KR100924801B1 - The Electric Products with Sealing Structure and LED Floodlight Thereof - Google Patents

The Electric Products with Sealing Structure and LED Floodlight Thereof Download PDF

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KR100924801B1
KR100924801B1 KR1020070079801A KR20070079801A KR100924801B1 KR 100924801 B1 KR100924801 B1 KR 100924801B1 KR 1020070079801 A KR1020070079801 A KR 1020070079801A KR 20070079801 A KR20070079801 A KR 20070079801A KR 100924801 B1 KR100924801 B1 KR 100924801B1
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case
liquid
liquid filler
electronic product
filler
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KR1020070079801A
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Korean (ko)
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KR20090015472A (en
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임정연
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임정연
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F21V15/012—Housings with variable shape or dimensions, e.g. by means of elastically deformable materials or by movement of parts forming telescopic extensions of the housing body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

본 발명은, 전자부품이 탑재되고 상기 전자부품을 전기적으로 서로 연결시키는 인쇄회로기판과; 상기 인쇄회로기판이 내부에 고정설치되고 밀폐되는 케이스와; 상기 케이스의 내부에 충진되는 액체충진물과; 상기 액체충진물 상에 배치되어 상기 액체충진물의 수축, 팽창에 따라 탄력적으로 부피가 조절되는 압력조절볼을; 포함하는 전자제품의 밀폐구조를 제공한다.The present invention provides a printed circuit board comprising electronic components mounted thereon and electrically connecting the electronic components to each other; A case in which the printed circuit board is fixed and installed therein; A liquid filler filled in the case; A pressure adjusting ball disposed on the liquid filler to elastically adjust a volume according to shrinkage and expansion of the liquid filler; It provides a sealed structure of an electronic product including.

이에 의하면, 전자제품의 밀폐구조에 있어서 종래 고형의 충진물을 액상의 액체충진물로 대체하고 상기 액체충진물의 압력이 일정하게 유지되도록 수축 및 팽창하는 압력조절볼을 구비함으로써 방열, 방수, 방진 특성을 향상시킬 수 있다.According to the present invention, in the sealed structure of the electronic product, the conventional solid filler is replaced with a liquid liquid filler and the pressure adjusting ball is contracted and expanded so that the pressure of the liquid filler is kept constant, thereby improving heat dissipation, waterproofing, and dustproof characteristics. You can.

특히, 방열 특성이 우수한 액상의 충진물을 사용함에 따라 전자제품의 내부부품 및 구조가 열 손상될 우려가 없다.In particular, there is no fear of thermal damage to the internal parts and structure of the electronic product by using a liquid filler having excellent heat dissipation characteristics.

또한, 액체충진물은 반영구적으로 사용될 수 있으며, 내부 부품 및 구조의 손상없이 분해수리 가능하다는 장점이 있다. In addition, the liquid filler can be used semi-permanently, there is an advantage that can be disassembled and repaired without damaging the internal parts and structures.

밀폐구조, 충진물, 압력조절볼, 점성, 수축, 팽창 Seal structure, filling material, pressure adjusting ball, viscosity, shrinkage, expansion

Description

밀폐구조를 갖는 전자제품 및 이를 이용한 LED 투광기{The Electric Products with Sealing Structure and LED Floodlight Thereof}Electronic products with sealed structure and LED floodlight using the same {The Electric Products with Sealing Structure and LED Floodlight Thereof}

본 발명은 전자제품의 밀폐구조에 관한 것으로서, 더욱 상세하게는 각종 전자부품이 실장되는 인쇄회로기판의 밀폐용 케이스 내부에 점성 및 비중을 조절할 수 있는 액상의 절연물을 충진하여 방수, 방진, 방열할 수 있도록 한 전자제품의 밀폐구조에 관한 것이다.The present invention relates to a sealed structure of an electronic product, and more particularly, a liquid insulating material capable of adjusting viscosity and specific gravity is filled in a sealed case of a printed circuit board on which various electronic components are mounted to be waterproof, dustproof, and heat dissipated. It relates to an airtight structure of an electronic product.

