KR101333435B1 - Test handler - Google Patents

Abstract

A test handler inspects a substrate having multiple semiconductor modules and inspection terminals connected to the semiconductor modules on one side. The test handler comprises an inspection chamber; a rack moving inside and outside the inspection chamber in a slide form and in which the substrate is laid; an inspection socket formed in the inspection chamber and connected to the inspection terminals of the substrate laid on the rack when the rack moves inside the inspection chamber; and a firmware module connected to the inspection socket and inspecting the semiconductor modules. The manufacturing costs and time for the semiconductor modules are reduced by performing an inspection process of the semiconductor modules before the semiconductor modules are manufactured into the individualized final products.

Description

Test handler

Embodiments of the invention relate to test handlers. More specifically, the present invention relates to a test handler for performing an inspection process on a substrate including a plurality of semiconductor modules.

Recently, with the development of semiconductor manufacturing technology, the use of mass storage devices using nonvolatile memories is increasing. For example, the use of solid state drives (SSDs) as a mass storage device using volatile memory and nonvolatile memory has been greatly increased.

The SSD is equipped with various types of active elements and passive elements on a substrate together with an integrated circuit device used as a control unit, a volatile memory device used as a buffer memory, a nonvolatile memory device used as a mass storage device, and the like. Can be prepared.

On the other hand, not only the SSD as described above, but also various types of semiconductor modules, for example, a semiconductor module such as a memory module, a graphics card, an audio card, a LAN card, etc., in which volatile memory devices are mounted, may improve the productivity of a plurality of semiconductor modules. The semiconductor modules may be manufactured on a single substrate, that is, a soft array substrate including a plurality of semiconductor modules may be manufactured, and then the semiconductor modules may be cut and individualized. In addition, each semiconductor module may be manufactured to remove defective products through performance inspection.

The inspection process for the semiconductor modules may be performed individually for each of the semiconductor modules using a specific jig suitable for the semiconductor modules, or may be manually performed by an operator after individualizing the semiconductor modules as described above. have. However, in the case of the inspection process as described above may take a lot of time, unnecessary manufacturing cost according to the semiconductor modules that are determined to be defective.

Embodiments of the present invention have an object to provide a test handler that can easily perform the inspection process for a soft array substrate including a plurality of semiconductor modules.

According to embodiments of the present invention, a test handler includes a test chamber for performing a test on a substrate including a plurality of semiconductor modules and having test terminals connected to the semiconductor modules on one side, and an inside of the test chamber. And a rack configured to be movable in a slide form to the outside and configured to place the substrate, and to be in contact with the test terminals of the substrate placed on the rack when the rack is provided in the test chamber and the rack is moved into the test chamber. A test socket configured to be connected to the test socket, a firmware module for inspecting the semiconductor modules, a supply conveyor for supplying the substrate, a discharge conveyor for discharging the inspected substrate in the test chamber, and the test chamber And a substrate for transferring the substrate between the supply and discharge conveyors It may include sending.

According to embodiments of the present invention, the inspection socket may have a recess into which one end of the substrate is inserted, and contact pads configured to be in contact with the inspection terminals may be provided inside the recess.

According to embodiments of the present invention, one side of the substrate may be provided with a through hole, and one side of the rack may be provided with a fixing pin inserted into the through hole of the substrate.

According to embodiments of the present invention, an alignment pin may be provided at one end of the rack, and an alignment hole into which the alignment pin is inserted may be formed at one side of the inspection socket.

According to embodiments of the present disclosure, a temperature controller may be further provided to supply temperature-controlled air into the test chamber to control the temperature inside the test chamber.

According to embodiments of the present invention, the temperature control unit may include a temperature control chamber disposed below the test chamber, a blower disposed in the temperature control chamber, and configured to supply air having the temperature controlled to the test chamber. It is disposed in the temperature control chamber and may include a heater for controlling the temperature of the air.

According to embodiments of the present invention, the temperature control unit may further include a cooler for supplying air cooled into the temperature control chamber.

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According to embodiments of the present invention, a rack opener may be further provided to load the substrate into the test chamber and move the rack into and out of the test chamber to unload the board from the test chamber. .

According to the embodiments of the present invention as described above, the time required to manufacture the semiconductor modules by performing the inspection process for the various semiconductor modules manufactured in the form of a soft array substrate before the semiconductor modules are individualized The cost can be greatly reduced.

In addition, the substrate may be aligned on one side of the rack by providing a fixing pin at one side of the rack which is moved into the test chamber and having a through hole into which the fixing pin is inserted. Therefore, even when the length of the substrate is changed, the inspection process of the substrate can be easily performed. As a result, the inspection process for various substrates of different lengths can be easily performed.

1 is a schematic diagram illustrating a substrate inspection apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic plan view for explaining the substrate inspection apparatus illustrated in FIG. 1.
3 is a schematic diagram illustrating a substrate including semiconductor modules.
FIG. 4 is a schematic side view for explaining the test handler shown in FIG. 1.
FIG. 5 is a schematic front view for describing the test chamber illustrated in FIG. 1.
FIG. 6 is a schematic diagram illustrating a rack and an inspection socket illustrated in FIG. 5.
FIG. 7 is a schematic plan view for describing the substrate transfer unit illustrated in FIG. 1.
FIG. 8 is a schematic front view for describing the substrate transfer unit illustrated in FIG. 1.
FIG. 9 is a schematic side view for explaining the pickup head shown in FIGS. 7 and 8.
FIG. 10 is a schematic diagram illustrating the stopper and the load lift of the feed conveyor shown in FIG. 1 and the substrate transfer unit shown in FIG. 7.
11 and 12 are schematic diagrams for describing a method of picking up a substrate using the pickup head shown in FIG. 9.
FIG. 13 is a schematic bottom view illustrating the rack opener illustrated in FIG. 8.
FIG. 14 is an enlarged view for explaining a hawk of the rack opener illustrated in FIG. 13.
FIG. 15 is a schematic configuration diagram illustrating the inspection conveyor illustrated in FIG. 1.
FIG. 16 is a schematic diagram illustrating a second loading conveyor shown in FIGS. 1 and 2.
FIG. 17 is a schematic configuration diagram for describing the carrying-out conveyor shown in FIGS. 1 and 2.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected sufficiently. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

