KR100430990B1 - A polystyrene board have write-layer - Google Patents
A polystyrene board have write-layer Download PDFInfo
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- KR100430990B1 KR100430990B1 KR10-2002-0007739A KR20020007739A KR100430990B1 KR 100430990 B1 KR100430990 B1 KR 100430990B1 KR 20020007739 A KR20020007739 A KR 20020007739A KR 100430990 B1 KR100430990 B1 KR 100430990B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/408—Matt, dull surface
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- Laminated Bodies (AREA)
Abstract
본 발명은 필기층이 형성된 폴리스티렌판재에 관한 것으로, 더욱 상세하게는 폴리스티렌판재에 일측 또는 양측면에 접합층을 매개로 접합되는 필기층을 형성하여 폴리스티렌판재에 직접 필기가 가능하게 하며 재활용이 용이하게 함을 목적으로 한 것이다.The present invention relates to a polystyrene plate member having a writing layer, and more particularly, a writing layer bonded to one side or both sides of the polystyrene plate member through a bonding layer is formed to enable writing directly on the polystyrene plate member and facilitates recycling. It is for the purpose.
즉, 본 발명은 폴리스티렌판재(100)의 일측면에 접합층(2)을 매개로 접합되는 필기층(1)을 형성한 것이다.That is, the present invention is to form a writing layer (1) bonded to one side of the polystyrene plate material 100 via the bonding layer (2).
따라서, 본 발명은 폴리스티렌판재의 일측 또는 양측면에 접합층을 매개로 접합되는 필기층을 형성하므로서, 필기면의 필기층과 폴리스티렌판재가 합성수지재로 이루어져 습도의 변화등에 의한 변형이 발생되지 않으며, 열선절단시 그 절단이 용이하게 이루어지는 것이다.Therefore, the present invention forms a writing layer bonded to one side or both sides of the polystyrene plate material through the bonding layer, so that the writing layer of the writing surface and the polystyrene plate material are made of a synthetic resin material, and thus no deformation is caused by changes in humidity. When cutting, the cutting is made easily.
Description
본 발명은 필기층이 형성된 폴리스티렌판재에 관한 것으로, 더욱 상세하게는 폴리스티렌판재에 일측 또는 양측면에 접합층을 매개로 접합되는 필기층을 형성하여 폴리스티렌판재에 직접 필기가 가능하게 하며 재활용이 용이하게 함을 목적으로 한 것이다.The present invention relates to a polystyrene plate member having a writing layer, and more particularly, a writing layer bonded to one side or both sides of the polystyrene plate member through a bonding layer is formed to enable writing directly on the polystyrene plate member and facilitates recycling. It is for the purpose.
일반적으로, 일측면에 필기면을 형성하여 광고 또는 미술재료 및 브리핑 등에 사용할 수 있게한 폴리스티렌판재는 폴리스티렌시트의 일측면에 종이를 접착하여 광고 또는 미술재료 및 브리핑용으로 사용시 일측 또는 양측면에 필기가 가능하도록 한 것이다.In general, a polystyrene sheet material having a writing surface on one side to be used for advertisements or art materials and briefings is adhered to paper on one side of the polystyrene sheet so that the writing surface can be used on one side or both sides when used for advertising or art materials and briefings. It was made possible.
상기한 바와 같이 폴리스티렌시트의 일측 또는 양측면에 접착되는 종이의 접합방법은 핫멜트(Hot melt) 등과 같은 접착제 또는 수성의 수지접착제를 이용하여 접합하거나, 종이와 폴리스틸렌시트를 200℃ 이상의 고열로 가열된 롤러등으로 고열 압착하여 접착하였다.As described above, the bonding method of the paper bonded to one side or both sides of the polystyrene sheet may be bonded using an adhesive such as hot melt or an aqueous resin adhesive, or the paper and the polystyrene sheet heated at a high temperature of 200 ° C. or higher. It was bonded by high-temperature pressing by the back.