일반적으로 종래의 전자제품의 밀폐구조는 케이스 내부의 기구적인 설계를 통한 패킹 또는 실링을 이용하거나, 케이스 내부에 에폭시 수지 또는 실리콘 수지를 충진하는 방법으로 형성된다.In general, the sealing structure of a conventional electronic product is formed by packing or sealing through a mechanical design inside the case, or by filling an epoxy resin or a silicone resin inside the case.

그 일례로서 LED(Light Emitting Diode) 투광기는 전류가 흐를 때 빛을 내는 반도체 발광소자를 적용한 조명기구로서, 상기 LED는 백열전구와 형광 등과 같은 기존의 광원에 비해 저전력, 고효율, 장시간 동작 수명 등의 장점으로 그 수요가 지속적으로 증가하고 있는 실정이다.For example, a light emitting diode (LED) emitter is a luminaire that employs a semiconductor light emitting device that emits light when current flows, and the LED has advantages such as low power, high efficiency, and long operating life compared to conventional light sources such as incandescent lamps and fluorescent lamps. As a result, the demand is continuously increasing.

한편, 전류인가시 발생되는 빛의 세기에 비례하여 발광원인 반도체 소자에 인가되는 전력이 증가하게 되는데, 이에 따라 전력소모가 많은 고출력 LED에는 발 광시 발생되는 열에 의해 반도체 소자 및 패키지 자체가 열화되어 손상되는 것을 방지할 수 있도록 케이스를 방열구조로 채용하는 것이 일반적이다.On the other hand, the power applied to the semiconductor device which is the light emitting source increases in proportion to the intensity of light generated when the current is applied. Accordingly, the high power LED, which consumes a lot of power, is deteriorated due to deterioration of the semiconductor device and the package itself by heat generated during light emission. It is common to employ a case with a heat dissipation structure to prevent it from becoming.

특히, 케이스 내부에는 반도체 소자는 보호하면서 발광된 빛을 그대로 투사시키도록 에폭시 수지 또는 실리콘 수지로 이루어진 투명한 충진제가 채워지게 된다.In particular, the case is filled with a transparent filler made of an epoxy resin or a silicone resin to project the emitted light as it is while protecting the semiconductor element.

그러나, 이러한 종래의 LED 투광기는 케이스 내부에 에폭시 수지를 충진하는 경우, 수지물의 경화 열에 의해 내부 부품 및 구조가 열 손상될 우려가 있고, 분해 수리가 불가능 하다는 단점이 있다. 또한 실리콘 수지를 사용하면 분해수리는 가능하나, 내부 부품 및 구조의 손상을 감수해야 하는 단점이 있다.However, when the conventional LED floodlight is filled with an epoxy resin inside the case, there is a risk that the internal parts and structure may be thermally damaged by the curing heat of the resin, and the decomposition and repair may not be possible. In addition, the use of the silicone resin can be disassembled and repaired, but there is a disadvantage in that damage to internal parts and structures is required.

본 발명은 상기한 문제점을 감안하여 안출된 것으로서, 케이스 내부에 점성 및 비중을 조절할 수 있는 액상의 절연물을 충진하여 방수, 방진, 방열할 수 있도록 한 전자제품의 밀폐구조를 제공하는데 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and an object thereof is to provide a sealed structure of an electronic product in which a liquid insulator capable of adjusting viscosity and specific gravity is filled in a case to be waterproof, dustproof, and heat dissipated. .

상기한 목적을 달성하기 위해 본 발명은, 전자부품이 탑재되고 상기 전자부품을 전기적으로 서로 연결시키는 인쇄회로기판과; 상기 인쇄회로기판이 내부에 고정설치되고 밀폐되는 케이스와; 상기 케이스의 내부에 충진되는 액체충진물과; 상기 액체충진물 상에 배치되어 상기 액체충진물의 수축, 팽창에 따라 탄력적으로 부피가 조절되는 압력조절볼을; 포함하는 전자제품의 밀폐구조를 제공한다.In order to achieve the above object, the present invention provides a printed circuit board comprising an electronic component mounted thereon and electrically connecting the electronic component to each other; A case in which the printed circuit board is fixed and installed therein; A liquid filler filled in the case; A pressure adjusting ball disposed on the liquid filler to elastically adjust a volume according to shrinkage and expansion of the liquid filler; It provides a sealed structure of an electronic product including.