FIG. 1 is a schematic diagram illustrating a substrate inspection apparatus including a test handler according to an exemplary embodiment of the present invention, and FIG. 2 is a schematic plan view illustrating the substrate inspection apparatus illustrated in FIG. 1. 3 is a schematic diagram illustrating a substrate including semiconductor modules.

1 and 2, a substrate inspection apparatus 10 according to an embodiment of the present invention may include a plurality of semiconductor modules 30 (see FIG. 3), for example, an SSD used as a mass storage device, and volatile. An inspection process for the soft array substrate 20 (see FIG. 3) including the semiconductor modules 30 such as a memory module, a graphics card, an audio card, a LAN card, a main board such as other mobile devices, and the like, is performed. It can be used to perform quickly.

In particular, as illustrated in FIG. 3, one side of the substrate 20 may include test terminals 22 electrically connected to the semiconductor modules 30. Specifically, the substrate 20 may include a plurality of openings in which the semiconductor modules 30 are disposed, and the semiconductor modules 30 and the substrate 20 disposed in each of the openings may include a plurality of openings. It can be connected via the connections. Each of the semiconductor modules 30, for example, an SSD, may include various types of active and passive elements together with an integrated circuit device, a buffer memory, a flash memory, and the like used as a controller.

Although not shown in detail, wires (not shown) connecting the semiconductor modules 30 and the test terminals 22 may be provided on the substrate 20 through the connection parts.

Referring back to FIGS. 1 and 2, the substrate inspection apparatus 10 may include a test handler 100 disposed between the loader 300 and the unloader 400 and the loader 300 and the unloader 400. It may include. In particular, the substrate inspection apparatus 10 may be disposed in a manufacturing line of the semiconductor modules 30. For example, the loader 300 may be connected in-line, or in series, with equipment for mounting an integrated circuit device, a buffer memory, a flash memory, and various kinds of active and passive devices on the substrate 20. The unloader 400 of the substrate inspection apparatus 10 may be connected to a cutting and sorting facility for individualizing the semiconductor modules 30 and classifying them according to a performance test result.

However, unlike the above, the plurality of substrates 20 may be supplied to the loader 300 in a state in which the plurality of substrates 20 are stored in the magazine 40, and also the plurality of magazines (according to the inspection result in the unloader 400). 44 may be separately stored.

The loader 300, the test handler 100, and the unloader 400 of the substrate inspection apparatus 10 may be connected to each other by a conveyor line 250 for transferring the substrate 20. In detail, the conveyor line 250 extends from the loader 300 to the unloader 400 via the test handler 100 and transfers the substrate 20 to the test handler 100. It may be used to eject the substrate 20 inspected by the test handler 100.

The conveyor line 250 extends from the loader 300 to the test handler 100 and a supply conveyor line 252 for transferring the substrate 20 to the test handler 100, and the test handler ( It may include a discharge conveyor line 254 extending from 100 to the unloader 400 and for discharging the substrate 20 inspected by the test handler 100.

That is, the loader 300 and the test handler 100 may be connected to each other by a supply conveyor line 252, and the test handler 100 and the unloader 400 may be connected to each other by a discharge conveyor line 254. Can be. However, unlike the above, the loader 300, the test handler 100 and the unloader 400 may be connected in series by one conveyor line.

In addition, although two test handlers 100 are connected in series between the loader 300 and the unloader 400, the number of the test handlers 100 may be changed as necessary. . That is, according to the production speed of the semiconductor modules 30, one or a plurality of test handlers 100 may be freely connected between the loader 300 and the unloader 400 regardless of the quantity, so that various types of semiconductors may be used. The test process of the modules 30 may be continuously performed without waiting time, and also when the test process of the substrates 20 contained in the magazine 40 is performed, the test handler 100 may be necessary. By controlling the number of times, the inspection process time can be greatly shortened.

According to one embodiment of the invention, the feed conveyor line 252 may extend from the loader 300 to the test handler 100 and to supply the substrate 20 to the test handler 100. Can be used. For example, the supply conveyor line 252 may include a load conveyor 370 provided in the loader 300 and a supply conveyor 260 provided in the test handler 100.

In addition, the discharge conveyor line 254 may extend from the test handler 100 to the unloader 400 and may be used to discharge the substrate 20 inspected by the test handler 100. For example, the discharge conveyor line 254 may include an discharge conveyor 280 provided in the test handler 100 and an unload conveyor 410 provided in the unloader 400.

The supply conveyor 260 and the discharge conveyor 280 may extend in parallel with each other, the test handler 100 inspects the substrate 20 from the supply conveyor 260 of the test handler 100. It may include a substrate transfer unit 150 for transferring to the chamber 102, the substrate 20 is transferred from the inspection chamber 102 to the discharge conveyor 280.

According to another embodiment of the present invention, although not shown between the loader 300, the test handler 100, and the unloader 400, a connection conveyor (not shown) may be provided. That is, the supply and discharge conveyor lines 252 and 254 may further include connection conveyors for transferring the substrate 20 between the loader 300, the test handler 100, and the unloader 400. . The connection conveyors may be provided to further facilitate the connection between the loader 300 and one or more test handlers 100 and the unloader 400.

