KR101022943B1 - A carrier member for manufacturing a substrate and a method of manufacturing a substrate using the same - Google Patents

Abstract

PURPOSE: A carrier member for manufacturing a substrate and a manufacturing method thereof are provided to remove a routing process and repetitively use the same carrier member, thereby simplifying a manufacturing process. CONSTITUTION: A carrier core layer(10) supports a printed circuit board. A concavo-convex part(20) is formed in an edge area of the carrier core layer. The concavo-convex part includes a protrusion type concavo-convex part and a groove type concavo-convex part. A releasing layer(30) is formed on the carrier core layer. A step part is formed in the edge area of the carrier core layer. The groove type concavo-convex part is coupled with the step part.

Description

Carrier member for substrate manufacturing and substrate manufacturing method using same {A CARRIER MEMBER FOR MANUFACTURING A SUBSTRATE AND A METHOD OF MANUFACTURING A SUBSTRATE USING THE SAME}

The present invention relates to a carrier member for producing a substrate and a method for producing a substrate using the same.

In general, a printed circuit board is wired on one or both sides of a board made of various thermosetting synthetic resins with copper foil, and then an IC or an electronic component is disposed and fixed on the board and coated with an insulator by implementing electrical wiring therebetween.

In recent years, with the development of the electronics industry, the demand for high functionalization and light weight reduction of electronic components is rapidly increasing. Accordingly, printed circuit boards on which such electronic components are mounted also require high density wiring and thinning.

In particular, in order to cope with the thinning of the printed circuit board, a coreless substrate that can reduce the thickness of the entire printed circuit board since the core board is not used and thus shorten the signal processing time has been attracting attention.

In the case of a coreless substrate, since the core substrate is not used, the use of a carrier member that performs a support function during the manufacturing process is required.

The carrier member used in the related art is configured to include a metal layer and a release film embedded in the metal layer surface. In the outer layer surface of such a carrier member, a release film was located in the center region, and the edge region had a shape made of a metal layer.

As the substrate is stacked on the carrier member, the metal layer of the edge region is adhered to and supported by the outer layer of the substrate.

When the stacking of the substrates is completed, a routing process of cutting the edge regions of the substrate and the carrier member is performed to separate the substrate and the carrier member.

Therefore, in manufacturing a coreless substrate using a conventional carrier member, the substrate is designed to be as large as an edge region to be cut in a later routing process.

In addition, the carrier member may not produce coreless substrates of the same size after manufacturing one coreless substrate, and the carrier member may be consumable and cannot be reused.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and proposes a carrier member which can omit a routing step in the manufacture of a printed circuit board including an uneven portion and which can be repeatedly used in the manufacture of a printed circuit board. .

In addition, a method of manufacturing a printed circuit board using the carrier member is proposed.

Carrier member according to the present invention is formed on the carrier core layer, the edge region of the carrier core layer, the concave and convex portion consisting of joinable projection and concave and convex concave and convex portion, and formed on the carrier core layer, It includes a release layer formed to contact the inside.

In addition, the protrusion of the protrusion-shaped uneven portion and the groove portion of the groove-shaped uneven portion is characterized in that formed continuously from one side to the other side of the uneven portion.

The uneven part may be formed at one edge area of the carrier core layer and the other edge area facing the one edge area.

In addition, the uneven portion is characterized in that it is formed to have a closed line shape along the edge area.

In addition, the uneven portion and the release layer is characterized in that formed on both sides of the carrier core layer.

In addition, the uneven portion is composed of a plurality of uneven portions including the first uneven portion and the second uneven portion, characterized in that it further comprises a plurality of separating release layer located between the plurality of uneven portions.

The edge region of the carrier core layer may have a stepped portion, and the groove-shaped uneven portion may be coupled to the stepped portion.

The present invention relates to a method of manufacturing a printed circuit board using the carrier member, comprising: (A) a carrier core layer, an uneven portion formed in an edge region of the carrier core layer, wherein the uneven portion is formed of joinable protrusions and recesses and grooves; Providing a carrier member formed on a carrier core layer, the carrier member comprising a release layer formed inwardly of the uneven portion; (B) building up a printed circuit board on the carrier member; (C) separating the printed circuit board and the carrier member; And (D) removing the protrusions and protrusions attached to the PCB.

In addition, the step (D) is characterized in that it is made through a physical removal method.

In addition, the step (D), (D-1) physical removal method; And (D-2) characterized in that made through a chemical removal method.

In addition, the carrier member provided in step (A) is characterized in that the uneven portion is formed to have a closed line shape along the edge area.

In addition, the carrier member provided in the step (A) is a carrier member formed on both sides of the uneven portion and the release layer on the carrier core layer, the printed circuit board is built up on both sides of the carrier core layer. It is characterized by.

In addition, the carrier member provided in step (A) is characterized in that the edge region of the carrier core layer has a stepped portion, and the groove-shaped uneven portion is coupled to the stepped portion.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

The present invention can produce multiple coreless substrates by using the same carrier member repeatedly, thereby reducing the cost for the carrier member.

In addition, the use of the carrier member according to the present invention can omit the routing step in the manufacturing process of the substrate, thereby simplifying the process and increasing productivity.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments associated with the accompanying drawings. In the present specification, in adding reference numerals to the elements of each drawing, it should be noted that the same elements as much as possible even if displayed on the other drawings. In addition, in describing the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view schematically showing a carrier member 100 according to a first embodiment of the present invention, Figure 2 is a state in which the uneven portion 20 of the carrier member 100 according to the first embodiment is separated It is a cross-sectional view showing. 3 is a perspective view of the carrier member 100 according to the first embodiment, and FIG. 4 is a perspective view of a modified embodiment of the carrier member 100 shown in FIG. 3.

Referring to FIG. 1, the carrier member 100 according to the present exemplary embodiment includes a carrier core layer 10, an uneven part 20 formed of a protrusion-shaped uneven part 22 and a groove-shaped uneven part 24, and a release layer. (30).

Here, the carrier core layer 10 serves to support the printed circuit board in the manufacture of the coreless substrate. It is preferably made of a hard material, and may be, for example, metal or polycarbonate.

The uneven portion 20 and the release layer 30 are formed on the carrier core layer 10.

In addition, as shown in FIGS. 1 and 2, the uneven portion 20 is formed in the edge region of the upper surface of the carrier core layer 10, and is formed of the protrusion-shaped uneven portion 22 and the groove-shaped uneven portion 24. do. The uneven part 20 may be made of metal, but preferably made of plastic resin.

In addition, the concave-convex portion 20 serves to adhere and fix the printed circuit board formed by being stacked on the carrier member 100. In particular, the outermost layer of the printed circuit board is bonded to the upper surface of the protrusion-shaped uneven portion 22. These protrusions and recesses 22 are removed after the printed circuit board is separated from the carrier member 100 in the manufacturing process of the printed circuit board.

At this time, the protrusion 23 of the protruding concave-convex portion 22 constituting the concave-convex portion 20 and the groove 25 of the groove-shaped concave-convex portion 24 have a shape that can be combined. Although the bar-shaped protrusion 23 is shown in FIG. 2, the shape of the protrusion 23 is not limited thereto. For example, it may be a "ㅗ" shape, a triangular shape, a bulb shape, or the like. The groove 25 is formed according to the shape of the protrusion 23.

Meanwhile, referring to FIG. 2, a process of bonding, fixing, and detaching a printed circuit board by the uneven portion 20 is as follows. If the uneven portion 20 is formed in the edge region of the carrier core layer 10, and the release layer 30 is formed inside the uneven portion 20 as described later, the top surface of the planar carrier member 100 It consists of the release layer 30 and the uneven part 20 formed in the outer side (edge area of the carrier member 100) of the release layer.

When the printed circuit board is stacked on the upper surface of the release layer 30 and the uneven portion 20, the printed circuit board is adhered to the upper surface of the uneven portion 20, and the printed circuit board is attached by the uneven portion 20. It is fixed. When the stacking of the printed circuit board is completed according to a later process, the printed circuit board is separated from the carrier member 100, wherein the uneven part 20 which fixes the printed circuit board is separated. That is, the protrusion-type uneven part 22 and the groove-type uneven part 24 are separated. The protruding concave-convex portion 22 is attached to the printed circuit board, and the groove-shaped concave-convex portion 24 is attached to the carrier core layer.

As the carrier member 100 according to the present embodiment has the uneven portion 20, unlike the conventional carrier member, the printed circuit board can be separated without a routing process, and a separate protrusion-type uneven portion 22 is manufactured. The carrier member can be reused by engaging the groove-shaped uneven portion 24. This simplifies the process and reduces costs.

And the uneven part 20 is formed in the edge area | region of the carrier core layer 10, It is preferable to have a line shape on a plane. This is because the line-shaped concave-convex portion 20 is sufficient for adhering and fixing the printed circuit boards to be stacked, and can be easily removed later.

