KR100707717B1 - Stacking method of semiconductor chips and stacking device thereof - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip stacking method and apparatus for stacking a plurality of semiconductor chips for high integration in a semiconductor manufacturing process.

More specifically, to stack a semiconductor chip package to high integration; The stacker for stacking the chip package by the loader is transported along the rail to the first stacking zone, and the chip package loaded in the tray on the first, first or second tray supply unit is picked up by the first pick-up head unit and placed on the stacked tray. The stack tray is transferred to the second stack zone, and the chip package loaded in the tray on the third tray supply unit is adhered to the top of the chip package arranged on the pickup stack tray by the second pickup head unit. After the stacking, the stacked trays in which the chip packages are stacked are transferred to the discharge zone, and the stacked chip packages in which the heights of the stacked chip packages are normal are inspected by a laser sensor detector, and the stacked chip packages in which the heights of the stacked chips are bad are examined. Separating and discharging the stacked tray on which the defective stacked chip package is loaded; It is characterized by maximizing productivity and reliability by maximizing workability and product reliability, and also providing automation of work continuity.

Semiconductors, Chips, Stacking, Bonding, High Integration, Trays

Description

Method and device for stacking semiconductor chips {STACKING METHOD OF SEMICONDUCTOR CHIPS AND STACKING DEVICE THEREOF}

1 is a plan view showing a schematic configuration of an apparatus of the present invention.

2 is a side view showing a schematic configuration of the apparatus of the present invention.

Figure 3 is a perspective view of the main portion showing the chip package supply of the device of the present invention.

Figure 4 is a perspective view of the main portion showing the adhesive supply of the device of the present invention.

Figure 5 is a perspective view of the main portion showing the inspection of the laminated package of the device of the present invention.

Figure 6 is a process diagram of a process of laminating and manufacturing a chip package of the present invention in two layers.

7 is a process chart of a process of laminating and manufacturing a chip package of the present invention in three layers.

** Description of symbols for the main parts of the drawing **

10: loader 12: lamination tray

15: rail 21, 22: laminated zone

23: inspection, discharge zone 31, 32, 33: tray supply

41, 42: tray recovery unit 50: adhesive supply unit

51 and 52: pickup head portion 60: laser sensor detector

70: defective laminated tray recovery unit 80: transfer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip stacking method and apparatus for stacking a plurality of semiconductor chips for high integration in a semiconductor manufacturing process.

In general, a semiconductor chip is formed on a wafer by repeating a series of wafer processing processes such as an oxidation process, a diffusion process, a photographic process, and a metal process, and the chips formed on the wafer are EDS (Electrical Die Sorting). The chip is tested for normality by the process, and the chip tested for good quality by the testing is slid and packaged.

In addition, the packaged chip expands its capacity by bonding two or more packages vertically stacked, pressurized, and heated as a method for increasing more memory density within a limited surface mount area.

Such a conventional semiconductor chip stacking device has been disclosed in a number of forms.

For example, it is roughly composed of a table on which the first and second trays are placed, a transfer part for loading or unloading the first and second trays to the table, and a pickup head part for picking up and stacking the chip package on the tray. After the first tray is loaded, the pickup head unit picks up the chip package on the first tray, unloads the first tray, and then loads the second tray to stack the chip package on the second tray. It was prepared to repeat.

However, in this method, since the first and second trays are repeatedly loaded and unloaded on the table, the workability is very low, and the work flow is difficult to achieve due to the static work flow of the fixed work table. The realization of automation was very difficult.

In addition, there is a problem that the work reliability is greatly reduced since the process of detecting work defects and errors of the stack package in the work process is excluded.

As another example, a rotatable index table is provided to be divided into first, second, and third regions, and nest pictures are installed in the first and third regions, respectively, and a splicer is installed in the second region.

The front surface of the table includes upper and lower package trays, an adhesive tray, and a laminated package tray, and a plurality of robot arms transferring the trays and the adhesive are provided.

The stacking apparatus stacks the chip package by the robot arm in the first and third regions while rotating the index table, and the upper package is coated with an adhesive.

Then, the index table is rotated and transferred again to press the chip packages stacked in the second area by using a bonding machine.

However, the apparatus also has a problem that the operation of the operator is very inconvenient as well as the tray supply discharge direction is complicated, thereby causing a work error.

In addition, the separate device for checking the above-mentioned work error is excluded, there is a inconvenience that the operator should check visually in the middle of every work.

In addition, there is a problem that the operation reliability is greatly reduced by eliminating the process of automatically detecting the failure and error of the chip package.

The present invention has been created to fundamentally solve all the problems of the prior art.

According to the present invention, the chip stacks are laminated in two or three layers while intermittently transferring the empty stacking trays for stacking the chip packages by the loader in one direction, as well as checking the bonding state of the stack packages by a laser sensor. The purpose is to maximize productivity and productivity by maximizing the workability and reliability of the product while guiding the separate trays containing the package and the defective laminated package separately.

The object of the present invention is to stack a semiconductor chip package to high integration; The stacker for stacking the chip package by the loader is transported along the rail to the first stacking zone, and the chip package loaded in the tray on the first, first or second tray supply unit is picked up by the first pick-up head unit and placed on the stacked tray. The stack tray is transferred to the second stack zone, and the chip package loaded in the tray on the third tray supply unit is adhered to the top of the chip package arranged on the pickup stack tray by the second pickup head unit. After the stacking, the stacked tray in which the chip package is stacked is transferred to the discharge zone, and the stacked chip package in which the stacked height of the chip package is normal is inspected by the laser sensor detector, and the stacked chip package in which the stacked height is bad. It is achieved by a semiconductor chip stacking method and apparatus for separating and discharging the stacked tray on which the defective stacked chip package is loaded.

Next, the semiconductor chip stacking method of the present invention for achieving the above object of the present invention will be described.

According to the present invention, the semiconductor chip package is stacked and highly integrated.

A stacking tray for stacking the chip packages by the loader to the first stacking zone along the rails, the chip packages loaded in the tray on the first tray supply unit being picked up by the first pick-up head unit, and arranged on the stacking tray; 1 bottom chip package stacking step,

The stacking tray in which the first lower chip package is arranged is transferred back to the second stacking zone along the rail by the loader, and the chip package loaded on the tray on the third tray supply unit is picked up by the second pick-up head unit to apply the adhesive. A second upper chip package laminating step of laminating and burying the upper and lower adhesive chips onto the first lower chip package aligned on the lamination tray;

The stacking tray in which the chip package is stacked is again inspected along the rail by the loader and transferred to the discharge zone, and the stacking chip package in which the stacking height of the chip package is normal by the laser sensor detector, and the stacking chip package in which the stacking height is poor The inspection is performed by separating and discharging the stacked tray on which the defective stacked chip package is loaded.

In addition, the stacking tray in which the stacking chip package, which is normal in the inspecting and discharging step, is loaded is continuously transported by a loader and heated by an oven to optimize the stacking state by adhesion of the stacking chip package.

In addition, the present invention in the stacking step of the first lower chip package picks up the chip package loaded on the tray on the second tray supply unit of the first stacked zone by the first robot arm, the adhesive is applied to the stacking arrangement on the stacking tray A second lower chip package stacking step of adhering and stacking the upper part of the first lower chip package may further include a method of laminating the stack of chip packages in a plurality of layers.

Next, a preferred embodiment for achieving the method of the present invention as described above will be described in detail with reference to the accompanying drawings.

That is, the lamination apparatus of the present invention, as shown in Figures 1 to 5,

A loader 10 for intermittently transporting the stacking tray 12 on which the chip package is to be stacked to the first and second stacking zones 21 and 22 along the rails 15 in one direction, and to the inspection and discharge zones 23;

First and second tray supply units 31 and 32 and the first and second trays, which vertically supply and supply a tray in which a chip package to be supplied to the stack tray 12 is stacked in one portion of the first stacked zone 21. A first tray recovery unit 41 which collects the empty trays that supply all the chip packages from the supply unit to be stacked;

The third tray supply unit 33 and the third tray supply unit supply both chip trays stacked up and down to supply a tray containing a chip package to be supplied to the stacking tray 12 in one portion of the second stacked zone 22. A second tray recovery section 42 for collecting one empty tray to be stacked;

The first and second pickup heads 51 and 52 for picking up and transferring the chip packages or trays from the first and second stacked zones 21 and 22, respectively, and the chip packages to be bonded to each other when the chip packages are stacked. Adhesive supply unit (50) (50) to bury the adhesive on the bottom,

The laser sensor detector 60 which detects the height and height of the laminated package on the stacking tray 12 in the inspection and discharge zone 23 and discriminates the normal and the defective, and the stacked package in which the failure is determined by the laser sensor detector are loaded. It consists of a defective laminated tray recovery unit 70 for separating and discharging the laminated tray separately.