전술한 바와 같이 본 발명에 따르면, 전자제품의 밀폐구조에 있어서 종래 고형의 충진물을 액상의 액체충진물로 대체하고 상기 액체충진물의 압력이 일정하게 유지되도록 수축 및 팽창하는 압력조절볼을 구비함으로써 방열, 방수, 방진 특성을 향상시킬 수 있다.As described above, according to the present invention, in the sealed structure of the electronics, the heat dissipation by replacing the conventional solid filler with a liquid liquid filler and having a pressure control ball that contracts and expands so that the pressure of the liquid filler is kept constant. Waterproof and dustproof properties can be improved.

특히, 방열 특성이 우수한 액상의 충진물을 사용함에 따라 전자제품의 내부부품 및 구조가 열 손상될 우려가 없다.In particular, there is no fear of thermal damage to the internal parts and structure of the electronic product by using a liquid filler having excellent heat dissipation characteristics.

또한, 액체충진물은 반영구적으로 사용될 수 있으며, 내부 부품 및 구조의 손상없이 분해수리 가능하다는 장점이 있다.In addition, the liquid filler can be used semi-permanently, there is an advantage that can be disassembled and repaired without damaging the internal parts and structures.

이하, 첨부된 도면을 참조로 본 발명의 전자제품의 밀폐구조를 적용한 LED 투광기에 대해 상세하게 살펴본다.Hereinafter, with reference to the accompanying drawings looks at in detail with respect to the LED floodlight to which the sealed structure of the electronic product of the present invention is applied.

도 1은 본 발명의 일실시예에 따른 전자제품의 밀폐구조를 적용한 LED 투광기를 나타낸 측단면도이고, 도 2는 도 1의 압력조절볼이 팽창된 상태를 나타낸 측단면도이며, 도 3은 도 1의 압력조절볼이 수축된 상태를 나타낸 측단면도이다.1 is a side cross-sectional view showing an LED floodlight to which a sealed structure of an electronic product according to an embodiment of the present invention is applied, FIG. 2 is a side cross-sectional view showing a state in which the pressure adjusting ball of FIG. 1 is inflated, and FIG. Side cross-sectional view showing a state in which the pressure control ball contracted.

도 1에 도시된 바와 같이 상기 LED 투광기는, 전원공급용 케이블(C)과, 상기 케이블(C)이 연결되고 내부에 소정 공간을 형성하는 케이스(10)와, 상기 수용공간상에 배치되도록 상기 케이스(10)의 내면에 고정설치되는 인쇄회로기판(20)과, 상기 인쇄회로기판(20)의 일면으로 다수개 실장되어 전원 인가시 발광하는 LED패키지(30)와, 상기 케이스(10)의 내부에 충진되는 액체충진물(40)과, 상기 LED패키지(30)의 발광 이면에 설치되고 상기 액체충진물(40) 상에 배치되어 상기 액체충진물(40)의 수축, 팽창에 따라 탄력적으로 부피가 조절되는 압력조절볼(50)을 포함하여 이루어진다.As shown in FIG. 1, the LED floodlight includes a power supply cable C, a case 10 to which the cable C is connected and forms a predetermined space therein, and disposed on the accommodation space. A printed circuit board 20 fixedly installed on an inner surface of the case 10, a plurality of LED packages 30 mounted on one surface of the printed circuit board 20 to emit light when power is applied, and the case 10 of the case 10. It is installed on the back of the liquid filling 40 and the light emitting of the LED package 30 and disposed on the liquid filling 40, the volume is elastically adjusted according to the contraction, expansion of the liquid filling 40 It is made to include a pressure adjusting ball (50).

상기 액체충진물(40)은 빛 투과성질을 갖는 액상의 절연물로서 이온이 제거된 상태로 사용되고, 점도 조절이 가능한 것을 특징으로 한다.The liquid filler 40 is used as a liquid insulator having a light transmissive property in a state where ions are removed, and the viscosity is adjustable.

