KR101334315B1 - Light emitting diode lamp and method of fabricating the same - Google Patents

Light emitting diode lamp and method of fabricating the same Download PDF

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Publication number
KR101334315B1
KR101334315B1 KR1020060136441A KR20060136441A KR101334315B1 KR 101334315 B1 KR101334315 B1 KR 101334315B1 KR 1020060136441 A KR1020060136441 A KR 1020060136441A KR 20060136441 A KR20060136441 A KR 20060136441A KR 101334315 B1 KR101334315 B1 KR 101334315B1
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KR
South Korea
Prior art keywords
resin
light emitting
lead
emitting diode
cured resin
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Application number
KR1020060136441A
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Korean (ko)
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KR20080061564A (en
Inventor
방세민
우도철
김대원
Original Assignee
서울반도체 주식회사
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Priority to KR1020060136441A priority Critical patent/KR101334315B1/en
Publication of KR20080061564A publication Critical patent/KR20080061564A/en
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Publication of KR101334315B1 publication Critical patent/KR101334315B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)

Abstract

A light emitting diode lamp and a method of manufacturing the same are disclosed. The light emitting diode lamp includes a cup part, a first lead having a leg extending from the cup part, and a second lead spaced apart from the first lead. A light emitting diode is mounted in the cup part of the first lead, and a bonding wire connects the light emitting diode to the second lead. Meanwhile, a first cured resin covers the light emitting diode, and a second cured resin containing a phosphor covers the first cured resin. The first cured resin has a concave upper surface. In addition, a sealing resin seals the cup portion of the first lead, a part of the second lead, and the first and second cured resins. Accordingly, since the phosphor is located away from the light emitting diode, light emitted by the diffuse reflection or the wavelength converted from the phosphor may be incident to the light emitting diode to reduce loss, thereby improving the light emission intensity.

LED lamp, phosphor, resin, silicone, epoxy

Description

LIGHT EMITTING DIODE LAMP AND METHOD OF FABRICATING THE SAME}

1 is a cross-sectional view illustrating a conventional light emitting diode lamp.

2 is a cross-sectional view illustrating a light emitting diode lamp according to an embodiment of the present invention.

The present invention relates to a light emitting diode lamp and a method of manufacturing the same, and more particularly, to a light emitting diode lamp and a method of manufacturing the same by forming a cured resin in a double light emission intensity.

LED lamps are widely used for indicators, electronic signs, and displays because they can implement colors, and are also used for general lighting because they can implement white light. Such LED lamps have high efficiency, long life, and environmental friendliness, and the field of using them continues to increase.

1 is a cross-sectional view illustrating a conventional light emitting diode lamp.

Referring to FIG. 1, a conventional LED lamp includes a cup portion 3 and a first lead 1a having legs extending from the cup portion 3. In addition, the second lead 1b is disposed spaced apart from the first lead. The second lead has a leg corresponding to the first lead 1a.

Meanwhile, a light emitting diode 5 is mounted in the cup part 3 of the first lead, and is electrically connected to the second lead through a bonding wire 7. The cup part 3 of the first lead has a cavity, and the light emitting diode 5 is mounted in the cavity. The side wall of the cavity forms an inclined reflective surface to reflect the light emitted from the LED 5 in a predetermined direction. In addition, the cured resin 11 covers the light emitting diode 5. The cured resin 11 is generally formed by doping and curing an epoxy resin containing a phosphor.

On the other hand, the sealing resin 15 seals the cup portion of the first lead, a part of the second lead and the cured resin 11. Generally, after the cured resin 11 is formed, the sealing resin 15 is formed by inverting the first lead and the second lead in a mold containing a liquid or gel epoxy resin and curing the epoxy resin.

According to the prior art, the light emitting diode lamp can convert the wavelength of the light emitted from the light emitting diode 5 by the phosphor to implement light of a required wavelength, for example white light.

However, in the conventional light emitting diode lamp, since the curable resin 11 containing the phosphor contacts the light emitting diode 5, the light emitted from the light emitting diode 5 is diffusely reflected by the phosphor and is incident into the light emitting diode 5 again. In addition, light converted by the phosphor may be incident back into the light emitting diode 5. The light incident into the light emitting diode may be absorbed and lost by the light emitting diode 5, or after passing through the light emitting diode, may be absorbed and lost at the bottom surface of the cavity. As a result, the light emission intensity is reduced.