In this case, as shown in FIG. 3, the carrier member 100 generally has the same shape as the printed circuit board to be manufactured. In this case, the uneven part 20 has one side edge region and one side edge region of the carrier core layer. It is preferable to be formed in the other edge region facing the. For example, when the carrier member 100 has a rectangular shape, the uneven portion 20 may be formed in the first edge region of the carrier core layer 10 and the second edge region facing the first edge region. . This is because bonding of the printed circuit board to both edge regions of the rectangular carrier member 100 is easy to fix the printed circuit board.

As shown in FIG. 4, the uneven portion 20 may be formed to have a closed line shape along the edge area of the carrier core layer 10. Such a shape is formed by forming the concave-convex portion 20 in all edge regions of the rectangular carrier core layer 10 and continuously connecting them. In the lamination process of a printed circuit board, a wet process is performed, and the liquid material (etching liquid, etc.) used is laminated between the outermost layer (adhesive surface of the carrier member) and the upper surface of the carrier member 100 on which the printed circuit board is laminated. It may be soaked, if the uneven portion 20 has such a shape it can prevent the liquid material is introduced.

In addition, the protrusions 23 of the protruding concave-convex portion 22 and the grooves 25 of the groove-shaped concave-convex portion 24 are preferably formed continuously from one side of the concave-convex portions 22 and 24 to the other side. In practice, the fixing of the printed circuit board to the carrier member 100 is based on the coupling of the protrusion 23 of the protruding concave-convex portion 22 and the groove 25 of the groove-shaped concave-convex portion 24. Therefore, a plurality of protrusions 23 and grooves 25 are formed, and the larger the engagement area, the larger the fixing force by the frictional force, and the largest fixing force is formed on all the uneven parts. Therefore, as described above, when the uneven portion 20 has a closed line shape along the edge region of the carrier core layer 10, the protrusion 23 and the groove 25 also have a closed line shape.

1 to 4, the release layer 30 contacts most of the outermost layers of the printed circuit board and supports the printed circuit board. However, it does not adhere to the outermost layer of the printed circuit board.

The release layer 30 may be a release material made of an epoxy-based release material or a fluorine resin, and the release layer 30 may have a silicon coating layer (not shown). In addition, the release layer 30 may be a film type release material that is generally used.

In this case, when the release layer 30 is made of a film-type release material, surface treatment is performed on the adhesive surface to the carrier core layer 10 in order to improve adhesion between the release layer 30 and the carrier core layer 10. It is desirable to. In this case, the surface treatment may be Si coating or plasma treatment, it is preferable to perform the surface treatment so that the adhesive surface of the release layer 30 is hydrophilic. For example, the release layer 30 may be a polyethylene terephthalate plastic sheet coated with a Si-based release agent.

5 to 7 are cross-sectional views schematically showing a carrier member according to preferred second, third and fourth embodiments of the present invention. Hereinafter, the carrier member according to the present embodiment will be described with reference to this. However, a configuration overlapping with the carrier member described with reference to FIGS. 1 to 4 will be omitted.

Referring to FIG. 5, the carrier member 200 according to the second embodiment is characterized in that the uneven portion 20 and the release layer 30 are formed on both sides of the carrier core layer 10. In manufacturing a coreless substrate using the carrier member 200, a printed circuit board may be laminated on both surfaces of the carrier member 200. This improves the productivity of the printed circuit board.

Referring to FIG. 6, the carrier member 300 according to the third exemplary embodiment includes a plurality of uneven parts of one side edge area including a first uneven part 20-1 and a second uneven part 20-2. The separation release layer 35 further includes a plurality of uneven parts.

In FIG. 6, the uneven part 20 is composed of two uneven parts (the first uneven part 20-1 and the second uneven part 20-2), and one separation release layer 35 is disposed therebetween. Although the carrier member 300 is located, it is apparent to those skilled in the art that two or three separate release layers may also be located between the uneven parts when the uneven parts are composed of three or four uneven parts.

When the two uneven parts 20-1 and 20-2 are included in the edge region of one side of the carrier core layer 10, the adhesive force to the printed circuit board is increased, and thus the fixing force is increased.

In addition, the first uneven portion 20-1 and the second uneven portion 20-2 are separated and formed by the separating release layer 35. The tooling hole (multilayer) is formed in the circuit layer formed on the separating release layer 35. In the manufacture of the structure, by forming a reference element) and subsequently laminating in multiple layers, uniform lamination is possible, and penetration of a liquid substance (etching liquid or the like) can be prevented.