또한, 상기 액체충진물(40)은 전원인가시 상기 LED패키지(30)의 발열을 흡수하고 상기 케이스(10)와의 접촉을 통해 상기 케이스(10) 외부로 방열하도록 구비된다.In addition, the liquid filler 40 is provided to absorb heat generated by the LED package 30 when the power is applied and to radiate heat to the outside of the case 10 through contact with the case 10.

또한, 상기 액체충진물(40)은 적정 점도를 갖도록 조절되어 상기 케이스(10) 를 통한 외부의 진동이 상기 케이스(10) 내부의 LED패키지(30)와 인쇄회로기판(20)에 전달되지 않도록 방진하게 됨은 물론이다.In addition, the liquid filling 40 is adjusted to have an appropriate viscosity so that the vibration of the outside through the case 10 is not transmitted to the LED package 30 and the printed circuit board 20 inside the case 10. Of course it is done.

상기 압력조절볼(50)은 상기 액체충진물(40)의 수축에 따라 부피가 팽창하고, 상기 액체충진물(40)의 팽창에 따라 부피가 수축하여 상기 케이스(10) 내부가 압력이 일정하게 유지되고 방수되는 기능을 갖도록 다수개 설치된다.The pressure adjusting ball 50 is expanded in volume as the liquid filling 40 shrinks, and the volume is contracted in accordance with the expansion of the liquid filling 40 to maintain a constant pressure inside the case 10 Multiple installations are provided to have a waterproof function.

이하, 도 1 내지 3을 참조하여 본 발명의 일실시예에 따른 LED 투광기 작동에 대해 살펴본다.Hereinafter, with reference to Figures 1 to 3 looks at the operation of the LED floodlight according to an embodiment of the present invention.

도 1에 도시된 바와 같이 전원이 인가되기 전 상기 케이스(10) 내면과 액체충진물(40) 그리고 상기 액체충진물(40)과 압력조절볼(50)은 서로 적정한 압력으로 균형을 이루고 있다.As shown in FIG. 1, the inner surface of the case 10, the liquid filling 40, and the liquid filling 40 and the pressure adjusting ball 50 are balanced to each other at an appropriate pressure before power is applied.

이 상태에서 상기 전원공급용 케이블(C)을 통해 상기 LED패키지(30)에 전원이 인가되면 상기 LED패키지(30)는 상기 액체충진물(40)을 투과하여 외부로 발광하게 되고 동시에 발열하게 된다.In this state, when power is applied to the LED package 30 through the power supply cable C, the LED package 30 passes through the liquid filling 40 to emit light to the outside and simultaneously generates heat.

이때 액상의 액체충진물(40)은 전도되는 상기 LED패키지(30)의 열을 흡수함과 동시에 접촉된 상기 케이스(10) 내면을 통해 외부로의 방열을 유도하게 된다.In this case, the liquid liquid filler 40 absorbs heat from the conductive LED package 30 and at the same time induces heat radiation to the outside through the inner surface of the case 10 in contact with the liquid.

또한, 상기 액체충진물(40)은 적정 점도를 갖도록 조절되어 상기 케이스(10)를 통한 외부의 진동을 흡수하여 상기 케이스로부터 LED패키지(30) 및 인쇄회로기판(20)으로 전달되는 진동을 최소화하게 된다.In addition, the liquid filler 40 is adjusted to have a suitable viscosity to absorb the vibration from the outside through the case 10 to minimize the vibration transmitted from the case to the LED package 30 and the printed circuit board 20. do.

그리고, 상기 압력조절볼(50)은 상기 액체충진물(40) 상에 배치되어 상기 케이스(10) 내면과 액체충진물(40)의 접촉압력이 항상 일정하게 유지되도록 탄력적으 로 수축, 팽창하면서 케이스(10) 내부의 압력조절을 하게 된다.In addition, the pressure adjusting ball 50 is disposed on the liquid filling 40 so as to contract and expand elastically so that the contact pressure between the inner surface of the case 10 and the liquid filling 40 is constantly maintained. 10) The internal pressure is controlled.

