JPS6235813A - Molding equipment - Google Patents

Abstract

PURPOSE:To enable to perform the replacement of a top force and a plunger and the like easily within a wide space by a method wherein a plunger-driving device is provided so as to be able to change its level in order to locate the whole plunger driving device at a high position when necessary. CONSTITUTION:When the non-airtight sealing package molding to seal an IC as a matter to be sealed is intended, firstly ICs are set in the cavity recesses 12b of a bottom force 15; secondly, a mold opening and closing device 1 is put into actuation so as to clamp a top force 10 and the bottom force 15 by contacting them with each other. The package molding is performed so as to seal the IC by pressure-feeding resin, which is produced by melting a tablet charged in a pot 11 through heating, to each cavity by means of a plunger 8. When the replacement of the top force 10 and the plunger 8 and the like is done, a plunger driving device 7 is shifted to and put into a high position. The shifting operation of the position of the device 7 is done by unclamping clampers 5 and then raising a mounting plate 6 so as to clamp the clampers 5 at upper annular grooves 4a. After the finish of replacement, the mounting plate 6 is lowered so as to put the device into the lower position by clamping the clampers 5 at lower annular grooves 4b.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to molding technology, and in particular to a technology useful for molding non-hermetically sealed packages, for example, in the manufacture of semiconductor devices.

[Background technology]

In the production of semiconductor devices, a transfer molding device that molds a non-hermetically sealed pancage is used to set semiconductor devices (hereinafter referred to as ICs) as objects to be sealed in a plurality of cavities formed in a mold. Some devices are configured to pancage an IC with resin by force-feeding resin as a molding material with a plunger.

However, when forming a small transfer molding device in which a cavity, launch, gate, and pot are directly incorporated inside the template, the stroke of the plunger is shortened by the thickness of the chase block, which was previously required. However, the inventor has found that there is a problem in that the stroke of the plunger is shortened, making it difficult to replace the upper mold, resulting in a decrease in productivity.

In addition, examples of transfer molding technology include:
"Electronic Materials November 1984 Special Issue" published by Kogyo Research Association Co., Ltd., November 20, 1984, P125-P12
There is 9.

[Purpose of the invention]

An object of the present invention is to provide a molding technique that allows easy replacement of the upper mold even when the stroke of the plunger becomes short.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, by providing the height position of the plunger drive device so that it can be changed, the entire plunger drive device can be positioned at a high place when necessary to expand the space in front of the plunger, and in this wide space, the upper mold This makes it easy to perform replacement work during plunge.

〔Example〕

FIG. 1 is a front view showing a transfer molding apparatus according to an embodiment of the present invention, and FIG. 2 is a front view for explaining its operation.

In this embodiment, the transfer molding apparatus is equipped with a mold opening/closing bag rIil consisting of a cylinder device, etc., and a plurality of guide pillars 2 are arranged substantially vertically on the mold opening/closing device 1. A platen 3 is installed at the upper end of the guide pillar 2, and a plurality of guide posts 4 are mounted on the platen 3.
is installed almost vertically. A clamper 5 is fitted into the guide post 4 so as to be movable up and down.
are annular grooves 4a formed at the upper and lower positions of the guide post 4;
4b by a one-touch operation, the guide post 4 can be stopped (detailed explanation of the structure will be omitted). Each clamper 5 is installed on a mounting plate 6, and a plunger drive device 7 consisting of a cylinder device or the like is installed approximately in the center of the mounting plate 6. A plunger 8 is connected to the piston loft of the plunger drive device 7, and the plunger 8 is configured to fit into a pot of an upper mold to be described later to forcefully feed resin.

An upper mold 10 is suspended from the platen 3 via a plurality of supports 9, and the upper mold 10 is formed by forming a mold plate having a built-in heater (not shown), and a box 1-11 and a plurality of cavities. It is constructed so that the recess 12a can be directly incorporated.

A floating plate (movable platen) 13 is fitted into the middle portion of the guide pillar 2 so as to be movable up and down, and this floating plate 13 is supported by the piston loft 1a of the mold opening/closing device 1. The lower mold 15 is placed on the floating plate 13 with a spacer block 14
The lower mold 15 is constructed such that the cull 16, runner 17, and cavity recess 12b are directly incorporated into a mold plate in which a heater (not shown) is built-in.

Next, the action will be explained.

