pressure control waveform SP (t) and scanning speed on the time axis. Replace with waveform SV (t). Alternatively, the measured value of the substrate length can be converted into time to directly correct the standard discharge pressure control waveform SP (t) and the scan speed control waveform SV (t).

In this embodiment, when the board | substrate length of the said board | substrate G is smaller than a standard value by the above-mentioned application | coating scanning parameter correction function, for example, as shown by a dashed-dotted line in FIG. 18, discharge pressure control waveform SP ( t) and the end of the scanning speed control waveform SV (t) can be corrected. This correction is made before the coating scan is started.

After the alignment of the substrate G and the measurement of the substrate length in the carry-in region M₁ are completed as described above, the alignment mechanism 200 separates the alignment pins 202A to 208B from the substrate G to the retracted position vertically downward. Get off. Immediately thereafter, the substrate conveying unit 84 moves the slider 98 at a relatively high speed in the conveying direction (X direction) from the conveying time position while maintaining the side periphery of the substrate G in the holding unit 102. Move straight. In this way, the board | substrate G moves straight to a conveyance direction (X direction) in the state which lifted out on the stage 76, and at the point where the front end part of the board | substrate G reached the setting position in the application | coating area | region M3, or application | coating scanning start position. The board | substrate conveyance part 84 stops the board | substrate conveyance of a 1st step.

As described above, when the substrate G reaches the set position in the application region M3, that is, the application scanning start position and stops there, the nozzle elevating mechanism 75 (Fig. 11) is operated under the control of the controller 230, and the resist The nozzle 78 is lowered vertically, and the distance or coating gap between the discharge port 78a of the nozzle and the substrate G is adjusted to an initial value (for example, 60 µm). Subsequently, under the control of the controller 230, the resist liquid supply mechanism 170 (FIG. 12) starts discharging the resist liquid R, and the substrate transfer unit 84 also starts the substrate transfer in the second step. On the other hand, the nozzle elevating mechanism 75 raises the resist nozzle 78 in an instant until the coating gap becomes the set value S _A (for example, 240 µm), and then the substrate G is horizontal as it is. Move it. In this way, application | coating scan | coating to the board | substrate G is performed by cooperation or cooperation by which the resist liquid discharge operation | movement in the resist liquid supply mechanism 170 and the board | substrate conveyance operation in the board | substrate conveyance part 84 were synchronized. (Step A ₅ ).

Here, the resist liquid discharge operation in the resist liquid supply mechanism 170 is performed in accordance with the discharge pressure control waveform SP (t) corrected based on the substrate length measured value obtained at the time of the alignment operation. Moreover, the 2nd step in the board | substrate conveyance part 84, ie, the board | substrate conveyance for application | coating scan, was performed according to the scanning speed control waveform SV (t) correct | amended based on the board | substrate length measurement value calculated | required at the time of alignment as mentioned above. All.

In this way, in the application | coating area | region M3, while the board | substrate G moves to a constant speed Vs in a conveyance direction (X direction) in a horizontal attitude | position, the elongate resist nozzle 78 is the board | substrate G just below. The resist liquid R is discharged in a band shape at a constant discharge pressure P _s toward the cross section), so that the resist liquid is applied from the front end side to the rear end side of the substrate G as shown in FIGS. 19 and 20. The film RM is formed to have a constant film thickness.

As shown in FIG. 21, when the above-mentioned application | coating process is complete | finished in the application | coating area | region M3, ie, in the vicinity where the rear end part of the board | substrate G passes just under the resist nozzle 78, the resist liquid supply mechanism 170 is Discharge of the resist liquid R from the resist nozzle 78 is completed. Almost simultaneously with this, the board | substrate conveyance part 84 stops the board | substrate conveyance of a 2nd step (for coating scan).

In FIG. 22, the pattern after completion | finish scanning of the resist coating film RM formed on the board | substrate G by the above-mentioned application | coating scan is shown typically. As shown by the dashed-dotted line L, the periphery of the board | substrate G divides a product area | region, ie, a film thickness guarantee area ES and a non-product area, ie, a film thickness non-guaranteed area (margin area) EM. The border is set.