그러나, 상기한 바와 같이 폴리스티렌시트의 일측 또는 양측면에 종이를 접착함에 있어서, 종이 일측면에 핫멜트 등과 같은 접착제를 사용하여 접착할 경우 고온에서 접착상태가 불완전해지는 문제점이 있었다.However, in bonding the paper to one side or both sides of the polystyrene sheet as described above, there is a problem that the adhesive state is incomplete at high temperatures when the adhesive is bonded to one side of the paper using an adhesive such as hot melt.
그리고, 수성의 접착제를 사용할경우에는 건조공정등이 부가되어 생산원가가 상승되는 등의 문제점이 있었다.In addition, when the water-based adhesive is used, there is a problem that a production process is increased due to a drying process or the like.
또한, 폴리스티렌시트의 일측면에 종이를 접착함에 있어서, 고열압착에 의하여 접착할 경우 고열압착 과정에 과다한 2 차발가 이루어져 표면강도가 저하되고 변형이 생겨서 그 사용이 제한되는 문제점이 있었다.In addition, in adhering the paper to one side of the polystyrene sheet, when the adhesive is bonded by high thermal compression, there is a problem in that the secondary shot is made excessively in the high thermal pressing process, thereby decreasing the surface strength and causing deformation, thereby limiting its use.
한편, 종이의 특성상 사용과정에 있어서 습도에 따른 종이의 수축 팽창에 따라 폴리스티렌판재의 뒤틀림 또는 오염등과 같은 변형이 발생되어 보관 등과 같은 유지관리 가 용이하지 않은 문제점이 있었다.On the other hand, due to the nature of the paper in the process of use, due to the shrinkage expansion of the paper due to humidity caused deformation such as warping or contamination of the polystyrene plate material, there was a problem that is not easy to maintain such as storage.
또한, 폴리스티렌판재의 재단과정에 있어 일측면의 접착된 종이로 인하여 열선절단 등과 같은 가공이 용이하지 않은 문제점이 있었다.In addition, in the cutting process of the polystyrene sheet material, there is a problem that processing such as hot wire cutting is not easy due to the bonded paper on one side.
이에, 본 발명은 상술한 문제점을 해결하기 위하여 창출한 것으로, 폴리스티렌판재의 일측면에 스틸렌계고무와 하이드로제네이티드 페트롤리움 레진 및 에틸렌비닐아세테이트로 이루어진 접합층을 매게로 접합되며 고밀도폴리에틸렌과 호모폴리프로필렌으로 이루어진 필기층을 형성한 것이다.Accordingly, the present invention has been made to solve the above-mentioned problems, the bonding layer consisting of styrene rubber, hydrogenerated petroleum resin and ethylene vinyl acetate on one side of the polystyrene sheet material is bonded with a high density polyethylene and homopoly A writing layer made of propylene was formed.
도 1 은 본 발명에 따른 일 실시예를 보인 사시도.1 is a perspective view showing an embodiment according to the present invention.
도 2 는 본 발명에 따른 일 실시예를 보인 측 다면도.Figure 2 is a side side view showing an embodiment according to the present invention.
도 2 는 본 발명에 따른 다른 실시예를 보인 측 단면도.Figure 2 is a side cross-sectional view showing another embodiment according to the present invention.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
1 : 필기층 2 : 접합층 100 : 폴리스티렌판재DESCRIPTION OF SYMBOLS 1 Writing layer 2 Bonding layer 100 Polystyrene board material
이하, 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.Hereinafter, described in detail by the accompanying drawings as follows.
본 고안은 폴리스티렌판재에 직접 필기가 가능하게 하며 재활용이 용이하게 한 것으로, 폴리스티렌판재(100)의 일측 또는 양측면에 접합층(2)을 매개로 접합되는 필기층(1)을 형성한 것이다.The present invention enables direct writing on a polystyrene plate material and facilitates recycling, and forms a writing layer 1 bonded to one side or both sides of the polystyrene plate material 100 via a bonding layer 2.
