JPS6032768B2 - High frequency heating device - Google Patents
High frequency heating deviceInfo
- Publication number
- JPS6032768B2 JPS6032768B2 JP54038755A JP3875579A JPS6032768B2 JP S6032768 B2 JPS6032768 B2 JP S6032768B2 JP 54038755 A JP54038755 A JP 54038755A JP 3875579 A JP3875579 A JP 3875579A JP S6032768 B2 JPS6032768 B2 JP S6032768B2
- Authority
- JP
- Japan
- Prior art keywords
- frequency heating
- partition plate
- heating device
- heater
- mica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Control Of High-Frequency Heating Circuits (AREA)
- Constitution Of High-Frequency Heating (AREA)
- Electric Ovens (AREA)
Description
【発明の詳細な説明】
本発明は高周波加熱装置の加熱室内に使用する仕切板を
改善しより耐久性の高い装置を実現することを目的とし
ている。DETAILED DESCRIPTION OF THE INVENTION An object of the present invention is to improve the partition plate used in the heating chamber of a high-frequency heating device and to realize a device with higher durability.
第1図は一般的な高周波加熱装置を断面図で示したもの
である。FIG. 1 is a cross-sectional view of a general high-frequency heating device.
第1図において1は加熱室であり、この加熱室1には導
波管2を連結させ、導波管2には高周波発振器であるマ
グネトロン3を設ける。マグネトロン3から発振された
電波は導波管2を通り、加熱室1に設けた電波給電用の
開□4から加熱室1内に照射され、被加熱物である食品
5を高周波加熱する。加熱室1にはさらにシーズヒータ
、赤外線ヒータ等で構成したヒータ6を設け、食品5を
ヒータ加熱する。食品5は高周波加熱あるいはヒータ加
熱をそれぞれ単独に、または両肩を併用することによっ
て最も適した加熱調理を選択使用するものである。電波
給電用の閉口4には仕切板7を設けている。仕切板7は
ガラスクロスの積層板、耐熱ガラス、結晶化ガラス磁器
等で構成されている。このような高周波加熱装置におい
て、仕切板7をガラスクロス積層板で構成した場合、耐
熱温度が比較的低いためにヒータ6によりヒータ加熱を
行う場合に熱劣化を起したり、またこれを防ぐために仕
切板の温度を低くしようとするとヒータ6の温度を十分
高くすることが出釆ず、ヒータ加熱が不十分になる欠点
があった。In FIG. 1, reference numeral 1 denotes a heating chamber, a waveguide 2 is connected to the heating chamber 1, and a magnetron 3, which is a high frequency oscillator, is provided in the waveguide 2. The radio waves oscillated from the magnetron 3 pass through the waveguide 2 and are irradiated into the heating chamber 1 from the radio wave power supply opening 4 provided in the heating chamber 1, thereby high-frequency heating the food 5, which is the object to be heated. The heating chamber 1 is further provided with a heater 6 composed of a sheathed heater, an infrared heater, etc., and the food 5 is heated with the heater. For the food 5, the most suitable heating method is selected and used by high-frequency heating or heater heating, either alone or by using both methods in combination. A partition plate 7 is provided in the closure 4 for radio wave power feeding. The partition plate 7 is made of a laminate of glass cloth, heat-resistant glass, crystallized glass porcelain, or the like. In such a high-frequency heating device, if the partition plate 7 is made of a glass cloth laminate, the heat resistance temperature is relatively low, so thermal deterioration may occur when the heater 6 heats the heater. If an attempt is made to lower the temperature of the partition plate, it is impossible to raise the temperature of the heater 6 to a sufficiently high temperature, resulting in insufficient heating by the heater.