즉, 도 2에 도시된 바와 같이, 상기 액체충진물(40)의 비중이 작아질 경우, 상기 케이스(10) 내면과 액체충진물(40)의 접촉압력이 감소됨과 동시에 상기 압력조절볼과 액체충진물(40)의 접촉압력도 함께 감소하게 되는바, 상기 압력조절볼(50)은 상기 액체충진물(40)의 감소된 비중을 보상하도록 탄력적으로 팽창하여 상기 액체충진물(40)은 케이스(10)와의 접촉압력이 항상 일정하게 유지되는 것이다.That is, as shown in FIG. 2, when the specific gravity of the liquid filler 40 decreases, the contact pressure between the inner surface of the case 10 and the liquid filler 40 decreases and at the same time the pressure regulating ball and the liquid filler ( The contact pressure of the 40 is also reduced, the pressure control ball 50 is elastically expanded to compensate for the reduced specific gravity of the liquid filling 40 so that the liquid filling 40 is in contact with the case 10 The pressure is always kept constant.

반대로 상기 액체충진물(40)의 비중이 커질 경우, 도 3에 도시된 바와 같이, 상기 압력조절볼(50)은 상기 케이스(10) 내면과 액체충진물(40)의 접촉압력이 증가한 량만큼 탄력적으로 수축하여 상기 액체충진물(40)은 케이스(10)와의 접촉압력이 항상 일정하게 유지될 수 있다.On the contrary, when the specific gravity of the liquid filler 40 is increased, as shown in FIG. 3, the pressure adjusting ball 50 is elastically as much as the contact pressure between the inner surface of the case 10 and the liquid filler 40 is increased. By contracting, the liquid filler 40 may be kept at a constant contact pressure with the case 10.

한편, 본 발명의 다른 실시예로서 본원의 전자제품의 밀폐구조는 도 4 및 도 5에 도시된 바와 같은 핸드폰에 적용될 수 있다.Meanwhile, as another embodiment of the present invention, the sealing structure of the electronic product of the present application may be applied to a mobile phone as shown in FIGS. 4 and 5.

도 4 및 도 5를 참조하면, 상기 핸드폰은, LCD(111)가 부착된 커버(110)와, 상기 커버(110)와 힌지(H) 결합되며 상면에 키패드(121)가 구비되는 본체부(120)와, 상기 본체부(120)의 내부에 고정설치되는 인쇄회로기판(125)과, 상기 본체부(120)의 하면에 착탈식으로 결합되는 충전지(130)와, 상기 본체부(120)의 내부에 충진되는 액체충진물(140)과, 상기 액체충진물(140) 상에 배치되어 상기 액체충진물(140)의 수축, 팽창에 따라 탄력적으로 부피가 조절되는 압력조절볼(150)을 포함하여 이루어진다.4 and 5, the mobile phone, the cover 110 is attached to the LCD 111, the cover 110 and the hinge (H) is coupled to the main body portion provided with a keypad 121 (top) 120, a printed circuit board 125 fixedly installed in the main body 120, a rechargeable battery 130 detachably coupled to a lower surface of the main body 120, and the main body 120. The liquid filling 140 is filled in the inside, and the pressure control ball 150 is disposed on the liquid filling 140 and the volume is elastically adjusted according to the contraction, expansion of the liquid filling 140.

여기서 주요구성인 상기 액체충진물(140) 및 압력조절볼(150)은 앞서 일실시예에서 기술한 바와 동일한 작용을 함으로써 방열, 방수, 방진 특성을 갖는 핸드폰의 밀폐구조를 제공할 수 있다.Here, the liquid filling 140 and the pressure adjusting ball 150, which are main components, may provide a sealed structure of a mobile phone having heat dissipation, waterproofing, and dustproofing properties by performing the same function as described in the above embodiment.

