KR100958604B1 - Led lighting apparatus - Google Patents

Abstract

PURPOSE: An LED(Light Emitting Diode) lamp is provided to prevent eyesight of a user from worsening by arranging a converter in the side of a case. CONSTITUTION: A plurality of LEDs(10a) are installed in a PCB(Printed Circuit Board) module(10,110). The PCB module is arranged in the inner bottom of the case(20). An opening is formed in the upper side of the case. A conductive coating(20c) is spread in the exterior of the case in order to emit the heat generated in the LED. The conductive coating comprises the carbon nanotube, the organic solvent, the dispersing agent, and an organic binder. The converter(30) changes an AC power source to a DC power source.

Description

LED Lighting Apparatus {LED Lighting Apparatus}

The present invention relates to a lamp using a light emitting diode, and more particularly, to a light emitting diode lamp having improved operating efficiency and reliability of the product by improving the heat dissipation effect by using a high-conductivity paint containing carbon nanotubes.

In the case of conventionally used lighting lamps, incandescent lamps or fluorescent lamps are mainly used as indoor light sources used in homes or offices, and mercury lamps or sodium lamps are mainly used as outdoor lights such as street lamps and security lamps.

However, the conventional light sources have a problem that the energy consumption is large compared to the brightness and the lifespan is short, so that the amount of light rapidly decreases with time, and thus periodic management is necessary. There was a problem acting as a cause of environmental pollution.

Therefore, in order to solve this problem, lighting lamps using light emitting diodes (LEDs) with low power consumption and long lifespan as light sources have been developed and released in recent years.

The light emitting diode (LED) has a junction structure of a P-type and an N-type semiconductor, and is an optoelectronic device that emits light of energy corresponding to a bandgap of a semiconductor by combining electrons and holes when a voltage is applied. Since time is fast and power consumption is low as low as 20% compared to general light bulbs, it is widely used in various fields such as indoor and outdoor lighting, street lighting, signage, structure lighting, and decorative lighting.

Since such light emitting diodes exhibit optimal operating efficiency only when they are maintained at a temperature of 50 ° C. to 60 ° C. or below at a normal room temperature of 25 ° C., the above conditions must be maintained to maintain the brightness and lifetime (more than 50,000 hours) required for the light emitting diode lamps. I can guarantee it.

However, currently used light emitting diode lamps are not able to maintain the above-described optimal operating state because the temperature rises to 80 ℃ or more when operating the power supply, and as a result, the brightness of the light emitting diode is lowered and the lifetime is also increased. The problem is that it becomes much shorter.

Therefore, in order to solve this problem, a lamp having a heat sink attached to a rear surface of a light emitting diode has recently been manufactured, but even in this case, heat is still generated because heat generated from the light emitting diode cannot effectively pass through the PCB substrate to the rear side. There is a problem in that the efficiency of the lamp is low because many and the temperature is high.

In addition, since most of the materials used as heat sinks are made of aluminum, which is required to import raw materials, it has a disadvantage of not only outflow of foreign currency but also an increase in material costs according to exchange rates, and a weak strength as a structural material for lighting.

In addition, in the case of a conventional LED lighting lamp, a converter for converting a commercial AC power source into a DC power source is assembled on the front of the lamp for a slim design. In this case, when the lamp is turned on, a shadow of the converter is generated to reduce illumination. And there is a disadvantage that causes a decrease in vision and discomfort of the user.

In addition, in the case of indoor lightings (specifically, indoor ceiling lights) in which lighting lamps of the same design are installed continuously, since AC power supplied to each lighting lamp is individually connected by using wires, the wiring structure becomes complicated, There is a problem that causes a malfunction or fire, such as lighting due to poor wiring connection.

The present invention is to solve the above-described problems of the prior art, an object of the present invention is to emit heat generated by the operation of the light emitting diode to the outside of the light easily by the light emitting diode which can improve the reliability of the light To provide a light.

In addition, another object of the present invention is to provide a light emitting diode lamp to prevent the shadow of the converter is generated on the light emitting surface during operation of the lamp by mounting a converter for supplying DC power to the light emitting diode on the side of the lamp case. will be.

In addition, another object of the present invention is to provide a DC power supply to each light emitting diode module through a DC line and an AC line patterned on the light emitting diode PCB substrate installed in each light when a plurality of lamps are installed in series By providing the AC power supplied to the lamp is to provide a light emitting diode lamp with a significantly simplified wiring structure.

In order to achieve the above object, a light emitting diode illumination lamp according to the present invention includes a PCB module unit in which a plurality of light emitting diodes are mounted, and light generated from the light emitting diodes is emitted on an upper surface of an inner bottom at least one PCB module unit is installed. And a case portion having an opening formed therein, and an outer surface of the case portion is coated with a highly conductive paint including carbon nanotubes to release heat generated from the light emitting diodes to the outside, wherein the highly conductive paint includes: DMF, NMP, dichloro 95 to 99.9 wt% of a mixed solution containing at least one organic solvent selected from methane, dichlorobenzene, isopropyl alcohol, acetone and ethanol, and 0.1 to 5 wt% of carbon nanotubes.

In addition, the mixed solution, characterized in that composed of 0.1 to 1 parts by weight of a dispersing agent and 1 to 10 parts by weight of the organic binder to evenly disperse the carbon nanotubes in an organic solvent with respect to 100 parts by weight of the organic solvent. .

The case part may include an outer case and a reflecting plate provided inside the outer case and having the upper surface of the PCB module installed therein, and the high conductive paint may be formed on at least one of an outer surface of the outer case or a rear surface of the reflecting plate. The part is applied with a thickness of 1 to 70 μm.

The apparatus may further include at least one converter having an AC input terminal to which AC power is input, an AC output terminal for outputting the AC power, and a DC output terminal for converting and outputting the AC power to DC power. At least one coupling groove into which each converter is fitted is formed, and each of the PCB module units includes a DC input terminal connected to the DC output terminal by a connector, and a DC wiring connecting the DC input terminal and each light emitting diode; And an AC input terminal connected to the AC output terminal by an connector, an AC output terminal, and an AC wiring connecting the AC input terminal to the AC output terminal is patterned.

In addition, the converter is provided for each PCB module unit, and when AC power is input to any one of the converters, the AC input and output terminals of each of the PCB module units and the AC input and output terminals of the converter are connected by connectors. And the AC power is also supplied to the remaining converters.

As described in detail above, the light emitting diode lamp according to the present invention is coated with a high-conductivity paint containing carbon nanotubes on the outer surface of the lamp case, so that the heat generated inside the lamp can be quickly discharged to the outside light emitting diode lamp There is an advantage that can improve the reliability.

In addition, the light emitting diode lamp according to the present invention has the advantage that it is possible to eliminate the degradation of illumination, deterioration of the user's vision and discomfort because the shadow is not generated by the converter during the operation of the lamp by the configuration of mounting the converter on the side of the case. .

In addition, the LED lighting device according to the present invention is not connected to a separate electrical wiring to each of the plurality of converters, but because the configuration is connected by a connector along the AC wiring patterned on the PCB substrate, the wiring structure is simplified, poor wiring There is an advantage that can eliminate the risk of malfunction or fire by the lighting.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail.

1 is an exploded perspective view showing a light emitting diode lamp according to an embodiment of the present invention, Figures 2 and 3 are a plan view and a cross-sectional view showing a coupling state of the light emitting diode lamp shown in FIG.

The light emitting diode illumination lamp according to the present embodiment includes a plurality of light emitting diodes 10a on which the PCB module 10 and 110 are mounted, and the light emitting diode 10a on the inner bottom surface 20a on which at least one of the PCB modules 10 and 110 is installed. A case 20 having an opening 20b for emitting light generated therefrom, and converters 30 and 130 for converting AC power supplied from an external power source (not shown) into DC power and supplying the DC power to the PCB modules 10 and 110. It is configured by.