仕切板7は耐熱ガラス、結晶化ガラス磁器等で構成すれ
ば耐熱温度は高くなるために、前述のような欠点は解消
されるが、誘電率が高いために電波に対して損失となり
、高周波加熱時の効率が低下する点、加工費が高くなる
などの欠点があり、いずれも好ましくなかつた。本発明
は上記従来の高周波加熱装置の欠点を解消し、より耐久
性を高め、しかも加熱性能を向上させることを目的とし
ている。If the partition plate 7 is made of heat-resistant glass, crystallized glass porcelain, etc., the heat-resistant temperature will be higher, and the above-mentioned drawbacks will be eliminated, but the high dielectric constant will cause loss to radio waves, making it difficult to use high-frequency heating. There are drawbacks such as reduced processing efficiency and increased processing costs, both of which are undesirable. It is an object of the present invention to eliminate the drawbacks of the conventional high-frequency heating devices described above, to further enhance durability, and to improve heating performance.
第2図は本発明による高周波加熱装置の仕切板を拡大し
た部分断面図で示したもので、取付構造、取付部分は第
1図の構造と同一である。FIG. 2 is an enlarged partial sectional view of the partition plate of the high-frequency heating device according to the present invention, and the mounting structure and the mounting portion are the same as the structure shown in FIG. 1.
第2図において、8はマィカ片であり、耐熱樹脂9を含
浸している。ここで本発明の特長は切断した端面にシリ
コンなどの樹脂10を更に含浸したことである。マィカ
片8に耐熱樹脂9を含浸したのみの、いわゆるマィカ板
と言われるものは、表面は耐熱樹脂9で覆われているの
で吸湿することはない。In FIG. 2, 8 is a piece of mica impregnated with heat-resistant resin 9. Here, the feature of the present invention is that the cut end surface is further impregnated with a resin 10 such as silicone. A so-called mica board, which is simply a mica piece 8 impregnated with a heat-resistant resin 9, does not absorb moisture because its surface is covered with the heat-resistant resin 9.
ところが、このような従来のマィカ板であると、プレス
加工等による切断端面はマィカ片8と耐熱樹脂9の切断
面が層状に露出することになる。この端面部分に水や蒸
気が付着すると毛管現象によって吸水され、これを長時
間使用するマィカ片8が剥離することになる。マィカ板
にはこのような欠点があるために高周波加熱装置の加熱
室内のように湿気の多い部分ではあまり使用されなかっ
た。本発明はこのような従来のマィカ板の欠点を切断端
面に更に樹脂10を含浸することによって端面部分に水
や蒸気が付着しても、吸水されることを防止している。
これにより切断端面の剥離を防止し高周波加熱装置の加
熱室内の湿気の多い部分での使用を可能にしたものであ
る。このような仕切板を設けた本発明による高周波加熱
装置においては、仕切板の吸水による劣化を防止できる
ので耐久性の高い装置を実現できることは勿論のこと、
仕切板に従来のようなガラスクロス積層板を使用するの
に比べて本発明によるマィカ仕切板は耐熱温度が高いの
で熱劣化の面でも優れており、これまた耐久性の高い装
置となる。However, in the case of such a conventional mica plate, the cut end surface of the mica piece 8 and the heat-resistant resin 9 is exposed in a layered manner at the end surface cut by press working or the like. If water or steam adheres to this end surface portion, it will be absorbed by capillary action, and the mica piece 8, which is used for a long time, will peel off. Because of these drawbacks, mica plates are not often used in humid areas such as the heating chambers of high-frequency heating devices. The present invention overcomes these drawbacks of the conventional mica board by further impregnating the cut end face with resin 10 to prevent water absorption even if water or steam adheres to the end face portion.
This prevents the cut end surface from peeling off and makes it possible to use it in a humid part of the heating chamber of the high-frequency heating device. In the high-frequency heating device according to the present invention provided with such a partition plate, it is possible to prevent deterioration of the partition plate due to water absorption, so it goes without saying that a highly durable device can be realized.
Compared to conventional glass cloth laminates used as partition plates, the mica partition plate according to the present invention has a higher heat resistance and is therefore superior in terms of thermal deterioration, resulting in a highly durable device.
