JPS63299883A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPS63299883A
JPS63299883A JP62131577A JP13157787A JPS63299883A JP S63299883 A JPS63299883 A JP S63299883A JP 62131577 A JP62131577 A JP 62131577A JP 13157787 A JP13157787 A JP 13157787A JP S63299883 A JPS63299883 A JP S63299883A
Authority
JP
Japan
Prior art keywords
laser
laser beam
beams
oscillator
oscillators
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62131577A
Other languages
Japanese (ja)
Inventor
Kimiharu Yasui
公治 安井
Masaaki Tanaka
正明 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62131577A priority Critical patent/JPS63299883A/en
Publication of JPS63299883A publication Critical patent/JPS63299883A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To improve the quality of laser beam by providing a plurality of laser beam oscillators linearly polarized in directions which do not run parallel with each other and arranging an optical system to superpose radiated laser beams. CONSTITUTION:There are provided laser beam oscillators 1, 4 having their respective linearly polarized elements 13, 14 and arranged a beam synthesized element 6 composed of beam slitters, etc. The laser beam 2 radiated from the laser beam oscillator 1 is a linearly polarized element 13, polarized in a direction shown by an arrow 11 and a beam 5 of the oscillator 4 is polarized by the element 14 in the direction of an arrow 12. Then, the polarized beams 2, 5 which do not run parallel with each other are synthesized by a synthesized optical element 6 into a beam 7 to machine a work 10. Since the beams 2, 5 do not interfere with each other, the superposed laser beam 9 becomes nearly similar in shape and stronger in strength. Accordingly, the quality laser beam is improved.

Description

【発明の詳細な説明】 本発明は、複数のレーザ発振器から出射されたレーザビ
ームを重畳して被加工物を加工するレーザ加工装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing apparatus that processes a workpiece by superimposing laser beams emitted from a plurality of laser oscillators.

［従来の技術］ 第８図は特開昭８０−２４４４９５号公報に開示された
従来のこの種レーザ加工装置の一例を示す断面図である
。図において、（１）は第１のレーザ発振器、（２）は
第１のレーザ発振器から出射されたレーザビーム、（３
）は反射鏡、（４）は第２のレーザ発振器、（５）は第
２のレーザ発振器より出射したレーザビーム、（Ｂ）は
例えばビームスプリッタの如きビーム合成光学素子、（
７）はレーザビーム（２）。[Prior Art] FIG. 8 is a sectional view showing an example of a conventional laser processing apparatus of this type disclosed in Japanese Patent Laid-Open No. 80-244495. In the figure, (1) is the first laser oscillator, (2) is the laser beam emitted from the first laser oscillator, and (3) is the laser beam emitted from the first laser oscillator.
) is a reflecting mirror, (4) is a second laser oscillator, (5) is a laser beam emitted from the second laser oscillator, (B) is a beam combining optical element such as a beam splitter, (
7) is a laser beam (2).

（５）が重畳されたレーザビーム、（８）は例えばレン
ズからなる集光素子、（９）は集光されたレーザビーム
、（１０）は被加工物である。(5) is a superimposed laser beam, (8) is a condensing element made of, for example, a lens, (9) is a focused laser beam, and (10) is a workpiece.

次に上記のように構成した装置の動作について説明する
。レーザ発振器（１）　、　（４）から出射されたレー
ザビーム（２）　、　（５）はビーム合成光学素子（６
）で合成されてレーザビーム（７）となり、集光素子（
８）により集光されて被加工物（１０）に照射され、被
加工物（ｌＯ）をレーザ加工する。Next, the operation of the apparatus configured as described above will be explained. The laser beams (2) and (5) emitted from the laser oscillators (1) and (4) are connected to the beam combining optical element (6).
) to form a laser beam (7), which is then sent to a condensing element (
8), the beam is focused and irradiated onto the workpiece (10), and the workpiece (lO) is laser-processed.

