JPS62189770A - Junction-type semiconductor light emitting device - Google Patents
Junction-type semiconductor light emitting deviceInfo
- Publication number
- JPS62189770A JPS62189770A JP61031573A JP3157386A JPS62189770A JP S62189770 A JPS62189770 A JP S62189770A JP 61031573 A JP61031573 A JP 61031573A JP 3157386 A JP3157386 A JP 3157386A JP S62189770 A JPS62189770 A JP S62189770A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- flat plate
- plate part
- junction
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 35
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- 239000000758 substrate Substances 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 6
- 229910052681 coesite Inorganic materials 0.000 abstract 3
- 229910052906 cristobalite Inorganic materials 0.000 abstract 3
- 239000000377 silicon dioxide Substances 0.000 abstract 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract 3
- 229910052682 stishovite Inorganic materials 0.000 abstract 3
- 229910052905 tridymite Inorganic materials 0.000 abstract 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 10
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 229910002665 PbTe Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、発光ダイオードや半導体レーザとして使用し
得る接合型半導体発光素子に関し、特に、平板部と、該
平板部の片面上に設けた柱状突起と、平板部及び柱状突
起の任意の箇所に設けた電極とから、なり、少なくとも
柱状突起内に平板部に対して垂直方向に延在するpn接
合を存し、該pn接合を含む発光部からの発光の波長を
変換する接合型半導体発光素子に関するものである。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a junction type semiconductor light emitting device that can be used as a light emitting diode or a semiconductor laser, and particularly relates to a junction type semiconductor light emitting device that can be used as a light emitting diode or a semiconductor laser. A light-emitting section consisting of a protrusion, an electrode provided at an arbitrary location on the flat plate part and the columnar protrusion, and having a pn junction extending perpendicularly to the flat plate part in at least the columnar protrusion, and including the pn junction. This invention relates to a junction type semiconductor light emitting device that converts the wavelength of light emitted from a semiconductor light emitting device.
(従来の技術〕
基板(平板部)に対して垂直方向に光を放出する発光素
子は、光ファイバとの結合が容易であり、また、面発光
体として一次元或いは二次元のアレイ構造を形成するこ
とによりOA情報機器等の種々の用途が期待されること
から、半導体レーザや発光ダイオードの研究分野におい
て開発が進められてきており、近年、多種類のものが実
用されている。(Prior art) A light emitting element that emits light in a direction perpendicular to a substrate (flat plate part) can be easily coupled with an optical fiber, and can also be used as a surface light emitter to form a one-dimensional or two-dimensional array structure. As a result, various applications such as OA information equipment are expected, and therefore development has been progressing in the research field of semiconductor lasers and light emitting diodes, and in recent years, many types have been put into practical use.
(発明が解決しようとする問題点〕
基板に対して垂直方向に形成した柱状突起内のpn接合
により基板に対して垂直方向に光を放出する接合型半導
体発光素子の基本的な構造例は、第4図に示す如く、平
板部(B)と、その片面上に設けた柱状突起(P)と、
柱状突起(P)の側周面および平板部(B)の上面に設
けたp側電極(El)と、平板部(B)の下面に設けた
n側電極(E2)とからなるものである、柱状突起(P
)内には平板部(B)に対して垂直方向に延在するpn
接合r’N1が、また平板部(B)内には該平板部(B
)に対して平行方向に延在するpn接合1)N2が存在
している。そして、電極(El)、([!2)間に電流
を注入してpn接合PNIにより平板部(B)に対して
垂直方向の光を得られるようにしである。(Problems to be Solved by the Invention) A basic structural example of a junction type semiconductor light emitting device that emits light in a direction perpendicular to the substrate by a pn junction in a columnar protrusion formed perpendicularly to the substrate is as follows. As shown in FIG. 4, a flat plate part (B), a columnar projection (P) provided on one side thereof,
It consists of a p-side electrode (El) provided on the side peripheral surface of the columnar projection (P) and the top surface of the flat plate part (B), and an n-side electrode (E2) provided on the bottom surface of the flat plate part (B). , columnar process (P
) is a pn extending perpendicularly to the flat plate part (B).
There is a joint r'N1 in the flat plate part (B), and in the flat plate part (B)
) there is a pn junction 1) N2 extending in a direction parallel to . Then, a current is injected between the electrodes (El) and ([!2) so that light in the direction perpendicular to the flat plate part (B) can be obtained by the pn junction PNI.
このような発光素子は、本来、従来の平板部に平行に発
光する構造の発光素子や平板部に垂直に発光する構造の
面発光素子よりも光の集束性に優れており、光ファイバ
と効率良く結合することができるものである。Such light-emitting devices inherently have better light focusing properties than conventional light-emitting devices that emit light parallel to the flat plate, or surface-emitting devices that emit light perpendicular to the flat plate, and are more efficient than optical fibers. It can be combined well.
ところで、この種の発光素子は、発光するという目的か
らその材料としてガリウムーヒ素(GaAs)を用いた
ものが大半を占める。GaAsを使用する理由として、
まず第1に材料費が安くしかも安定して供給されること
、第2に反応性イオンエツチングや反応性イオンビーム
エツチングを行い易いことがあげられる。By the way, most of this type of light emitting elements use gallium-arsenide (GaAs) as a material for the purpose of emitting light. The reason for using GaAs is
Firstly, materials are inexpensive and can be supplied stably, and secondly, reactive ion etching and reactive ion beam etching can be easily performed.
しかしながら、GaAsは禁止帯幅が狭く、発光の波長
が0.91〜0.98wと長く赤外線放射であるので、
発光を視覚できない。そのため、G、jA!lからなる
発光素子を発光ダイオードや半導体レーザとして用いる
場合には支障ないが、たとえば発光素子を一次元または
二次元のアレイ構造に形成(アレイ化)してディスプレ
イ装置等に使用する場合には発光を可視光線に変換する
必要があるが、そのような具体的手段を施した前記発光
素子は未だ提供されていないのが実情である。However, GaAs has a narrow bandgap and emitted light with a long wavelength of 0.91 to 0.98W, which is infrared radiation.
I can't see the luminescence. Therefore, G, jA! There is no problem when using a light-emitting element consisting of L as a light-emitting diode or a semiconductor laser, but for example, when the light-emitting element is formed into a one-dimensional or two-dimensional array structure (arrayed) and used for a display device, etc. It is necessary to convert the light into visible light, but the reality is that no light-emitting device has yet been provided with such specific means.
従って本発明の目的は、単独でまたは複数個をアレイ化
してディスプレイ装置としても使用できるように発光部
からの発光の波長を変換する接合型半導体発光素子を提
供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a junction type semiconductor light emitting device that converts the wavelength of light emitted from a light emitting part so that it can be used alone or in an array as a display device.
前記目的は、平板部と、該平板部の片面上に設けた柱状
突起と、平板部及び柱状突起の任意の箇所に設けた電極
とからなり、少なくとも柱状突起内に平板部に対して垂
直方向に延在するpn接合を有する接合型半導体発光素
子において、柱状突起の頂上面に露出するpn接合を含
む発光部の少なくとも一部分を覆う螢光層を該頂上面に
設けてなることを特徴とする接合型半導体発光素子によ
り達成される。The object consists of a flat plate part, a columnar protrusion provided on one side of the flat plate part, and an electrode provided at any location on the flat plate part and the columnar protrusion. A junction type semiconductor light emitting device having a pn junction extending to the columnar protrusion, characterized in that a phosphor layer is provided on the top surface of the columnar protrusion to cover at least a portion of the light emitting portion including the pn junction exposed on the top surface. This is achieved by a junction type semiconductor light emitting device.
ところで、上記のような接合型半導体発光素子は、平板
部に対して垂直方向に延在するpn接合(pn接合PN
I)による光を得ることをその本来の目的とするもので
あり、平板部に対し゛ζ平行方向に延在するpn接合(
pn接合PN2)は存在しないか、または存在してもで
きるだけ発光しないように様々な工夫をすることが好ま
しい、たとえば1つの工夫として、柱状突起内及び平板
部内にpn接合を形成する際に平板部の上部表面をマス
キングして不純物の拡散を行えば、平板部内に水平方向
に延在するpn接合PN2が実質的に形成されない接合
型半導体発光素子を得ることができる。By the way, the junction type semiconductor light emitting device as described above has a pn junction (pn junction PN
The original purpose is to obtain light by I), and the pn junction (
It is preferable that the pn junction PN2) does not exist, or even if it does exist, various measures are taken to prevent it from emitting light as much as possible.For example, as one measure, when forming a pn junction in the columnar protrusion and the flat plate part, it is preferable to By masking the upper surface of the substrate and diffusing impurities, it is possible to obtain a junction type semiconductor light emitting device in which a pn junction PN2 extending horizontally within the flat plate portion is not substantially formed.