FIG. 4 is a schematic side view for explaining the test handler shown in FIG. 1, and FIG. 5 is a schematic front view for explaining the test chamber shown in FIG. 1.

1, 2, 4, and 5, the test handler 100 may be used to inspect the semiconductor modules 300 of the substrate 20. As an example, the test handler 100 includes an inspection chamber 102 having an inspection socket 120 configured to be connected to inspection terminals 22 of the substrate 20 to inspect the semiconductor modules 30. ), A test module 130 connected to the test socket 120 to test the semiconductor modules 30, and between the supply and discharge conveyor lines 260 and 280 and the test chamber 102. It may include a substrate transfer unit 150 for transferring the substrate 20.

The test chamber 102, the test module 130, and the substrate transfer unit 150 may be disposed on the supply and discharge conveyors 260 and 280. According to one embodiment of the invention, the test handler 100 may include two test chambers 102, and two test modules 130 respectively connected to the test chambers 102. It may include. The test chambers 102 may be arranged in a direction perpendicular to the supply and discharge directions of the substrate 20.

In addition, a temperature controller 140 for controlling the temperature inside the test chambers 102 may be disposed below the test chambers 102. In particular, the supply and discharge conveyors 260 and 280 may be disposed between the temperature control units 140.

The test chamber 102 may include a rack 110 on which the substrate 20 is placed, and the rack 110 may be inside the test chamber 102 for loading and unloading the substrate 20. And it may be configured to be movable horizontally outward. For example, the test chamber 102 may have a form of a drawer cabinet and the rack 110 may be moved into and out of the test chamber 102 in a slide form.

In particular, according to an embodiment of the present invention, the inspection chamber 102 may be provided with a plurality of racks 110, as shown in the drawings, and the plurality of substrates 20 in the inspection chamber 102. Inspection process can be performed simultaneously. As an example, the plurality of racks 110 may be arranged in a plurality of rows and columns as shown in FIG.

In addition, the inspection chamber 102 may be provided with a plurality of inspection sockets 120 configured to be connected to the substrates 20 loaded in the racks 110. The test terminals 22 of the substrate 20 loaded on the racks 110 are connected to the test sockets when the racks 110 are moved into the test chamber 102, that is, when the racks 110 are closed. 120 may be contacted.

FIG. 6 is a schematic diagram illustrating a rack and an inspection socket illustrated in FIG. 5.

Referring to FIG. 6, each of the test sockets 120 may have a recess 122 configured to insert an end portion of the substrate 20, and the substrate 20 may be inside the recess 122. Contact pads 124 configured to be in contact with the test terminals 22 may be provided.

According to an embodiment of the present invention, one side of the substrate 20 may be provided with, for example, two through holes 24 (see FIG. 3), and one side of the rack 110 may have the through holes. 24 and corresponding pins 112 may be provided. That is, when the substrate 20 is loaded on the rack 110, the fixing pins 112 may be inserted into the through holes 24, whereby the substrate 20 may be disposed on the rack 110. The position can be fixed. Therefore, when the rack 110 is closed, the test terminals 22 of the substrate 20 loaded on the rack 110 may be inserted into the recess 122 of the test socket 120. In addition, the test terminals 22 of the substrate 20 may be stably contacted with the contact pads 124.

As a result, the substrate 20 may be fixed on the rack 110 with one side of the substrate 20 aligned with one side of the rack 110, even if the length of the substrate 20 is changed. That is, an inspection process for various substrates may be performed in the inspection chamber 100.

In addition, an alignment pin 114 may be provided at the front end of the rack 110 as shown in FIG. 6 for accurate contact between the test terminals 22 and the contact pads 124. Correspondingly, the inspection socket 120 may be provided with an alignment hole 126 into which the alignment pin 114 is inserted. For example, alignment pins 114 may be provided at both front ends of the rack 110, respectively, and alignment holes corresponding to the alignment pins 114 may be provided at both sides of the test socket 120. Field 126 may be provided.

4 and 5, the test sockets 120 of the test chamber 102 may be connected to the test module 130. In this case, the test module 130 may include a plurality of firmware modules 132 connected to each of the test sockets 120. Although not shown, the firmware modules 132 may be connected to a test server (not shown) and may download firmware for inspection of the semiconductor modules 30 from the test server.

In particular, the firmware modules 132 may download firmware or a test program corresponding to the semiconductor modules 30 to be inspected from the test server, and use the downloaded firmware to form the semiconductor modules 30. The controller mounted on the board can be driven. In addition, an inspection program such as a self-diagnosis program may be installed in the semiconductor modules 30 and the semiconductor modules 30 may be inspected using the inspection program.

In addition, a power source for driving the semiconductor modules 30 may be applied during the inspection process of the semiconductor modules 30. After the inspection process of the semiconductor modules 30 is completed, the semiconductors may be applied. The test result of the modules 30 may be transmitted to the test server.

On the other hand, the temperature control unit 140 may be used to adjust the temperature inside the test chamber 102. In particular, the temperature controller 140 may supply the temperature controlled air into the test chamber 102 to maintain a constant temperature of the substrates 20 loaded on the racks 110. For example, as shown, the temperature control unit 140 is disposed inside the temperature control chamber 141 and the temperature control chamber 141 disposed below the test chamber 102 and the test chamber 102. It may include a blower 142 for providing air therein and a heater 144 for adjusting the temperature of the air.

Although not shown, the test chamber 102 may be provided with a duct (not shown) for uniformly supplying the air between the racks 110, and the dotted line arrow indicates an approximate circulation of air. . In addition, although not shown, the test handler 100 may further include a cooler (not shown) for adjusting the internal temperature of the test chamber 102. For example, the cooler may be disposed above the inspection chamber 102 and may provide cooled air into the temperature control unit 140 through a separate duct, and the cooled air may include the blower ( 142 may be supplied into the test chamber 102.