여기서, 상기 필기층(1)은 베이스 수지를 이루며 상호간의 분자 결합력인 상용성에 의하여 필기가 가능한 무광의 거친면을 형성하는 고밀도 폴리에틸렌 및 호모폴리프로필렌과 버블 안정과 질감개선을 위한 코폴리머 폴리프로필렌 및 선형 저밀도 폴리에틸렌으로 배합조성한 것이다.Here, the writing layer (1) is made of a high-density polyethylene and homo-polypropylene forming a base resin and forming a matte rough surface that can be written by the compatibility of the mutual molecular bonding force, copolymer polypropylene for bubble stability and texture improvement and Formulated with linear low density polyethylene.
한편, 상기 필기층(1)을 배합 조성함에 있어서 배합 조성된 필기층(1)의 오염방지를 위하여 대전방지제와 통상적인 1차, 2차 산화방지제 및 브로킹방지제를 배합조성하여 형성하며, 상기 산화방지제는 0.1phr로 배합조성하고 열 안정제는 0.1phr으로 배합조성하여 실시함이 바람직한 것이다.On the other hand, in the formulation composition of the writing layer (1) in order to prevent the contamination of the composition of the writing layer (1) formulated by forming an antistatic agent and a conventional primary, secondary antioxidant and anti-broking agent in a formulation composition, Antioxidants are preferably formulated at 0.1 phr and heat stabilizers are formulated at 0.1 phr.
또한, 상기 필기층의 고밀도 폴리에틸렌은 30~60 중량%로 배합 조성하고, 호모폴리프로필렌은 30~60 중량%로 배합 조성하며, 코폴리머 폴리프로필렌은 15~30 중량%으로 배합 조성하고, 선형 저밀도 폴리에틸렌은 15~30 중량%로 배합조성하여 실시할 수 있는 것이다.In addition, the high-density polyethylene of the writing layer is 30 to 60% by weight blended composition, homopolypropylene is 30 to 60% by weight blended, copolymer polypropylene is 15 to 30% by weight blended composition, linear low density Polyethylene can be carried out by blending composition at 15 to 30% by weight.
또한, 상기 필기층을 배합 조성하는 고밀도 폴리에틸렌과 호모폴리프로필렌은 상호간의 분자 결합력을 나타내는 상용성을 최소화하기 위하여 고밀도 폴리에틸렌은 유동성을 나타내는 MI가 0.2 이하인 것을 사용하고, 호모폴리프로필렌는 MI가 10 이상인 것을 사용하며, 두 수지간의 함량은 무광택효과를위해 동일하게 배합조성하여 실시함이 바람직한 것이다.In addition, in order to minimize the compatibility of the high-density polyethylene and homopolypropylene composition composition of the writing layer, the high-density polyethylene is used to have a fluid MI of 0.2 or less, and the homopolypropylene has a MI of 10 or more To use, the content between the two resins is preferably carried out by the same formulation composition for the matte effect.
그리고, 상기 접합층(2)은 폴리스티렌판재(100)와의 접착강도를 유지하는 스틸렌계고무와 조성물의 사용성이 증가되게하는 하이드로제네이티드 페트롤리움 레진과 실링성의 유지를 위한 에틸렌 아크릴릭 에시트 및 적절한 히트 실링(Heat Sealing) 온도의 유지를 위한 에틸렌 비닐 아세테이트로 배합조성한 것이다.In addition, the bonding layer (2) is a styrene-based petroleum resin for maintaining the adhesive strength with the polystyrene sheet 100 and the hydrophobized petroleum resin for maintaining the use of the composition and ethylene acrylic esheet for maintaining the sealing property and appropriate heat Formulated with ethylene vinyl acetate to maintain the sealing temperature.