本発明においてはかかる構造の接合型半導体発光素子を
使用することが好ましい。In the present invention, it is preferable to use a junction type semiconductor light emitting device having such a structure.
また、螢光層は柱状突起内の発光部からの発光の波長、
即ち柱状突起の構成材料としてよく使用されるGaAs
の場合にはその発光波長0.91〜0.98p”を他の
波長に変換するためのもので、その螢光体としでは、放
射される発光(G、IASの場合は赤外線)の刺激によ
って螢光を発するものを用いる必要がある0発光を可視
光に変換する螢光体としては、たとえば可視光線のうち
赤色に変換する場合は、Yo、t4Ybe、zsEro
、oloCI (発光波長0.66P)、緑色では、Y
e、 54Yb+、’ +5Ero、 r+ F s
(発光波長0.55戸)、青色は、Y @、 1sY
bo、 5sTlo、。。1 F、(発光波長0.47
pJを用いればよく、用途に応じて使い分ければよい。In addition, the fluorescent layer has a wavelength of light emitted from the light emitting part within the columnar protrusion.
That is, GaAs, which is often used as a constituent material of columnar projections,
In the case of , it is used to convert the emission wavelength of 0.91 to 0.98p" into another wavelength, and as a phosphor, it is used to convert the emission wavelength 0.91 to 0.98p" into another wavelength. For example, when converting visible light to red, Yo, t4Ybe, zsEro are used as phosphors for converting 0 emission into visible light.
, oloCI (emission wavelength 0.66P), green, Y
e, 54Yb+,' +5Ero, r+F s
(emission wavelength 0.55 units), blue color is Y @, 1sY
bo, 5sTlo,. . 1 F, (emission wavelength 0.47
pJ may be used, and it may be used appropriately depending on the purpose.
本発明の接合型半導体発光素子は、柱状突起の頂上面に
設けた螢光層によりGaAs活性層からの発光の波長を
変換する。The junction type semiconductor light emitting device of the present invention converts the wavelength of light emitted from the GaAs active layer by a phosphor layer provided on the top surface of the columnar projection.
以下、本発明の接合型半導体発光素子の実施例を図面に
基づいて説明する。Embodiments of the junction type semiconductor light emitting device of the present invention will be described below based on the drawings.
第1図及び第2図は本発明の接合型半導体発光素子の一
実施例を示す。この実施例の接合型半導体発光素子は、
その材料としてG’aAsを用い、ディスプレイ装置等
に使用できるようにGaAsの発光を可視光に変換する
もので、螢光体としては前述に例示のうち任意のものを
選定すればよい0図から明らかなように、この発光素子
は、基Fi、(Bl)と上部Jig (B2)からなる
二層構造を有する平板部(B)と、その平板部(B)の
片面上に設けた円柱状突起(P)と、円柱状突起(P)
の側周面及び平板部(B)の上面に設けたp側電極([
B1)と、平板部(B)の下面に設けたn側電極(B2
)と、円柱状突起(P)の頂上面の全面に形成したSi
02層(5)と、この5iot層(5)上に設けた螢光
層(7)と、平板部(B)の上面と電極(El)との間
に介在させた絶縁層(10)とで構成されている。FIGS. 1 and 2 show an embodiment of the junction type semiconductor light emitting device of the present invention. The junction type semiconductor light emitting device of this example is:
G'aAs is used as the material, and the light emitted by GaAs is converted into visible light so that it can be used in display devices, etc. As the phosphor, any one of the examples shown above can be selected. As is clear, this light emitting element has a flat plate part (B) having a two-layer structure consisting of a base Fi, (Bl) and an upper part Jig (B2), and a cylindrical part provided on one side of the flat plate part (B). Protrusion (P) and cylindrical protrusion (P)
The p-side electrode ([
B1) and the n-side electrode (B2
) and Si formed on the entire top surface of the cylindrical protrusion (P).
02 layer (5), a fluorescent layer (7) provided on this 5iot layer (5), and an insulating layer (10) interposed between the upper surface of the flat plate part (B) and the electrode (El). It consists of
円柱状突起(P)内には、平板部(B)に対して垂直方
向に延在する円筒状のpn接合PNIが形成されている
が、平板部(B)内には、該平板部(B)に対して平行
方向に延在するpn接合PN2は形成されていないので
、電極(El)、(B2)間に電流を注入した場合、p
n接合PNIにより実質的に平板部(B)に対して垂直
方向のみに発光し、しかも絶縁層(10)を設けること
により、平板部(B)の上面の電極(El)から電極(
B2)に向かって平板部(B)を垂直方向に横切る電流
を流れないようにすることができ、円柱状突起(P)の
側周面の電極(El)からpn接合r’N1を横切って
電極(B2)に向かって流れる電流の注入効率を向上さ
せることになる。A cylindrical pn junction PNI extending perpendicularly to the flat plate part (B) is formed in the cylindrical projection (P); Since the pn junction PN2 extending parallel to B) is not formed, when a current is injected between the electrodes (El) and (B2), p
The n-junction PNI emits light only in the direction substantially perpendicular to the flat plate part (B), and by providing the insulating layer (10), the electrode (El) on the upper surface of the flat plate part (B) is connected to the electrode (
It is possible to prevent the current from flowing vertically across the flat plate part (B) toward B2), and from the electrode (El) on the side peripheral surface of the cylindrical projection (P) across the p-n junction r'N1. This improves the injection efficiency of the current flowing toward the electrode (B2).
この構造の発光素子は、円柱状突起(P)内の発光部か
らの発光波長を他の波長に変換するために、円柱状突起
(P)の頂上面に露出する発光部を覆う螢光層(7)を
該頂上面の全面に形成した5rOt層(5)を介して設
けであるので、赤外線を可視光線に変換することができ
る。従って、この発光素子を一次元または二次元のアレ
イ構造にすることにより、OA情報機器等の精密なディ
スプレイ装置を提供することができ、実用上極めて有用
なものである。A light emitting element with this structure has a phosphor layer that covers the light emitting part exposed on the top surface of the cylindrical projection (P) in order to convert the wavelength of light emitted from the light emitting part within the cylindrical projection (P) into another wavelength. (7) is provided through the 5rOt layer (5) formed on the entire surface of the top surface, so infrared rays can be converted into visible light. Therefore, by forming this light-emitting element into a one-dimensional or two-dimensional array structure, it is possible to provide a precision display device for OA information equipment, etc., which is extremely useful in practice.
次に第1図に示した構造の発光素子の製造方法の一例を
、GaAsを基板としその基板上にA J GaAsを
エピタキシャル成長させて^j! GaAsによる波長
の発光を可視光に変換する場合について簡潔に説明する
。Next, an example of a method for manufacturing a light emitting device having the structure shown in FIG. 1 is to use GaAs as a substrate and epitaxially grow A J GaAs on the substrate. A case in which light emission of a wavelength by GaAs is converted into visible light will be briefly described.
まず、n型GaAs基板(81)上に、円柱状突起(P
)を形成するためのn型A 1 xGa+−、Asエピ
タキシャル成長層を形成し、このエピタキシャル成長層
をたとえば反応性イオンエツチング法によりイオンエツ
チングして円柱状突起(P)を形成する。当該円柱状突
起(P)を切り出したエピタキシャル成長層の残余部分
が図に示した上部JlI (B2)となる、この上部層
(B2)は必ずしも必須ではなく、基板(B1)に至る
まで円柱状突起(P)を切り出しても構わない。次に、
円柱状突起(P)の頂上面及び上部層(B2)の表面を
マスク状態に、かつ円柱状突起(P)の側周面を非マス
ク状態にした後に、p型の不純物(好適には亜鉛)の拡
散を行って、円柱状突起(P)内に円筒状のpn接合P
NIを形成する。First, a cylindrical protrusion (P
) to form an n-type A 1 xGa+-, As epitaxial growth layer, and this epitaxial growth layer is ion-etched using, for example, a reactive ion etching method to form a cylindrical protrusion (P). The remaining part of the epitaxial growth layer from which the cylindrical protrusion (P) is cut out becomes the upper JlI (B2) shown in the figure. This upper layer (B2) is not necessarily essential, and the cylindrical protrusion extends all the way to the substrate (B1). You may cut out (P). next,
After masking the top surface of the columnar projection (P) and the surface of the upper layer (B2) and leaving the side peripheral surface of the columnar projection (P) in an unmasked state, a p-type impurity (preferably zinc) is added. ) to form a cylindrical pn junction P within the cylindrical protrusion (P).