FIG. 7 is a schematic plan view illustrating the substrate transfer unit illustrated in FIG. 1, and FIG. 8 is a schematic front view illustrating the substrate transfer unit illustrated in FIG. 1. FIG. 9 is a schematic side view for explaining the pickup head shown in FIGS. 7 and 8.

7 to 9, the substrate transfer unit 150 includes a load arm 164 for transferring the substrate 20 transferred by the supply conveyor 260 to the inspection chamber 102, and the inspection chamber. And an unload arm 166 that transfers the substrate 20 examined at 102 to the discharge conveyor 280.

The rod and unload arms 164 and 166 may be moved in the vertical direction by the vertical driver 152 and may be moved in the horizontal direction by the horizontal driver 156. In detail, the substrate transfer part 150 may be disposed to face the front surface of the inspection chamber 102, and the horizontal driver 156 may be mounted on the vertical driver 152 and move in a vertical direction, and the vertical direction may be provided. It may be mounted on the first support member 154 extending in the first horizontal direction from the driver 152 toward the inspection chamber 102. In particular, the horizontal driver 156 may extend in a second horizontal direction perpendicular to the extending direction of the first support member 154, and move the rod and unload arms 164 and 166 in the second horizontal direction. You can.

The vertical and horizontal drivers 152 and 156 may have a form of a well-known rectangular coordinate robot. For example, it includes a motor for providing rotational force, a power transmission device including a ball screw and a ball block or a pulley and a belt for converting the rotational motion of the motor into a linear reciprocating motion, and guide members for guiding the linear reciprocating motion. Can be configured.

In addition, the rod and unload arms 164 and 166 may be mounted to the second support member 158 that is movably mounted to the horizontal driver 156. The second support member 158 may extend from the horizontal driver 156 toward the inspection chamber 102, and the load and unload arms 164 and 166 may be connected to the second support member 158 by the second support member 158. It may be arranged adjacent to each other in the horizontal direction.

In particular, the rod and unload arms 164 and 166 may be disposed to be movable in a direction perpendicular to the second support member 158. For example, the second support member 158 may be equipped with second and third vertical drivers 160 and 162 connected to the rod and unload arms 164 and 166, respectively. As an example, hydraulic or pneumatic cylinders may be used as the second and third vertical drives 160 and 162.

Each of the load and unload arms 164 and 166 may include a head support 168 connected to the second or third vertical drive 160 or 162 and a pickup head 170 mounted to the head support 168. have. The head support 168 and the pickup head 170 may each have a plate shape, and in particular, the lower edge portion of the pickup head 170 may extend downward to closely contact the edge portion of the substrate 20. have.

Particularly, according to an embodiment of the present invention, the front and both side lower surface edge portions except the rear side of the pickup head 170 may have one side edge portion and one side edge portion where the through holes of the substrate 20 are formed. It may extend downward to be in close contact with both side edge portions facing. That is, the edge portion of the pickup head 170 extending downward may have a rectangular ring shape in which the rear side is opened. This is to correspond to the substrates 20 having various lengths because the length of the substrate 20 can be changed.

In addition, a guide member for guiding the substrate 20 to the front side of the pickup head 170 so that the substrate 20 is in close contact with the lower surface of the pickup head 170 while picking up the substrate 20. 172 may be disposed.

FIG. 10 is a schematic diagram illustrating the stopper and the load lift of the feed conveyor shown in FIG. 1 and the substrate transfer unit shown in FIG. 7.

Referring to FIG. 10, the substrate transfer unit 150 moves the stopper 174 and the substrate 20 stopped by the stopper 174 upward to stop the substrate transferred on the supply conveyor 260. May include a load lift 176.

The stopper 174 may be disposed above the feed conveyor 260 as shown, and may be configured to be movable in the vertical direction to stop the substrate 20 transferred on the feed conveyor 260. For example, the stopper 174 may be connected to the stopper driver 178 as shown, and a hydraulic or pneumatic cylinder may be used as the stopper driver 178.

Meanwhile, the load lift 176 for moving the substrate 20 suspended on the supply conveyor 260 upwards lifts the pair of lift arms 180 and the lift arms 180 in the vertical direction. The driver 182 may be included. The lift driver 182 may be a hydraulic or pneumatic cylinder.

However, unlike the above, the stopper driver 178 and the lift driver 182 may include a power transmission device and a guide member for converting the rotational motion of the motor and the motor into a linear motion.

In this case, the supply conveyor 260 may have a pair of recesses 268 to secure the movement path of the lift arms 180. For example, as shown, the feed conveyor 260 is for conveying the substrate 20 and the plurality of rollers including a motor 262 and a drive roller 264 connected to the motor 262. Conveyor belt 266 may be included, and may include idle rollers 270 to enable the conveyor belt 266 to form the recesses 268, in particular as shown.

Unlike the above, according to another embodiment of the present invention, the supply conveyor 260 may include a plurality of conveyors (not shown), the plurality of conveyors may be arranged to be spaced apart from each other by a predetermined interval. In this case, the lift arms 182 of the rod lift 176 may be arranged to be movable in the vertical direction between the plurality of conveyors.

7 to 9 again, the load arm 164 of the substrate transfer part 150 is configured to pick up the substrate 20 moved upward by the load lift 176. Can be moved downward by

11 and 12 are schematic diagrams for describing a method of picking up a substrate using the pickup head shown in FIG. 9.

