KR100620214B1 - Polychromatic led package with improved heat protection rate - Google Patents

Abstract

According to an aspect of the present invention, there is provided a high power light emitting diode package, comprising: a first package housing formed of a high thermal conductive ceramic or a thermally conductive plastic and having an inner space; A second package housing made of the same material as the first package housing and inserted into an inner space of the first package housing; At least one heat transfer slug which is a conductive material and is electrically disconnected and inserted into an inner space of the second package housing; A pair of lead frames fixed between the first package housing and the second package housing; And at least one LED chip bonded to the top surface of the heat transfer slug and electrically connected to the lead frame through the heat transfer slug, wherein the second package housing includes a slug boundary for electrically disconnecting the respective heat transfer slugs. It is formed integrally, and is divided by the slug boundary to provide a high output light emitting diode package with improved heat dissipation efficiency, characterized in that a slug seating space for forming each of the heat transfer slug is formed.

LED chip, LED diode, rectangular shape, high thermal conductivity ceramics, LCD device

Description

High power LED package with improved heat dissipation efficiency {POLYCHROMATIC LED PACKAGE WITH IMPROVED HEAT PROTECTION RATE}

1 is a perspective view showing a general circular high power light emitting diode package;

2 is a perspective view showing a high power light emitting diode package according to the present invention;

3 is an exploded perspective view illustrating a high power light emitting diode package according to the present invention;

4 is a plan view, side view, and bottom view of a high power light emitting diode package according to the present invention;

5 is a front cross-sectional view, a longitudinal cross-sectional view and a side cross-sectional view showing a high power light emitting diode package according to the present invention;

6 is a plan view of an LED chip mounted on a high power light emitting diode package according to the present invention;

7 is a plan view of an LED chip mounted in another embodiment of a high power light emitting diode package according to the present invention;

8 is a cross-sectional view of a molding material molded in the high power light emitting diode package according to the present invention.

♣ Explanation of symbols for main part of drawing ♣

1, 2: package housing 3a, 3b: heat transfer slug

5a, 5b: lead frame 4a, 4b: connection terminal

6a, 6b: slug seating space 9: slug border

10a, 10b: slug seating jaw 8a, 8b: terminal seating groove

The present invention relates to a high output light emitting diode package having improved heat dissipation efficiency, and more particularly, to form a shape of a conventional general light emitting diode package in accordance with the shape of the mounting space of the LED package, and to be easily applied. The present invention relates to a high output light emitting diode package having improved heat dissipation efficiency by applying conductive ceramics as a material of a package housing.

Generally, in the conventional high output light emitting diode package, as shown in FIG. 1, a heat dissipation member 103 capable of dissipating heat is fixed to a central portion of the main body housing 101, and the heat dissipation member 103 is fixed. The LED chip 105 is bonded inside. In addition, a pair of lead frames 111 are installed in the main body housing 101 to protrude to the outside, and the LED chip 105 is mounted on a submount 109 that serves as a circuit board. 111 is electrically connected to the LED chip 105, and the LED chip 105 is protected by a light emitting lens 107 covering an upper surface of the main body housing 101.

Therefore, the light emitting diode package 100 including the conventional heat dissipation member is configured to supply a large input current to the LED chip 105 by heat radiating from the LED chip 105 through the heat dissipation member 103. The optical high power can be obtained.

However, the light emitting diode package 100 having the above-mentioned conventional heat dissipation member has the following problems.

First, since the conventional high output light emitting diode has a large size, it is difficult to be compatible with, for example, an existing LCD device, and there is a problem in that a separate mounting fixture must be installed.

Second, since the body housing 101 of the light emitting diode package 100 is made of a general plastic (polymer) material or a thermally conductive plastic material having low thermal conductivity, heat emitted from the LED chip 105 to the outside of the housing 101. The heat dissipation efficiency is significantly lowered due to the dissipation, and thus, the life of the LED chip 105 is shortened as described above.

