JPS6048887B2 - Laminated magnetic material - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to laminated magnetic materials, and in particular to materials which provide structures of a quality particularly suitable for use in alternating current applications, such as transformer cores, magnetic recording heads and shielding of electric and magnetic fields. It depends.

Soft magnetic materials with high magnetic permeability are often used for transformer cores, magnetic heads, and the like.

Here, the soft magnetic material means a material that has low magnetic susceptibility and low remanence. In such cases, a soft magnetic material with high magnetic permeability is retained along with electrically insulating organic compounds to reduce eddy current losses. It is an object of the present invention to provide an improvement to this type of structure and to provide a laminated magnetic material for producing improved laminated structures. Current methods for producing high permeability laminates involve first depositing individual layers of soft magnetic material at approximately 100°C.
Heat treatment at °C gives the desired high magnetic permeability. The heat-treated soft magnetic material is manually bonded with an organic insulating compound. However, heat treatment physically softens the magnetic layer, making it more likely to curve during the bonding process.
The curvature causes non-uniformity and deterioration of the magnetic properties of the individual soft magnetic layers and the resulting structure. Furthermore, in order to provide the laminated product with good properties during medium and high frequency operation, it is desirable that the layers of magnetic material be very thin.

That is, the preferred thickness of the magnetic material layer is approximately O, 0254Trr.
It is on the order of lTL (O, 001 inches). Therefore, soft magnetic layers are typically drawn from storage in thin rolls and have an inherent bow or curvature due to the winding process. Therefore, when the magnetic layers are laminated, they are flattened, which adds additional stress and thus further impairs the magnetic uniformity and properties of the structure. Additionally, the bonding process adds additional stress and the laminated cores often become porous (spongy) due to bubbles in the organic adhesive or poor adhesion. Therefore, an object of the present invention is to provide a laminated magnetic material which has uniform magnetic permeability and coercivity, and allows the manufacture of products having very good uniform magnetic properties without the above-mentioned stresses and drawbacks. There is. During the manual gluing process described above, the soft magnetic layer is often bent so severely that the resulting laminate becomes completely unsuitable for its application.

If this type of bending is detected during manufacturing, the thin film layer is discarded. Although this increases costs somewhat,
The impact is less significant than if a bent layer were detected after manufacture and the entire finished assembly, including the laminate structure, would have to be discarded. Furthermore, laminates that do not have to be discarded are required to have relatively little bending.
Therefore, the scrap loss rate in industrial production is extremely high. Therefore, another object of the present invention is to provide a uniformly laminated magnetic material that can eliminate manual bonding steps and has a low scrap loss rate. Because of the processing difficulties described above, layers thinner than 0.02547 rgn (0.00 H inch) have not been practically usable.

This limits the frequency range in which the structure can operate satisfactorily. Therefore, another object of the present invention is to
The object is to provide a laminated magnetic material with a much thinner and softer magnetic layer. An additional object of the present invention is, of course, to provide a laminated structure for use in recording heads and the like having excellent high frequency operating characteristics. It is often required that two or more recording heads be aligned.

When used in this type of application, it is not sufficient for a pair of heads to have good operating characteristics because of the differences between their operating characteristics. Laminated magnetic material according to the present invention
Because the structures made from the . Another advantage of the present invention is that the insulating layer is much harder than the magnetic layer and therefore has significantly improved wear characteristics. Is Rukoto.

This is particularly beneficial for magnetic head applications.
In fact, in cases where there is no need to improve the structure's high frequency response characteristics, it is more important to improve its wear characteristics. This property is very important, especially if the manufacture of such structures is cheaper, more uniform and has a lower scrap rate. It is therefore another object of the present invention to provide a magnetic laminate that retains the high frequency response characteristics of commonly available devices and has better wear characteristics.
It is yet another object of the invention to provide a laminate which is compatible with the above-mentioned purpose and has the above-mentioned advantages, without requiring a thickness reduction step, a vapor deposition step or an electrodeposition step.

According to the principles of the present invention, the soft magnetic metal layers are separated by an insulating material having a substantially higher electrical resistance than the soft magnetic metal, and after the laminate is formed, the laminate is heated to the annealing temperature of the soft magnetic metal. Heating gives the soft magnetic metal the optimum magnetic permeability for the final product.

According to another principle characteristic of the invention, the layered structure is preformed in the shape of the object to be manufactured, for example by a blanking operation, prior to the heat treatment step.