9 to 12, the load arm 164 may include clamps 184 for holding the substrate 20. The clamps 184 may be disposed on both sides of the pickup head 170 and may be moved in opposite directions to grip the substrate 20. For example, a clamp driver 186 may be disposed on the head support 168 to move the clamps 184 in opposite horizontal directions. For example, a pneumatic or hydraulic cylinder may be used as the clamp driver 186, and may be extended and stretched to grasp the substrate 20.

Specifically, for example, the rod arm 164 may be moved downward by the second vertical drive unit 160, whereby the rod lift 176 to the lower edge portions of the pickup head 170 The raised substrate 20 may be in close contact with each other. In this case, the pickup head 170 may be elastically supported by the head support 168. For example, a plurality of guide bars 188 may be mounted on the pickup head 170, and the plurality of guide bars 188 may extend upward through the head support 168. In addition, a plurality of coil springs 190 may be disposed to surround each of the plurality of guide bars 188 between the head support 168 and the pickup head 170.

The second vertical driver 160 may closely contact the lower edge portions of the pickup head 170 to the substrate 20 such that the coil springs 190 are compressed to a predetermined degree. At this time, the interval between the clamps 184 may be increased by the clamp driver 186, in order to hold the substrate 20 after the substrate 20 is in close contact with the pickup head 170. Can be reduced. As a result, the lower edge portions of the substrate 20 may be supported by the clamps 184, and the upper edge portions of the substrate 20 may be connected to the lower edge portions of the pickup head 170. Can be supported by. In particular, the substrate 20 may be gripped more stably between the pickup head 170 and the clamps 184 by the restoring force of the coil springs 190.

The substrate 20 picked up by the pickup head 170 of the rod arm 164 may be loaded into one of the racks 110 by the vertical driver 152 and the horizontal driver 156. have. A method of loading the substrate 20 into the rack 110 will be described later.

Although not shown, the substrate transfer part 150 may include the unloaded substrate after the substrate 20 inspected in the inspection chamber 102 is unloaded from the rack 110 by the unload arm 166. And an unload lift 192 for moving 20 onto the discharge conveyor 280. In this case, the unload lift 192 may be configured to be substantially the same as the load lift 176, and the discharge conveyor 280 may also be configured to be substantially the same as the supply conveyor 260.

A method of picking up the inspected substrate 20 from the rack 110 by the unload arm 166 and moving the substrate 20 onto the discharge conveyor 280 by the unload lift 192. The method uses the load lift 176 to move the substrate 20 upwards from the feed conveyor 260 and the load lift 176 using the pickup head 170 of the load arm 164. Since it is similar to the method of picking up the substrate 20 on the (), further detailed description thereof will be omitted.

Referring back to FIG. 8, the substrate transfer unit 150 may include a rack opener 194 for opening one of the racks 110. The rack opener 194 may open the rack 110 to load the substrate 20 picked up by the load arm 164 into one of the racks 110.

FIG. 13 is a schematic bottom view for explaining the rack opener shown in FIG. 8, and FIG. 14 is an enlarged view for explaining a hawk of the rack opener shown in FIG. 13.

Referring to FIGS. 13 and 14, the rack opener 194 may be mounted below the first support member 154, and a hawk 196 and the hawk 196 for opening the rack 110. ) May include first and second hawk drivers 198 and 210 for moving the first and second horizontal directions, respectively.

The first hawk driver 198 is mounted on the lower surface of the first support member 154 and is movably mounted to the guide rail 200 and the guide rail 200 extending in the first horizontal direction. The block 202 and the ball screw 204 and the motor 206 and the like mounted on the guide block 202 may be included. In this case, a third support member 208 extending in the first horizontal direction may be mounted on the guide block 202, and the hawk 196 may be mounted on a front end portion of the third support member 208. Can be.

In addition, a second hawk driver 210 for moving the hawk 196 in the second horizontal direction may be mounted at a front end portion of the third support member 208. Hydraulic or pneumatic cylinders may be used as the second hawk driver 210.

However, the scope of the present invention will not be limited by the configuration of the first and second hawk drivers 198 and 210, and the configuration of the first and second hawk drivers 198 and 210 itself may be varied as necessary. can be changed.

On the other hand, the hawk 196 may have a pin shape, each rack 110 may be provided with a coupling block (110B) configured to be coupled to the hawk (110). For example, the coupling block 110B may be mounted on the cover front surface 110A of the rack 110 and may have a coupling hole 110C into which the hawk 196 may be inserted.

The first hawk driver 198 may advance the hawk 196 so that the hawk 196 is adjacent to the coupling block 110B to open the rack 110, and the second hawk driver 1 After the hawk 196 is inserted into the coupling hole 110C by the 210, the rack 110 may be opened by reversing the hawk 196.

As described above, after the substrate 20 inspected inside the rack 110 is picked up by the pickup head of the unload arm 166 as the rack 110 is opened, the second support member 158 is horizontal. The inspection target substrate 20 picked up by the pickup head 170 of the rod arm 164 may be moved by the driving unit 156 in the second horizontal direction. Can be located.

Subsequently, after the inspection target substrate 20 picked up by the pickup head 170 of the rod arm 164 is loaded into the rack 110, the first hawk driver 198 advances the hawk 196. As a result, the rack 110 may be loaded into the test chamber 102. Subsequently, after the coupling state of the hawk 196 and the coupling hole 110C is released by the second hawk driver 210, the first hawk driver 198 may reverse the hawk 196. have.

Referring back to FIGS. 1 and 2, the loader 300 may include a load conveyor 370 for loading the substrate 20 into the test handler 100. That is, the substrate 20 may be transferred from the load conveyor 370 to the supply conveyor 260, and may be transferred from the supply conveyor 260 to the inspection chamber 102.