이상에서는 본 발명의 전자제품의 밀폐구조를 LED 투광기 및 핸드폰에 한정하여 예시하였으나, 여타 밀폐구조를 갖는 노트북, 카메라, 세탁기, 비데 등의 방수, 방열이 필요한 다양한 전자제품에 응용될 수 있고, 군용 및 자동차 등의 고속 기동에 따른 고 진동으로부터 제품을 보호하도록 사용되는 등 다양한 산업부분에 응용될 수 있음은 물론이다.In the above, the sealed structure of the electronic product of the present invention is exemplified by being limited to the LED floodlight and the mobile phone, but it can be applied to various electronic products requiring waterproof and heat dissipation such as notebooks, cameras, washing machines, bidets, etc. And it can be applied to a variety of industrial parts, such as used to protect the product from high vibration caused by high-speed startup of the car.

도 1은 본 발명의 일실시예에 따른 전자제품의 밀폐구조를 적용한 LED 투광기를 나타낸 측단면도이고,1 is a side sectional view showing an LED floodlight to which a sealed structure of an electronic product according to an embodiment of the present invention is applied;

도 2는 도 1의 압력조절볼이 팽창된 상태를 나타낸 측단면도이며,Figure 2 is a side cross-sectional view showing a state in which the pressure adjusting ball of Figure 1 inflated,

도 3은 도 1의 압력조절볼이 수축된 상태를 나타낸 측단면도이며,Figure 3 is a side cross-sectional view showing a state in which the pressure adjusting ball of Figure 1 contracted,

도 4는 본 발명의 다른 실시예에 따른 전자제품의 밀폐구조를 적용한 핸드폰을 나타낸 사시도, 및Figure 4 is a perspective view of a mobile phone to which the sealing structure of the electronic product according to another embodiment of the present invention, and

도 5는 도 4의 A-A선에 따른 단면도이다.5 is a cross-sectional view taken along the line A-A of FIG.

** 도면의 주요부분에 대한 부호의 설명 **** Explanation of symbols for main parts of drawings **

10: 케이스 20: 인쇄회로기판10: case 20: printed circuit board

30: LED패키지 40: 액체충진물30: LED Package 40: Liquid Filler

50: 압력조절볼 C: 전원공급용 케이블50: pressure adjusting ball C: power supply cable

110: 커버 120: 본체부110: cover 120: main body

125: 인쇄회로기판 130: 충전지125: printed circuit board 130: rechargeable battery

140: 액체충진물 150: 압력조절볼140: liquid filling 150: pressure control ball

Claims (10)

전자부품이 탑재되고 상기 전자부품을 전기적으로 서로 연결시키는 인쇄회로기판과;A printed circuit board on which electronic components are mounted and electrically connecting the electronic components to each other; 상기 인쇄회로기판이 내부에 고정설치되고 밀폐되는 케이스와;A case in which the printed circuit board is fixed and installed therein; 상기 케이스의 내부에 충진되는 액체충진물과; A liquid filler filled in the case; 상기 액체충진물 상에 배치되어 상기 액체충진물의 수축, 팽창에 따라 탄력적으로 부피가 조절되는 압력조절볼을; A pressure adjusting ball disposed on the liquid filler to elastically adjust a volume according to shrinkage and expansion of the liquid filler; 포함하는 밀폐구조를 갖는 전자제품.Electronic product having a sealed structure containing. 제 1항에 있어서, 상기 액체충진물은, The method of claim 1, wherein the liquid filler, 액상의 절연물로서 이온 제거된 상태인 것을 특징으로 하는 밀폐구조를 갖는 전자제품. An electronic product having a sealed structure, characterized in that the state is ion-removed as a liquid insulator. 제 1항에 있어서, 상기 액체충진물은,The method of claim 1, wherein the liquid filler, 상기 케이스 내부의 열을 흡수하여 상기 케이스와의 접촉을 통해 상기 케이스 외부로 방열하는 것을 특징으로 하는 밀폐구조를 갖는 전자제품. The electronic product having a sealed structure, absorbing heat inside the case and radiating heat to the outside of the case through contact with the case. 삭제delete 제 1항 내지 제 3항 중 어느 한에 있어서, 상기 압력조절볼은,The pressure adjusting ball according to any one of claims 1 to 3, 상기 액체충진물의 수축에 따라 부피가 팽창하고, 상기 액체충진물의 팽창에 따라 부피가 수축하여 상기 케이스 내부가 압력이 일정하게 유지되고 방수되도록 하는 것을 특징으로 하는 밀폐구조를 갖는 전자제품.An electronic product having a sealed structure, characterized in that the volume is expanded according to the shrinkage of the liquid filling, the volume is contracted as the expansion of the liquid filling so that the pressure is kept constant and waterproof inside the case. 전원 인가시 발광하는 LED패키지와; An LED package which emits light when power is applied; 상기 LED패키지가 실장되는 인쇄회로기판과; A printed circuit board on which the LED package is mounted; 상기 인쇄회로기판이 내부에 고정설치되는 케이스와; A case in which the printed circuit board is fixedly installed therein; 상기 케이스의 내부에 충진되는 액체충진물과; A liquid filler filled in the case; 상기 LED패키지의 발광 이면에 설치되고 상기 액체충진물 상에 배치되어 상기 액체충진물의 수축, 팽창에 따라 탄력적으로 부피가 조절되는 압력조절볼을; A pressure control ball installed on the light emitting back surface of the LED package and disposed on the liquid filler to elastically adjust the volume according to the contraction and expansion of the liquid filler; 포함하는 LED 투광기. LED floodlight included. 제 6항에 있어서, 상기 액체충진물은, The method of claim 6, wherein the liquid fill, 액상의 절연물로서 이온 제거된 상태인 것을 특징으로 하는 LED 투광기. LED floodlight, characterized in that the ion is removed as a liquid insulator. 제 6항에 있어서, 상기 액체충진물은,The method of claim 6, wherein the liquid fill, 상기 LED패키지의 열을 흡수하고 상기 케이스와의 접촉을 통해 상기 케이스 외부로 방열하는 것을 특징으로 하는 LED 투광기.The LED floodlight, which absorbs heat from the LED package and radiates heat to the outside of the case through contact with the case. 삭제delete 제 6항 내지 제 8항 중 어느 한에 있어서, 상기 압력조절볼은,The pressure adjusting ball according to any one of claims 6 to 8, 상기 액체충진물의 수축에 따라 부피가 팽창하고, 상기 액체충진물의 팽창에 따라 부피가 수축하여 상기 케이스 내부가 압력이 일정하게 유지되고 방수되도록 하는 것을 특징으로 하는 LED 투광기.The LED floodlight, characterized in that the volume is expanded according to the shrinkage of the liquid filling, the volume is contracted as the expansion of the liquid filling to maintain a constant pressure and waterproof inside the case.
KR1020070079801A 2007-08-08 2007-08-08 The Electric Products with Sealing Structure and LED Floodlight Thereof KR100924801B1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101351710B1 (en) 2012-12-14 2014-01-14 김대수 Light emitting diode lamp

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101336987B1 (en) * 2011-12-14 2013-12-16 (주) 사람과나눔 Heat radiate module for electronic parts and heat radiate liquid used the same
CN114001289B (en) * 2021-11-24 2024-09-20 固安翌光科技有限公司 Deformation lighting device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5200125A (en) 1988-12-24 1993-04-06 T&K International Laboratory, Ltd. Method for seal molding electronic components with resin
JPH08111478A (en) * 1994-10-06 1996-04-30 Toshiba Corp Resin sealed semiconductor device
US5874324A (en) 1996-03-14 1999-02-23 Towa Corporation Method of sealing electronic component with molded resin
KR20060082919A (en) * 2005-01-13 2006-07-20 삼성전자주식회사 Spacer formation apparatus for liquid crystal display and manufacturing method of liquid crystal display using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5200125A (en) 1988-12-24 1993-04-06 T&K International Laboratory, Ltd. Method for seal molding electronic components with resin
JPH08111478A (en) * 1994-10-06 1996-04-30 Toshiba Corp Resin sealed semiconductor device
US5874324A (en) 1996-03-14 1999-02-23 Towa Corporation Method of sealing electronic component with molded resin
KR20060082919A (en) * 2005-01-13 2006-07-20 삼성전자주식회사 Spacer formation apparatus for liquid crystal display and manufacturing method of liquid crystal display using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101351710B1 (en) 2012-12-14 2014-01-14 김대수 Light emitting diode lamp

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