한편, 상기 접합층(2)의 스틸렌계고무는 30~60 중량%로 배합 조성하고, 하이드로제네이티드 페트롤리움 레진은 5~20 중량%로 배합 조성하며, 에틸렌 아크릴릭 에시트는 15~45 중량%로 배합 조성하고, 에틸렌 비닐 아세테이트 10~40 중량%로 배합 조성하되, 상기 에틸렌 아크릴릭 에시트는 아크릴릭 에시드의 함량이 11 중량% 이상으로 배합 조성된 것을 사용하고, 에틸렌 비닐 아세테이트는 비닐아세테이트 함량이 9 중량% 이상으로 배합 조성된 것을 사용하여 실시함이 바람직하며, 소정량의 산화방지제와 열 안정제를 배합 조성하여 실시할 수 있는 것이다.On the other hand, the styrene-based rubber of the bonding layer (2) is 30 to 60% by weight of the composition, the hydrogenated petroleum resin is 5 to 20% by weight of the composition, ethylene acrylic sheet is 15 to 45% by weight The ethylene vinyl acetate is used in a compounding composition of 10 to 40% by weight, wherein the ethylene acrylic acetate is used in an acrylic acid content of 11% by weight or more, and ethylene vinyl acetate has a vinyl acetate content of 9 It is preferable to carry out using what was mix | blended in weight% or more, and can carry out by carrying out the compounding composition of a predetermined amount of antioxidant and a heat stabilizer.
또한, 상기한 바와 같이 접합층(2)을 배합 조성함에 있어서 스틸렌계고무는 그 함량이 30 중량% 이하가 되면 접착강도가 약해지게 되고 60 중량% 이상이 되면 제품의 압출성형시 흐름성을 저하시켜 작업성 및 속도에 영향을 미칠 우려가 있으므로 30~60 중량% 로 배합 조성하여 실시함이 바람직하며, 상기 하이드로제네이티드 페트롤리움 레진은 그 함량이 5 중량% 이하가 되면 상용성 증가에 전혀 도움이 되지 못하고 20 중량% 이상이 되면 경제적인 면에서 적절하지 못하므로 5~20 중량% 배합 조성함이 바람직한 것이다.In addition, in the composition of the bonding layer 2 as described above, when the content of the styrene-based rubber is 30% by weight or less, the adhesive strength is weakened, and when the content is 60% by weight or more, the flowability during extrusion of the product is decreased. Since it may affect the workability and speed, it is preferable to carry out the formulation composition at 30 to 60% by weight, and the hydrogenated petroleum resin may help increase the compatibility when the content is 5% by weight or less. If it does not become more than 20% by weight is not suitable in terms of economics it is preferable to formulate 5 to 20% by weight of the formulation.
또한, 에틸렌 아크릴릭 에시트는 아크릴릭 에시트함량의 11 중량% 이하인 것을 사용하게 되면 핫 텍크(Hot Tack)가 약해져 실링(Sealing)성이 저하되므로 11 중량% 이상의 것을 사용하는 것이 바람직하고, 접합층을 배합 조성함에 있어 상기 에틸렌 아크릴릭 에시트의 전체 함량이 15 중량% 이하일 때는 접착강도가 약해지며 45 중량% 이상일 때는 구성물들간의 상용성을 저하시켜 구성물들의 고유특성을 유지할 수 없게 되며 경제적인 면에서도 적절치 못하므로 15~45 중량%로 배합 조성함이 바람직하다.In addition, when ethylene acrylic sheet is used in an amount of 11% by weight or less of the acrylic sheet content, hot tack is weakened and sealing property is lowered, so it is preferable to use 11% by weight or more. In the formulation, when the total content of the ethylene acrylic sheet is 15 wt% or less, the adhesive strength becomes weak, and when it is 45 wt% or more, the compatibility between the components is lowered, so that the intrinsic properties of the components cannot be maintained. Since it is not possible to mix the composition to 15 to 45% by weight.