またヒータの温度は十分高くすることができるので、ヒ
ータ加熱の性能も高めることができる。さるに仕切板を
従来のような耐熱ガラス、結晶化ガラス、磁器等で構成
するものと比べて本発明によるマイカ仕切板は、誘電率
誘電体損失が低いために電波に対する損失が少なく、高
周波加熱時の効率が高くなる。またプレスによる切断打
抜加工、穴加工等が容易にできるもので、加工が安価に
でき、仕切板の取付もビス等で簡単に固定できるので組
立が容易である。また材料費も安価であるので極めて経
済的に構成できるものである。このように本発明による
と簡単な構成により耐久性が高く、しかも加熱効率の高
い高周波加熱装置をより経済的に構成できるものである
。Furthermore, since the temperature of the heater can be made sufficiently high, the heating performance of the heater can also be improved. Furthermore, compared to conventional partition plates made of heat-resistant glass, crystallized glass, porcelain, etc., the mica partition plate according to the present invention has a low dielectric constant and dielectric loss, so there is less loss against radio waves, and it is suitable for high-frequency heating. Time efficiency increases. In addition, cutting and punching using a press, drilling, etc. can be easily performed, so processing can be done at low cost, and the partition plate can be easily fixed with screws, etc., so assembly is easy. Moreover, since the material cost is low, it can be constructed extremely economically. As described above, according to the present invention, a high-frequency heating device having a simple structure, high durability, and high heating efficiency can be constructed more economically.
第1図は一般的な高周波加熱装置の断面図、第2図は本
発明の一実施例を示す高周波加熱装置の仕切板を拡大し
た部分断面図である。
1..・加熱室、2・・・導波管、3・・・マグネトロ
ン、4・・・開口、6…ヒータ、7・・・仕切板、8・
・・マィカ片。
第1図
第2図FIG. 1 is a sectional view of a general high-frequency heating device, and FIG. 2 is an enlarged partial sectional view of a partition plate of a high-frequency heating device showing an embodiment of the present invention. 1. ..・Heating chamber, 2... Waveguide, 3... Magnetron, 4... Opening, 6... Heater, 7... Partition plate, 8...
...Mica piece. Figure 1 Figure 2
Claims (1)
板を設け、上記仕切板の端面には樹脂を含浸したことを
特徴とする高周波加熱装置。1. A high-frequency heating device characterized in that a partition plate made of a mica plate is provided between a heating chamber and a radio wave power supply part, and an end surface of the partition plate is impregnated with resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54038755A JPS6032768B2 (en) | 1979-03-30 | 1979-03-30 | High frequency heating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54038755A JPS6032768B2 (en) | 1979-03-30 | 1979-03-30 | High frequency heating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55131984A JPS55131984A (en) | 1980-10-14 |
JPS6032768B2 true JPS6032768B2 (en) | 1985-07-30 |
Family
ID=12534098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54038755A Expired JPS6032768B2 (en) | 1979-03-30 | 1979-03-30 | High frequency heating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6032768B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6050704U (en) * | 1983-09-12 | 1985-04-10 | 日立化成工業株式会社 | Heat-resistant composite mica plate for microwave oven magnetron shielding |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5035240A (en) * | 1973-06-12 | 1975-04-03 | ||
JPS5431945B2 (en) * | 1976-12-27 | 1979-10-11 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5839281Y2 (en) * | 1977-08-08 | 1983-09-05 | 株式会社東芝 | High frequency heating device |
-
1979
- 1979-03-30 JP JP54038755A patent/JPS6032768B2/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5035240A (en) * | 1973-06-12 | 1975-04-03 | ||
JPS5431945B2 (en) * | 1976-12-27 | 1979-10-11 |
Also Published As
Publication number | Publication date |
---|---|
JPS55131984A (en) | 1980-10-14 |
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