JPS61188957A - Manufacture of circuit module - Google Patents

Abstract

PURPOSE:To obtain a circuit module of the same extremely thin degree as the thickness of a chip type electronic parts by mounting in the shape that the parts are effectively buried in a substrate made of cured resin. CONSTITUTION:A silicone resin film 2 is obtained on a glass plate 1, gelled to impart adhesive and mold releasing properties to the surface as a support 3. Electrodes 4, 5 sides are disposed at the prescribed positions on the support 3 of drawn trapezoidal or semicircular-sectional cylindrical chip type electronic parts 6-8. Spacers 9 made of Teflon are disposed, ultraviolet curable resin 10 is molded around the parts 6-8 on the support 3 in this state, a flat plate 11 made, for example, Teflon is coated thereon, and ultraviolet ray is emitted to cure the resin 10. Then, the support 3, the plate 11 and the spacers 9 are separated to obtain the parts 6-8 buried in a substrate 12. Then, silver paste is screen printed to form a desired conductor pattern 13.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing a circuit module in which chip-type electronic components are mounted on a substrate.

[Technical background of the invention and its problems]

Conventionally, as a mounting method for IC chips and other chip-type electronic components, a circuit pattern is formed by selectively etching a steel foil-covered resin substrate to form a circuit pattern on a printed wiring board or a ceramic substrate such as alumina by thick film printing. A method is often used in which electronic components are connected to a thick film printed wiring board on which electronic components are formed using soldering or conductive adhesive.

However, in principle, the thickness of the obtained circuit module can be less than the sum of the thickness of the board and the components, so this method is not suitable for realizing circuit modules in electronic devices that are becoming thinner and thinner. is insufficient. In addition, in this method, the process of forming the thick-film printed wiring board and the process of mounting chip-type electronic components on the board are completely independent processes, so the manufacturing process for the entire circuit module is extremely complicated. There are problems in that it takes time and there is a limit to the reduction in manufacturing costs.

[Purpose of the invention]

Objective L1 of the present invention: It is possible to reduce the thickness to a thickness equal to or close to that of a chip-type component, and it is also possible to simultaneously form a conductor pattern on a uniform board and connect electronic components. The object of the present invention is to provide a method for manufacturing a circuit module which has a simple manufacturing process and takes a short time to manufacture.

[Summary of the invention]

In order to achieve this object, the present invention first places a chip-type electronic component having a narrowed shape on the electrode side at a predetermined position on a support with the electrode terminal forming surface of the electronic component facing the surface of the support, A liquid resin made of, for example, an ultraviolet curable resin is cast around the chip-type electronic component, a covering member is placed on the liquid resin, and then the liquid resin is cured. At this time, if an ultraviolet curing resin is used as the support, a glass plate, polyethylene terephthalate resin, polycarbonate resin, vinyl chloride resin, polyethylene resin, tetrafluoroethylene resin, etc.
A translucent material such as hexafluoropropylene resin, polystyrene resin, or polyethylene resin is used. In addition, the support must have adhesive properties in order to fix the chip-type electronic component, and for this purpose, preferably a film with releasability is formed so that the support can be peeled off in the next step. Ru. Suitable materials for this coating include, for example, gel-like silicone resin, acetic acid-ethylene copolymer, and heated polyethylene film.

Next, the support is peeled off. At this time, since the electronic component has a narrowed shape on the electrode side, the electronic component will not fall off when the support is peeled off.

In this way, after peeling off the support, a conductor pattern is formed on the surface of the substrate made of cured resin that was facing the support, and on the conductor pattern and the chip-type electronic component exposed on the surface of the substrate. Connect to the terminal. Here, when the coating member to be placed on the liquid resin is to be peeled off from the cured resin together with the support, a fluororesin sheet such as a Teflon sheet or a Teflon-treated coating may be used to improve releasability. A resin sheet with a silicone resin coating or a silicone resin coating formed on the same material as the support is used. On the other hand, if the member is not to be peeled off from the cured resin, the material should be heated at 150°C to 180°C.
Any material that has a heat resistance of 1 may be used, and for example, glass epoxy plates, BT resin f plates, PES resins, PEEK resins, polycarbonate resins, polysulfone resins, polyphenylene sulfide resins, polyphenylene oxide resins, etc. are used. Further, a ceramic plate, a metal plate, etc. may be used as necessary.

As a method for forming the conductive pattern, since the terminal surface of the chip-type electronic component and the surface of the substrate are on the same plane, screen printing, offset printing, a drawing method using a dispenser, etc. can be used. It is also possible to form a conductor pattern by a photographic method in which a metal thin film layer is formed and selectively etched using a photosensitive resin. The conductor material used for the conductor pattern is a thermosetting resin such as epoxy resin or phenol resin as a binder.
Then, 1 m of gold, silver, nickel, tungsten, molybdenum, platinum, aluminum, tin, and other metal powders, alloys or composite powders containing these as main components, or semiconductor powders such as carbon powder and vanadium pentoxide powder are kneaded. You can also use a paste made from the same ingredients.