또한, 상기 에틸렌 비닐 아세테이트는 비닐아세테이트함량이 9 중량% 미만인 것을 사용할 경우에는 에틸렌 비닐 아세테이트 특성이 저밀도폴리에틸렌의 특성에 가까워져 가열 실링(Heat Sealing)온도도 상승하게 되므로 9 중량% 이상의 것이 바람직 하며, 접합층을 배합조성하는 에틸렌 비닐 아세테이트는 10 중량% 미만일 경우에는 접착강도가 약해지고 가열 실링(Heat Sealing) 온도도 상승하게 되며 40 중량%이상일 때는 구성물 경도가 저하되며 압출성형 후 절단시 작업성을 저하시키므로 10~40 중량%으로 배합 조성함이 바람직 한 것이다.In addition, when ethylene vinyl acetate has a vinyl acetate content of less than 9% by weight, the ethylene vinyl acetate property is closer to that of the low density polyethylene, so that the heat sealing temperature is also increased. When the ethylene vinyl acetate compounding the layer is less than 10% by weight, the adhesive strength is weak and the heat sealing temperature is increased, and when the weight is over 40% by weight, the composition hardness is lowered and the workability during cutting after extrusion molding is lowered. It is preferable to formulate a compounding composition of 10 to 40% by weight.
이하, 본 발명의 제조과정에 대하여 설명하면 다음과 같다.Hereinafter, the manufacturing process of the present invention will be described.
상기한 바와 같이 폴리스티렌판재(100)의 일측면에 접합층(2)을 매개로 접합되며 표면에 분자간의 상호결합력인 상용성에 의하여 필기면을 형성하는 필기층(1)을 형성한 본 발명의 제조는 스틸렌계고무와 에틸렌 비닐 아세테이트, 하이드로제네이티드 페트롤리움 레진, 에틸렌 아크릴릭 에시트 및 통상의 첨가제를 밤바리믹서에서 용융혼합한 후 혼련된 접합층(2) 수지조성물을 펠렛화 하고, 호모폴리프로필렌과 코폴리머폴리프로필렌, 고밀도 폴리에틸렌, 선형 저밀도 폴리에틸렌, 대전방지제 및 통상의 첨가제를 밤바리믹서에서 용융혼합한 후 혼련된 필기층(1) 수지조성물을 펠렛화 한다.Production of the present invention in which the writing layer 1 is bonded to one side of the polystyrene plate material 100 through the bonding layer 2 as described above, and the writing layer 1 is formed on the surface to form a writing surface by compatibility between molecules. Is a mixture of styrene-based rubber, ethylene vinyl acetate, hydrogenated petroleum resin, ethylene acrylic sheet and ordinary additives in a balm mixer, followed by pelletizing the kneaded bonding layer (2) resin composition and homopolypropylene. And copolymerized polypropylene, high density polyethylene, linear low density polyethylene, antistatic agent, and conventional additives in a balm mixer, and pelletized the kneaded writing layer (1) resin composition.
이상과 같이 펠렛화된 상기 필기층 수지조성물과 접합층 수지 조성물을 각각 서로 다른 층을 구성하는 호퍼에 투입하여 압출가공에 의한 통상의 필름 성형장치 및 성형방법에 준하여 필름을 성형하게 되는데, 원형다이에 의한 인플레이션 성형, 티-다이에 의한 티-다이 압출성형 중 적정한 방법을 선택하여서 복층으로 압출하여 제조하는 것이다.The pelletized writing resin composition and the bonding layer resin composition pelletized as described above are put into a hopper constituting different layers, respectively, and the film is molded according to a conventional film forming apparatus and a molding method by extrusion processing. It is produced by extruding into multiple layers by selecting an appropriate method among inflation molding by and die-die extrusion by tee-die.
상기한 바와 같이 이면에 접합층(2)이 형성된 필기층(1) 시트를 폴리스티렌판재(100)에 가열된 로울러에 의하여 가열접합하므로서 일측 또는 양측면에 필기면이 형성된 폴리스티렌판재(100)의 제조가 완료되는 것이다.As described above, the sheet of the writing layer 1 having the bonding layer 2 formed on the back surface is heat-bonded by a roller heated to the polystyrene plate 100 so that the production of the polystyrene sheet 100 having the writing surface formed on one or both sides thereof is possible. It's done.