Form NI.
拡散工程の後に、円柱状突起(P)の側周面及び頂上面
と上部層(B2)の上面にp側電極(El)を、また基
板(B1)の下面にn側電極(B2)を設ける。その後
、不必要な電極材料及びマスク層をリフトオフ法により
除去することにより、円柱状突起(P)内に基板(B1
)に対して垂直方向に延在するpn接合PNIのみを有
し、かつ平板部(B)内にpn接合PN2を有しない発
光ダイオードとして使用することのできる接合型半導体
発光素子が製造される。After the diffusion process, a p-side electrode (El) is placed on the side peripheral surface and top surface of the cylindrical projection (P) and the top surface of the upper layer (B2), and an n-side electrode (B2) is placed on the bottom surface of the substrate (B1). establish. Thereafter, by removing unnecessary electrode materials and mask layers by a lift-off method, the substrate (B1
) A junction type semiconductor light emitting device is manufactured which can be used as a light emitting diode having only a pn junction PNI extending in a direction perpendicular to the plate portion (B) and not having a pn junction PN2 in the flat plate portion (B).
発光素子の製造後に、円柱状突起(P)の頂上面に前述
の発光を可視光に変換する螢光体のうち任意のものを塗
布すれば、第1図に示した発光波長を他の波長に変換す
ることのできる螢光層(7)を有する接合型半導体発光
素子を製造することができる。After manufacturing the light-emitting element, if any of the aforementioned phosphors for converting light emission into visible light is coated on the top surface of the cylindrical protrusion (P), the light emission wavelength shown in Fig. 1 can be changed to other wavelengths. It is possible to produce a junction type semiconductor light emitting device having a fluorescent layer (7) that can be converted into a phosphor layer (7).
上述の実施例の発光素子は、基板上に基板と同じ材料の
エピタキシャル成長層を設けたものであるが、基板のみ
でも発光素子として使用できる。Although the light emitting device of the above-mentioned embodiment has an epitaxially grown layer of the same material as the substrate provided on the substrate, the substrate alone can also be used as a light emitting device.
しかしながら、一層強力な発光を得るためにはエピタキ
シャル成長層を設けることが好ましい。また螢光N(7
)は、円柱状突起(P)の頂上面の全面に設ける必要は
なく、頂上面に露出する発光部の少なくとも一部を覆え
ば発光の波長を変換することができるが、変換の効率か
らすると発光部の全体を覆うように設けることがより好
ましい。However, in order to obtain even stronger light emission, it is preferable to provide an epitaxially grown layer. Also, fluorescent N (7
) does not need to be provided on the entire top surface of the cylindrical projection (P), and the wavelength of the emitted light can be converted by covering at least a part of the light emitting part exposed on the top surface, but from the viewpoint of conversion efficiency, It is more preferable to provide it so as to cover the entire light emitting part.
さらに螢光層(7)は、円柱状突起(P)の頂上面にS
tO,層(5)を形成してこの5ift層(5)上に設
ける必要はなく、円柱状突起(P)の頂上面に直接に設
けても構わない。Furthermore, a fluorescent layer (7) is formed on the top surface of the cylindrical projection (P).
It is not necessary to form the 5ift layer (5) and provide it on the 5ift layer (5), and it may be provided directly on the top surface of the cylindrical projection (P).
上記の事項を考慮した発光素子を第3図に示す。FIG. 3 shows a light emitting device that takes the above matters into consideration.
この実施例の発光素子は、螢光層(7)が510m層(
5)を介さずにかつ円柱状突起(P)の頂上面の全面に
設けられずに、頂上面に露出する発光部のみを覆う環状
を呈し、平板部(B)が基板のみからなり、この基板か
ら円柱状突起(P)が形成されたものである以外は第1
図に示した発光素子と同一であり、発光部からの発光を
可視光に変換することができる。 一
本発明において、電極(El)、(B2)は、実施例に
示す位置および大きさに特定されるものではなく、任意
の位置に(■意の大きさで設けることができる。また、
pn接合の形成方法については、特に制限を要せず、例
えば不純物の拡散法、p(またはn)型半導体層とn(
またはp)型半導体層のエピタキシャル気相成長法(こ
の場合は、異種接合することも可能である)、或いはそ
の他の方法であってもよい。In the light emitting device of this example, the phosphor layer (7) has a 510 m layer (
5) It is not provided on the entire top surface of the cylindrical projection (P), but has an annular shape that covers only the light emitting part exposed on the top surface, and the flat plate part (B) consists only of the substrate, and this The first except that the cylindrical protrusion (P) is formed from the substrate.
It is the same as the light emitting element shown in the figure, and can convert light emitted from the light emitting part into visible light. In the present invention, the electrodes (El) and (B2) are not limited to the positions and sizes shown in the examples, but can be provided at arbitrary positions (■) and with any desired size.
There are no particular restrictions on the method for forming the pn junction, such as impurity diffusion, p (or n) type semiconductor layer and n (
Alternatively, epitaxial vapor phase growth of a p) type semiconductor layer (in this case, heterojunction is also possible), or other methods may be used.
本発明においては、垂直発光に寄与するpn接合PNI
の長さは、柱状突起(P)の高さを大きくすることによ
り長くすることができるので、柱状突起(P)の高さは
少なくとも2P、特に少なくとも10Pとすることが好
ましい。半導体ウェハの表面上に柱状突起(P)を形成
することは、たとえば反応性イオンエツチング法により
可能であり、しかして高さ数十〜数百戸の柱状突起(P
)を有する本発明の発光素子が容易に製造できる。In the present invention, a pn junction PNI that contributes to vertical light emission is used.
The length of can be increased by increasing the height of the columnar projection (P), so it is preferable that the height of the columnar projection (P) is at least 2P, particularly at least 10P. It is possible to form columnar protrusions (P) on the surface of a semiconductor wafer by, for example, reactive ion etching.
) can be easily manufactured.
本発明に関して、柱状突起(P)における「垂直方向」
の意味は平板部(B)に対して角度90゜の直角方向の
みと限定的に解釈する必要はなく、基板に対して90°
より多少大きい、または小さい傾斜角度を有する場合も
含まれる。たとえば、柱状突起(P)の全体、もしくは
その内部に形成された同軸円筒状pn接合PNIのみを
、下部の直径を大きくした円錐台状等に形成し、光ファ
イバに対して一層結合し易いように出力光を集束させる
もよく、あるいは逆に上記とは逆の円錐台状とし、使用
目的に応じて適度に発散させるもよい。Regarding the present invention, the "vertical direction" in the columnar projection (P)
There is no need to limit the meaning of the term to mean only a direction perpendicular to the flat plate part (B) at an angle of 90°;
This also includes cases where the angle of inclination is somewhat larger or smaller. For example, the entire columnar projection (P) or only the coaxial cylindrical pn junction PNI formed inside the columnar projection (P) may be formed into a truncated conical shape with a larger diameter at the bottom to make it easier to couple to the optical fiber. The output light may be converged, or conversely, the output light may be formed into a truncated cone shape, which is the opposite of the above, and may be appropriately diverged depending on the purpose of use.
本発明の接合型半導体発光素子に用いる発光材料として
は、■−v族化合物半導体であるGaAs、GaP5
AJGaAs、 InP s InGaAsP
、 InGaP、 InAjlP。The light-emitting materials used in the junction type semiconductor light-emitting device of the present invention include GaAs, GaP5, which are ■-v group compound semiconductors.
AJGaAs, InPs InGaAsP
, InGaP, InAjlP.
GaAsP s GaN 、 InAsP 、 InA
sSb等、II−Vl族化合物半導体であるZn5e
% ZnS s ZnO、CdSe、 CdTe等、T
V−Vl族化合物半導体であるPbTe 、 Pb5n
Te。GaAsP s GaN, InAsP, InA
Zn5e, which is a II-Vl group compound semiconductor such as sSb
% ZnS ZnO, CdSe, CdTe etc., T
PbTe, Pb5n, which are V-Vl group compound semiconductors
Te.
Pb5nSe等、更にIV−rV族化合物半導体である
SiC等があり、それぞれの材料の長所を活かして適用
することが可能である。There are materials such as Pb5nSe, and SiC, which is a group IV-rV compound semiconductor, and each material can be applied by taking advantage of its advantages.