In addition, when the cured resin 11 is formed of an epoxy resin having a relatively high hardness, cracks occur in the cured resin 11 due to a difference in thermal expansion coefficient, or the cured resin 11 is peeled off from the cup part 3. This may cause disconnection of the bonding wire, and the epoxy resin may be deformed by the heat generated by the light emitting diodes 5, or the epoxy may be deformed by ultraviolet rays or short wavelength visible light emitted from the light emitting diodes. To solve this problem, silicone may be used instead of epoxy to form a cured resin containing a phosphor. However, when the cured resin 11 is formed using silicon, an air layer may be formed at an interface therebetween due to the material difference between the cured resin 11 and the sealing resin 15, and such an air layer may be Is observed, resulting in a poor appearance of the light emitting diode lamp.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a light emitting diode lamp that can improve light emission intensity by alleviating loss of light emitted from a light emitting diode back into the light emitting diode.

Another object of the present invention is to provide a light emitting diode lamp capable of preventing peeling and cracking of the cured resin.

Another technical problem to be achieved by the present invention is to provide a light emitting diode lamp that can solve the appearance defect observed from the outside.

In order to achieve the above technical problem, a light emitting diode lamp according to an aspect of the present invention includes a cup portion and a first lead having a leg extending from the cup portion. A second lead is spaced apart from the first lead, a light emitting diode is mounted in a cup portion of the first lead, and a bonding wire connects the light emitting diode to the second lead. Meanwhile, a first cured resin covers the light emitting diode, and a second cured resin containing a phosphor covers the first cured resin. The first cured resin has a concave upper surface. In addition, a sealing resin seals the cup portion of the first lead, a part of the second lead, and the first and second cured resins.

In embodiments of the present invention, the first cured resin does not contain a phosphor, and thus the light emitted from the light emitting diode passes through the first cured resin without wavelength conversion and enters into the second cured resin containing the phosphor. do. Therefore, since the phosphor is located away from the light emitting diode, light emitted by diffuse reflection or wavelength conversion of the phosphor from the phosphor may be incident to the light emitting diode to reduce loss, thereby improving light emission intensity. In addition, by containing a phosphor in the second cured resin, the sealing resin may not contain a phosphor. Therefore, the amount of phosphor used can be reduced, and it is easy to control the distribution of the phosphor. In addition, since the first cured resin has a concave upper surface, it is easy to form by forming a second cured resin on the first cured resin.

In some embodiments of the present invention, the second cured resin may have a higher refractive index than the first cured resin. Accordingly, total internal reflection can be prevented at the interface between the first cured resin and the second cured resin.

Meanwhile, the first cured resin and the second cured resin may be silicone, and the sealing resin may be epoxy. In this case, since the first and second cured resins have relatively low hardness, the first and second cured resins are prevented from being peeled off from the cup portion or cracking therein, and the resin deformation due to the light emitted from the light emitting diode is prevented.

In contrast, the first cured resin, the second cured resin, and the sealing resin may all be epoxy. In this case, the first cured resin, the second cured resin, and the sealing resin are all formed of the same kind of material, so that the appearance defect due to the interface generation can be solved.

Alternatively, the first cured resin may be silicone, and the second cured resin and the sealing resin may be epoxy. In this case, the first cured resin has a relatively low hardness, prevents cracking and peeling, and the second cured resin and the sealing resin are formed of the same kind of material, thereby preventing appearance defects due to interface generation. I can solve it. Meanwhile, the first hardening resin and the second hardening resin may be formed of different materials to generate an interface, but the phosphor is contained in the second hardening resin, so that the interface between the first and second hardening resins is external. Can be prevented from

On the other hand, the second cured resin may have a concave, flat or convex upper surface.

On the other hand, the second cured resin may be formed to cover at least a portion of the upper horizontal surface of the cup portion. As the second cured resin is attached to the first cured resin and the cup part, adhesion of the second cured resin may be improved. In addition, the cup portion may have a rim protruding from its edge. When the frame is formed by dotting the second cured resin, the second cured resin prevents the second cured resin from flowing out from the cup to help the formation of the second cured resin.

According to another aspect of the present invention, a method of manufacturing a light emitting diode lamp includes preparing a lead frame including a cup part and a first lead having a leg extending from the cup part, and a second lead spaced apart from the first lead. A light emitting diode is mounted in the cup part and electrically connected to the first lead and the second lead. Thereafter, a first cured resin is formed in the cup part to dope and cure the resin to cover the light emitting diode. The first hardening resin is formed to have a concave upper surface. Meanwhile, a second cured resin covering the first cured resin is formed by dotting and curing a resin containing a phosphor on the first cured resin. In addition, a sealing resin for sealing the cup part of the first lead, a part of the second lead, and the first and second cured resins is formed. Accordingly, a light emitting diode lamp may be manufactured in which the light emitting diode and the phosphor are separated from each other to improve the light emission intensity, and since the first hardening resin has a concave upper surface, the second hardening resin may be formed by doping the second hardening resin. It is easy.

Meanwhile, electrically connecting the light emitting diode to the first lead and the second lead may include forming a bonding wire connecting the light emitting diode to the second lead. After the bonding wire is formed, the first and second cured resins are formed. In this case, the bonding wire is formed such that portions of the bonding wire positioned on the first cured resin are located away from a central region of the first cured resin.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, etc. of components may be exaggerated for convenience. Like numbers refer to like elements throughout.

2 is a cross-sectional view illustrating a light emitting diode lamp according to an embodiment of the present invention.

Referring to FIG. 2, the LED lamp includes a cup part 23 and a first lead 21a having legs extending from the cup part 23. In addition, the second lead 21b is disposed spaced apart from the first lead. The second lead has a leg corresponding to the first lead 21a.

The light emitting diode 25 is mounted in the cup part 23 of the first lead, and is electrically connected to the second lead through a bonding wire 27. In addition, the light emitting diode may be mounted on the cup part 23 using a conductive adhesive (not shown) and electrically connected to the first lead 21a. Alternatively, the light emitting diode may be connected to another bonding wire (not shown). It may be electrically connected to the first lead by.

The cup part 23 of the first lead has a cavity, and the light emitting diode 25 is mounted in the cavity. The side wall of the cavity forms an inclined reflecting surface to reflect light emitted from the light emitting diode 25 in a predetermined direction. Meanwhile, the edge 27 protruding from the edge of the cup part 23 may be formed. The edge 27 prevents the resin from flowing out of the cup portion 23 while forming the cured resin.

Meanwhile, the first hardening resin 31 covers the light emitting diode 25. The first hardening resin 31 is formed by doping a liquid or gel-like transparent resin such as epoxy or silicon and curing the same, and does not contain a phosphor. The first hardening resin 31 is formed in the cavity to have a concave upper surface as shown.

In addition, the second curing resin 33 covers the upper portion of the first curing resin 31. The second cured resin 33 contains a phosphor to wavelength convert at least a portion of the light emitted from the light emitting diode 25. The second curing resin 33 is formed by doping a liquid or gel-like resin, such as epoxy or silicone, containing phosphor and curing the same, and is located on the cup part 23 surrounded by the rim 27. As is preferred, it is thick at its center. The second hardening resin 33 may be formed to cover at least a portion of the upper horizontal surface of the cup portion 23 to improve its adhesion. In addition, the second cured resin 33 may have a convex upper surface as shown, but is not limited thereto, and may have a flat upper surface or a concave upper surface.

Meanwhile, the sealing resin 35 seals the cup part of the first lead, a part of the second lead, and the first and second cured resins 31 and 33. The sealing resin 35 is formed by inverting the first lead and the second lead in a mold containing a liquid or gel resin after the second hardening resin 33 is formed, and curing the resin. It may be formed to have a shape. The sealing resin 35 has a lens function for protecting the light emitting diode 25 and refracting the light emitted from the light emitting diode 25 into a predetermined direction angle. The sealing resin 35 does not need to contain a phosphor, and thus the amount of phosphor used may be reduced.

According to the present embodiment, since the phosphor is distributed in the second cured resin 33, the light emitted from the light emitting diode 25 is diffusely reflected by the phosphor, and the incident to the light emitting diode 25 can be alleviated. Reduction of wavelength converted light in the phosphor into the light emitting diodes 25 is reduced. As a result, the amount of light incident on the light emitting diode 25 and lost is reduced to improve the light emission intensity.

On the other hand, the second cured resin 33 may have a higher refractive index than the first cured resin 31, thereby preventing light loss due to total internal reflection at the interface between the first and second cured resin 31 Can be.

In addition, the problem of the conventional LED lamp can be solved by appropriately selecting the materials of the first curing resin 31, the second curing resin 33 and the sealing resin. For example, the resins 31, 33, and 35 may be formed of the same type of material, for example, an epoxy resin, thereby preventing appearance defects due to interface generation and reduction in emission intensity. In addition, the first hardening resin 31 and the second hardening resin 33 are formed of silicon, and the sealing resin 35 is formed of epoxy to prevent the resin from peeling off or cracking in the resin. have.

Meanwhile, the first curable resin 31 may be formed of silicon, and the second curable resin 33 and the sealing resin may be formed of epoxy. In this case, resin peeling and crack generation may be prevented by the first hardening resin 31, and an air layer that may be formed at an interface between the first hardening resin 31 and the second hardening resin 33 may be formed. It is prevented to be observed from the outside by the phosphor in the two-curing resin 33.

Hereinafter, a light emitting diode lamp manufacturing method according to an embodiment of the present invention will be described.

Referring again to FIG. 2, first, a lead frame having a first lead 21 a and a second lead 21 b is prepared. The first lead 21a has a cup portion 23 and a leg extending from the cup portion, and the second lead 21b has a leg corresponding to the leg of the first lead. The cup part 23 has a cavity, and a protruding edge 27 may be formed at the edge of the cup part.

