JPS63156709U - - Google Patents
Info
- Publication number
- JPS63156709U JPS63156709U JP4874287U JP4874287U JPS63156709U JP S63156709 U JPS63156709 U JP S63156709U JP 4874287 U JP4874287 U JP 4874287U JP 4874287 U JP4874287 U JP 4874287U JP S63156709 U JPS63156709 U JP S63156709U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- main body
- apparatus main
- contact portion
- frame portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図は本考案の一実施例を示す平面図であり
、第２図は第１図の斜視図であり、第３図は半導
体ウエハーを装置本体上に載置した状態を示す模
式図であり、第４図は半導体ウエハーをブレイク
した後の状態を示す模式図である。第５図は従来
例を示す断面図である。
１……半導体ウエハーブレイク装置、２……フ
レーム部材、３……装置本体、４……当接部材、
５……吸着手段、１３……半導体ウエハー、１３
ａ……ハーフカツト溝。
FIG. 1 is a plan view showing an embodiment of the present invention, FIG. 2 is a perspective view of FIG. 1, and FIG. 3 is a schematic diagram showing a state in which a semiconductor wafer is placed on the device body. 4 is a schematic diagram showing the state after the semiconductor wafer is broken. FIG. 5 is a sectional view showing a conventional example. 1... Semiconductor wafer breaking device, 2... Frame member, 3... Device main body, 4... Contact member,
5... Adsorption means, 13... Semiconductor wafer, 13
a...Half cut groove.
Claims (1)
ートを上記装置本体との間で保持するフレーム部
と、 上記装置本体に設けられ上記半導体ウエハーの
スクライブ位置に対応した凹凸形状を有する当接
部と、 上記半導体ウエハーを上記シートとともに上記
当接部に吸着する吸着手段とを有することを特徴
とする半導体ウエハーブレイク装置。[Scope of Claim for Utility Model Registration] An apparatus main body, a frame portion for holding a sheet on which a scribed semiconductor wafer is attached between the apparatus main body, and a frame portion provided on the apparatus main body and corresponding to the scribing position of the semiconductor wafer. A semiconductor wafer breaking device comprising: a contact portion having an uneven shape; and suction means for sucking the semiconductor wafer together with the sheet onto the contact portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987048742U JPH05326Y2 (en) | 1987-03-31 | 1987-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987048742U JPH05326Y2 (en) | 1987-03-31 | 1987-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63156709U true JPS63156709U (en) | 1988-10-14 |
| JPH05326Y2 JPH05326Y2 (en) | 1993-01-07 |
Family
ID=30870559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987048742U Expired - Lifetime JPH05326Y2 (en) | 1987-03-31 | 1987-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05326Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5028748A (en) * | 1973-07-13 | 1975-03-24 | ||
| JPS5147564A (en) * | 1974-10-23 | 1976-04-23 | Daido Steel Co Ltd | Kinzokufunmatsuno seizohoho |
| JPS5147565A (en) * | 1974-10-23 | 1976-04-23 | Chukyo Electric Co | HARIGANE CHOKUSENSOCHI |
-
1987
- 1987-03-31 JP JP1987048742U patent/JPH05326Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5028748A (en) * | 1973-07-13 | 1975-03-24 | ||
| JPS5147564A (en) * | 1974-10-23 | 1976-04-23 | Daido Steel Co Ltd | Kinzokufunmatsuno seizohoho |
| JPS5147565A (en) * | 1974-10-23 | 1976-04-23 | Chukyo Electric Co | HARIGANE CHOKUSENSOCHI |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05326Y2 (en) | 1993-01-07 |