上記より明らかなように、本発明の接合型半導体発光素
子は、平板部に対して垂直方向に延在するp 、n接合
を有する柱状突起の頂上面に露出するpn接合を含む発
光部の少なくとも一部分を覆う螢光層を該頂上面に設け
たことにより、発光部からの発光の波長を他の波長に変
換することができ、たとえば発光を可視光に変換する螢
光体からなる螢光層を設けた場合には発光を視覚化でき
るので、アレイ構造とすることにより精密なディスプレ
イ装置等を提供することができ、実用上極めて有用なも
のである。As is clear from the above, the junction type semiconductor light emitting device of the present invention has at least one light emitting portion including a pn junction exposed on the top surface of a columnar protrusion having p and n junctions extending perpendicularly to the flat plate portion. By providing a fluorescent layer covering a part of the top surface, the wavelength of the light emitted from the light emitting part can be converted to another wavelength, for example, a fluorescent layer made of a phosphor that converts the light emission into visible light. Since the light emission can be visualized by providing an array structure, it is possible to provide a precise display device, etc., which is extremely useful in practice.
第1図は本発明の接合型半導体発光素子の一実施例の斜
視図、第2図は第1図に示した発光素子の断面図、第3
図は本発明の接合型半導体発光素子の別の実施例の断面
図である。FIG. 1 is a perspective view of one embodiment of the junction type semiconductor light emitting device of the present invention, FIG. 2 is a sectional view of the light emitting device shown in FIG. 1, and FIG.
The figure is a sectional view of another embodiment of the junction type semiconductor light emitting device of the present invention.
Claims (1)
部及び柱状突起の任意の箇所に設けた電極とからなり、
少なくとも柱状突起内に平板部に対して垂直方向に延在
するpn接合を有する接合型半導体発光素子において、
柱状突起の頂上面に露出するpn接合を含む発光部の少
なくとも一部分を覆う螢光層を該頂上面に設けてなるこ
とを特徴とする接合型半導体発光素子。Consisting of a flat plate part, a columnar projection provided on one side of the flat plate part, and an electrode provided at any location on the flat plate part and the columnar projection,
In a junction type semiconductor light emitting device having a pn junction extending in a direction perpendicular to a flat plate part in at least a columnar projection,
1. A junction type semiconductor light emitting device comprising a phosphor layer provided on the top surface of a columnar protrusion to cover at least a portion of a light emitting section including a pn junction exposed on the top surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61031573A JPS62189770A (en) | 1986-02-15 | 1986-02-15 | Junction-type semiconductor light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61031573A JPS62189770A (en) | 1986-02-15 | 1986-02-15 | Junction-type semiconductor light emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62189770A true JPS62189770A (en) | 1987-08-19 |
Family
ID=12334915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61031573A Pending JPS62189770A (en) | 1986-02-15 | 1986-02-15 | Junction-type semiconductor light emitting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62189770A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0462196U (en) * | 1990-10-04 | 1992-05-28 | ||
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US6608332B2 (en) | 1996-07-29 | 2003-08-19 | Nichia Kagaku Kogyo Kabushiki Kaisha | Light emitting device and display |
US6614179B1 (en) | 1996-07-29 | 2003-09-02 | Nichia Kagaku Kogyo Kabushiki Kaisha | Light emitting device with blue light LED and phosphor components |
US7615795B2 (en) | 1996-03-26 | 2009-11-10 | Cree, Inc. | Solid state white light emitter and display using same |
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-
1986
- 1986-02-15 JP JP61031573A patent/JPS62189770A/en active Pending
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JPH0462196U (en) * | 1990-10-04 | 1992-05-28 | ||
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US7329988B2 (en) | 1996-07-29 | 2008-02-12 | Nichia Corporation | Light emitting device with blue light LED and phosphor components |
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US9130130B2 (en) | 1996-07-29 | 2015-09-08 | Nichia Corporation | Light emitting device and display comprising a plurality of light emitting components on mount |
US7026756B2 (en) | 1996-07-29 | 2006-04-11 | Nichia Kagaku Kogyo Kabushiki Kaisha | Light emitting device with blue light LED and phosphor components |
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US9739444B2 (en) | 2007-03-05 | 2017-08-22 | Intematix Corporation | Light emitting diode (LED) based lighting systems |
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US10204888B2 (en) | 2011-04-13 | 2019-02-12 | Intematix Corporation | LED-based light sources for light emitting devices and lighting arrangements with photoluminescence wavelength conversion |
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