At this time, between the first and second stacked zones 21 and 22, the first and second stacked zones corresponding to each other so that a separate package can be picked up by the first and second pick-up heads 51 and 52 ( 21 and 22 can be achieved by further configuring the transfer unit 80 to be transported by the transfer table (82).

In addition, the first, second, third tray supply unit 31, 32, 33 and the first, second tray recovery unit 41, 42 is configured to stack and stack the tray up and down.

Reference numeral 100 denotes an operation unit.

Next, the operation and operation of the apparatus of the present invention configured as described above will be described.

First, in the present invention, the chip package is stacked in two layers to achieve high integration. Referring to FIG. 6, a stacking tray 12 for stacking chip packages by the loader 10 along a rail 15 is first stacked. The feed to the zone 21 is supplied.

In this state, the first pickup head part 51 picks up the chip package from the tray located at the upper end of the first tray supply part 31 and arranges the chip package in the stacked tray 12 in a state of correcting the position.

In this case, the first pick-up head unit 51 picks up and carries several chips at a time such as four, eight, sixteen, etc. at a time.

When the supply of the lower chip package is completed on the stacking tray 12 in this way, the stacking tray 12 is transferred by the loader 10 to the second stacking zone 22.

The second pickup head unit 52 picks up the chip package from the tray located at the upper end of the third tray supply unit 33 and transfers the adhesive to the bottom surface of the package in the adhesive supply unit 50. After the pinch, the position is corrected and fed to be stacked on top of each lower chip package of the stacking tray 12.

In this case, the chip package on the stacking tray 12 may sometimes be supplied with another material stacked in addition to the package.

This is supplied to the stacking tray 12 by the first and second pick-up heads 51 and 52. In particular, a transfer 80 is used between the first and second pick-up heads 51 and 52. Since the first and second pickup heads 51 and 52 move on the stacking tray 12, the first and second pickup heads 51 and 52 can be moved.

That is, depending on which of the first and second pick-up head portions 51 and 52 the supply portion of the article is located, the first and second pick-up head portions 51 and 52 directly place the article on the stacking tray 12. The feeder 82 on the transfer unit 80 that supplies or feeds back and forth may be supplied to the other pickup head portion, and may be supplied to the laminated tray by the other pickup head portion.

When the chip package is laminated on the stacking tray 12 as described above, the stacking tray 12 is transferred again by the loader 10 to be transported to the inspection and discharge zone 23.

In this state, the laser sensor detector 60 inspects each of the stacked chip packages on the stacked tray 12.

This is determined by detecting the height of the four corners of the stacked chip package as shown in FIG. 5 by detecting whether the laminated bonding of the chip package is defective or normal.

In this way, if the chip package on the stacking tray 12 contains a defect, it is separated and discharged by a separate recovery unit 70, the stacking tray 12 loaded with the normal chip package is continuously transferred to the oven (Not shown) to optimize stack bonding of chip packages.

At this time, the stacking tray 12 containing the defective stacked chip package is detected by the laser sensor detector 60 as described above and transferred to the recovery unit 70 to be modified or separated into a normal chip package in the inspection step. It is conveyed again and inspected again by a laser sensor detector, and then conveyed to an oven (not shown).

Meanwhile, when all the chip packages of the trays on the first and third tray supply units 31 and 33 are supplied from the first and second stacked zones 21 and 22, the empty trays are the first and second pickup heads. The trays 51 and 52 are recovered to the first and second tray recovery parts 41 and 42, and the first and third tray supply parts 31 and 33 are again equipped with trays in which new chip packages are loaded. It is automatically supplied to the upper part to achieve continuous work.

In addition, the present invention described above is a case in which the chip package is stacked in two layers, and in the case of stacking in three layers in order to further integrate the same, the following description will be given with reference to FIG. 7.

Compared to the above-described embodiment of FIG. 6, the first pick-up head part 51 picks up the chip package from the tray located at the top of the first tray supply part 31 in the first stacked zone 21. After aligning and arranging the stacked trays 12 in a position-corrected state, the first pickup head unit 51 picks up the chip package from the tray located at the upper end of the second tray supply unit 32 without moving. In the adhesive supply unit 50, the adhesive is squeezed to the bottom of the package, and then the position is corrected, and the adhesive supply unit 50 is suitably stacked on each lower chip package of the stacking tray 12.