Thereafter, a light emitting diode 25 is mounted in the cup part 23 to be electrically connected to the first lead 21a and the second lead 21b. The light emitting diode 25 may be mounted on the cup part 23 through an electrically conductive adhesive (not shown), and may be electrically connected to the first lead 21a. The second lead may be connected by a bonding wire 27. And may be electrically connected to 21b. Meanwhile, the light emitting diode 25 may be electrically connected to the first lead 21a by another bonding wire (not shown) instead of an electrically conductive adhesive.

Subsequently, a first curing resin 31 covering the light emitting diode is formed. The first curing resin 31 is formed by doping a liquid or gel-like transparent resin such as silicone or epoxy into the cavity of the cup part 23 and curing it. In this case, the first hardening resin is formed to have a concave upper surface in the cavity. Generally, when a liquid or gel phase, especially a low viscosity resin, is poured into the cavity, the resin rises up along the sidewall of the cavity, so that the resin is concave.

Thereafter, a second cured resin 35 covering the first cured resin 31 is formed. The second curing resin may be formed by doping a resin containing a phosphor, such as silicon or epoxy, in a central region of the first curing resin 33 and curing the resin. When dotting a resin containing phosphor, the resin flows down to cover the first cured resin 31. At this time, in order to prevent the bonding wire 27 from being deformed due to the pressure of the dispenser or the resin during the doping of the resin, the bonding wire 27 has a region located above the first hardening resin 31. It is preferably formed so as to be located away from the central region of the first hardening resin (31). On the other hand, the edge 27 formed on the edge of the cup portion 23 prevents the resin from flowing down to the outside of the cup portion 23.

Subsequently, the lead frame on which the second hardening resin 33 is formed is placed upside down in the mold containing the epoxy resin, and the sealing resin 35 is formed by curing the epoxy resin.

Accordingly, the LED lamp in which the second curing resin 33 containing the phosphor is located away from the LED 25 can be manufactured.

According to the embodiments of the present invention, it is possible to provide a light emitting diode lamp that can improve the light emission intensity by mitigating that the light emitted from the light emitting diode is again incident to the light emitting diode and lost. In addition, it is possible to provide a light emitting diode lamp capable of preventing peeling or cracking of the cured resin and solving external appearance defects observed by selecting materials of the first and second cured resins. On the other hand, since the first cured resin is formed to have a concave upper surface, it is easy to dope and form the second cured resin.

Claims (10)

A first lead including a cup part; A second lead spaced apart from the first lead; A light emitting diode mounted in the cup part of the first lead; Bonding wires connecting the light emitting diodes to the second leads; A first cured resin covering the light emitting diode; A second curing resin covering the first curing resin and containing a phosphor; And A sealing resin sealing the cup part of the first lead, a part of the second lead, and the first and second cured resins, The second cured resin covers at least a portion of the upper horizontal surface of the cup portion, The cup portion has a rim protruding at its edge, The second cured resin is positioned on the cup portion surrounded by the rim. The method according to claim 1, The second cured resin has a higher refractive index than the first cured resin. The method according to claim 1, The first cured resin and the second cured resin is silicon, the sealing resin is an LED lamp, characterized in that the epoxy. The method according to claim 1, The first curing resin, the second curing resin and the sealing resin is an LED lamp, characterized in that the epoxy. The method according to claim 1, The first curing resin is silicon, the second curing resin and the sealing resin is an LED lamp, characterized in that the epoxy. The method according to claim 1, The second cured resin has a convex top surface. The method of claim 6, The second cured resin has a convex bottom surface. delete delete delete
KR1020060136441A 2006-12-28 2006-12-28 Light emitting diode lamp and method of fabricating the same KR101334315B1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100966368B1 (en) * 2008-05-15 2010-06-28 삼성엘이디 주식회사 Led package
KR101028173B1 (en) * 2009-02-13 2011-04-08 엘지이노텍 주식회사 Light emitting device package and fabrication method therof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374005A (en) * 2001-04-10 2002-12-26 Toshiba Corp Optical semiconductor device
JP2005197423A (en) * 2004-01-07 2005-07-21 Matsushita Electric Ind Co Ltd Led light source
JP2005340512A (en) * 2004-05-27 2005-12-08 Fujikura Ltd Light emitting device and method for manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374005A (en) * 2001-04-10 2002-12-26 Toshiba Corp Optical semiconductor device
JP2005197423A (en) * 2004-01-07 2005-07-21 Matsushita Electric Ind Co Ltd Led light source
JP2005340512A (en) * 2004-05-27 2005-12-08 Fujikura Ltd Light emitting device and method for manufacturing the same

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