For example, when molding a non-hermetically sealed package (not shown) that seals an IC (not shown) as an object to be sealed, the IC is set in the cavity recess 12b of the lower mold 15, and the mold opening/closing device 1 is activated to bring the upper mold 10 and lower mold 15 together and clamp them. In this state, a resin made by heating and melting the tab left placed in the pot 11 is pumped into each cavity by the plunger 8, thereby forming a pan cage and sealing the IC.

By the way, if the heat of the heater is quickly and effectively transferred to the cavity, runner, etc. by directly incorporating a cavity, a runner, etc. into the mold plate in which the heater is built-in, then as described above, The stroke of the plunger becomes extremely short. In such a case, when replacing the upper mold or the plunger, the plunger is close to the pot, making it difficult to replace the upper mold or the plunger.

Therefore, in this embodiment, by moving the entire plunger drive device to a higher location, sufficient work space is secured for upper die exchange and mid-plunge exchange, and the exchange work can be easily performed. There is.

That is, during the above-mentioned molding operation, the plunger drive device 7 is installed at a low position as shown in FIG. As shown in Figure 2, the plunger drive device 7 is moved to a higher position and installed.

To shift to this position, loosen the clamper 5 and then
This is easily accomplished by raising the clamper 5 and tightening the clamper 5 at the upper annular groove 43.

After the replacement work is completed, contrary to the above, the mounting plate 6 is lowered and installed in the lower annular groove 4b by the clamper 5, and the plunger drive device 7 is set to the original molding work position.

Furthermore, in this embodiment, when viewed from the perspective of being able to change the equipment of the transfer molding apparatus, the apparatus of the present invention can reduce the height of the plunger drive device 7 during transfer, so that the overall height of the apparatus of 2000 m or more can be reduced to 1700 m. am
You can do the following. If the height of a normal door is 1800 mm, you can easily pass through the door.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the configuration for changing the height position of the plunger drive device is not limited to a structure in which a mounting plate is slidably disposed on a guide pole and fixed in position by a clamper, but also a structure using a screw jack mechanism, etc. It may be.

Molding molds are not limited to those in which cavities, runners, pots, etc. are directly assembled into a mold plate, and may also be those in which a chase block in which a cavity, etc. is formed is assembled replaceably to a mold plate. good.

〔effect〕

fi+ By configuring the plunger drive device so that its height can be changed, the entire plunger drive device can be positioned at a high place when necessary, so that the space in front of the plunger can be expanded.

(2) When converting the upper mold or plunger, by moving the plunger drive device to a higher place and expanding the space at the front,
Since the conversion work of the upper die and the plunger can be easily carried out, the work efficiency can be improved and the operating rate of the entire apparatus can be increased.

(3) By placing the plunger drive device in a low position during molding work, the stroke of the plunger can be set short, increasing molding efficiency and achieving the above (2).
Combined with this, productivity can be improved.

(4) By locating the plunger drive device at a low location, the height of the entire device can be reduced, making it easier to transport and install the device.

(5) By incorporating cavities, runners, pots, etc. into a template with a built-in heater, the cavities, etc. can be heated quickly and effectively by the heater, thereby preventing insufficient curing of molded products due to heating delays. can be prevented from occurring.

[Application field]

In the above explanation, the invention made by the present inventor is mainly applied to a transfer molding apparatus for molding a non-hermetically sealed package for an IC, which is the background field of application of the invention, but the invention is limited thereto. It can also be applied to molding equipment for molding other products.

[Brief explanation of the drawing]

FIG. 1 is a front view showing a transfer molding apparatus which is an embodiment of the present invention, and FIG. 2 is a front view for explaining its operation. 1... Mold opening/closing device, 2... Guide pillar, 3...
・Platen, 4... ・Guide post, 5... Clamper, 6... Mounting plate, 7... Plunger drive device,
8... Plunger, 9... Support, 10... Upper mold, 11... Pot, 12a, 12b... Cavity recess, 13... Floating plate, 14... Spacer block, 15 ...lower die, 16...cal, 17...runner. Agent: Patent Attorney Yoshio Ogawa No. 1
Figure 2

Claims (1)

[Scope of Claims] 1. A molding device characterized in that the position of the plunger drive device is configured to be changeable. 2. Claims characterized in that the plunger drive device is slidably supported by a guide pole erected on the platen, and is configured to be fixed in position to the guide pole by a clamper. The molding device according to item 1. 3. The molding apparatus according to claim 1, wherein the mold is incorporated in a mold plate having a built-in heater.