In this case, in order to maximize the luminous efficiency inside the case 20, the amount is preferably made of a material such as aluminum, iron plate, stainless steel or anodizing, and a reflector plate having the PCB modules 10 and 110 installed on an upper surface thereof is separately configured. If necessary, the inner surface of the case 20 itself performs a reflecting plate function, or the case 20 may be formed of a reflecting plate material. In this embodiment, the inner surface of the case 20 itself functions as a reflecting plate for convenience of description. The case is described as an example.

In addition, the outer surface of the case 20, a high-conductivity paint containing carbon nanotubes (CNT) to easily discharge the heat generated from the light emitting diodes (10a) mounted on each of the PCB module (10,110) to the outside 20c is applied.

Carbon nanotubes, which are the main components of the highly conductive paint 20c used in the present invention, have a thermal conductivity of 1,800 to 6,000 W / mK, which is considerably superior to 401 W / mK of copper (Cu), which is a metal having excellent thermal conductivity. Since it has a degree to allow the heat generated in the light emitting diode (10a) to be quickly discharged to the outside.

Meanwhile, the highly conductive paint 20c including the carbon nanotubes is a carbon nanotube, an organic solvent for producing a liquid coating by dispersing the carbon nanotubes, and a carbon nanotube to be uniformly dispersed in the organic solvent. A dispersant, and an organic binder.

At this time, the carbon nanotubes are preferably surface modified to improve the dispersibility and thermal conductivity in the organic solvent. In this embodiment, the carbon nanotubes are dissolved in hydrogen peroxide solution (H ₂ O ₂ : DI-water for a predetermined time). = 1: 1) and hydrochloric acid solution (HCl: DI-water = 1:10), and then sonicated for about 10 minutes to 1 hour, aqua regia (sulfuric acid: nitric acid = 3: 1) ) Can also be used.

By the above process, the amorphous carbon contained in the carbon nanotubes is removed, and the carboxyl functional group (-COOH) is attached to the surface of the carbon nanotubes, thereby improving the dispersibility in the organic solvent. By intentionally damaging, it is possible to obtain a carbon nanotube of the appropriate length to optimize the thermal conductivity.

In addition, the organic solvent is N, N-Dimethylforamide (DMF), N-Methyl-2-Pyrrolidone (NMP), dichlorobenzene (1,2-dichlorobenzene), dichloromethane, isopropyl alcohol (IPA, isopropyl alcohol), acetone At least one of ethanol may be used, and in this embodiment, dichlorobenzene is used as an example.

In addition, the dispersant is preferably Pluronic series or Tetronic series (BASF), the organic binder is preferably ethyl-cellulose or α-terpineol.

In order to manufacture the highly conductive paint 20c composed of the above components, first, a mixed solution of 0.1 to 1 part by weight of dispersant and 1 to 10 parts by weight of an organic binder is prepared based on 100 parts by weight of an organic solvent. In order to mix the components evenly, the mixed solution is sonicated for 5 to 10 minutes.

Next, 95 to 99.9 wt% of the mixed solution thus prepared is mixed with 0.1 to 5 wt% of the surface-modified carbon nanotubes as described above, and stirred in a stirrer for 5 to 30 minutes, followed by sonication for 5 to 30 minutes. The paint 20c is obtained.

At this time, the sonication is to obtain a uniform and rapid heat transfer effect when the high conductive paint 20c is applied to the outer surface of the case 20 by dispersing the carbon nanotubes evenly in the mixed solution.

4 is a graph showing the heat dissipation effect of the highly conductive paint 20c according to the content of carbon nanotubes, and FIG. 5 is a graph showing the heat dissipation effect according to the ultrasonic treatment time when the surface of the carbon nanotubes is modified.

As can be seen in Figure 4, the high-conductivity paint (20c) has a characteristic that the heat dissipation effect is increased up to 2wt% carbon nanotube content, but the heat dissipation effect is greatly increased even if the carbon nanotube content is increased above It will not change.

