JPS6185174U - - Google Patents

Info

Publication number
JPS6185174U
JPS6185174U JP16962084U JP16962084U JPS6185174U JP S6185174 U JPS6185174 U JP S6185174U JP 16962084 U JP16962084 U JP 16962084U JP 16962084 U JP16962084 U JP 16962084U JP S6185174 U JPS6185174 U JP S6185174U
Authority
JP
Japan
Prior art keywords
semiconductor laser
laser device
view
heat sink
fixing means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16962084U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16962084U priority Critical patent/JPS6185174U/ja
Publication of JPS6185174U publication Critical patent/JPS6185174U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第5図は本考案半導体レーザ装置の
実施の一例を示すもので、第1図が全体の分解斜
視図、第2図はステムとそれに固定されたヒート
シンクを示すところの第1図の2−2線に沿う断
面図、第3図は半導体レーザの拡大斜視図、第4
図は半導体レーザ装置の断面図、第5図がキヤツ
プ取付面における半導体レーザ装置の平面図、第
6図は半導体レーザ装置の一つの従来例を示す分
解斜視図である。 符号の説明、1…ステム、6…ヒートシンク、
7…固定手段、10…半導体レーザ。
1 to 5 show an example of the implementation of the semiconductor laser device of the present invention, in which FIG. 1 is an exploded perspective view of the entire device, and FIG. 2 is a first diagram showing a stem and a heat sink fixed thereto. Figure 3 is an enlarged perspective view of the semiconductor laser; Figure 4 is a cross-sectional view taken along line 2-2;
5 is a sectional view of the semiconductor laser device, FIG. 5 is a plan view of the semiconductor laser device on a cap mounting surface, and FIG. 6 is an exploded perspective view showing one conventional example of the semiconductor laser device. Explanation of symbols, 1...Stem, 6...Heat sink,
7... Fixing means, 10... Semiconductor laser.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ステムにリベツト等の固定手段を介して固手さ
れたヒートシンクに半導体レーザがボンデイング
されてなることを特徴とする半導体レーザ装置。
A semiconductor laser device characterized in that a semiconductor laser is bonded to a heat sink fixed to a stem via a fixing means such as a rivet.
JP16962084U 1984-11-08 1984-11-08 Pending JPS6185174U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16962084U JPS6185174U (en) 1984-11-08 1984-11-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16962084U JPS6185174U (en) 1984-11-08 1984-11-08

Publications (1)

Publication Number Publication Date
JPS6185174U true JPS6185174U (en) 1986-06-04

Family

ID=30727342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16962084U Pending JPS6185174U (en) 1984-11-08 1984-11-08

Country Status (1)

Country Link
JP (1) JPS6185174U (en)

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