In this way, the heat treatment step eliminates the internal build-up that occurs when the laminate is folded into the final product shape. If it is desired to create a shield or concentration of the electric field, a highly conductive shielding material, such as copper, is disposed between one or more adjacent magnetic layers.

This is particularly useful, for example, in the case of multi-track tape heads, where adjacent head sections are separated from each other by field shields. As a result, since the magnetic layer shields the magnetic field and the conductive layer shields the electric field, both the magnetic field and the electric field are shielded, and "crosstalk" between adjacent head parts is prevented.
A composite structure that prevents this can be easily manufactured.
Alternatively, laminated shielding sections may be made individually and applied for shielding purposes in a manner quite different from recording head or transformer type implementations. From the above summary of the features of the present invention, it can be seen that high-quality laminations can be produced without the manual labor previously required, which increases cost, impairs uniformity, and decisively reduces the overall operating characteristics of the resulting product. It will be clear that a simple method of forming an article is provided by the present invention.

Furthermore, in transformer-type applications, the frequency response characteristics of the final product can be easily controlled, especially by means such as varying the thickness ratio of magnetic and insulating materials.
According to the invention, the thickness reduction step can be eliminated.

That is, the soft magnetic metal layers are separated by one or more layers which, when heated, form a high resistance layer of greater than about 10-'' ohm.alpha.
The group element is placed on a foil of group 1 metal such as aluminum and disposed between layers of soft magnetic metal. Heat and pressure are applied to the resulting laminate to completely react the materials and form a high resistance layer, such as a hard semiconductor layer, between the soft magnetic metal layers. Since the conventionally used organic adhesive is not used, the soft magnetic metal can be annealed to restore its magnetic permeability.
In this case, it is not possible to further increase the permeability by further reducing the thickness. Therefore, in this example, the high frequency response characteristics provided by the very thin soft magnetic metal layer obtained using the reduced thickness are not improved, but the uniform high permeability and A structure with good wear properties is obtained. A variation of the embodiment described above is obtained by depositing a semiconductor such as selenium onto a layer of soft magnetic metal prior to stacking it into a laminate.

The structure is then heated under pressure to bond the laminates together.
A laminate with high magnetic permeability and good wear properties is obtained. In this example, approximately 1
The elements forming a continuous layer with a resistance of 0-' ohm.a or more are deposited by plating or deposition onto the soft magnetic metal or metal foil. Objects, features and advantages of the invention will become apparent from the following description with reference to the accompanying drawings.

In the figures, the same components are indicated by the same reference numerals. It should be noted that the drawings are not drawn to scale as design drawings, but are merely drawn for illustrative purposes. Before explaining the laminated magnetic material according to the present invention, the laminated magnetic material, which is the basis of the present invention and is formed by insulating a soft magnetic material layer with an intermetallic compound forming layer, will be explained. In FIG. 2, the layer 10 of soft magnetic material is replaced by a layer 12 of a suitable insulating compound-forming material.
When the material is heated, it reacts with the soft magnetic material to form an electrically insulating compound consisting of covalently bonded elements in stoichiometric proportions, in other words, an electrically insulating metal. They form compounds called intermediate compounds. The desired number of layers 10 and 12 are built up into a sandwich structure 14 and placed within an etch-resistant casing 16 shown in FIG. The casing 16 and the enclosed sandwich structure 14 are placed in a push can 18 and a filler material 20 having the same mechanical properties as the magnetic material is placed between the sides of the can 18 and the casing 16.

An end cap (not shown) is welded to the can to close the end of the can. An exhaust pipe is disposed on one of the caps so that the can can be evacuated after the end cap is welded in place. After the can is evacuated, the exhaust pipe is tightened and closed by welding to maintain the reduced pressure inside the can 18. The structure 22 shown in FIG. 1 thus obtained is heated in a suitable manner and extruded through a laminar flow die to form layers 10 and 1.
2 decreases in thickness and is bonded by diffusion. After extrusion,
The can 18 and filler portion 20 are removed, for example by etching.

During etching, an etch-resistant casing 16 protects the reduced thickness sandwich structure 14.

FIG. 4 is a photograph of the laminated portion of the actually extruded billet. To briefly explain, it has a layer of soft magnetic material 24, and this layer is formed by the magnetic material 24 in the heat treatment process described later.
The thickness is reduced together with an intervening layer 26 of a material forming an intermetallic compound.