Therefore, the carbon nanotube content of the highly conductive paint 20c is preferably 0.1 to 5 wt%, more preferably 0.1 to 2 wt% in view of the high cost of carbon nanotubes.

In addition, as shown in FIG. 5, the heat dissipation effect of the highly conductive paint 20c increases until the ultrasonic treatment time for the carbon nanotube is 40 minutes, but the heat dissipation effect of the highly conductive paint 20c is rather higher. Will decrease.

Therefore, in the case of the highly conductive paint 20c according to the present embodiment, the ultrasonic treatment time for the hydrogen peroxide solution and the acid treated carbon nanotubes is preferably 10 minutes to 40 minutes.

In addition, the case 20 is preferably made of a material such as iron, aluminum, aluminum die casting, cast iron, stainless steel in order to further improve the thermal conductivity, the high-conductivity paint 20c is a light emitting diode (10a) for effective heat dissipation ) Is preferably applied to the outer surface of the case 20 except for the inner surface of the case 20 in which the PCB modules 10 and 110 mounted thereon are installed.

At this time, when the coating thickness of the highly conductive paint 20c is too thin, there is a disadvantage in that the thermal conductivity improvement effect is hardly obtained because the overall content of the carbon nanotubes is not large. On the contrary, when the coating thickness is too thick, Above the thickness, since the thermal conductivity improving effect is almost the same, there is a problem that only an unnecessary manufacturing cost increases.

Therefore, it is preferable that the coating thickness is experimentally determined to be an appropriate thickness. In the present embodiment, it was determined that the coating thickness is most preferably 1 to 70 μm according to the characteristics of the lighting.

On the other hand, the converter (30, 130) has a plurality of fitting projections (30b) on the upper and lower portions of the converter housing (30a) made of plastic so as to be fitted into the defect groove (20d) formed on the side of the case 20 Formed.

Therefore, when the converter 30, 130 is passed in a direction parallel to the coupling groove 20d, the fitting protrusion 30b is pressed by the top and bottom of the coupling groove 20d and the coupling groove 20d. Will pass through.

Thereafter, when the converter 30 passes through the coupling groove 20d until just before the stopper 30c having a larger cross-sectional area than the coupling groove 20d, the fitting protrusion 30b is returned to its original position by elasticity inherent to the plastic material. As it returns, the upper and lower ends of the defect grooves 20d are fitted between the fitting protrusion 30b and the stopper 30c.

By such a configuration, the converters 30 and 130 of the light emitting diode lamp according to the present invention do not cover the opening 20b of the case which is the light emitting surface, and can be stably fixed to the side of the case 20.

In this case, the converters 30 and 130 refer to the converter housing 30a having the above-described structure, a power conversion (AC to DC) device (not shown) provided therein, and an AC input / output terminal and a DC output terminal described later. The concept is all inclusive.

As described above, the light emitting diode lamp according to the present invention has a structure in which the converters 30 and 130 are inserted into and mounted in the coupling grooves 20d, which are perforations formed on the side of the case 20, and thus, the converters generated by the lamp according to the prior art. The shadow of 30 and 130 can be easily removed, and thus there is an advantage in that the user's vision loss and discomfort can be minimized.

In the present embodiment, the converters 30 and 130 are used one by one for each PCB module 10 and 110 as shown in FIGS. 1 to 3, and the attachment position is not related to the direction in which the light is emitted. Attach to the side of the).

Therefore, when the two PCB modules 10 and 110 and the converters 30 and 130 are installed as shown in the drawing, the converters 30 and 130 are preferably installed at both left and right sides of the case 20. Furthermore, when three or more PCB modules 10 and 110 are installed, the converters 30 and 130 may be installed on side surfaces in the vertical direction in addition to the left and right sides described above.

In addition, in the present exemplary embodiment, the case of the case 20 is a rectangular plane, but as an example, the converters 30 and 130 may be installed on each side even in the case of a polygon, except that the plane of the case 20 is described below. In the case of a circular shape such as a down light, it may be attached to the side of the case 20 as described above, but may be installed on the back of the case 20 in some cases.