Referring to FIG. 7, in the carrier member 400 according to the fourth embodiment, the edge region of the carrier core layer 10 includes a stepped portion 15, and the groove-shaped uneven portion 24 includes the stepped portion. It is characterized in that coupled to the portion (15).

The uneven portion 20 may be formed on the upper surface of the carrier core layer 10 like the carrier member 100 described with reference to FIG. 1, but the carrier member 400 according to the present embodiment may have a stepped portion ( By placing the groove-shaped uneven portion 24 in 15), the thickness of the carrier member can be lowered, and in particular, the thickness of the release layer 30 can be lowered.

In addition, when the groove-shaped concave-convex portion 24 is coupled to the stepped portion 15, the groove-shaped concave-convex portion 35 adheres to the carrier core layer 10 on the bottom and one side of the groove-shaped concave-convex portion 35. 10) can increase the adhesion.

Meanwhile, FIG. 8 illustrates a process of separating the uneven parts 20 of the carrier member 400 according to the fourth embodiment, which is the uneven parts of the carrier member 100 according to the first embodiment shown in FIG. 2. 20) Similar to separation process.

9 to 12 are process cross-sectional views showing a method of manufacturing a substrate using a carrier member for manufacturing a substrate according to a preferred embodiment of the present invention in the process sequence.

Hereinafter, a method of manufacturing a substrate using the carrier member 200 for manufacturing a substrate according to the second embodiment described above will be described. Even if the carrier member for substrate manufacture according to the first, third and fourth embodiments described above is used, the substrate can be manufactured by the same and very similar processes as those described in the present embodiment, and thus detailed description thereof will be omitted.

First, as shown in FIG. 9, a carrier member is provided. The carrier member 200 illustrated in FIG. 6 is a carrier member 200 according to the second embodiment of the present invention, which is formed in the carrier core layer 10 and the edge region of the carrier core layer 10, and is joinable. Concave-convex portion 20 composed of protruding concave-convex portion 22 and groove-shaped concave-convex portion 24, and release layer 30 formed on the carrier core layer 10 and formed inside of the concave-convex portion 20. ) And the uneven portion 20 and the release layer 30 is characterized in that formed on both sides of the carrier core layer (10).

When the uneven portion 20 and the release layer 30 form a printed circuit board by using the carrier member 200 formed on both sides of the carrier core layer 10, two printed circuit boards are formed by one carrier member 200. Can be formed, the productivity is increased.

Next, as shown in FIG. 10, the printed circuit board is built up on the carrier member 200.

In FIG. 10, a printed circuit board having a three-layer structure is stacked. The process of building up a printed circuit board including an insulating layer and a circuit layer on the carrier member 200 may be performed by a conventional insulating layer stacking and circuit pattern forming process. The detailed description of the conventional process of forming the buildup layer may be omitted. Briefly, a metal layer is laminated on the carrier member 200 to form a first circuit layer, an insulating layer is stacked thereon, and a second circuit layer including vias is formed again. By repeating this process, a printed circuit board having a multilayer structure of two layers and three layers can be manufactured.

Meanwhile, in the present embodiment, as shown in FIG. 10, a metal layer is formed directly on the carrier member 200, but a film type protective layer is first formed on the carrier member 200, and a circuit layer and an upper portion of the protective layer are formed. The printed circuit board may be built up by forming an insulating layer. At this time, it is preferable that a protective layer is a film-type soldering resist layer.

Next, as shown in FIG. 11, the printed circuit board is separated from the carrier member 200. In a conventional manufacturing process of a printed circuit board using a carrier member, a routing process of cutting edge regions of the printed circuit board and the carrier member is performed to separate the printed circuit board and the carrier member.

However, in the carrier member 200 according to the present invention, since the printed circuit board and the carrier member 200 are physically coupled by the uneven portion 20, the carrier member 200 can be easily separated by physical force without the need for a routing process. .

Subsequently, when the projection-shaped concave-convex portion 22 is prepared and coupled to the groove-shaped concave-convex portion 24, the carrier member 200 can be reused.

Next, as illustrated in FIG. 12, the process of manufacturing the printed circuit board is terminated by removing the protrusion-shaped unevenness 22 attached to the printed circuit board.

Removal of the protruding concave-convex portion 22 may be performed by a physical removal method such as, for example, a method of cutting off using a knife and a method of removing abrasive using a polishing brush.