Meanwhile, the loader 300 may include a first loading conveyor 310 as shown. The first loading conveyor 310 may remove the substrate 20 from an apparatus for performing a previous process, for example, a device for mounting various elements constituting the semiconductor modules 30 on the substrate 20. Can be used to receive. That is, the substrate inspection apparatus 10 may be connected to each other in an inline form with the apparatus for performing the previous process.

In addition, unlike the above, the substrate 20 may be supplied from a magazine. In this case, the loader 300 may be provided with a supply magazine 40 in which a plurality of substrates 20 are accommodated. For example, the supply magazine support 302 for supporting the supply magazine 40 may be provided. May be disposed below the first loading conveyor 310.

The substrate 20 provided through the first loading conveyor 310 or from the supply magazine 40 may be transferred by the second loading conveyor 320, and the downstream side of the second loading conveyor 320 may be disposed at the downstream side of the second loading conveyor 320. An electrical inspection unit 350 may be disposed to perform an electrical inspection of the substrate 20, for example, a process of measuring current, voltage, resistance, and the like.

The electrical inspection unit 350 may include an inspection conveyor 352 for electrically inspecting the substrate 20. According to an embodiment of the present invention, the electrical inspection unit 350 may include a plurality of inspection conveyors 352 arranged in multiple layers.

FIG. 15 is a schematic configuration diagram illustrating the inspection conveyor illustrated in FIG. 1.

Referring to FIG. 15, each inspection conveyor 352 includes a conveyor belt 354 for transporting the substrate 20, a motor 356 for rotating the conveyor belt 354, and the substrate 20. And a contactor 358 for contacting the test terminals 22 to electrically inspect the substrate 20.

A stopper 360 for stopping the substrate 20 conveyed by the conveyor belt 354 may be disposed downstream of the conveyor belt 354. The stopper 360 may have a letter 'L' shaped cross section as shown, and may be configured to be movable in the vertical direction by the stopper driver 362. In particular, the substrate 20 transferred by the conveyor belt 354 may be stopped by a vertical portion of the stopper 360, and one side of which the inspection terminals 22 of the substrate 20 are provided. The end may be supported by the horizontal portion of the stopper 360.

The contactor 358 may be disposed above the horizontal portion of the stopper 360, and may be configured to be movable in the vertical direction by the contactor driver 364. In particular, the contactor 358 may include a plurality of test pins 366 configured to be in contact with the test terminals 22. Although not shown, the test pins 366 may be connected to an electrical test module (not shown), and the electric test module may transmit a signal for electrical test to the substrate 20 through the test pins 366. Can be authorized.

The stopper driver 362 and the contactor driver 364 may each include a pneumatic or hydraulic cylinder. Alternatively, the stopper driver 362 and the contactor driver 364 may be configured using a motor, a belt, a ball screw, a ball block, or the like.

As described above, when the multi-level inspection conveyors 352 are used, the second loading conveyor 320 and the load conveyor 370 are moved in the vertical direction by the loading elevator 322 and the load elevator 372, respectively. It can possibly be configured.

That is, the substrate 20 provided through the first loading conveyor 310 or from the supply magazine 40 may be moved onto the second loading conveyor 320, and the multilayer inspection conveyors 352 may be moved. It can be moved in the vertical direction by the loading elevator 322 to be delivered to one of the.

In addition, the load elevator 372 is the load conveyor in order to transfer the electrical inspection completed substrate 20 from one of the multilayer inspection conveyors 352 to the supply conveyor 260 of the test handler 100. The height of 370 can be adjusted.

As a result, the substrate 20 is transferred from the first carry-in conveyor 310 or the supply magazine 40 onto the second carry-on conveyor 320 and the second of which the height is adjusted by the carry-in elevator. The load conveyor 370 may be loaded from the loading conveyor 320 into one of the inspection conveyors 352, and the height is adjusted by the load elevator 372 after the electrical inspection is completed in the inspection conveyor 352. It may be delivered to the supply conveyor 260 of the test handler 100 through.

Referring back to FIGS. 1 and 2, the supply magazine 40 may be configured to be movable in a horizontal direction, for example, in a horizontal direction perpendicular to the transfer direction of the substrate 20. Although not shown in detail, a supply magazine driver (not shown) for moving the supply magazine 40 in a horizontal direction may be provided on the supply magazine support 302. In this case, a plurality of supply magazines 40 may be provided on the supply magazine support 302, and the supply magazine driver 302 may transfer one of the supply magazines 40 to the second loading conveyor 320. The feed magazines 40 can be moved to align with.

In addition, a buffer magazine support 304 for positioning the buffer magazine 42 may be disposed above the first supply conveyor 310. The buffer magazine 42 may be used to receive the substrate 20 that is determined to be defective among the substrates 20 inspected by the electrical inspection unit 350. According to an embodiment of the present invention, a plurality of buffer magazines 42 may be disposed on the buffer magazine support 304, and the buffer magazines 42 may be horizontally disposed on the buffer magazine support 304. A buffer magazine driver (not shown) for moving may be disposed.

The buffer magazine driver may also move the buffer magazines 42 to align one of the buffer magazines 42 with the second loading conveyor 320.

Meanwhile, one of the substrates 20 stored in the supply magazine 40 is taken out and placed on the second loading conveyor 320 in the second loading conveyor 320, and the inspection is determined as the defect. A gripper configured to be movable in a horizontal direction on the second loading conveyor 320 to receive the defective substrate 20 transferred from the conveyor 352 to the second loading conveyor 320 in the buffer magazine 42. 330 (see FIG. 16) may be provided.

FIG. 16 is a schematic diagram illustrating a second loading conveyor shown in FIGS. 1 and 2.