As described above, after the chip packages are bonded to be stacked in two layers in the first stacked zone 21, the stacked tray 12 is transferred to the second stacked zone 22 by the loader 10 again, and thus, as described above. As described above, the chip pick-up on the third tray supply part 33 is picked up by the second pick-up head part 52, the adhesive supply part 50 applies the adhesive to the bottom surface of the package, and then corrects the position of each chip of the stacking tray 12. Since it is suitable to be stacked on top of the chip package, it is bonded in three layers.

As described above, the stacking tray 12 in which the chip packages stacked in three layers are stacked is again transferred and supplied by the loader 10 to the stacking chip package on the stacking tray 12 by the laser sensor detector 60. Each test will separate and discharge the stacked tray containing the good and bad chip packages.

As described above, in the present invention, the chip package is laminated in two or three layers while intermittently transferring an empty lamination tray in which the chip package is to be stacked by a loader in one direction, as well as bonding the laminated package by a laser sensor. By inspecting the condition, separate and discharge the trays containing the normal lamination package and the bad lamination package, and maximize the workability and product reliability, and also provide the continuity of the work to achieve the automation to maximize productivity. will be.

Claims (4)

In the semiconductor chip stacking method of stacking a plurality of chip packages transported for high integration of the semiconductor chip, A stacking tray for stacking the chip packages by the loader to the first stacking zone along the rails, the chip packages loaded in the tray on the first tray supply unit being picked up by the first pick-up head unit, and arranged on the stacking tray; 1 bottom chip package stacking step, The stacking tray in which the first lower chip package is arranged is transferred back to the second stacking zone along the rail by the loader, and the chip package loaded on the tray on the third tray supply unit is picked up by the second pick-up head unit to apply the adhesive. A second upper chip package laminating step of laminating and burying the upper and lower adhesive chips onto the first lower chip package aligned on the lamination tray; The stacking tray in which the chip package is stacked is again inspected along the rails by a loader and transported to the discharge zone, and the stacked chip package having a normal stack height of the chip package by a laser sensor detector and a stacked chip package having a poor stack height are stacked. And inspecting and discharging the laminated tray on which the defective laminated chip package is loaded, and discharging the defective stacked chip package. The method of claim 1, In the stacking step of the first lower chip package, the chip package loaded on the tray on the second tray supply unit of the first stacking zone is picked up by the first robot arm, coated with adhesive, and then aligned on the stacking tray. The method of claim 1, further comprising stacking the chip package in a plurality of layers, further comprising a second lower chip package stacking step of adhering and laminating the upper portion. In the semiconductor chip stacking device for manufacturing a plurality of chip packages transported for high integration of the semiconductor chip, A loader 10 for intermittently transporting the stacking tray 12 on which the chip package is to be stacked to the first and second stacking zones 21 and 22 along the rails 15 in one direction, and to the inspection and discharge zones 23; First and second tray supply units 31 and 32 and the first and second trays, which vertically supply and supply a tray in which a chip package to be supplied to the stack tray 12 is stacked in one portion of the first stacked zone 21. A first tray recovery unit 41 which collects the empty trays that supply all the chip packages from the supply unit to be stacked; The third tray supply unit 33 and the third tray supply unit supply both chip trays stacked up and down to supply a tray in which a chip package to be supplied to the stack tray 12 is stacked in one portion of the second stacked zone 22. A second tray recovery section 42 for collecting one empty tray to be stacked; The first and second pickup heads 51 and 52 for picking up and transferring the chip package or the tray from the first and second stacked zones 21 and 22, respectively, and the chip package to be bonded to each other when the chip package is stacked. Adhesive supply unit (50) (50) to bury the adhesive on the bottom, The laser sensor detector 60 which detects the height and height of the laminated package on the stacking tray 12 in the inspection and discharge zone 23 and discriminates whether it is normal or defective, A semiconductor chip stacking device, characterized in that it is composed of a defective stacking tray recovery unit (70) for separating and discharging the stacking tray separately. The method of claim 3, First and second stacked zones 21 corresponding to each other so that separate packages can be picked up by the first and second pick-up heads 51 and 52 between the first and second stacked zones 21 and 22. And a transfer device (80) which is transported by the transfer table (82) to (22).

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