Here, layers 24 and 26 are, as shown by black line 28,
Diffusion coupled. The laminate shown in Figure 4 is then processed into the final product shape.

Etching is performed to remove the protrusions from the workpiece and remove any metal that may be contaminating the edges of the laminate. The extruded stock or formed component is heat treated in much the same manner as is known in the art to impart the desired high magnetic permeability and low coercivity properties. During this heat treatment step, the fourth
The diffusion shown by line 28 forms the intermetallic compound shown by bracket 30 in FIG. Magnetic material 24 in FIG. 4J is annealed to form large grain groups 32 in FIG. 5, and layer 26 in FIG.
It is located in the center layer 34 of the layer marked with . Other layers in FIG. 5, such as layers 36, 38 and 40, are first, second and third intermetallic compounds consisting of a soft magnetic material, an insulating compound-forming material, and a metal. An important feature of this laminated magnetic material is that the soft magnetic materials do not follow the regulation of simple covalent bonds, but each element is bonded in a fixed atomic ratio similar to a true chemical compound, resulting in insulating properties. is to form an intermetallic compound.

Layer 12 of FIG. 2 is preferably comprised of a metal that is difficult to melt, such as niobium, tantalum, zirconium, titanium, hafnium, or vanadium. However, the type of magnetic material used must be considered in the selection of the thin film, and whether the sandwich structure 14 should include additional layers as described below with respect to the example shown in FIG. The type of magnetic material needs to be taken into account. The hard-to-melt metals mentioned above are preferred not only because they have a high melting point and good formability, but also because they have many insulating intermetallic compounds between themselves or with soft magnetic materials in adjacent layers. This is preferable because it forms .

The phase diagram of binary intermetallic compounds is published by Matsuku Grow, New York. McGraw-HillBO
OkCO. "Compositions of Binary Alloys" by Max Hansen, published in 1958 in
ConstitutiOnOfBinaryAllOy
s) Rodney, 2nd edition and published in 196 years, also by McGrow Bill Publishers, New York. P. It is described in "Compositions of Binary Alloys" by Rodney P. ElliOt, 1st expanded edition. Intermetallic compounds and their properties are discussed in G.H., Willey & Sons, New York. Westburgsk (J.H.We
stbrOOk) Mei's "Intermetallic Compounds"
See etallicCompOunds).
The example shown in FIG. 3 is the same as the previous example except that an additional layer 44 is disposed between the layer of hard-to-weld metal 12 and the layer of magnetic material 10.

A material is selected for layer 44 that forms an intermetallic compound with the material of layer 12 and does not impair the normal magnetic properties of material 10. The soft magnetic material 10 is, for example, Hi-Mu 800 (H
yMu8OO).

This is carpenter steel. Corporation (C
arpenterSteelCOrpOratioOn)
It is a product name of 79% nickel, 16% iron and 4%
of molybdenum. This alloy is a single-phase, or solid solution, alloy with a nickel crystal structure and, with appropriate heat treatment, exhibits high magnetic permeability and low coercivity. Layer 10 is 0.1787 Tgn (0.007 inch) thick and approximately 5.08 cT wide! t (2 inches), length approx. 1
It is 2.70 cm (5 inches). Layer 12 in this example of intermetallic layered magnetic material has a thickness of about 0.0
178Tn111 (0.0007 inch) commercial grade zirconium. The relative thicknesses of layers 10 and 12 are selected to enhance the properties of the magnetic material while providing the compound metal with good electrical insulation properties within the desired operating frequency range for the final product. Thickness ratios of 10:1 to 20:1 are preferred, but lower thickness ratios may result in layer 34 in FIG. 5 of the annealed product.
The insulating compound forming material layer indicated by becomes relatively thick.

Considering the size, it is desirable that all or most of the insulating compound-forming material layer react to form an insulating intermetallic compound, in which case it corresponds to layer 34 in Figure 5. There are no layers. The Hi-Mu 800/zirconium sandwich structure 14 described above was covered with a layer of titanium, which served as an etch-resistant layer 16. The sandwich structure and the etching-resistant layer are made of low carbon steel.
Low carbon steel filling metal 2, which has metallurgical properties similar to Hi-Mu 800, is used as a filling metal. was used.
Other suitable filler metals with similar metallurgical properties to Hi-Mu 800 are copper-nickel alloys. Of course, if other types of magnetic materials are used, other types of filler metals will be used. Other examples of suitable soft magnetic materials include Van NOstrand, New York;
``Ferromagnetism'' by Richard M. BOzOrth, published in 1951 by Richard M. BozOrth, and the American Institute of Metals Handbook Committee, published in 1961 by the American Institute of Metallurgy (ASM). (MetalsH
This will become clear from pages 785 to 79 of "Metals Handbook" (MetalsHandbOOk) edited by andbOOk COmitteeOfASM).