In order to solve the problems of the conventional LED package described above, the present invention can be easily applied to a mechanism, a device or an apparatus to be mounted on a completed LED package by changing the shape of a general circular LED package, and at the same time, The purpose of the present invention is to provide a high output light emitting diode package having excellent light emission characteristics by applying conductive ceramics or thermally conductive plastic as a package housing material.

In order to achieve the above object, the present invention provides a high power light emitting diode package comprising: a first package housing made of a high thermal conductivity ceramics or a thermally conductive plastic and having an inner space; A second package housing made of the same material as the first package housing and inserted into an inner space of the first package housing; At least one heat transfer slug which is a conductive material and is electrically disconnected and inserted into an inner space of the second package housing; A pair of lead frames fixed between the first package housing and the second package housing; And at least one LED chip bonded to the top surface of the heat transfer slug and electrically connected to the lead frame through the heat transfer slug, wherein the second package housing includes a slug boundary for electrically disconnecting the respective heat transfer slugs. It is formed integrally, and is divided by the slug boundary to provide a high output light emitting diode package with improved heat dissipation efficiency, characterized in that a slug seating space for forming each of the heat transfer slug is formed.

In addition, the present invention provides a high output light emitting diode package having improved heat dissipation efficiency having a rectangular shape of the first package housing.

The present invention also provides a high output light emitting diode package having improved heat dissipation efficiency, wherein the high thermal conductivity ceramic is any one selected from alumina (Al ₂ O ₃ ), silicon carbide (SiC), and aluminum nitride (AlN). The housing provides a high-output light emitting diode package having improved heat dissipation efficiency, the inner space of which is formed in any one shape among rectangular, circular, elliptical and bicyclic.

In addition, the present invention provides a high output light emitting diode package having improved heat dissipation efficiency further includes a zener diode mounted on the heat transfer slug and polarly connected to the connection terminal of the lead frame.

In addition, the present invention provides a high power light emitting diode package having improved heat dissipation efficiency that is bonded to the upper surface of the heat transfer slug and electrically connected to the LED chip is protected by a light emitting lens or a molding material.

In addition, the present invention provides a high-output light emitting diode package with improved heat dissipation efficiency is molded by a molding material of silicon, the LED chip, and then molded again with an epoxy resin.
In addition, the present invention provides a high power light emitting diode package having improved heat dissipation efficiency, characterized in that the LED chip bonded to the upper surface of the heat transfer slug and electrically connected to the polarity is protected by the molding material and the light emitting lens.
In addition, the present invention is a slug seating jaw for mounting and fixing the heat transfer slug to the slug seating space in the state in which the lower portion of the second package housing is open to the second package housing is integrally formed on the slug border Provided is a high power light emitting diode package having improved heat dissipation efficiency.
In addition, the present invention is characterized in that the first package housing is covered with the second package housing, the heat transfer slug inserted into the second package housing and has a fixing jaw for fixing in close contact with the lead frame Provides a high power LED package with improved thermal efficiency.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration of the present invention.

2 is a perspective view showing a high power light emitting diode package according to the present invention, Figure 3 is an exploded perspective view showing a high power light emitting diode package according to the present invention, Figure 4 is a plan view showing a high power light emitting diode package according to the present invention. , Side view and bottom view.

The present invention has been applied to the specific embodiments as shown in each of the above drawings, the present invention is not limited to these specific embodiments, and various modifications can be made without departing from the spirit of the present invention.

2 to 4, the high power light emitting diode package according to the present invention first processes the first package housing 1, which is an external part, into a polygonal shape of triangle or more, and the second package housing 2 is It is not necessary to be processed into the same shape as the shape of the first package housing 1, but in the embodiment of the present invention will be described with the first and second package housing (1, 2) in a rectangular shape.

In addition, as the material of the first and second package housings 1 and 2, thermally conductive plastics are conventionally used. Such thermally conductive plastics include ABS (Acrylonitrile Butadiene Styrene), LCP (Liquid Crystalline Polymer), PA (Polyamide), PPS (Polyphenylene Sulfide), TPE (Thermoplastic Elastomer), etc. (Copper, silver, aluminum, etc.) and thermal conductivity is lower than ceramics. That is, since the nature of the material having a heat transfer function depends on the heat conductivity of the material itself, it is preferable to adopt a material having high heat conductivity in order to achieve efficient heat transfer.