Meanwhile, the converters 30 and 130 may include an AC input terminal (not shown) to which AC power is externally input, an AC output terminal (not shown) for outputting the AC power, and a DC output terminal for converting and outputting the AC power to DC power ( Not shown).

In addition, as shown in FIG. 6, each of the PCB modules 10 and 110 may include a DC input terminal 11, a DC wiring 12 connecting the DC input terminal 11, and the respective light emitting diodes 10a. AC wirings 15 connecting the 2AC terminals 13 and 14 and the first and second AC terminals 13 and 14 are patterned.

In this case, the PCB substrate may be an epoxy material FR-4, CEM-1, etc., but is not limited thereto and may be preferably implemented by any one of a variety of PCB substrates known within the range to perform the same function. .

In addition, the patterning formed in the PCB module 10 shown in Figure 6 is for explaining an embodiment of the present invention, of course, can be patterned in a variety of ways. In addition, in the case of arranging a plurality of PCB modules, the arrangement may be implemented in various forms as necessary.

According to the above configuration, the light emitting diode illumination lamp according to the present invention simply connects the input and output terminals provided in the converters 30 and 130 and the terminals 11, 13, and 14 provided in the PCB modules 10 and 110 using a connector. By doing so, since the plurality of converters 30 and 130 and the PCB modules 10 and 110 can be electrically connected, there is an advantage that the wiring structure can be significantly simplified in comparison with the prior art.

In detail, when AC power is input from the outside to the AC input terminal of the first converter 30 connected to the connector 31 in FIGS. 1 and 2, the DC power converting the AC power is applied at the DC output terminal of the first converter. The AC output terminal is output as it is, and in this case, the DC output terminal and the AC output terminal of the first converter 30 are connected to the DC input of the first PCB module 10 by the connector 32 and the connector 33, respectively. It is connected to the terminal 11 and the first AC terminal 13 (in this case, serves as an AC input terminal).

Accordingly, the plurality of light emitting diodes 10a mounted on the first PCB module 10 may be emitted by the DC power supplied along the DC wiring 12 connected to the DC input terminal 11. The AC power supplied to the first AC terminal 13 of the 1PCB module 10 is transferred to the second AC terminal 14, which in this case functions as an AC output terminal, along the AC wiring 15 of the first PCB module 10. .

Meanwhile, the second AC terminal 14 of the first PCB module 10 is connected to the second AC terminal 114 of the second PCB module 110 (in this case, serves as an AC input terminal) by the connector 35. The first AC terminal 113 of the 2PCB module 110 (in this case, functions as an AC output terminal) is connected to the AC input terminal (not shown) of the second converter 130 by the connector 36 and the second converter 130. DC output terminal (not shown) is connected to the DC input terminal 111 of the second PCB module 110 by the connector 37.

With this configuration, as described above, the AC power transferred from the AC output terminal of the first converter 30 to the first AC terminal 13 of the first PCB module 10 is connected to the second AC terminal of the second PCB module 110 ( 114), and is transmitted to the AC input terminal of the second converter 130 through the AC wiring (not shown) and the first AC terminal 113, the second converter 130 converts it to DC power source to the second PCB module 110 The plurality of light emitting diodes 110a mounted on the second PCB module 110 emits light by being supplied to the DC input terminal 111.

On the other hand, when two lamps shown in Figures 1 to 3 are installed adjacent to each other by connecting the AC output terminal of the second converter 130 with the AC input terminal of any one converter provided in the other lamp by a connector to supply AC power You can continue.

In the present exemplary embodiment, the case in which two PCB modules 10 and 110 are installed in one lamp is described as an example. However, even when three or more PCB modules are installed, AC power may be supplied to each converter in the same manner.

As described above, the LED lamp according to the present invention is different from the conventional technology in which the supply wiring of AC power must be separately allocated to the converters 30 and 130 provided in each lamp, and the AC terminal patterned to each PCB module 10 and 110 is connected. Since the AC power input to one converter is supplied to the other converter through AC wiring, wiring structure can be significantly simplified, which simplifies the installation process of the lamp and operates the lamp by complicated wiring structure. The risk of failure and fire can be minimized.

