KR100560511B1 - Method of manufacturing for plasma display panel - Google Patents

Abstract

An address electrode and a dielectric layer are formed on the substrate, a paste is applied on the dielectric layer to form a partition base layer for forming a partition wall, and a DFR film including a sand blast film and a black film is laminated on the partition base layer, and optionally The DFR film is exposed and developed by using a mask having a pattern of, and sand blasting the partition base layer using the DFR film remaining on the partition base layer to convert the partition base layer into a partition having an arbitrary pattern. And removing the film for sand blast to form a black layer formed of the black film on the partition wall.

Bulkhead, black layer, DFR, sand blast, plasma, display

Description

Manufacturing method of plasma display panel {METHOD OF MANUFACTURING FOR PLASMA DISPLAY PANEL}

1 is a partially exploded perspective view illustrating a plasma display panel according to an exemplary embodiment of the present invention.

2, 3 and 5 to 9 are cross-sectional views illustrating a method of manufacturing a plasma display panel according to an embodiment of the present invention.

Figure 4 is a cross-sectional view showing a film for laminating for the contrast enhancement layer according to an embodiment of the present invention.

The present invention relates to a method of manufacturing a plasma display panel, and more particularly, to a method of manufacturing a black layer provided in a plasma display panel for improving contrast.

In recent years, a plasma display panel (PDP) has attracted attention as a high-definition large-screen, high-quality display device. This plasma display panel has various characteristics that can achieve natural gradation display, have good color reproducibility and responsiveness, and can be enlarged at a relatively low cost.

In a typical plasma display panel, two transparent glass substrates are disposed to face each other, and another glass substrate (hereinafter referred to as a back side glass substrate for convenience) is opposed to one glass substrate (hereinafter, for convenience, a front side glass substrate). On one side, a plurality of transparent electrodes having a stripe shape are formed in parallel with each other, and bus electrodes narrower in width than the transparent electrodes are formed along each longitudinal direction of the transparent electrodes. Each of these transparent electrodes and bus electrodes is covered with a transparent dielectric layer), and a transparent protective film made of magnesium oxide or the like is formed on the dielectric layer.

On the other hand, a plurality of stripe-shaped address electrodes disposed to be orthogonal to the transparent electrodes are formed on one side of the back side glass substrate facing the front side glass substrate, and these address electrodes are covered with a dielectric layer having high reflectance. On the dielectric layer, a plurality of partition walls are formed in parallel with the address electrodes, that is, in a stripe shape, and are located between the address electrodes. The partition cells form a discharge cell which is a gas discharge space. Inside these discharge cells, phosphors corresponding to the three primary colors R, G, and B (red, green, blue) are formed on both inner wall light dielectric layers of the partition wall.

In such a plasma display panel, the two glass substrates are opposed to each other, and a mixed gas such as Ne-Xe, He-Xe, etc. is sealed inside each discharge cell, and the surroundings thereof are sealed with a seal glass or the like to provide one device. Will be constructed.

The transparent electrode is made of a transparent conductive material such as ITO (Indium Tin 0xide), SnO _2, etc., The bus electrode is provided to reduce the resistance of the transparent electrode having a high sheet resistance to improve its conductivity, the transparent electrode A material having a smaller sheet resistance, for example, a laminate of Ag, Cr-Cu-Cr, or the like is used.

In the plasma display panel, as the transparent electrode, the bus electrode, and the address electrode are each drawn out of the substrate and a voltage is selectively applied to a terminal connected thereto, the plasma display panel selectively generates a discharge in the discharge cell, thereby discharging the discharge. Thus, visible light generated by excitation from the phosphor in the discharge cell is displayed on the outside.

In the plasma display panel having such a structure, conventionally, a black layer is provided on the plasma display panel to improve the contrast of the plasma display panel. When the black layer is formed on the front glass substrate, the discharge sustain electrode It is arrange | positioned between these, and when formed in the back side glass substrate, it is arrange | positioned between discharge cells.