一般にレーザ発振器から出射されるレーザビームの出力
は、種々の条件から上限があるのが黄通であり、例えば
通常のＣＯ□レーザ発振器では２゜ＫＷが商業的に達成
される最高出力である。しかしながら上記の装置によれ
ば４０ＫＷはおろか、１０台以上のレーザ発振器からの
レーザビームを重畳することにより、１００ＫＷのレー
ザ出力を得ることもでき、大物の被加工物の加工や高速
加工の実現に偉力を発揮する。Generally speaking, the output of a laser beam emitted from a laser oscillator has an upper limit due to various conditions. For example, in a normal CO□ laser oscillator, 2°KW is the maximum output that can be achieved commercially. However, with the above device, it is possible to obtain a laser output of not only 40KW but also 100KW by superimposing the laser beams from 10 or more laser oscillators, which is useful for machining large workpieces and realizing high-speed machining. Demonstrate great power.

［発明が解決しようとする問題点］ 上記のような従来のレーザ加工装置は前記のように構成
されているため、レーザ発振器（１）。[Problems to be Solved by the Invention] Since the conventional laser processing apparatus as described above is configured as described above, the laser oscillator (1).

（４）から出射するレーザビーム（２）　、　（５）の
偏波方向が時間的にランダムに変化し、ある時間内には
２つのレーザビーム（２）　、　（５）の偏波方向が同
一となって干渉しあうことがあった。例えば、レーザ発
振器（１）　、　（４）からのレーザビーム（２）。The polarization directions of the laser beams (2) and (5) emitted from (4) change randomly over time, and within a certain time, the polarization directions of the two laser beams (2) and (5) are the same. There were times when they interfered with each other. For example, laser beams (2) from laser oscillators (1), (4).

（５）をそれぞれ独立に集光した場合、レーザビーム（
２）　、　（５）の強度が第９図（ａ）に示すガウス状
に分布したとすれば、両者を重畳した場合には第９図（
ｂ）に示すようにレーザビーム（ア）ははＶ相似形状で
、全体の強度が増大した集光レーザビーム形状が得られ
るはずであるが、実際には第９図（ｅ）　、　　（ｄ）
に示すようにビーム形状がくずれる現象が観測され、こ
のようなくずれたレーザビームを用いて被加工物（１０
）を加工すると著しい加工不良を生ずることがあった。(5) are focused independently, the laser beam (
If the intensities of 2) and (5) are distributed in a Gaussian shape as shown in Fig. 9(a), then when the two are superimposed, Fig. 9(
As shown in b), the laser beam (a) has a V-like shape, and a focused laser beam shape with increased overall intensity should be obtained, but in reality, it is shown in Figs. 9(e) and (d).
As shown in Figure 2, a phenomenon in which the beam shape is distorted was observed, and the workpiece (10
) may result in significant processing defects.

本発明は、上記のような問題点を解消するためになされ
たもので、複数のレーザビームを重畳しても品質を損う
ことなく高エネルギー密度のレーザビームを得ることの
できるレーザ加工装置を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and provides a laser processing device that can obtain a laser beam with high energy density without deteriorating the quality even when multiple laser beams are superimposed. The purpose is to obtain.

［問題点を解決するための手段］ 本発明は、偏波方向が互いに平行でないように直線偏光
されたレーザビームを出射する複数のレーザ発振器から
のレーザビームを重畳するようにした、レーザ加工装置
を提供するものである。[Means for Solving the Problems] The present invention provides a laser processing device that superimposes laser beams from a plurality of laser oscillators that emit linearly polarized laser beams such that the polarization directions are not parallel to each other. It provides:

［作　用コ 複数のレーザ発振器から出射されたレーザビームは、そ
の偏波方向が互いに平行でないように重畳されるので、
互いに干渉することがなく高品質のレーザビームが得ら
れる。[Operation: Laser beams emitted from multiple laser oscillators are superimposed so that their polarization directions are not parallel to each other, so
High quality laser beams can be obtained without mutual interference.

