JPS647645A - Semiconductor device and manufacture thereof - Google Patents
Semiconductor device and manufacture thereofInfo
- Publication number
- JPS647645A JPS647645A JP16133187A JP16133187A JPS647645A JP S647645 A JPS647645 A JP S647645A JP 16133187 A JP16133187 A JP 16133187A JP 16133187 A JP16133187 A JP 16133187A JP S647645 A JPS647645 A JP S647645A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- sections
- lead
- chip
- protruding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To shorten a distance between the end of an LSI chip and the end of a package and to house a large chip into the package in small width while reducing thermal stress by forming a protruding section at the nose of a lead, connecting the protruding section and a pad section with conductive paste and sealing the lead and the chip with a resin. CONSTITUTION:A plurality of bonding pad sections 8 for an LSI chip 2 are disposed onto a chip 2 while protruding sections 7 are shaped at the noses of a lead 1 corresponding to each pad section 8, the protruding sections 7 from the lead 1 and said pad sections 8 are connected electrically with conductive paste 11, and these sections are sealed 5 with a resin. Bonding pad rows A, B in the LSI chip 2 are respectively localized and arranged oppositely to both end sections of the chip 2 while the protruding sections 7 are shaped at the noses of the lead 1 corresponding to each pad 8 in said pad rows A, B, and the protruding sections 7 in the lead 1 and the pads 8 are connected electrically with soft conductive paste 11. The pad rows A, B are disposed so that the pad rows A, B and both pin rows of a dual-in-line package are crossed at right angles, and sealed 5 with the resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62161331A JPH0775253B2 (en) | 1987-06-30 | 1987-06-30 | Semiconductor device and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62161331A JPH0775253B2 (en) | 1987-06-30 | 1987-06-30 | Semiconductor device and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS647645A true JPS647645A (en) | 1989-01-11 |
JPH0775253B2 JPH0775253B2 (en) | 1995-08-09 |
Family
ID=15733052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62161331A Expired - Lifetime JPH0775253B2 (en) | 1987-06-30 | 1987-06-30 | Semiconductor device and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0775253B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04124864A (en) * | 1990-09-14 | 1992-04-24 | Matsushita Electric Works Ltd | Lead frame |
EP0508462A2 (en) * | 1991-04-12 | 1992-10-14 | Texas Instruments Incorporated | Microelectronic device incorporating an improved packaging scheme |
EP0712159A3 (en) * | 1994-11-08 | 1997-03-26 | Oki Electric Ind Co Ltd | Structure of resin molded type semiconductor |
JP2003023133A (en) * | 2001-07-06 | 2003-01-24 | Matsushita Electric Ind Co Ltd | Lead frame, plastic molded type semiconductor device using the same and its manufacturing method |
JP2006186229A (en) * | 2004-12-28 | 2006-07-13 | Mitsui High Tec Inc | Lead frame and semiconductor apparatus using the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5542354U (en) * | 1978-09-13 | 1980-03-18 | ||
JPS5577164A (en) * | 1978-12-07 | 1980-06-10 | Nec Corp | Semiconductor device |
JPS61258458A (en) * | 1985-05-13 | 1986-11-15 | Hitachi Ltd | Resin-sealed ic |
-
1987
- 1987-06-30 JP JP62161331A patent/JPH0775253B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5542354U (en) * | 1978-09-13 | 1980-03-18 | ||
JPS5577164A (en) * | 1978-12-07 | 1980-06-10 | Nec Corp | Semiconductor device |
JPS61258458A (en) * | 1985-05-13 | 1986-11-15 | Hitachi Ltd | Resin-sealed ic |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04124864A (en) * | 1990-09-14 | 1992-04-24 | Matsushita Electric Works Ltd | Lead frame |
EP0508462A2 (en) * | 1991-04-12 | 1992-10-14 | Texas Instruments Incorporated | Microelectronic device incorporating an improved packaging scheme |
EP0712159A3 (en) * | 1994-11-08 | 1997-03-26 | Oki Electric Ind Co Ltd | Structure of resin molded type semiconductor |
US6002181A (en) * | 1994-11-08 | 1999-12-14 | Oki Electric Industry Co., Ltd. | Structure of resin molded type semiconductor device with embedded thermal dissipator |
JP2003023133A (en) * | 2001-07-06 | 2003-01-24 | Matsushita Electric Ind Co Ltd | Lead frame, plastic molded type semiconductor device using the same and its manufacturing method |
JP2006186229A (en) * | 2004-12-28 | 2006-07-13 | Mitsui High Tec Inc | Lead frame and semiconductor apparatus using the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0775253B2 (en) | 1995-08-09 |
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