〔Effect of the invention〕

According to the present invention, since the chip-type electronic component is mounted in a form that is reliably embedded in the substrate made of hardened resin,
A conductor pattern is formed on this board by printing, etc., and at the same time connection is made with the terminal of the chip type electronic component.
can. Therefore, it is possible to obtain an extremely thin circuit module whose thickness is approximately the same as that of a chip-type electronic component. Furthermore, in the manufacturing process, the board is formed by curing the liquid resin, and as mentioned above, the formation of the conductor pattern and the terminal connection of the chip-type α-child component are performed simultaneously, so that the wiring board is formed and Compared to the conventional method of mounting electronic components separately, this method is significantly simpler and allows circuit modules to be obtained in a shorter time, thereby significantly reducing manufacturing costs.

[Implementation sequence of the invention]

FIG. 1 shows the manufacturing process of a circuit module according to an embodiment of the present invention. First, as shown in Figure 1(a), the thickness is 3 m.
A silicone resin (manufactured by Toshiba Silicon Co., Ltd. 'f'5E3Q51) was coated with a spinner on a glass plate with a size of about
The support 3 is obtained by heating at 15° C. for 15 minutes to gel it and impart adhesiveness and releasability to the surface. And the second
As shown in FIGS.
, 8.3371 As shown in Figure (b), power is distributed to a predetermined position on the support 3.

A chip mounter was used to place these parts. Note that Fig. 2 shows a resistor, Fig. 3 shows a capacitor, and Fig. 4 shows a transistor.

Next, as shown in FIG. 1(C), a spacer 9 made of Teflon with a thickness of about 2rnrn is placed around the support 3, and in this state, each chip m and the electronic components 6 to 6 on the support 3 are placed.
An ultraviolet curable resin 10 is cast around 8, and further covered with a flat plate 11 made of Teflon, for example. Then, ultraviolet rays are irradiated from the side of the support 3 to cure the ultraviolet curing resin 10. This cured ultraviolet curable resin becomes the substrate of the circuit module.

Next, by peeling off the support 3, the flat plate 11, and the spacer 9, the chip-type electronic component 6 is placed inside the substrate 12 made of a cured ultraviolet curable resin, as shown in FIG. 1(d).
~8 is embedded.

In this state, the terminals of each chip type electronic component 6 to 8 are exposed from the surface of the substrate 12.

Next, as shown in FIG. 1(e), desired conductor patterns 13 are formed by screen printing, for example, silver paste on the curtain plate 12, and these conductor patterns 1
3 and the terminals of chip type electronic components 6 to 8 are established. Thereafter, the silver paste was cured by heating at 150° C. for 1 hour to complete the @road module.

When the circuit module thus obtained was subjected to an operation test, good operation was obtained.

Figure @5 shows a circuit module according to another embodiment of the present invention, in which a glass epoxy plate with a thickness of 2 mm, for example, is used as the flat plate 11 installed on the ultraviolet curing resin, and this is used as in the previous embodiment. It is not peeled off, but is left tightly attached to the substrate 12, and is used as a reinforcing plate for the circuit module.

The present invention can be modified in various ways without departing from the scope of the invention.

[Brief explanation of drawings]

Figure 1 is a diagram for explaining the manufacturing process of a circuit module according to Embodiment 1 of the present invention; Figures 2 to 4 are diagrams showing the shape of a chip-type electronic component used in the present invention; The figure is a sectional view of a circuit module according to another embodiment of the present invention in its final step. 3...Support, 6-8...Chip type electronic component, 4゜5...Terminal, 9...Spacer, 10...UV curable resin, 11...Flat plate, 12...Hardened A substrate made of ultraviolet curing resin, 13... conductor pattern. Representative Patent Attorney Kensuke Chika (and 1 other person) No. 1
Figure 2 Figure 3 Figure 4

Claims (3)

[Claims] (1) In a method for manufacturing a circuit module in which a chip-type electronic component is mounted on a substrate, a chip-type electronic component having a narrowed shape on the electrode side is placed at a predetermined position on an adhesive support to form an electrode terminal of the electronic component. The forming surface is arranged to face the surface of the support, a liquid resin is cast around the electronic component, a covering member is placed on the liquid resin, the liquid resin is cured, and the support is then placed. After peeling off, a conductor pattern is formed on the surface of the substrate made of the cured resin that was facing the support, and the conductor pattern is connected to the electrode terminal on the chip-type electronic component. A method for manufacturing a featured circuit module. (2) The method for manufacturing a circuit module according to claim 1, wherein the chip-type electronic component has a trapezoidal cross-sectional shape. (3) The method for manufacturing a circuit module according to claim 1, wherein the chip-type electronic component has a semicylindrical cross-sectional shape.