JPS6252038B2 - - Google Patents
Info
- Publication number
- JPS6252038B2 JPS6252038B2 JP6717484A JP6717484A JPS6252038B2 JP S6252038 B2 JPS6252038 B2 JP S6252038B2 JP 6717484 A JP6717484 A JP 6717484A JP 6717484 A JP6717484 A JP 6717484A JP S6252038 B2 JPS6252038 B2 JP S6252038B2
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- die
- plated
- bath
- plated wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 48
- 229910052759 nickel Inorganic materials 0.000 claims description 24
- 238000007747 plating Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 3
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
〔発明の背景の目的〕
本発明はニツケルめつき線、特にダイオードリ
ード用ニツケルめつき線の製造方法に関する。
ニツケルめつき線、特にダイオードリードに用
いられるニツケルめつき線を製造するには従来ワ
ツト浴がめつき浴として用いられている。しかし
ながら、ワツト浴を用いて製造されるニツケルめ
つき線は無光沢であるので、めつきを施した後
に、ダイス引抜き加工により光沢化を行う必要が
あつた。さらに、ニツケルめつき線の中でもダイ
オードに用いられる線についてはヘツダー加工に
供するために、焼純後５〜10％程度の加工度によ
りダイス引抜き加工を行い、めつき線の硬さを調
節する必要があつた。
しかしながら、ニツケルめつき線のダイス引抜
き加工は、ニツケルが硬質のためにダイスの寿命
が短かく、ダイコスト、ダイス交換の手間等コス
トに与えるデメリツトが大きかつた。
本発明の目的は前記した如き従来技術の欠点を
解消し、ニツケルめつき後にダイス引抜き加工を
要することなく、適正な硬度を有し且つ光沢ある
外観を有するニツケルめつき線の新規な製造方法
を提供することにある。
〔発明の概要〕
本発明は、ニツケルめつきすべき素材にダイス
加工を施こして所定の硬度を与えた後に、ワツト
浴の硫酸ニツケル濃度を150〜230ｇ／としたニ
ツケルめつき浴によつてニツケルめつきを施こす
ことを特徴とするニツケルめつき線の製造方法で
ある。
従来のワツト浴及び低濃度ワツト浴として第１
表に示すような組成が知られている。
BACKGROUND OF THE INVENTION The present invention relates to a method of manufacturing nickel plated wire, particularly nickel plated wire for diode leads. Conventionally, a Watt bath is used as a plating bath for producing nickel plated wire, especially nickel plated wire used for diode leads. However, since the nickel plated wire produced using the Watt bath is matte, it has been necessary to make it glossy by die drawing after plating. Furthermore, for wires used in diodes among nickel plated wires, in order to prepare them for header processing, it is necessary to perform die drawing processing at a processing rate of about 5 to 10% after sintering to adjust the hardness of the plated wires. It was hot. However, die drawing of nickel-plated wire has a short lifespan due to the hardness of nickel, which has significant disadvantages in terms of die cost, labor for replacing dies, and other costs. The purpose of the present invention is to eliminate the drawbacks of the prior art as described above, and to provide a new method for manufacturing nickel plated wire that has appropriate hardness and a glossy appearance without requiring die drawing after nickel plating. It is about providing. [Summary of the Invention] The present invention provides a nickel plating bath using a nickel plating bath with a nickel sulfate concentration of 150 to 230 g/Watt bath after dicing a material to be nickel plated to give it a predetermined hardness. This is a method for producing a nickel-plated wire characterized by applying nickel plating. The first conventional Watts bath and low concentration Watts bath.
The compositions shown in the table are known.
直径0.8mmの銅線を断面減少率約10％となるよ
うにダイスにより引抜き加工し、次いで塩化ニツ
ケル45ｇ／、ほう酸30ｇ／で種々の濃度の硫
酸ニツケルよりなるニツケルめつき浴を用い、PH
4.5、温度55℃、及び電流密度15A／ｄm2でニツ
ケルめつきを行つてニツケルめつき線を得た。こ
れらのニツケルめつき線の光沢、及びダイオード
に供される前のヘツダー加工性について調べ、結
果を第２表に示した。
Copper wire with a diameter of 0.8 mm was drawn with a die so that the area reduction rate was approximately 10%, and then PH was applied using a nickel plating bath consisting of nickel sulfate at various concentrations with 45 g of nickel chloride and 30 g of boric acid.
4.5, nickel plating was performed at a temperature of 55° C. and a current density of 15 A/dm 2 to obtain a nickel plated wire. The gloss of these nickel plated wires and header processability before being used in diodes were investigated, and the results are shown in Table 2.
本発明によるときは、光沢の有るニツケルめつ
き線が得られるので、ニツケルめつき後のダイス
加工が不要となり、ダイス加工をニツケルめつき
が施される前に行うことができるから、ダイスの
摩耗を少くし、寿命を長くすることができ、ダイ
スコスト及びダイス交換の手間が低減される。ま
た、本発明により得られるニツケルめつき線はヘ
ツダー加工性が良いので、ダイオード用のニツケ
ルめつき線として適している。
According to the present invention, since a shiny nickel plated line is obtained, die processing after nickel plating is not required, and die processing can be performed before nickel plating, which reduces die wear. The life of the die can be increased by reducing the die cost and the labor of replacing the die. Further, since the nickel plated wire obtained by the present invention has good header workability, it is suitable as a nickel plated wire for diodes.
第１図は本発明方法を実施するのに用いられる
装置の一例を示す説明図である。
１……被めつき線、２……硬度調節用ダイス、
３……ニツケルめつき浴、４……巻き取りボビ
ン。
FIG. 1 is an explanatory diagram showing an example of an apparatus used to carry out the method of the present invention. 1...Filled wire, 2...Hardness adjustment die,
3... Nickel plating bath, 4... Winding bobbin.
Claims (1)
して所定の硬度を与えた後に、ワツト浴の硫酸ニ
ツケル濃度を150〜230ｇ／としたニツケルめつ
き浴によつてニツケルめつきを施こすことを特徴
とするニツケルめつき線の製造方法。1. The material to be nickel-plated is dice-processed to give it a predetermined hardness, and then nickel-plated is applied in a nickel-plating bath with a nickel sulfate concentration of 150 to 230 g/Watt bath. A method for manufacturing nickel plated wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6717484A JPS60211098A (en) | 1984-04-03 | 1984-04-03 | Manufacture of nickel plated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6717484A JPS60211098A (en) | 1984-04-03 | 1984-04-03 | Manufacture of nickel plated wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60211098A JPS60211098A (en) | 1985-10-23 |
| JPS6252038B2 true JPS6252038B2 (en) | 1987-11-02 |
Family
ID=13337262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6717484A Granted JPS60211098A (en) | 1984-04-03 | 1984-04-03 | Manufacture of nickel plated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60211098A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0342438U (en) * | 1989-09-05 | 1991-04-22 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62235357A (en) * | 1986-04-07 | 1987-10-15 | Teijin Chem Ltd | Molded polycarbonate article |
| JP5708846B1 (en) * | 2014-02-26 | 2015-04-30 | 株式会社オートネットワーク技術研究所 | Stranded conductor and insulated wire |
-
1984
- 1984-04-03 JP JP6717484A patent/JPS60211098A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0342438U (en) * | 1989-09-05 | 1991-04-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60211098A (en) | 1985-10-23 |
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