However, in the field of light emitting diode packages to which the present invention is applied, a thermally conductive metal cannot be used as the material of the package housings 1 and 2. The first and second package housings 1 and 2 are made of metal because they require electrical insulation between the connection terminals 4a and 4b of the lead frames 5a and 5b and the heat transfer slugs 3a and 3b located therein. If the package housing (1, 2) is made of a material there is a problem that it is not electrically insulated.

Therefore, in the present invention, high thermal conductive ceramics are used as the package housing 1 and 2 materials. This high thermal conductivity ceramic is a ceramic material developed to dissipate heat quickly in a circuit board. Representative examples include alumina (Al ₂ O ₃ ), silicon carbide (SiC) and aluminum nitride (AlN). have. Among the high thermally conductive ceramics, aluminum nitride (AlN) has the same physical properties as that of alumina, and is widely used because it is superior to alumina in thermal conductivity.

The physical properties of the thermally conductive plastics according to the prior art and alumina, which is one of the high thermally conductive ceramics employed in the present invention, were compared. As shown in Table 1, alumina, which is a kind of high thermal conductivity ceramics adopted in the present invention, is relatively inferior in terms of density or insulation strength to thermally conductive plastics, but has high thermal conductivity, coefficient of thermal expansion, specific heat, and maximum operating temperature. In terms of thermal and insulating properties, it exhibits significantly higher physical properties than thermally conductive plastics.

In particular, the package housing (1, 2) in the field of high power light emitting diode package applied to the present invention, because the electrical conductivity and thermal properties such as the thermal conductivity, the maximum operating temperature is required rather than the mechanical properties such as strength and weight, high thermal conductivity If ceramics are applied to the package housings 1 and 2, remarkable heat dissipation effect can be obtained rather than thermally conductive plastics.

Accordingly, the first and second package housings 1 and 2 of the present invention are made of a material of a conventional thermally conductive plastic or a thermally thermally conductive ceramic, and the thermally conductive plastic is manufactured as an injection molding process, and is made of a high thermally conductive ceramic. In this case, it is manufactured as a general process of molding and then sintering ceramic powder in a predetermined form.

Among the manufactured package housings 1 and 2, rectangular heat transfer slugs 3a and 3b and lead frames 5a and 5b and second connection terminals 4a and 4b are integrally formed in the second package housing 2. Insert is mounted.

That is, in the case of the heat transfer slugs 3a and 3b, a pair of heat transfer slugs 3a and 3b is inserted into and mounted in the rectangular slug seating spaces 6a and 6b formed in the second package housing 2. The pair of heat transfer slugs 3a and 3b are electrically insulated and fixed by the slug border 9 formed at the center of the second package housing 2 and the slug seating jaws 10a and 10b integrally formed therewith. . In addition, the pair of heat transfer slugs 3a and 3b mounted on the second package housing 2 are completely opened from the bottom surface of the second package housing 2 so that the LED chip is mounted on the substrate in a later process. It is to dissipate heat generated from.

In addition, lead frames 5a and 5b and connecting terminals 4a and 4b formed integrally therewith are fixed to respective seating grooves on both outer surfaces of the second package housing 2 of the present invention. 5b) is fixed to the frame seating grooves 8a and 8b formed on the outer surface, and the connecting terminals 4a and 4b are fixed to the terminal seating grooves 8a and 8b.

As described above, the rectangular heat transfer slugs 3a and 3b, the lead frames 5a and 5b and the connection terminals 4a and 4b are inserted into the second package housing 2 and then the first package housing 1 ) Will be covered on top of it. The first package housing 1 covered on the upper part is fixed to the second package housing 2 by a force-fitting or adhesive attachment method so that the heat transfer slugs 3a and 3b, the lead frames 5a and 5b, and the connection terminal ( The fixing jaw 12 formed in the first package housing 1 is fixed to 4a and 4b, and the second package housing 2 and the heat transfer slugs 3a and 3b fixed thereto and the lead frame 5a, 5b) and the connection terminals 4a and 4b are tightly fixed.