Meanwhile, in the present embodiment, a case in which one converter is provided for each PCB module has been described as an example. However, if necessary, one converter may be provided for each PCB module.

However, in this case, each of the plurality of PCB modules 10 and 110 is further provided with a DC output terminal connected to the DC wiring, connecting the DC output terminal of any one PCB module and the DC input terminal of the other PCB module with a connector. By the method, the DC power output from the converter is supplied to the plurality of PCB modules.

In addition, when only one PCB module is used, of course, only the DC wiring 12 connecting the respective light emitting diodes 10a may be patterned.

On the other hand, the LED lamp according to the invention further comprises a plate-shaped cover 40 of acrylic material for closing the opening so that the user's eyes and the like is not directly exposed to the light emitting surface (ie, the opening) of the lamp.

At this time, the plate cover 40, as shown in Figure 3, the magnet 22 provided in the flange 21 formed to extend outward from the periphery of the opening 20b of the case 20, and the plate cover Since the structure is coupled to the case 20 by the magnetic force acting between the magnetic body cover 42 provided at the edge of the 40, unlike the prior art coupled by screwing the assembly process is simple and beautiful appearance There is an advantage.

In the present exemplary embodiment, the case in which the magnet 22 is coupled to the rear surface of the flange 21 is described as an example, but is not limited thereto. If necessary, the magnet 22 may be embedded in the flange surface, and the magnet 22 may be installed in the flange surface. It can be implemented in a variety of ways.

In addition, in the present exemplary embodiment, a case in which a cover 42 made of a magnetic material is separately provided at the edge of the plate cover 40 is described as an example. However, the plate cover 40 and the magnetic cover 42 may be integrally formed. It may be.

In addition, contrary to the present embodiment, the case may be made of a magnetic material, or the magnetic material may be coupled to the flange, and the cover may be made of a magnet.

In addition, in the present embodiment, the case in which the cover has a plate shape was described as an example, but is not limited thereto and may be implemented in a curved shape as necessary.

On the other hand, the light emitting diode lighting according to the present invention can be applied to the hanging type, ceiling embedded, ceiling-mounted, wall-mounted, wall-mounted lighting, depending on the attachment type, in addition to street lamps, security lights, floodlights depending on the use place , Human body detection light, office light, house light, dust proof light, moisture proof light, tunnel light, direct lighting light, wall light, grass light, landscape light, emergency light, park light, underwater light, walking light, and It can be applied to all types of lamps.

The description so far has been mainly focused on the ceiling-mounted lighting of the above-described various types of lighting, but in addition to the light emitting diode lighting according to the present invention as an indoor lighting, as shown in Figure 7 LED intuitive lamp or bulb Shaped LED converter can be applied to the built-in lamp.

In addition, the light emitting diode illumination lamp according to the present invention, as shown in Figure 8 LED flat plate light fixture, PC material or steel material dustproof moisture-proof light, LED direct light, LED corner light, LED tripod, LED blackboard light, The present invention can be applied not only to LED lamp lamps, LED bars, etc., but also to LED lamps and LED living room lamps having a shape as shown in FIG.

In addition, the light emitting diode illumination lamp according to the present invention, as shown in Figure 10 LED direct light, LED stair light, LED liner (angle), LED bathroom light, LED down light, LED circular direct light that can be adjusted and embedded It is also applicable to LED sensors and the like.

Further, the light emitting diode illumination lamp according to the present invention can be applied to various types of LED wall lamps or LED direct lamps as shown in FIG.

In addition, the light emitting diode illumination lamp according to the present invention can be applied to the LED lawn light or LED spotlight as shown in FIG. 12, and also to the LED underground light as shown in FIG.

In addition, the light emitting diode lamp according to the present invention, as shown in Figure 14 is also applicable to LED floodlights, LED tunnel lights and LED walking lights, the lamps are automatically lifted remotely as shown on the right side of FIG. It may be installed to enable.