In the present embodiment, the substrate (by applying the coating scan according to the discharge pressure control waveform SP (t) and the scan speed control waveform SV (t) corrected based on the substrate length measurement value of the substrate G as described above), On G), the resist coating film RM can be formed in a desired outline (outline) and film thickness profile. That is, as shown in FIG. 22, the start position and the end position of the coating scan are made in accordance with a desired position in the margin area EM without projecting the outline of the resist coating film RM on the substrate G out of the substrate edge. It is possible to substantially stop the liquid tomb RMA of the resist coating film RM, which can be near, in the margin area EM (not to enter the film thickness guarantee area ES).

The substrate G is also centered on the stage 76 at the time of alignment in the direction (Y direction) orthogonal to the coating scanning direction, so that it is aligned with the centerline of the resist nozzle 78, so that the tolerance is given to the width size of the substrate G. Even if there is an error, the error can be divided into two equally to the left and right, and the outline and the film thickness profile of the resist coating film RM can be aligned equally to the left and right.

After the above-described coating scan is finished, the nozzle elevating mechanism 75 lifts the resist nozzle 78 vertically upward to evacuate the substrate G. Next, the board | substrate conveyance part 84 starts the board | substrate conveyance of a 3rd step with a comparatively large conveyance speed. Then, the substrate (G) is when you get to the end point position in the transport out area ₍₅ M) the substrate feed section 84 stops the substrate carrying the third step. Immediately after this, the pad adsorption control unit 115 stops supplying the vacuum to the adsorption pad 104, and at the same time, the pad actuator 109 moves the adsorption pad 104 to the original position (retraction position) from the traveling movement position (combination position). ) And the suction pad 104 is separated from both ends of the substrate G. At this time, the pad adsorption control unit 115 supplies a positive pressure (compressed air) to the adsorption pad 104 and accelerates separation from the substrate G. Instead, the lift pin 92 ascends from the original position below the stage to the traveling movement position above the stage to unload the substrate G. FIG.

Next, the carrying out machine, ie, the transfer arm 74, accesses the carrying out area M ₅ , receives the substrate G from the lift pin 92, and takes it out of the stage 76 (step A ₆ ). If the board | substrate conveyance part 84 passed the board | substrate G to the lift pin 92, it immediately returns to the loading area M 'by the highway. By the time to be taken out the substrate (G) of the process is completed as described above, the out zone (M _5), brought region (M₁) in the import, the alignment as described above with respect to the new substrate (G) to obtain a coating in the following Substrate length measurement and conveyance start are performed in order.

As described above, the resist coating unit (CT) 40 of the present embodiment is formed by the alignment mechanism 200 in the loading region M₁ prior to the coating scanning in the coating region M3 of the stage 76. Simultaneously with the positioning of G), the length size of the substrate G is measured using the position (movement distance) sensor 220, and predetermined parameters for coating scanning, for example, coating, are made according to the substrate size measurement value. Corrections are made to the scanning start position (timing), the application scanning end position (timing), the application scanning distance (application scanning time) or the discharge pressure control waveform SP (t) and the scanning speed control waveform SV (t). Then, by applying the coating scan in the coating region M3 by using the corrected parameters, the resist coating film RM formed on the substrate G even if there is a tolerance or an error in the size of the substrate G. It is possible to prevent the influence of the error of the substrate size from appearing in the outline and the film thickness profile, thereby improving the reliability of the coating process and the product ratio.

As mentioned above, although this invention was demonstrated about highly suitable embodiment, this invention is not limited to the said embodiment, A various deformation | transformation is possible within the range of the technical idea.

For example, in the said embodiment, the optical sensor (horizontal linear scale 220) was used in order to measure the position or moving distance of movable alignment pin 204A, 204B. However, a non-optical sensor can also be used, and the moving distance measured value can be obtained from the rotation amount of the electric motor in the horizontal drive unit 216.

In addition, in the said embodiment, the size of the board | substrate G was measured only at the coating scan direction at the time of alignment. However, the substrate size may be measured in the direction (Y direction) orthogonal to the coating scan direction (X direction), or the predetermined parameter for the coating process can be corrected based on the substrate size measured value. For example, when the other side of the substrate G is aligned with the reference position without centering the substrate G in the Y direction, if there is a tolerance or an error in the substrate size, the centerline of the substrate G is the stage centerline. Deviate from the centerline of (76C). It is also possible to displace the resist nozzle 78 in the Y direction in accordance with the substrate size measurement. In another aspect, alignment with respect to the board | substrate G can be performed only in an application | coating scanning direction (X direction), and can also be abbreviate | omitted in the direction (Y direction) orthogonal to it. It is also possible to change the alignment pins 202A and 202B from the fixed mold to the movable mold in the coating scanning direction (X direction).