For example, when the black layer is formed between the discharge cells of the rear side glass substrate, the black layer may be formed on the top surface of the partition wall forming the discharge cell. That is, this black layer can be formed by forming an address electrode, a dielectric layer, a partition, and a fluorescent layer on the back side glass substrate, and then apply | coating paste for a black layer on the upper surface of a partition.

In the related art, the black layer is formed by printing a paste for the black layer on the upper surface of the partition wall by using a screen mask or by coating a coater and drying it two to three times.

However, in such a black layer forming process, a printing press or a coater necessary for the process is required separately, thereby increasing the manufacturing cost, and after forming a partition on the back side glass substrate, a black layer must be formed separately. There is a concern that work productivity may be lowered due to work defects caused by process progress.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing a plasma display, which allows a black layer formed on a partition wall to improve contrast using a simple and existing process step. have.

Accordingly, the manufacturing method of the plasma display panel according to the present invention

An address electrode and a dielectric layer are formed on the substrate, a paste is applied on the dielectric layer to form a partition base layer for forming a partition wall, and a DFR film including a sand blast film and a black film is laminated on the partition base layer, and optionally The DFR film is exposed and developed by using a mask having a pattern of, and sand blasting the partition base layer using the DFR film remaining on the partition base layer to convert the partition base layer into a partition having an arbitrary pattern. And removing the film for sand blast to form a black layer formed of the black film on the partition wall.

In the above process, the partition base layer may be formed by a printing method or a coating method by a coater.

The DFR film includes a cover film formed on the sand blast film, and when the thickness of the black film is t ₁ and the cover film is t ₂ , the DFR film satisfies the following conditions. do.

_{t 2/2 ≤ t 1 ≤} t 2 × 3

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a partially exploded perspective view showing a plasma display panel according to the present invention.

As shown in the drawing, the plasma display panel has a structure in which two transparent glass substrates 20 and 22 are disposed to face each other and an image can be realized by a discharge mechanism therebetween.

Looking at the configuration thereof, first, the discharge sustaining electrode 24 is formed on the first substrate 20 as the front substrate, and the address electrode 26 is formed on the second substrate 22 as the rear substrate.

In addition, a partition wall 30 is formed between the first substrate 20 and the second substrate 22 so that a plurality of discharge cells 28, which are discharge regions, are formed, and R is discharged into the discharge cells 28. A fluorescent layer 32 composed of, G, B phosphors is disposed.

A dielectric layer 34 is formed on the first substrate 20 over the discharge sustaining electrode 24 while covering the discharge sustaining electrode 24, and a protective layer 36 is applied on the dielectric layer 34. Another dielectric layer 38 is formed on the second substrate 22 to cover the address electrode 26 between the address electrode 26 and the partition wall 30. The fluorescent layer 32 is formed on the side surface of the partition wall 30 and the top surface of the dielectric layer 38 into the discharge cell 28.

In the above configuration, the barrier rib 30 is formed in a stripe shape extending in one direction of the second substrate 22, and the address electrode 26 is also formed in a stripe shape like the barrier rib 30. It has a structure that is arranged parallel to the partition wall 30 between the partition wall 30. In the present invention, the structure of the partition wall 30 and the address electrode 26 is just one example, and the configuration thereof is not necessarily limited thereto. For example, the partition wall 30 may form a discharge cell even in a grid-type closed structure, or may be provided in a structure in which a discharge cell and a non-discharge area may be mixed to form a cell.

The discharge sustaining electrode 24 is disposed on the first substrate 20 in a substantially orthogonal state to the address electrode 26, wherein the discharge sustaining electrode 24 is a transparent electrode (such as ITO). 24a) and a opaque bus electrode 24b made of metal.

The transparent electrode 24a has a pair of electrode structures arranged in a state in which one discharge cell 28 faces each other, and the bus electrodes 24b are electrically connected to the transparent electrodes 24a, respectively. The structure is arranged in a state orthogonal to the address electrode 26.

On the other hand, the black layer 40 is formed on the upper surface of the partition wall 30 having a predetermined thickness according to the pattern of the partition wall 30. Here, the black layer 40 is disposed on the non-light emitting area of the plasma display panel to improve the contrast characteristics of the plasma display panel. In the present invention, the black layer 40 includes the following process steps. Manufactured through.