Referring to FIG. 16, the second loading conveyor 320 may be configured to be movable in the vertical direction by the loading elevator 322, and a conveyor belt 324 and a motor for moving the substrate 20. 326, the conveyor belt 324 and the motor 326 are installed and mounted to the frame 328 to be positioned above the conveyor belt 324, the frame 328 mounted to the loading elevator 322. And a gripper 330 configured to be movable in the horizontal direction.

In particular, the gripper 330 is a horizontal moving member 334 configured to be movable along a horizontal guide rail 332 mounted to the frame 328 and a vertical guide rail 336 mounted to the horizontal moving member 334. It can be configured to be movable in the horizontal and vertical direction through the vertical moving member 338 configured to be movable along (). Although not shown in detail, the frame 328 may be provided with a horizontal gripper driving unit 340 for moving the horizontal moving member 334 in a horizontal direction, and the horizontal moving member 334 may be provided with the vertical moving member. A vertical gripper driver 342 may be disposed to move the 338 in the vertical direction.

The gripper 330 may be mounted on the vertical moving member 338 and may grip one side of the substrate 20 to withdraw the substrate 20 from the supply magazine 40. In addition, the gripper 330 may function as a pusher for accommodating the defective substrate 20 moved from the electrical inspection unit 350 onto the second loading conveyor 320 in the buffer magazine 42.

Although not shown in detail, the horizontal gripper driver 340 may be configured using a motor, a belt, a ball screw, a ball block, or the like, and the vertical gripper driver 342 is configured using a pneumatic or hydraulic cylinder. Can be. In addition, the gripper operation of the gripper 330 may be implemented using a solenoid or the like or alternatively using a pneumatic or hydraulic cylinder. However, since the configuration of the horizontal and vertical gripper drivers 340 and 342 and the configuration for the gripper operation of the gripper 330 may be variously changed, the scope of the present invention will not be limited thereby.

According to one embodiment of the present invention as described above, the substrate 20 provided through the first loading conveyor 310 or from the supply magazine 40 is the second loading conveyor 320 and the inspection conveyors One of 352 and via the load conveyor 370 may be supplied to the test handler 100. However, if the electrical inspection process for the substrate 20 can be omitted or if the electrical inspection process has already been performed, the second loading conveyor 320, the electrical inspection unit 350, and the buffer magazine support 304 are provided. May be removed from the loader 300.

In addition, when the substrate inspection apparatus 10 is used inline only, the supply magazines 40 may be unnecessary. In this case, the supply magazine support 302 and the load conveyor 370 may be connected to the loader 300. May be removed from, and the first incoming conveyor 310 may function as the load conveyor 370.

Referring again to FIGS. 1 and 2, the unloader 400 may include an unload conveyor 410 for receiving the substrate 20 carried out from the test handler 100. That is, the substrate 20 may be transferred from the discharge conveyor 280 of the test handler 100 to the unload conveyor 410.

On the other hand, the downstream side of the substrate inspection apparatus 10 for cutting the inspected substrate 20 to individualize the semiconductor modules 30 and then separately storing according to the inspection result in the test handler 100 Can be connected in-line. That is, the unload conveyor 410 may transfer the substrate 20 to the cutting and sorting device.

According to one embodiment of the present invention, as shown in the lower portion of the unloading conveyor 410, the carrying out magazine 44 for accommodating the inspected substrate 20 may be disposed. That is, the substrates 20 inspected by the test handler 100 may be carried out from the substrate inspecting apparatus 10 after being accommodated in the carrying magazine 44.

FIG. 17 is a schematic configuration diagram for describing the carrying-out conveyor shown in FIGS. 1 and 2.

Referring to FIG. 17, an unloading magazine support 402 may be disposed below the unloading conveyor 410 to support a plurality of unloading magazines 44. Although not shown, the unloading magazine support 402 may be disposed. ), An unloading magazine driver (not shown) may be provided to move the unloading magazines 44 in a horizontal direction.

In addition, a downstream elevator 422 may be provided at a downstream side of the unload conveyor 410 to move the transport conveyor 420 and the transport conveyor 420 in a vertical direction. That is, the substrate 20 may be moved onto the take-out conveyor 420 via the unload conveyor 410 and move to the take-out magazine 44 after being moved in the vertical direction by the take-out elevator 422. Can be stored. In particular, the transport conveyor 420 may classify and store the substrates 20 inspected by the test handler 100 in the transport magazines 44 according to a test result.

The transport conveyor 420 is provided with a conveyor belt 424 and a motor 426 for moving the substrate 20, the conveyor belt 424 and a motor 426, and are mounted in the transport elevator 422. A pusher mounted on the frame 428 to be positioned above the frame 428 and the conveyor belt 424 and configured to be movable in a horizontal direction to receive the substrate 20 in the carrying out magazine 44 ( 430) and the like.

In particular, the pusher 430 is horizontal to move the horizontal moving member 434 and the horizontal moving member 434 configured to move along the horizontal guide rail 432 mounted to the frame 428 in a horizontal direction. A vertical pusher driver 438 mounted to the pusher driver 436 and the horizontal moving member 434 to move the pusher 430 in the vertical direction may be included.

The horizontal pusher driver 436 may be configured using a motor, a belt or a ball screw and a ball block, and the vertical pusher driver 438 may be configured using a pneumatic or hydraulic cylinder. However, the configuration of the horizontal and vertical pusher drivers 436 and 438 can be changed in various ways, which will not limit the scope of the present invention.

Meanwhile, as described above, the substrate 20 may be stored in the carrying out magazine 44 from the carrying out conveyor 420, but alternatively, the substrate 20 may be transferred to the cutting and sorting apparatus via the carrying out conveyor 420. It may be.

