JPS60132462U - partial plating device - Google Patents

partial plating device

Info

Publication number
JPS60132462U
JPS60132462U JP1634984U JP1634984U JPS60132462U JP S60132462 U JPS60132462 U JP S60132462U JP 1634984 U JP1634984 U JP 1634984U JP 1634984 U JP1634984 U JP 1634984U JP S60132462 U JPS60132462 U JP S60132462U
Authority
JP
Japan
Prior art keywords
plating
partial plating
plating device
lead frame
partial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1634984U
Other languages
Japanese (ja)
Other versions
JPS6333963Y2 (en
Inventor
土岐 荘太郎
野口 文信
智夫 成島
武夫 藤井
Original Assignee
凸版印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 凸版印刷株式会社 filed Critical 凸版印刷株式会社
Priority to JP1634984U priority Critical patent/JPS60132462U/en
Publication of JPS60132462U publication Critical patent/JPS60132462U/en
Application granted granted Critical
Publication of JPS6333963Y2 publication Critical patent/JPS6333963Y2/ja
Granted legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案による部分めっき装置の概略説明図で
あり、第2図は、本考案の部分めっき鶴装置においてス
パージャ−内部を拡大して示した概略説明図である。 1・・・部分めっき装置、2・・・めっきタンク、3・
・・ホンフ、4.・・・スパージャ−15・・・陽極、
6・・・マスク板、7・・・めっきエリア、8・・・リ
ードフレーム、9・・・熱風吹き出しノズル、10・・
・送風口、11・・・排風口、12・・・上ゴム、13
・・・陰極線、14・・・ヒーター、15・・・温度セ
ンサー、16・・・蓋、17・・・熱風。
FIG. 1 is a schematic explanatory diagram of a partial plating apparatus according to the present invention, and FIG. 2 is a schematic explanatory diagram showing an enlarged view of the inside of a sparger in the partial plating apparatus according to the present invention. 1... partial plating device, 2... plating tank, 3...
...Honfu, 4. ... Sparger 15 ... Anode,
6...Mask plate, 7...Plating area, 8...Lead frame, 9...Hot air blowing nozzle, 10...
・Air outlet, 11...Exhaust port, 12...Top rubber, 13
... Cathode ray, 14... Heater, 15... Temperature sensor, 16... Lid, 17... Hot air.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレームに貴金属を部分的にめっきする装置にお
いて、リードフレームのめつきエリア7に熱風を吹きつ
けるノズル9をめっき液を噴出させる陽極部5の近傍に
配置してなる部分めっき装置。
This partial plating device is a device for partially plating a precious metal on a lead frame, in which a nozzle 9 that blows hot air onto a plating area 7 of the lead frame is arranged near an anode section 5 that spouts out a plating solution.
JP1634984U 1984-02-08 1984-02-08 partial plating device Granted JPS60132462U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1634984U JPS60132462U (en) 1984-02-08 1984-02-08 partial plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1634984U JPS60132462U (en) 1984-02-08 1984-02-08 partial plating device

Publications (2)

Publication Number Publication Date
JPS60132462U true JPS60132462U (en) 1985-09-04
JPS6333963Y2 JPS6333963Y2 (en) 1988-09-08

Family

ID=30503038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1634984U Granted JPS60132462U (en) 1984-02-08 1984-02-08 partial plating device

Country Status (1)

Country Link
JP (1) JPS60132462U (en)

Also Published As

Publication number Publication date
JPS6333963Y2 (en) 1988-09-08

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