JPS6299185A - Card emboss transferring mechanism - Google Patents

Abstract

PURPOSE:To obtain an emboss transferring mechanism capable of transferring an emboss with a low pressure and while applying the pressure only to an emboss part, by combining an ink-impregnated member with a member for restraining excessive outflow of an ink. CONSTITUTION:An ink pad 1 capable of being moved vertically is provided on the upper side of a card support 3 on which a card 11 provided with an emboss 11a is placed, and a protective sheet 2 is so fitted as to cover the lower surface of the ink pad 1. The ink pad 1 is impregnated with a card emboss transferring ink, and the protective sheet functions to prevent the ink of the ink pad 1 from making direct contact with a transfer recording paper 10 or flowing out in excess, and functions to permit the ink from the ink pad 1 to penetrate under 1 low pressure. Accordingly, the profile of an emboss 11a is transferred onto the paper 10.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to a card processing device having an embossed portion on its surface, particularly for performing emboss transfer of embossed cards such as IC memory cards and LSI chip built-in cards. The present invention relates to a transfer device.

(Prior Art) As shown in FIG. 5 or 6, an embossed card generally has an embossed part 11a formed on the surface 11b of a card 110. Conventionally, mechanisms such as those shown in FIGS. 3 and 4 have been known for transferring the embossing of this type of card to other parts. Emboss transfer roller guides 4 are installed above the card holder 3 at regular intervals, and an elastic emboss transfer roller 5 is rolled and press-fitted from the side between them. When performing transfer, first the card 11 having the embossment 1lae and the pressure-sensitive paper 12 for emboss transfer are fed onto the card holding table 3 by a feeding mechanism (not shown), and then the emboss transfer roller 5 is moved in the direction of the arrow in FIG. The roller 5 is rotated and deformed by the card 11, the pressure-sensitive paper 12, and the guide 4 as shown in FIG. 4, and the entire area of the card is embossed and transferred onto the pressure-sensitive paper 12 by the roller pressure at this time. In this configuration, the gap between the card holder 3 and the guide 4 is set to such a dimension that the elastic deformation of the emboss transfer roller 5 can generate enough pressure to color the pressure-sensitive paper 12 for emboss transfer. The prescribed deformation of this emboss transfer port-ra 5 is card emboss f
It depends on the thickness of the card 11 including lat.

(Problems to be Solved by the Invention) The conventional card emboss transfer mechanism described above is configured to transfer the card emboss 11a onto the transfer pressure-sensitive paper 12 using the deformation pressure of the emboss transfer roller 5, so it is inevitable that the card emboss 11a will be transferred to the entire card. Pressure is applied. If such a card emboss transfer mechanism performs emboss transfer on a card with a built-in LSI chip, such as an IC memory card, there is a possibility that the built-in LSI chip may be damaged. Further, since the pressure of transferring the card emboss is large, there are drawbacks such as the paint on the upper surface of the card embossed part being worn away and the height of the emboss changing. Furthermore, in order to reciprocate the emboss transfer roller 5 under high pressure, a robust structure is required, resulting in a disadvantage that the mechanism is large-scale and expensive.

An object of the present invention is to provide an emboss transfer mechanism that can perform emboss transfer using low pressure and applying pressure only to the embossed portion.

(Means for Solving the Problems) The emboss transfer mechanism of the present invention includes a combination of a member impregnated with ink and a member for suppressing excessive outflow of ink, which is disposed on a card holding stand, and which is attached to the card. It is pressed down vertically toward the holding table, thereby performing emboss transfer of ink onto the paper.

(Example) Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a side view showing a card emboss transfer mechanism according to an embodiment of the present invention in a state before a transfer operation, and FIG. 2 is a side view showing a card emboss transfer mechanism according to an embodiment of the present invention in a state during transfer. be. A vertically movable ink pad 1 is provided above a card holder 3 on which a card 11 having an embossed lla is placed, and a protective sheet 2 is attached to the pad so as to cover the lower surface of the ink pad 1. Ink pad 1
The protective sheet 2 is impregnated with ink for transferring the card embossing, and the protective sheet 2 is coated with an ink pad 1 on the transfer paper 10.
This sheet is used to prevent ink from coming into direct contact with the ink pad 1 and to prevent the ink from flowing out excessively, and the low pressure acts to allow the ink from the ink pad 1 to pass through with pressure.

Card 11 with embossed lla and top fil of hiso
The embossed transfer paper 10 is supplied onto the card holder 3 by a mechanism (not shown) at l, and the ink pad 1 and the protective sheet 2 work together to perform a downward movement relative to the card holder 3, and the protective sheet 2vc pressure is applied to the card. Emboss l
The ink of the ink pad 1 is transmitted from the retaining sheet 2 to the embossed transfer paper 10 side only in the portion la, and thereby the embossed shape 1laO is transferred onto the paper 10Ilc.

(Effects of the Invention) As explained above, since the transfer mechanism according to the present invention uses ink, the pressure required for pressing is low, and the embossing transfer of LSI chip built-in cards such as IC memory cards can be performed with less stress.

This can be done without damaging the LSI chip, and has the advantage of being able to have a compact and simple structure that does not cause abrasion or peeling of the paint on the upper surface of the card embossing or a change in the height of the embossing.

[Brief explanation of drawings]

FIG. 1 is a side view of an emboss transfer mechanism according to an embodiment of the present invention in a state before a transfer operation, and FIG. 2 is a side view of an embodiment of the present invention in a state during transfer. Fig. 3 is a side view of a conventional embossed transfer mechanism before the start of transfer, Fig. 4 is a side view of the conventional transfer mechanism during transfer operation, and Figs. 5 and 6 show examples of embossed cards. FIG. 1... Ink pad, 2... Protective sheet, 3
... Card holding stand, 10... Embossed transfer paper. 11... Card with 1 emboss, 11a... Emboss, 11b... Card surface.

Claims (1)

[Claims] In an emboss transfer mechanism for a card having an emboss,
An ink impregnating member and an ink overflow suppressing member are arranged on the card holder, and these members press the transfer paper perpendicularly to the embossment of the card on the card holder to transfer the card emboss. A card emboss transfer mechanism featuring: