JPS63162547U - - Google Patents

Info

Publication number
JPS63162547U
JPS63162547U JP5434787U JP5434787U JPS63162547U JP S63162547 U JPS63162547 U JP S63162547U JP 5434787 U JP5434787 U JP 5434787U JP 5434787 U JP5434787 U JP 5434787U JP S63162547 U JPS63162547 U JP S63162547U
Authority
JP
Japan
Prior art keywords
external
external lead
leads arranged
semiconductor
semiconductor container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5434787U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5434787U priority Critical patent/JPS63162547U/ja
Publication of JPS63162547U publication Critical patent/JPS63162547U/ja
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,bはそれぞれ本考案の一実施例の側
面図および正面図、第2図は第1図に示す実施例
をプリント基板に実装した状態を示す断面図、第
3図は従来のZIP型の半導体集積回路装置であ
る。 図において、1―1は半導体装置容器、1―2
,1―3,1―4,1―5は外部電極リード、1
―6,1―7はプリント基板、2―1は半導体装
置容器、2―2,2―3は外部電極リードである
Figures 1a and b are a side view and a front view, respectively, of an embodiment of the present invention, Figure 2 is a sectional view showing the embodiment shown in Figure 1 mounted on a printed circuit board, and Figure 3 is a conventional This is a ZIP type semiconductor integrated circuit device. In the figure, 1-1 is a semiconductor device container, 1-2
, 1-3, 1-4, 1-5 are external electrode leads, 1
-6 and 1-7 are printed circuit boards, 2-1 is a semiconductor device container, and 2-2 and 2-3 are external electrode leads.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体容器の第1の側辺に並べられた複数の第
1の外部リードと前記半導体容器の前記第1の側
辺の反対側に位置する第2の側辺に並べられた複
数の第2の外部リードとを含み、前記第1の外部
リードと前記第2の外部リードの少くとも先端が
互いに反対向きとなつていることを特徴とする半
導体集積回路装置。
a plurality of first external leads arranged on a first side of the semiconductor container; and a plurality of second external leads arranged on a second side of the semiconductor container opposite to the first side. 1. A semiconductor integrated circuit device comprising: an external lead, wherein at least tips of the first external lead and the second external lead are oriented in opposite directions.
JP5434787U 1987-04-09 1987-04-09 Pending JPS63162547U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5434787U JPS63162547U (en) 1987-04-09 1987-04-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5434787U JPS63162547U (en) 1987-04-09 1987-04-09

Publications (1)

Publication Number Publication Date
JPS63162547U true JPS63162547U (en) 1988-10-24

Family

ID=30881256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5434787U Pending JPS63162547U (en) 1987-04-09 1987-04-09

Country Status (1)

Country Link
JP (1) JPS63162547U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02260448A (en) * 1989-03-30 1990-10-23 Mitsubishi Electric Corp Semiconductor device and radiating fin

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942427A (en) * 1972-05-15 1974-04-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942427A (en) * 1972-05-15 1974-04-22

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02260448A (en) * 1989-03-30 1990-10-23 Mitsubishi Electric Corp Semiconductor device and radiating fin

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