［発明の実施例コ 第１図は本発明実施例の説明図である。図において、（
１）は第１のレーザ発振器、（２）は第１のレーザ発振
器から出射されたレーザビーム、（３）は反射鏡、（４
）は第２のレーザ発振器、（５）は第２のレーザ発振器
より出射したレーザビーム、（６）は例えばビームスプ
リッタからなるビーム合成光学素子、（７）はレーザビ
ーム（２）　、　（５）が重畳されたレーザビーム、（
８）は例えばレンズの如き集光素子、（９）は集光され
たレーザビーム、（１０）は被加工物である。（１１）
、　（１２）はレーザビームの偏波方向を示す矢印、（
１３）、　（１４）はそれぞれのレーザ発振器（１）　
、　（４）に備えられた直線偏光化素子で、例えばレー
ザ管の端部にブリュースタ角で設置されたウィンドある
いは共振器内に設置された折返しミラーなどである。Embodiment of the Invention FIG. 1 is an explanatory diagram of an embodiment of the invention. In the figure, (
1) is the first laser oscillator, (2) is the laser beam emitted from the first laser oscillator, (3) is the reflecting mirror, and (4) is the laser beam emitted from the first laser oscillator.
) is the second laser oscillator, (5) is the laser beam emitted from the second laser oscillator, (6) is a beam combining optical element such as a beam splitter, and (7) is the laser beam (2), (5). is superimposed on the laser beam, (
8) is a condensing element such as a lens, (9) is a focused laser beam, and (10) is a workpiece. (11)
, (12) is an arrow indicating the polarization direction of the laser beam, (
13) and (14) are the respective laser oscillators (1)
, (4) A linear polarizing element provided in, for example, a window installed at the end of the laser tube at Brewster's angle or a folding mirror installed in the resonator.

、　次に上記のように構成した本発明の作用について説
明する。レーザ発振器（１）から出射するレーザビーム
（２）は、直線偏光化素子（１３）によりその振動面が
矢印（１１）で示すように紙面に対して垂直方向に偏波
し、またレーザ発振器（４）から出射したレーザビーム
（４）は、直線偏光化素子（１４）により矢印（１２）
で示すように紙面と平行方向に偏波しており、これら偏
波方向が互いに平行でない２つのレーザビーム（２）　
、　（５）は、合成光学素子（６）により合成されてレ
ーザビーム（７）となり、さらにレンズ（８）により集
光されてレーザビーム（９）として被加工物（１０）に
照射され、被加工物（ｌＯ）の加工をおこなう。このと
き、レーザビーム（２）。Next, the operation of the present invention configured as described above will be explained. The laser beam (2) emitted from the laser oscillator (1) is polarized by the linear polarization element (13) so that its plane of vibration is perpendicular to the plane of the paper as shown by the arrow (11). The laser beam (4) emitted from the
As shown in the figure, two laser beams are polarized in a direction parallel to the plane of the paper, and these polarization directions are not parallel to each other (2)
, (5) are combined by a combining optical element (6) to become a laser beam (7), which is further focused by a lens (8) and irradiated onto a workpiece (10) as a laser beam (9). The workpiece (lO) is processed. At this time, the laser beam (2).

（５）はその偏波方向が平行でないため０、互いに干渉
することなく重畳される。(5) is 0 because their polarization directions are not parallel, so they are superimposed without interfering with each other.

第２図（ａ）はレーザ発振器（１）　、　（４）から出
射したレーザビーム（２）　、　（４）をそれぞれ単独
で集光した場合の集光レーザビームの形状を、また（ｂ
）はレーザ発振器（１）　、　　（４）から出射したレ
ーザビーム（２）　、　（４）を重畳して集光した場合
の集光レーザビーム（９）の形状を示すもので、全体の
形状ははソ相似形で強度のみが増加していることがわか
る。Figure 2 (a) shows the shape of the focused laser beam when the laser beams (2) and (4) emitted from the laser oscillators (1) and (4) are focused individually, and (b)
) shows the shape of the focused laser beam (9) when the laser beams (2) and (4) emitted from the laser oscillators (1) and (4) are superimposed and focused, and the overall shape is It can be seen that only the strength increases in the so-similar shape.

この場合、重畳されるレーザビームの偏光方向を、第３
図に示すように互いに軸対称になるようにすれば、加工
方向による性能の差をなくすことができる。In this case, the polarization direction of the superimposed laser beam is
By making them axially symmetrical with each other as shown in the figure, differences in performance depending on the machining direction can be eliminated.

第４図、第５図は本発明の他の実施例を示すもので、直
線偏光化素子（１３）、　（１４）を備えたレーザ発振
器（１）　、　（４）を対向配置し、その間に例えばプ
リズムからなる両面反射鏡（１５）を配置して、両レー
ザ発振器（１）　、　（４）から出射されたレーザビー
ム（２）　、　（５）を重畳するようにしたものである
。4 and 5 show other embodiments of the present invention, in which laser oscillators (1) and (4) equipped with linear polarization elements (13) and (14) are arranged facing each other, and For example, a double-sided reflecting mirror (15) made of a prism is arranged to superimpose the laser beams (2) and (5) emitted from both laser oscillators (1) and (4).

上記の実施例では、第２のレーザ発振器（４）を第１の
レーザ発振器（１）の反対側に配置した場合を示したが
、第６図に示すように両者を直交して配置してもよく、
またレーザ発振器の数も２台に限るものでなく、３台以
上設けてもよい。In the above embodiment, the second laser oscillator (4) was placed on the opposite side of the first laser oscillator (1), but as shown in FIG. Good too,
Further, the number of laser oscillators is not limited to two, and three or more may be provided.

さらに、レーザ発振器は同一の性能である必要はなく、
たとえば一方のレーザ発振器（１〉から出射するレーザ
ビーム（２）の形状が第７図（ａ）に示すようにスパイ
ク状であり、他方のレーザ発振器（４）から出射するレ
ーザビーム（５）の形状が同図（ｂ）に示すように山形
状であれば、これらを重畳して同図（ｅ）に示す形状の
レーザビーム形状が得られるが、この形状のレーザビー
ムは鉄等を高精度で切断するのに最適である。Additionally, laser oscillators do not have to have identical performance;
For example, the shape of the laser beam (2) emitted from one laser oscillator (1) is spike-like as shown in FIG. 7(a), and the shape of the laser beam (5) emitted from the other laser oscillator (4) is If the shape is a mountain as shown in Figure (b), the laser beam shape shown in Figure (e) can be obtained by superimposing them, but this laser beam can be used to cut iron etc. with high precision. Ideal for cutting with.

［発明の効果］ 以上のように、本発明によれば互いに偏波方向が平行で
ないように直線偏光された複数のレーザビームを重畳す
るようにしたもので、互いに干渉することなく、したが
ってビーム品質を損うことなく高エネルギ密度のレーザ
ビームを得ることができる。[Effects of the Invention] As described above, according to the present invention, a plurality of linearly polarized laser beams are superimposed so that the polarization directions are not parallel to each other, so that they do not interfere with each other, and therefore the beam quality is improved. A high energy density laser beam can be obtained without damaging the

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例によるレーザ加工装置を示す
説明図、第２図（ａ）　、　（ｂ）は本発明の動作を示
す波形図、第３図はレーザビームの偏波方向の例を示す
説明図、第４図、第５図及び第６図は本発明の他の実施
例の説明図、第７図（ａ）〜（Ｃ）は本発明の別の実施
例の波形図。第８図は従来のレーザ加工装置を示す説明
図、第９図はその動作を示す波形図である。 図において、（１）は第１のレーザ発振器、（２）は第
１のレーザ発振器から発生したレーザビーム、（３）は
反射鏡、（４）は第２のレーザ発振器、（５）は第２の
レーザ発振器から発生したレーザビーム、（６）はビー
ム合成光学素子、（７）は合成されたレーザビーム、（
８）は集光素子、（９）は集光されたレーザビーム、（
１０）は被加工物、（ｌｌ）、　（１２）はレーザビー
ムの偏波方向、（１３）、（１４）は直線偏光化素子で
ある。なお図中同一符号は同−又は相当部分を示す。FIG. 1 is an explanatory diagram showing a laser processing apparatus according to an embodiment of the present invention, FIGS. 2(a) and (b) are waveform diagrams showing the operation of the present invention, and FIG. 3 is a diagram showing the polarization direction of the laser beam. An explanatory diagram showing an example; FIGS. 4, 5, and 6 are explanatory diagrams of other embodiments of the present invention; FIGS. 7(a) to (C) are waveform diagrams of another embodiment of the present invention. . FIG. 8 is an explanatory diagram showing a conventional laser processing apparatus, and FIG. 9 is a waveform diagram showing its operation. In the figure, (1) is the first laser oscillator, (2) is the laser beam generated from the first laser oscillator, (3) is the reflecting mirror, (4) is the second laser oscillator, and (5) is the laser beam generated from the first laser oscillator. The laser beam generated from the laser oscillator 2, (6) the beam combining optical element, (7) the combined laser beam, (
8) is a condensing element, (9) is a focused laser beam, (
10) is a workpiece, (ll) and (12) are polarization directions of laser beams, and (13) and (14) are linear polarization elements. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (2)

【特許請求の範囲】[Claims] （１）複数のレーザビームを重畳した高エネルギー密度
のレーザビームによって被加工物を加工する装置におい
て、偏波方向が互いに平行でないように直線偏光された
レーザビームを発生させる複数のレーザ発振器と、これ
ら複数のレーザ発振器から出射されたレーザビームを重
畳させる光学系とを備えたことを特徴とするレーザ加工
装置。(1) In an apparatus that processes a workpiece with a high-energy-density laser beam in which multiple laser beams are superimposed, a plurality of laser oscillators generate linearly polarized laser beams whose polarization directions are not parallel to each other; A laser processing device comprising: an optical system that superimposes laser beams emitted from the plurality of laser oscillators. （２）前記直線偏光された複数のレーザビームの偏波方
向が光軸上軸対称であることを特徴とする特許請求の範
囲第１項記載のレーザ装置。(2) The laser device according to claim 1, wherein the polarization directions of the plurality of linearly polarized laser beams are symmetrical on the optical axis.
JP62131577A 1987-05-29 1987-05-29 Laser beam machine Pending JPS63299883A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62131577A JPS63299883A (en) 1987-05-29 1987-05-29 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62131577A JPS63299883A (en) 1987-05-29 1987-05-29 Laser beam machine

Publications (1)

Publication Number Publication Date
JPS63299883A true JPS63299883A (en) 1988-12-07

Family

ID=15061305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62131577A Pending JPS63299883A (en) 1987-05-29 1987-05-29 Laser beam machine

Country Status (1)

Country Link
JP (1) JPS63299883A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6150629A (en) * 1995-11-29 2000-11-21 Baasel-Scheel Lasergraphics Gmbh Laser engraving system
WO2017159874A1 (en) * 2016-03-18 2017-09-21 Kabushiki Kaisha Toyota Chuo Kenkyusho Laser processing device, three-dimensional shaping device, and laser processing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6150629A (en) * 1995-11-29 2000-11-21 Baasel-Scheel Lasergraphics Gmbh Laser engraving system
WO2017159874A1 (en) * 2016-03-18 2017-09-21 Kabushiki Kaisha Toyota Chuo Kenkyusho Laser processing device, three-dimensional shaping device, and laser processing method
JP2017170454A (en) * 2016-03-18 2017-09-28 株式会社豊田中央研究所 Laser processing apparatus, three-dimensional molding apparatus, and laser processing method

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