After reducing the pressure in the device 22, it was heated to 700°C, and the temperature was 1.27°C.
The thickness of each layer is reduced and diffusion bonded by extrusion through a 112 inch (cm) laminar flow die.

The extruded billet is sprayed with a ferric chloride etching solution to remove the low carbon steel can and fill. Titanium was chosen because it is attacked by ferric chloride, leaving behind the titanium and the sandwich structure. The result of the etching process is a rectangular array with a cross section shown in the micrograph of FIG. The sandwich structure is then further rolled to 0
．． The thickness is 508 m1rL (0.020 inch). The extruded flat stock is machined into a toroid with a square cross section, the toroid is smoothed, and the edges of the laminate are treated with a hydrogen fluoride-nitric acid solution to remove metal contamination. etching.

Several toroids are then heated to 900° C. for 2 hours and allowed to cool while remaining in the furnace. As a result, the magnetic layer 32
is in a completely annealed state and becomes large grains as shown in Figure 5, resulting in "thermal twins" (wide grain width). Although not fully shown in the micrograph in Figure 5 at 1350 magnification, internal diffusion between the zirconium and Hi-Mu 800 layers results in intermetallic interactions shown in the phase diagram for the Ni-Zr system. Almost all of the compounds were formed. However, layer 40 of FIG. 5 is likely a third electrically insulating intermetallic compound of zirconium and Hi-Mu 800, and is therefore much more resistive compared to Hi-Mu 800. Some of the workpieces made from the extruded flat stores were not heat treated and both the unheated and annealed toroids were wound in the shape of a transformer using known techniques. The same configuration was used for comparison.

As a result, especially in the high frequency range. In the range, the emf on the secondary side of the transformer with the annealed toroid was much larger than the emf exhibited by the unannealed toroid at the same drive current. Moreover, transformers with annealed toroids exhibited sharp resonant frequencies due to the increased capacitive effect of the insulating intermetallic compounds found to be obtained during heat treatment. In two other examples of laminated magnetic materials made of intermetallic compounds, sandwich structures 14 were constructed according to FIG.

In one, a layer 10 of Hi-Mu 800 0.178-inch (0.007 inch) thick
n (0.0007 inch) thick titanium layer (12
) and adjacent titanium by a composite layer of approximately the same thickness of unoxidized, highly conductive copper (0FHC). It is known that copper does not cause any harm when diffused into a magnetic material made of H-Mu 800, and it is also known that copper forms an insulating intermetallic compound with titanium. was selected. Also tried replacing the titanium layer 12 with cadmium.
(The results of the experiment were equally satisfactory, and there was no need for the intermetallic compound to be formed from the magnetic material itself. Furthermore, it is necessary that intervening metals such as copper diffuse into the magnetic metal to some extent.) For example, in the Hi-Mu 800/copper-titanium example, even if less than 6% copper diffuses into the Hi-Mu 800, it has been found that the frequency response of the resulting structure is improved. It has been found that satisfactory results are obtained.The layer of copper 44 in Figure 3 should not be significantly thicker than the thickness of the layer of insulating compound forming material.

This is because as the thickness of such an unreacted layer increases, loss due to eddy current increases. Substituting nickel for copper is also substantially the same as above, and the results are also almost the same. An example of the use of laminated magnetic materials for a shielding structure is schematically shown in FIG.

The shielding sandwich structure 14S has a thicker copper layer 46 compared to the intervening layer 44 of the embodiment of FIG. This copper layer 46 is sandwiched between both adjacent titanium layers 48 and further disposed between the soft magnetic materials 10 . The thickness of the copper layer and the soft magnetic material layer is 0.178 wgn (0.007 inch), and the thickness of the titanium layer is 0.0178 wrm (0.0007 inch). The other points were manufactured in the same manner as in the above-mentioned example. However, in this case, the titanium layer 48
forms an insulating intermetallic compound with both the soft magnetic material 10 and the thick copper layer 46. These intermetallic compounds are
A compound similar to layers 36, 38 and 40 in the figure, the resulting layer is thick enough to act as an electric field shield. Therefore,
After the billet is thinned and milled out, the copper layer 46 acts as an electric field shielding layer, and the magnetic layer 10, corresponding to layer 32 in FIG. 5, acts as a magnetic field shielding layer. If the highly conductive layer 46 is used for electric field shielding, it must not be so thin that all of it reacts during the annealing process.

In practice, it should be at least three times as thick as the layer 48 of insulating compound material. It is preferable that the layer 46 that remains after the completion of the intermetallic compound generation reaction has approximately the same thickness as the remaining layer of soft magnetic material. However, as far as the shielding effect is concerned, the highly conductive layer can be made as thick as desired, provided that space constraints are met. When used for some types of shielding, it may not be necessary to insulate conductive layer 460 from soft magnetic layer 10. Therefore, in this case layer 48 is stripped. When used for shielding, the transformer structure shown in FIGS. 2 and 3 and the shielding structure are combined. That is, as shown in FIG. 7, the extruded billet forms a layer 14 of the first sandwich structure shown in FIG.
and a second sandwich structure 14S consisting of a shielding layer as shown in FIG. After thickness reduction and shaping, the parts for the transformer obtained by the sandwich structure 14 are connected to the driving or receiving magnetization circuit, while the parts for the shielding obtained by the sandwich structure 14S are not connected. By doing so, the composite structure shown in Figure 7 is eminently suitable for use as a multi-track recording head, since the shields shield the transformer parts from each other. Each section acts as a track, and the shielding adjacent to it prevents "crosstalk" from sections for other transformers. Those skilled in the art will appreciate that circuit M is shown only schematically. For example, portion 14 is indicated by the dotted line in the figure.
This does not necessarily indicate that the circuits M are connected together; the circuit M may include electrical circuit parts. The present invention proposes to use other high-resistance materials instead of the materials that react to form intermetallic compounds as described above. In one embodiment, approximately 0.0127 wrm (0.00
Arsenic was deposited to a thickness of 0.05 inch). A laminated product similar to the laminated product in Figure 2 is a soft magnetic metal (Hi-Mu 800).
and on arsenic-coated foil. Next, pressure was applied to the laminate and heated to the annealing temperature of a soft magnetic metal. The arsenic and aluminum reacted to form a semiconductor or essentially electrically insulating layer between each layer of soft magnetic metal. The resulting laminate is polished and polished prior to testing.
In other embodiments using aluminum foil, 0.0
0.016077!771 (0.00063) on 178TfrIrt (0.0007 inch) aluminum foil
An antimony layer of 1.5 inch was deposited and laminated with a soft magnetic metal.

This J laminate was heated to the annealing temperature of a soft magnetic metal.
This creates a diffusion bond between the antimony and the soft magnetic metal, and the aluminum reacts with the antimony to form a semiconductor or essentially insulating layer. Although the diffusion bonded portion is probably not insulating, the resulting semiconductor layer is sufficiently electrically insulating that the resulting laminate as a whole is excellent for use as a magnetic head, for example. have characteristics. Soft magnetic metal layer (approximately 0.0254wr
Since the thickness (0.00 H inch) is not reduced, the high frequency response characteristics of the resulting structure are not improved as markedly as they would be if the thickness was reduced as described above. However, the high frequency response characteristics are somewhat improved compared to the high frequency response characteristics of known laminates of the same thickness. The reason for this is that annealing is performed after lamination in order to eliminate internal stresses that occur during manufacturing, which were not eliminated in known laminate structures. Furthermore, the scrap loss rate of known laminates is high, and the laminate made from the laminated magnetic material according to the present invention is much more uniform, and the hardness of the high resistance layer is greater, so that the wear resistance of the laminate is lower. Remarkably high. In other embodiments of this feature of the invention, the highly resistive material is deposited directly onto the soft magnetic metal layers, thereby eliminating the need for these layers to react to form a highly resistive layer. Ta. For example, selenium may be deposited on a soft magnetic metal and stacked to form a laminate in the same manner as described above to obtain a laminate with properties similar to those described for the arsenic-aluminum example. Similar results can be obtained using silicon.In practice, composite laminates can be prepared at temperatures similar to the annealing temperature of soft magnetic metals if high frequency response characteristics are not a critical property required for the particular product in which the laminate is installed. To obtain the desired wear resistance provided by the hardness of the semiconductor or other high resistance layer, it is only necessary to heat the structure to an extent that provides adequate adhesion. or other high resistance compounds may be used as additional components.The layer between the soft magnetic metals in FIG.
It may also consist of selenium deposited on tin or hafnium. Other examples include cadmium sulfide, lead sulfide, cadmium oxide, zinc sulfide, zinc oxide, nickel oxide, germanium sulfide, and tin sulfide. ``Physics and Chemistry Handbook'' published by Chemical Rubber Company.
OOkOfChemistryandPhysjcs)
Other compounds with energy gaps comparable to those described in can also be used. 1972
-197 edition (53rd edition) states that this type of semiconductor device is
Listed on pages -89 to E-92.