Although the above-described embodiment is related to the floating transfer type spinless coating method, the present invention is horizontally mounted to fix a substrate on a suction-fixed stage, and horizontally orthogonally intersects the elongated resist nozzle above the nozzle length direction. It is also applicable to the spinless coating method of applying the resist liquid from the corner end to the corner end on the substrate while moving in the direction. Also in this case, it is possible to provide a substrate size measuring unit for measuring the size of the substrate (particularly the size in the coating scan direction) during alignment, while providing an alignment mechanism for positioning the substrate on the adsorption fixed stage.

In addition, although the measurement of the board | substrate size in this invention is performed most immediately before application | coating scan, it is upstream with respect to a process flow in the resist application | coating unit (CT) 40 in an application | coating development process system (FIG. 1). When the substrate is aligned with any unit located, the size of the substrate can be measured at that location.

As the processing liquid in the present invention, in addition to the resist liquid, for example, a coating liquid such as an interlayer insulating material, a dielectric material, a wiring material, or the like can be used, and a developing solution, a rinse liquid, or the like can also be used. The substrate to be treated in the present invention is not limited to an LCD substrate, and other flat panel display substrates, semiconductor wafers, CD substrates, photomasks, printed substrates, and the like can also be used.

According to the coating method and the coating apparatus of this invention, the influence of the tolerance and the error of a board | substrate size does not appear in the outline and film thickness profile of the coating film formed on a board | substrate in a spinless coating method by the structure and effect | action as mentioned above. And the reliability and product ratio of the coating treatment can be improved.

Claims (23)

A coating scan is performed in which the ejection openings of the substrate to be processed and the elongated nozzle are horizontally opposed to each other with a small gap to move the nozzle in a relatively horizontal direction while discharging the processing liquid from the nozzle with respect to the substrate. It is a coating method of forming the coating film of the said processing liquid on a board | substrate, Prior to the coating scan, a step of aligning the substrate by moving the substrate in a one-dimensional or two-dimensional direction parallel to the plate surface at a predetermined place; Measuring the length of the substrate in the coating scanning direction at the time of positioning the substrate; The substrate length size is determined by a predetermined parameter that defines the outline in the coating scan so that the influence of the tolerance or error of the substrate length size does not appear in the outline of the coating film of the processing liquid formed on the substrate. A coating method having a step of correcting according to an error between a standard value and a measured value. The coating method according to claim 1, wherein the parameter includes a position of a start point or an end point of the coating scan set on the substrate. The coating method according to claim 1, wherein the parameter includes a distance from a time point of the coating scan set on the substrate to an end point. The coating method according to claim 1, wherein the parameter includes a timing for starting or terminating the discharge of the processing liquid from the nozzle onto the substrate. A stage for horizontally supporting the substrate to be processed, An alignment mechanism for aligning the substrate by moving the substrate on the stage in one or two dimensional directions parallel to the plate surface; The dispensing port of the elongate nozzle is horizontally opposed to the said aligned substrate with a small gap, and a coating scan is performed to move the nozzle in a relatively horizontal direction while discharging the processing liquid from the nozzle, A coating processing unit for forming a coating film of the processing liquid on the substrate; A substrate size measuring unit which measures the length size of the substrate in the coating scanning direction when the substrate is aligned; The substrate length size is determined by a predetermined parameter that defines the outline in the coating scan so that the influence of the tolerance or the error of the substrate length size does not appear in the outline of the coating film of the processing liquid formed on the substrate. An application apparatus having a parameter correction unit for correcting according to an error between a standard value and a measured value. The coating device according to claim 5, wherein the parameter correction unit corrects a position of a start point or an end point of the coating scan set on the substrate. The coating device according to claim 5, wherein the parameter correction unit corrects a distance from a time point of the coating scan set on the substrate to an end point. The coating device according to claim 5, wherein the parameter correction unit corrects a timing of starting or ending the discharge of the processing liquid from the nozzle on the substrate. 9. The method according to any one of claims 5 to 8, The substrate is rectangular, The said coating process part performs the said coating process toward the 2nd side of the opposite side to the 1st side of the said board | substrate, And the substrate size measuring unit measures a length from at least a first side to a second side of the substrate. delete delete delete delete delete delete delete delete delete delete delete delete delete delete

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