As described above, the carrying out conveyor 420 may be configured very similarly to the second carrying conveyor 320 except for the pusher 430. However, the elements constituting the second loading and unloading conveyors 320 and 420 may be variously changed as necessary and the scope of the present invention will not be limited by the structure or mounting method of the elements.

Referring back to FIGS. 1 and 2, the unloader 400 marks markings on the substrate 20 transferred to the unload conveyor 410 according to the test result of the test handler 100. Module 450 may be included. The marking module 450 may form an inspection mark corresponding to a good or defective product on the substrate 20 according to the inspection result of the substrate 20. Alternatively, the marking module 450 may be formed on the inspection result on the substrate 20. According to the rating or corresponding inspection mark may be displayed.

Although not shown in detail, the marking module 450 sprays ink onto the substrate 20 to move the marker 452 and the marker 452 in the horizontal and vertical directions to form the inspection mark. 454 may include. In particular, the marker driver 454 may include a horizontal marker driver for moving the marker 452 in a horizontal direction and a vertical marker driver for moving the marker 452 in a vertical direction. As an example, a rectangular coordinate robot may be used as the horizontal marker driver, and a pneumatic or hydraulic cylinder may be used as the vertical marker driver.

In addition, although not shown, the unloader 400 may include a vision camera (not shown) for identifying the substrate 20 transferred from the test handler 100. The vision camera may photograph an identification mark provided on the substrate 20 and transmit the image to the test server, and the test server may identify the substrate 20 by analyzing the identification mark image. . Similarly, although not shown, the test handler 100 and the loader 300 may be provided with a vision camera (not shown) for photographing the identification mark of the substrate 20 as described above.

According to the embodiments of the present invention as described above, by performing the inspection process for the various semiconductor modules 30 manufactured in the form of the soft array substrate 20 before the semiconductor modules 30 are individualized The time and cost required for manufacturing the semiconductor modules 30 can be greatly reduced. In addition, a plurality of test handlers 100 may be configured to be connected in series between the loader 300 and the unloader 400 using the plurality of conveyors 250, thereby manufacturing various semiconductor modules 30. It is possible to easily cope with, and to sufficiently reduce the waiting time of the substrates in the inspection process of the semiconductor modules 30.

In particular, the substrate may be aligned on one side of the rack by providing a fixing pin at one side of the rack which is moved into the test chamber and having a through hole into which the fixing pin is inserted. Therefore, even when the length of the substrate is changed, the inspection process of the substrate can be easily performed. As a result, the inspection process for various substrates of different lengths can be easily performed.

On the other hand, the substrate inspection apparatus 10 according to the embodiments of the present invention described above includes a plurality of horizontal and vertical drives, conveyors and elevators, the horizontal and vertical drives, conveyors and elevators Since its configuration can be configured using well-known mechanical elements, its structure and shape can be variously changed as necessary. The present invention is directed to the structure and form of the horizontal and vertical drives, conveyors and elevators themselves. Its scope will not be limited.

In addition, while the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art various modifications of the present invention without departing from the spirit and scope of the present invention described in the claims below. And can be changed.

10: substrate inspection device 20: substrate
22: inspection terminal 40: supply magazine
42: buffer magazine 44: export magazine
30: semiconductor module 100: test handler
102: inspection chamber 110: rack
120: test socket 130: test module
132: firmware module 140: temperature controller
150 substrate transfer portion 164 load arm
166: unload arm 170: pickup head
174: stopper 176: road lift
192: unload lift 194: rack opener
252: supply conveyor line 254: discharge conveyor line
260: supply conveyor 280: discharge conveyor
300: loader 310: first loading conveyor
320: second loading conveyor 322: loading elevator
350: electrical inspection unit 352: inspection conveyor
370: load conveyor 372: load elevator
400: unloader 410: unload conveyor
420: take out conveyor 422: take out elevator
450: marking module

Claims (9)

An inspection chamber for inspecting a substrate including a plurality of semiconductor modules and having test terminals connected to the semiconductor modules at one side thereof;
A rack provided to be movable in a slide form to the inside and the outside of the inspection chamber and configured to place the substrate;
An inspection socket provided in the inspection chamber and configured to be in contact with inspection terminals of a substrate placed on the rack when the rack is moved into the inspection chamber;
A firmware module connected to the test socket and configured to test the semiconductor modules;
A supply conveyor for supplying the substrate;
A discharge conveyor for discharging the inspected substrate in the inspection chamber; And
And a substrate transfer portion for transferring the substrate between the inspection chamber and the supply and discharge conveyors. The test handler of claim 1, wherein the test socket has a recess into which one end of the substrate is inserted, and contact pads are provided inside the recess to be in contact with the test terminals. The test handler of claim 1, wherein a through hole is provided at one side of the substrate, and a fixing pin is inserted at one side of the rack to be inserted into the through hole of the substrate. The test handler of claim 1, wherein an alignment pin is provided at one end of the rack, and an alignment hole into which the alignment pin is inserted is formed at one side of the inspection socket. The test handler of claim 1, further comprising a temperature controller configured to supply temperature-controlled air into the test chamber to control the temperature inside the test chamber. The method of claim 5, wherein the temperature control unit,
A temperature control chamber disposed below the test chamber;
A blower disposed inside the temperature control chamber and configured to supply the temperature-controlled air into the test chamber; And
And a heater disposed inside the temperature control chamber to adjust the temperature of the air. The test handler of claim 6, wherein the temperature control unit further comprises a cooler for supplying cooled air into the temperature control chamber. delete The test of claim 1, further comprising a rack opener for loading the substrate into the inspection chamber and moving the rack into and out of the inspection chamber to unload the substrate from the inspection chamber. Handler.

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