The semiconductor or other high resistance layer described above can also be in the form of a tape. For example, hafnium or molybdenum powder can be mixed with selenium powder and a volatile adhesive to form a tape-like high-resistance layer. Details regarding this are described in, for example, U.S. Pat. No. 3,293,072, but by doing this, heating causes the organic adhesive to volatilize and selenium to react with the metal, resulting in the desired high resistance. A layer is formed. Similar tapes can also be made by mixing antimony or arsenic powder with aluminum powder, and the resulting high resistance layer is semiconductor.
The resistance of the molybdenum-selenium compound in the above example is about 4,000 ohms.alpha., and the resistance of the hafnium-selenium compound is about 40,000 ohms.alpha..

Many other elements can be tape-formed, laminated, and reacted to form high resistance layers. A semiconductor can also be formed by reacting two metals. For example, metals such as molybdenum and hafnium can react with non-metals such as sulfur to form high resistance inorganic compound layers.
Tapes can also be made of powdered semiconductors, such as selenium. In the case of the laminated magnetic material of the present invention, each layer can be heated by heating the laminated product in an atmosphere rich in various gases to diffuse the gas into the insulating layer, or by introducing the gas into the insulating layer by other methods. It is also possible to further improve the hardness of the insulating layer.

In a preferred embodiment according to this aspect of the invention, the method of manufacturing the laminate is exactly the same as described above.

The laminate is first assembled, machined, annealed, polished, and cleaned. This is then heated in a hydrogen-enriched atmosphere to cause the hydrogen to diffuse into the insulating layer, forming a metal hydride that is harder than the insulating layer without hydrogen diffusion. At the same time, optimum magnetic properties can be imparted to the soft magnetic material through annealing. Many examples of suitable metal hydrides of this type can be found at Academic Publishing, New York.
Muller, Blacklege, published in 196 years by icPress.
dge) and LibOwitz, “
"Metal Hydrides".

Other gases can also be diffused into or combined with the metals with good results. for example,
Oxygen and nitrogen can also be diffused or bonded into the insulating layer, but these gases are more difficult to diffuse than hydrogen. As described above, it is clear that the structure according to the present invention not only has improved wear characteristics, but also has high reliability and excellent uniformity.

More importantly, however, the present invention provides a soft magnetic laminate that can be annealed after manufacture to impart more favorable magnetic properties to the soft magnetic metal.

[Brief explanation of the drawing]

Figure 1 is a schematic cross-sectional view of the laminated building before thickness reduction, Figure 2
The figure is a partially enlarged view taken along line 2-2 in Figure 1, Figure 3 is a schematic diagram showing a modification of the structure shown in Figure 2, and Figure 4 is a diagram similar to that shown in Figure 2. 7 micrographs showing the grain structure of the same structure after thickness reduction; FIG. 5 is a micrograph showing the grain structure of the structure shown in FIG. 4 after heat treatment; and FIG. 6 is a schematic cross-section of the shielding laminate. 7 are schematic cross-sectional views of a composite structure consisting of the laminate shown in FIG. 2 or 3 and the laminate shown in FIG. 6. DESCRIPTION OF SYMBOLS 10... Soft magnetic material layer, 12... Insulating compound forming material layer, 14... Sandwich structure, 16... Casing, 18... ...
Can, 20...Filling substance, 24...Magnetic material, 44...Additional layer, 46...Highly conductive layer, 48...・Insulating compound layer.

Claims (1)

[Claims] 1 A laminated magnetic material comprising a plurality of layers of soft magnetic material and at least one electrically insulating layer disposed between adjacent soft magnetic material layers, wherein the insulating layer is bonded to the soft magnetic material layer during annealing. A laminated magnetic material that is thermally coupled and characterized in that the insulating layer is made of a semiconductor layer.