The first package housing 1 is a hollow hollow rectangle having a central portion, and the inner wall of the central space portion is formed with an inclined surface 14 to improve the luminous efficiency of light emitted from the LED chip to be mounted later.

In addition, the first package housing (1) in the fixing groove (11a, 11b) formed in the connecting terminals (4a, 4b) when the first package housing 1 is inserted and fixed to the second package housing (2) as described above The protrusion (13 in FIG. 5) formed in the fixing jaw 12 of 1) is inserted and fixed so that the position of the connecting terminals 4a and 4b is fixed in position so as not to shift.

5 is a front cross-sectional view, a longitudinal cross-sectional view and a side cross-sectional view showing a high power light emitting diode package according to the present invention.

The high power light emitting diode package according to the present invention assembled in the manner described above is shown in the cross-sectional shape as shown in FIG. That is, as shown in Figure 5 (a), each of the heat transfer slug (3a, 3b), the lead frame (5a, 5b) and the first package housing 1 is inserted into the second package housing (2) and The connecting terminals 4a and 4b are fixed by the fixing jaw 12 formed in the first package housing 1, and the heat transfer slugs 3a and 3b are electrically maintained by the slug boundary 9. Will be.

In addition, as shown in (b) and (c) of Figure 5, the connecting terminal (4a, 4b) of the present invention is a projection 13 formed in the lower portion of the first package housing 1, the connecting terminal (4a, Inserted into the fixing grooves (11a, 11b) formed in the 4b) to secure the connection terminals (4a, 4b) and the lead frame (5a, 5b) firmly in place, the lower portion of the lead frame (5a, 5b) 2 is packaged in a form that is completely open at the lower surface of the package housing (2) is mounted in a post-process to receive power.

FIG. 6 is a plan view of an LED chip mounted on a high power light emitting diode package according to the present invention, FIG. 7 is a plan view of an LED chip mounted on another embodiment of a high power light emitting diode package according to the present invention, and FIG. The molding material is molded in the high power light emitting diode package according to the cross-sectional view.

The LED chips 20 to 23 are mounted on the high output light emitting diode package according to the present invention assembled as described above. That is, as shown in Figure 6, the LED chip 20 is fixed to the upper surface of the assembled heat transfer slug (3a, 3b), and the polarity connection so as to energize the bonding wires (30, 31, 32).

As shown in FIG. 6A, one LED chip 20 may be polarized, and as shown in FIG. 6B, one or more LED chips 20 to 23 may be bonded wires 33 to 37. It can be connected to the polarity so as to be energized, and the number of the connection of the LED chip (20 ~ 23) can be adjusted according to the environment in which the high power light emitting diode package is applied.

In addition, the zener diode 25 may be mounted to protect the LED chips 20 to 23 when static electricity or a sudden current is supplied. That is, the Zener diode 25 is a semiconductor device using a phenomenon in which when a large reverse voltage is applied to a semiconductor pn junction or an np junction, a large current starts to flow at a certain voltage and the voltage is kept constant. As applied to the LED package, it is possible to maintain a constant voltage even when static electricity or a rapid current is supplied, thereby increasing the reliability of the product. It is important to bond these zener diodes 25 so that the length of the bonding wire 38 is short.

On the other hand, the present invention has been shown while the above-described configuration, the central space portion of the first package housing 1 is shown in the form of a rectangular shape, in another embodiment of the present invention, as shown in FIG. The central space portion may be processed into a shape. That is, as shown in (a) of FIG. 7, the inner space may be formed in a perfect circle shape or an ellipse shape, and as shown in (b) of FIG. 7, a portion where a pair of circles overlap each other. It can be formed in a shape that contacts. The shape of the central space can be arbitrarily changed, and for more directed light emission, it is preferable to form a circular internal space rather than a rectangular shape.