한편, 본 발명의 다른 제조방법으로는 필기층(1) 수지조성물을 통상의 필름 성형장치에 의하여 성형한 후 폴리스티렌판재(100)의 일측면에 가열 접합하는 과정에 있어 상기 필기층(1) 필름과 폴리스티렌판재(100) 중 일측에 접합층(2) 수지 조성물을 티-다이 등과 같은 압출코팅장치로 압출코팅하여 접합하므로서 일측 또는 양측면에 필기면이 형성된 폴리스티렌판재(100)의 제조가 완료되는 것이다.On the other hand, according to another manufacturing method of the present invention, the writing layer (1) film in the process of heat-bonding to one side of the polystyrene plate member 100 after molding the resin composition by a conventional film forming apparatus And the polystyrene plate member 100 is completed by manufacturing the polystyrene plate member 100 having a writing surface formed on one side or both sides by extrusion coating the bonding layer (2) resin composition to one side by extrusion coating device such as a tee-die. .
따라서, 본 발명은 폴리스티렌판재의 일측 또는 양측면에 접합층을 매개로 접합되는 필기층을 형성하므로서, 필기면의 필기층과 폴리스티렌판재가 합성수지재로 이루어져 수분을 흡수하는 종이류와는 달리 습도의 변화등에 의한 변형이 발생되지 않으며, 열선절단시 그 절단이 용이하게 이루어지는 것이다.Therefore, the present invention forms a writing layer which is bonded to one side or both sides of the polystyrene plate material through the bonding layer, and thus, the writing layer and the polystyrene plate material of the writing surface are made of synthetic resin material, and thus, unlike papers that absorb moisture, such as changes in humidity. Deformation is not caused by, and the cutting is easily made when cutting the hot wire.
또한, 필기층과 폴리스티렌판재가 합성수지의 재질로 이루어져 있어 재활용이 가능한 매우 유용한 것이다.In addition, since the writing layer and the polystyrene plate material is made of a synthetic resin material, it is very useful for recycling.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0007739A KR100430990B1 (en) | 2002-02-09 | 2002-02-09 | A polystyrene board have write-layer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0007739A KR100430990B1 (en) | 2002-02-09 | 2002-02-09 | A polystyrene board have write-layer |
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| KR20030067970A KR20030067970A (en) | 2003-08-19 |
| KR100430990B1 true KR100430990B1 (en) | 2004-05-12 |
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| KR20030067968A (en) * | 2002-02-09 | 2003-08-19 | 주식회사 오광 | A film for polystyrene sheet coating |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6216120A (en) * | 1985-07-15 | 1987-01-24 | Tomoegawa Paper Co Ltd | Manufacture of writing sheet |
| EP0312289A1 (en) * | 1987-10-12 | 1989-04-19 | COURTAULDS FILMS & PACKAGING (HOLDINGS) LTD. | Polymeric films |
| WO1990011183A1 (en) * | 1989-03-28 | 1990-10-04 | Write Again, Inc. | Re-usable writing material |
| JPH04353585A (en) * | 1991-05-31 | 1992-12-08 | Kanzaki Paper Mfg Co Ltd | Easily writable tacky adhesive sheet |
| JPH09175085A (en) * | 1995-12-27 | 1997-07-08 | Chiyoda Container- Kk | White board |
-
2002
- 2002-02-09 KR KR10-2002-0007739A patent/KR100430990B1/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6216120A (en) * | 1985-07-15 | 1987-01-24 | Tomoegawa Paper Co Ltd | Manufacture of writing sheet |
| EP0312289A1 (en) * | 1987-10-12 | 1989-04-19 | COURTAULDS FILMS & PACKAGING (HOLDINGS) LTD. | Polymeric films |
| WO1990011183A1 (en) * | 1989-03-28 | 1990-10-04 | Write Again, Inc. | Re-usable writing material |
| JPH04353585A (en) * | 1991-05-31 | 1992-12-08 | Kanzaki Paper Mfg Co Ltd | Easily writable tacky adhesive sheet |
| JPH09175085A (en) * | 1995-12-27 | 1997-07-08 | Chiyoda Container- Kk | White board |
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