In addition, the light emitting diode illumination lamp according to the present invention can be applied to LED ship lights or LED explosion-proof lights, as shown in Figure 15, as shown in Figure 16 LED street light, LED light, LED security light and LED power pole And the like.

In addition, the light emitting diode lamp according to the present invention can be applied to LED solar street light, LED outdoor light, LED security light, LED solar-wind street light and LED solar road guide light as shown in FIG.

In the above case, it is preferable that the above-mentioned high conductive paint 20c is applied to the outer surface of the lamp case capable of heat transfer with the outside, and may be applied to the heat dissipation fin when the heat dissipation fin is formed.

In addition, when the reflective plate is separately provided in the case 20 as described above, the highly conductive paint 20c is preferably applied to at least one portion of the outer surface of the case or the rear surface of the reflective plate.

In addition, the highly conductive paint 20c may be applied to the outer surface of the case, the rear surface of the reflecting plate, or all or part of the heat dissipation fin according to the shape of the portion to be applied.

Although the above-described embodiments have been described with respect to the most preferred examples of the present invention, it is not limited to the above embodiments, and it will be apparent to those skilled in the art that various modifications can be made without departing from the technical spirit of the present invention.

1 is an exploded perspective view showing the configuration of a light emitting diode lamp according to the present invention;

2 and 3 are a plan view and a cross-sectional view showing the configuration of the lamp shown in FIG. 1, respectively;

4 and 5 are graphs showing the heat dissipation effect of the highly conductive paint according to the content of carbon nanotubes and the ultrasonic treatment time of carbon nanotubes, respectively;

Figure 6 is a plan view showing the configuration of a PCB module applied to the lamp shown in Figure 1, and

7 to 17 are exemplary views showing various types of lamps to which the light emitting diode lamps according to the present invention are applied.

Claims (5)

A PCB module unit on which a plurality of light emitting diodes are mounted; A case portion having an opening through which light generated by the light emitting diode is emitted, is formed at an upper portion of an inner bottom surface of the at least one PCB module unit; The outer surface of the case portion is coated with a high conductive paint including carbon nanotubes to release heat generated from the light emitting diode to the outside, the high conductive paint, 95 to 99.9 wt% of a mixed solution containing at least one organic solvent selected from DMF, NMP, dichloromethane, dichlorobenzene, isopropyl alcohol, acetone and ethanol, and 0.1 to 5 wt% of carbon nanotubes. LED lighting. The method of claim 1, wherein the mixed solution, A light emitting diode lamp comprising: 0.1 to 1 parts by weight of a dispersant for uniformly dispersing carbon nanotubes in an organic solvent and 1 to 10 parts by weight of an organic binder with respect to 100 parts by weight of the organic solvent. The method of claim 2, The case part is provided in the inner case and the outer case is configured to combine the reflection plate is installed on the upper surface of the PCB module unit, The high conductive paint is applied to at least one of the outer surface of the outer case or the back of the reflecting plate with a thickness of 1 to 70 ㎛ light emitting diode lamp. The method according to any one of claims 1 to 3, And at least one converter having an AC input terminal to which AC power is input, an AC output terminal for outputting the AC power, and a DC output terminal for converting and outputting the AC power to DC power. At least one coupling groove to which each converter is fitted is formed at the side of the case part, Each of the PCB module units includes a DC input terminal connected to the DC output terminal by a connector, a DC wiring connecting the DC input terminal to each light emitting diode, an AC input terminal connected to the AC output terminal by a connector, and an AC output. Light emitting diode lamp, characterized in that the terminal and the AC wiring connecting the AC input terminal and the AC output terminal is patterned. The method of claim 4, wherein The converter is provided for each PCB module unit, When AC power is input to any one of the converters, the AC input and output terminals of each of the PCB module units and the AC input and output terminals of the converter are connected by connectors so that the AC power is supplied to the remaining converters. LED lighting lamp.

Images