In addition, since the protruding concave and convex portions 22 may remain on the printed circuit board after performing the physical removal method, the convex concave and convex portions 22 may be completely removed by further performing a chemical removal method using a removing solution. have.

The removal liquid here is a resin removal liquid that selectively removes only the plastic resin, for example, an organic amine removal liquid containing an organic amine such as dimethyl sulfoxide, dimethyl formamide, ammonium fluoride removal liquid containing ammonium fluoride, and inorganic removal liquid. This can be used.

Meanwhile, a process of forming a protective layer on the circuit layer formed on the outermost layer of the carrier member 200 of the printed circuit board may be further performed. A printed circuit board may be manufactured by forming a protective layer on a contact surface with respect to the carrier member 200 and forming an opening in the protective layer to expose the connection terminal by laser processing.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

1 is a cross-sectional view of a carrier member according to a first embodiment of the present invention.

2 is a cross-sectional view showing a state in which the uneven portion of the carrier member according to the first embodiment of the present invention is separated.

3 is a perspective view of a carrier member according to a first embodiment of the present invention.

4 is a perspective view of a modified embodiment of the carrier member according to the first embodiment of the present invention.

5 to 7 are cross-sectional views of the carrier member according to the second, third and fourth embodiments of the present invention.

8 is a cross-sectional view showing a state in which the uneven portion of the carrier member according to the fourth embodiment of the present invention is separated.

9 to 12 are manufacturing process diagrams of a printed circuit board using the carrier member of the present invention.

<Explanation of symbols for the main parts of the drawings>

10; Carrier core layer 15; Stepped portion 20; Irregularities

22; Projection type uneven portion 23; Protrusion 24; Grooved irregularities

25; Groove 20-1; First uneven portion 20-2; 2 uneven part

30; Release layer 35; Separation Release Layer

Claims (13)

Carrier core layer; An uneven portion formed in an edge region of the carrier core layer, the uneven portion comprising a convex convex concave portion and a convex convex portion; And A release layer formed on the carrier core layer and formed to contact the inner side of the uneven portion; Carrier member for manufacturing a substrate comprising a. The method according to claim 1, Carrier member for substrate manufacturing, characterized in that the projection of the protrusion-shaped uneven portion and the groove portion of the groove-shaped uneven portion is formed continuously from one side to the other side of the uneven portion. The method according to claim 1, The uneven part is a carrier member for manufacturing a substrate, characterized in that formed in one edge region and the other edge region facing the one edge region of the carrier core layer. The method according to claim 1, The uneven part is a carrier member for manufacturing a substrate, characterized in that formed to have a closed line shape along the edge area. The method according to claim 1, The uneven portion and the release layer are formed on both sides of the carrier core layer carrier member for substrate production. The method according to claim 1, The uneven part is composed of a plurality of uneven parts including the first uneven part and the second uneven part, A carrier member for manufacturing a substrate, comprising a plurality of separating release layers positioned between the plurality of uneven parts. The method according to claim 1, The edge region of the carrier core layer has a stepped portion, The groove-shaped uneven part is a carrier member for manufacturing a substrate, characterized in that coupled to the stepped portion. (A) a carrier core layer, an uneven portion formed in the edge region of the carrier core layer, wherein the uneven portion composed of joinable protrusion-type unevenness and groove-shaped unevenness, and a release layer formed on the carrier core layer and formed inside the uneven portion Providing a carrier member comprising a; (B) building up a printed circuit board on the carrier member; (C) separating the printed circuit board and the carrier member; And (D) removing the protrusions and protrusions attached to the printed circuit board; Method of manufacturing a printed circuit board comprising a. The method according to claim 8, The step (D) is a manufacturing method of a printed circuit board, characterized in that made through a physical removal method. The method according to claim 8, Step (D), (D-1) physical removal method; And (D-2) A method of manufacturing a printed circuit board, characterized in that it is made through a chemical removal method. The method according to claim 8, The carrier member provided in the step (A) is a manufacturing method of the printed circuit board, characterized in that the uneven portion is formed to have a closed line shape along the edge area. The method according to claim 8, The carrier member provided in the step (A) is a carrier member in which the uneven portion and the release layer are formed on both sides of the carrier core layer, The printed circuit board of claim 1, wherein the printed circuit board is built up on both sides of the carrier core layer. The method according to claim 8, The carrier member provided in the step (A), wherein the edge area of the carrier core layer has a stepped portion, the groove-shaped uneven portion is a manufacturing method of a printed circuit board characterized in that coupled to the stepped portion.

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