Meanwhile, in order to protect the LED chips 20 to 23 electrically bonded to the upper surfaces of the heat transfer slugs 3a and 3b and electrically connected to each other, as shown in FIG. Molding).

That is, the light emitting diode package according to the present invention may be protected by covering the light emitting lens 107 to protect the mounted LED chips 20 to 23, or by covering the light emitting lens 107 and protecting the LED chip 20. For the protection of ˜23, the upper surface of the light emitting diode package may be molded as the molding material 40 made of silicon. In addition, the light emitting lens 107 may be removed and the upper surface of the light emitting diode package may be protected by the molding material 40.

In addition, the LED chips 20 to 23 mounted with the molding material 40 of silicon are first molded, and then the second molding is performed again with the molding material 41 of epoxy resin on the upper surface of the LED. The protection of the chips 20-23 and the bonding wires 30-37 was made.

Therefore, in the construction of the high power light emitting diode package, when the light emitting lens 107 is removed, molding is performed using only the molding materials 40 and 41 to obtain a side effect of improving productivity due to the simplification of parts and the simplification of the process. Can be.

As described above, the present invention has the effect that by applying a high thermal conductivity ceramics or a thermally conductive plastic as the package housing material to effectively dissipate heat emitted from the LED chip, it is possible to provide a high output light emitting diode package having excellent light emission characteristics. In addition, there is an effect that the shape of the package housing corresponds to the space portion of the device to be mounted, so that, for example, an LED package mounting portion such as an LCD device can be easily applied to a narrow or specific shape space portion.

Claims (10)

In the high power light emitting diode package, A first package housing made of high thermal conductivity ceramics or thermally conductive plastic and having an inner space; A second package housing made of the same material as the first package housing and inserted into an inner space of the first package housing; At least one heat transfer slug which is a conductive material and is electrically disconnected and inserted into an inner space of the second package housing; A pair of lead frames fixed between the first package housing and the second package housing; At least one LED chip bonded to the upper surface of the heat transfer slug and electrically connected to the lead frame through the heat transfer slug, The second package housing is integrally formed with a slug boundary for electrically disconnecting each heat transfer slug, and is divided by the slug boundary so that a slug seating space for allowing each heat transfer slug to be seated is formed. High power LED package with improved heat dissipation efficiency. The high power light emitting diode package having improved heat dissipation efficiency of claim 1, wherein the first package housing has a rectangular shape. The high output light emitting diode package having improved heat dissipation efficiency according to claim 2, wherein the high thermal conductivity ceramic is any one selected from alumina (Al ₂ O ₃ ), silicon carbide (SiC), and aluminum nitride (AlN). The high output light emission of claim 1, wherein the first package housing has an inner space formed in one of a shape selected from a quadrangular shape, a circular shape, an ellipse shape, and a bilateral shape. Diode package. The high output light emitting diode package having improved heat dissipation efficiency according to claim 1, further comprising a zener diode mounted on the heat transfer slug and polarly connected to a connection terminal of the lead frame. The LED package of claim 1, wherein the LED chip bonded to the top surface of the heat transfer slug and electrically connected to the polarizer is protected by a light emitting lens and / or a molding material. The LED package of claim 1, wherein the LED chip is molded by a molding material made of silicon and then molded again by an epoxy resin. The LED package of claim 1, wherein the LED chip bonded to the upper surface of the heat transfer slug and electrically connected to the polarizer is protected by a molding material and a light emitting lens. The slug seating jaw for mounting and fixing the heat transfer slug to the slug seating space in a state in which the lower portion of the second package housing is open is integrally formed in the slug boundary. High power LED package with improved heat dissipation efficiency. The room of claim 1, wherein the first package housing includes a fixing jaw for fixing the lead frame to each heat transfer slug that is covered by the second package housing and is inserted into the second package housing. High power LED package with improved thermal efficiency.

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