2, 3 and 5 to 9 are reference views for a manufacturing method for forming the black layer 40 in accordance with the present invention.

First, after the dielectric layer 38 is formed on the second substrate 22 together with the address electrode (not shown), as shown in FIG. 2, the dielectric layer 38 is formed on the second substrate 22, as shown in FIG. 3. A partition base layer 42 having a thickness considering the height of the partition 30 to be formed is formed.

Here, the partition base layer 42 may be formed by printing a plurality (7 to 8 times or more) of the paste for forming the partition 30 as a printing method and drying the entire surface, and coating and drying the coater as a coater. It may be formed by.

Next, a process of laminating a DFR (Dry Film Resist) film 44 (see FIG. 4) according to the present invention is performed on the partition base layer 42. As shown in FIG. 4, the DFR film 44 is formed by stacking the black film 44b and the sand blast film 44c on the base film 44a, and the cover film 44d on the top thereof. It is arranged and configured.

In the structure of the DFR film 44, the black film 44b is a portion which will form the black layer 40 through a subsequent process, and each film maintains the following relationship so that the final DFR film 44 Is preferably configured.

_{t 2/2 ≤ t 1 ≤} t 2 × 3

In the above formula, t ₁ represents the thickness of the black film, t ₂ represents the thickness of the cover film.

When this DFR film 44 is laminated onto the partition base layer 42, the base film 44a is removed from the DFR film 44 away from the black film 44b. Accordingly, the DFR film 44 is attached to the partition base layer 42 while the black film 44b is in contact with each other, and the reinforcing method performed at this time is performed by a conventional method (see FIG. 5).

When the process is completed, the cover film 44d is separated from the sand blast film 44c, and then the black film 44b and the sand blast film 44c remaining on the partition base layer 42 are separated. Exposure and development processes are carried out. To this end, a mask 46 having a predetermined hole pattern is formed on both films 44b and 44c to form a partition wall (see FIG. 6).

When the sand blast film 44c is left on the partition base layer 42 together with the black film 44b while maintaining a predetermined pattern, the sand blast process is performed on the partition base layer 42. This is done (see FIG. 7), whereby the partition base layer 42 can be formed as the partition 30 (see FIG. 8).

In this case, as shown in FIG. 8, the sand blast film 44c is left together with the black film 44b on the upper surface of the partition wall 30. In the subsequent step, the sand blast film 44c ) Is peeled off and removed from the black film 44b, thereby allowing the black film 44c to remain on the partition 30 to form the black layer 40.

As described above, in the present invention, the black layer can be easily formed through the same process of forming a partition wall using laminating and sand blasting methods using a DFR film.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, in the method of manufacturing a plasma display panel according to the present invention, the black layer disposed on the upper surface of the partition wall can be easily formed through the existing partition wall forming process, thereby easily forming the black layer for providing contrast. Has the advantage that it can.

This advantage can be improved in the production of the plasma display panel due to the simplification of the process, and because there is no need for a separate equipment to form a black layer it can also have an advantage in reducing the manufacturing cost accordingly.

Claims (4)

Forming an address electrode and a dielectric layer over the substrate; Applying a paste on the dielectric layer to form a partition base layer for forming a partition; Laminating a DFR film including a sand blast film and a black film on the partition base layer; Exposing and developing the DFR film using a mask having any pattern; Sand blasting the partition base layer using the DFR film remaining on the partition base layer to form the partition base layer as a partition having an arbitrary pattern; Removing the sand blast film to form a black layer consisting of the black film on the partition wall A method of manufacturing a plasma display panel comprising a step. The method of claim 1, A method of manufacturing a plasma display panel in which a partition base layer is formed by a printing method. The method of claim 1, A method of manufacturing a plasma display panel in which a partition base layer is formed by a coating method by a coater. The method of claim 1, The DFR film includes a cover film formed on the sand blast film, wherein when the thickness of the black film is t ₁ and the thickness of the cover film is t ₂ , the plasma display panel satisfies the following conditions. Way. _{t 2/2 ≤ t 1 ≤} t 2 × 3

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