JPS6469022A - Wireless bonding structure of chip-shaped electronic part - Google Patents

Wireless bonding structure of chip-shaped electronic part

Info

Publication number
JPS6469022A
JPS6469022A JP22737687A JP22737687A JPS6469022A JP S6469022 A JPS6469022 A JP S6469022A JP 22737687 A JP22737687 A JP 22737687A JP 22737687 A JP22737687 A JP 22737687A JP S6469022 A JPS6469022 A JP S6469022A
Authority
JP
Japan
Prior art keywords
bumps
transferred
leads
film
onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22737687A
Other languages
Japanese (ja)
Other versions
JPH054818B2 (en
Inventor
Minoru Hirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP22737687A priority Critical patent/JPS6469022A/en
Publication of JPS6469022A publication Critical patent/JPS6469022A/en
Publication of JPH054818B2 publication Critical patent/JPH054818B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Electronic Switches (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To increase bonding strength by composing a surface joining with an Al pad in a bump of a metallic material having the slow forming rate of an intermetallic compound with Al except Au and constituting a surface transferred onto an electrode surface in a wiring substrate of a metallic material having a low eutectic point with a metal in the electrode surface. CONSTITUTION:A transparent conductive film 42 consisting of ITO, in which Sn is doped into an In oxide, is formed onto the surface of a transparent glass plate 41, a photo-resist film is applied onto the surface of the film 42, and a mask 43 for plating is shaped through patterning. Opening sections in the mask are electroplated with Cu, and Cu bumps are formed. The surfaces of the Cu bumps are electroplated with Au. The resist film 43 is removed, thus shaping a bump substrate made up of the glass substrate 41, the transparent conductive film 42 and the bumps 2. Inner leads 3 are positioned with the bumps 2, and the bumps 2 are transferred to the leads 3. The bumps 2 transferred to the lower sections of the noses of the leads 3 and Al pads 11 for a semiconductor element 1 are positioned, and thermocompression-bonded. Accordingly, no intermetallic compound of Au and Al on joint surfaces among the pads and the bumps is formed, thus preventing the lowering of bonding strength.
JP22737687A 1987-09-10 1987-09-10 Wireless bonding structure of chip-shaped electronic part Granted JPS6469022A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22737687A JPS6469022A (en) 1987-09-10 1987-09-10 Wireless bonding structure of chip-shaped electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22737687A JPS6469022A (en) 1987-09-10 1987-09-10 Wireless bonding structure of chip-shaped electronic part

Publications (2)

Publication Number Publication Date
JPS6469022A true JPS6469022A (en) 1989-03-15
JPH054818B2 JPH054818B2 (en) 1993-01-20

Family

ID=16859839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22737687A Granted JPS6469022A (en) 1987-09-10 1987-09-10 Wireless bonding structure of chip-shaped electronic part

Country Status (1)

Country Link
JP (1) JPS6469022A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5383093A (en) * 1986-05-19 1995-01-17 Nippondenso Co., Ltd. Hybrid integrated circuit apparatus
JP2012228871A (en) * 2011-04-13 2012-11-22 Rohm Co Ltd Thermal head and method for manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead
JPS6458866A (en) * 1987-08-28 1989-03-06 Nippon Steel Corp Rodless cylinder

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead
JPS6458866A (en) * 1987-08-28 1989-03-06 Nippon Steel Corp Rodless cylinder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5383093A (en) * 1986-05-19 1995-01-17 Nippondenso Co., Ltd. Hybrid integrated circuit apparatus
JP2012228871A (en) * 2011-04-13 2012-11-22 Rohm Co Ltd Thermal head and method for manufacturing the same

Also Published As

Publication number Publication date
JPH054818B2 (en) 1993-01-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees