JPS5942703A - Insulative thermal conductor and method of producing same - Google Patents
Insulative thermal conductor and method of producing sameInfo
- Publication number
- JPS5942703A JPS5942703A JP15170582A JP15170582A JPS5942703A JP S5942703 A JPS5942703 A JP S5942703A JP 15170582 A JP15170582 A JP 15170582A JP 15170582 A JP15170582 A JP 15170582A JP S5942703 A JPS5942703 A JP S5942703A
- Authority
- JP
- Japan
- Prior art keywords
- insulation
- metal powder
- coupling agent
- heat
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Inorganic Insulating Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、ヒートシンクルンに適した絶を礒・V1良熱
f云導体及びその製造方法に開rる。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a heat sink conductor suitable for heat sinking and a method for manufacturing the same.
従来、フエライ)・、−セラミ7り等は、右1)側列脂
(例えばポリビニルアルコール)等でバインタ′ヅヵ果
を持たせ、粉本を圧縮成型し焼成しζ焼結体としている
。しh化、このようなフェライ1−、セラミック等を製
造する方法は従来より変わってf9らず、ポリビニルア
ルコール等のバイングーを使用4−ることにより、[−
程が複雑化する、二とや焼結が比較的高温であること等
の多くの欠点を有しζいる。また、ヒートシンク、放熱
容器等に使用する場合に−は熱1、テ性とくに熱伝導性
力Fll1題となるが、フェライト、セラミック等は本
来熱伝導が要、い1・都合があった。Conventionally, ferrite, -ceramic, etc. have been made into a sintered body by applying a binder with side resin (for example, polyvinyl alcohol), compression molding the powder, and firing. The method for manufacturing such ferrites, ceramics, etc. is unchanged from the conventional method, and by using binder such as polyvinyl alcohol, [-
However, it has a number of drawbacks, such as a complicated process and a relatively high temperature for sintering. In addition, when used in heat sinks, heat dissipation containers, etc., thermal properties, especially thermal conductivity, are an issue, but ferrite, ceramics, etc. originally required heat conduction.
一方、ヒートシンク、放熱容器等の用途に関して、金属
は熱伝導は良好であるが、電気導通・Illoがあるた
め使いにくい問題点があった。On the other hand, when it comes to applications such as heat sinks and heat dissipation containers, metals have good thermal conductivity, but they have the problem of being difficult to use because of electrical conductivity and Illo.
本発明は、)−記の点に鑑み、熱f云導にLと絶縁=l
’14とを兼j;z(liitえていてピー1ンンク、
放熱容器M−に使用するのに適した絶縁1)1.1゛毛
熱11、も・°体及びその製造方法を提供しようとする
ものである。。In view of the points in )-, the present invention provides heat f conduction with L and insulation = l.
'14 and j;z(liit and p1nk,
It is an object of the present invention to provide an insulating body suitable for use in a heat dissipation container M-1) and a method for manufacturing the same. .
本発明に係る絶縁性良熱()1専木は、金属粉体の表面
に酸化物等の絶縁薄層を形成し1、−jシをガラス、金
属酸化物宿の連結h’l中にかi′Ik ’1ろことを
1、ン徴としている。The insulating and heat-resistant (1) special wood according to the present invention forms an insulating thin layer of oxide or the like on the surface of the metal powder, and then connects the glass and metal oxide layer into the connection h'l. i′Ik '1 roto is 1, n sign.
また、本発明の絶縁・1?1良熱伝導木の製造方法は、
第1図(l\)のような金属粉I4−1の1(面を同図
(13)の如く酸化物’tW層等の絶縁薄層ンを形成す
ることにより絶縁処理する1−稈と、同図((:)の如
(力゛ラス、コロイド状シリカ1.イ1敗金属々1の連
結剤:(と1iij記絶縁処理された金属粉本1とを混
訃する1゛、程と、該混合工程で111られな混合物を
所定形状に成型するL程と、成型体を加熱し−ζ固1ヒ
さぜる熱外141 ]−程とからなっている。ただし、
熱処理1゛程は好適の焼結よりも低!:11!て゛行−
)1.光通の焼結で’l崎i+5度が高くなりすぎ、絶
縁a層間を連結する曲に金属白木が溶融してしまうから
である。。In addition, the method for producing insulation and 1?1 good thermal conductivity wood of the present invention is as follows:
The surface of the metal powder I4-1 as shown in Figure 1 (l\) is insulated by forming an insulating thin layer such as an oxide 'tW layer as shown in Figure 1 (13). , as shown in the same figure ((:). The mixing process consists of a step L in which the mixture is molded into a predetermined shape, and an exothermal step in which the molded product is heated and stirred to a solid state.However,
Heat treatment is about 1゜ lower than suitable sintering! :11! T-line
)1. This is because the sintering of Kotsu makes the temperature of +5 degrees too high, and the plain metal wood melts in the curve that connects the insulation A layers. .
以下、本発明に係る絶縁性良熱1!、辱木及びその製造
方法を実施例により詳細tこ説明する。Below, insulation good heat 1 according to the present invention! , the wood and the method for producing the same will be explained in detail by way of examples.
すζ施例1
平均粒径50μのアルミニウム粉末の表面にA l 2
0−の絶縁薄層を形成し、アルミニラ11粉末4、、’
71Hに月して連結剤としてフロイド状シリカ(水溶液
中に粒子径1. (,1□〜2f1+nμの810゜が
30重量%含有されてしこるもので、密度的1,2()
、粘度6引1s)を2ccの割合で加え、混練、造粒後
1 、 S Lon/can2の圧力でプレス成へりし
た1、そして、11)られな成型体を火気中で411
+1 ’Cにて約2時間焼成した。固化した成型体は電
気伝導度(105〜10らΩc111)と絶縁体であり
、が−〕熱1ム導度が(1−10W/In−K)と極め
て火きく、また密度か(2、136/cc)と軽量であ
った。ζExample 1 Al2 on the surface of aluminum powder with an average particle size of 50μ
Form a thin insulating layer of 0- and alumina 11 powder 4,,'
71H, as a linking agent, floid-like silica (30% by weight of 810° particles with a particle diameter of 1.
, viscosity 6 minus 1 s) was added at a rate of 2 cc, kneaded and granulated, and pressed at a pressure of 1.S Lon/can2.
It was baked at +1'C for about 2 hours. The solidified molded body is an insulator with electrical conductivity (105 to 10Ωc111), but has extremely high thermal conductivity (1-10W/In-K) and density (2, It was lightweight at 136/cc).
実施例2
カーボニール鉄粉末の表面に鉄酸化物の絶縁薄層を形成
し、カーボニール鉄粉末2gに月して連結剤としてコロ
イド状シリカ(水溶液中に粒子径] 1’、l ” 2
0 IllμのSiO2が30重量%含有されているも
ので、密度的1.211、粘度Gc:1+s)を20e
Cの割合で加え、混練、造!ζ!、後、プレス成イーリ
した。そして、111られた成1j、す、1本を人気中
でG 11 fl T、’にて約2時間焼成した1、固
化した成型困ば電気fL;導度(1+E’ −I +
1’ Ωf: Ill )と高抵抗体て′あり、が−ノ
熱(jk導度カ(1−1t1〜’/+n ・K IどJ
(Bメて入きく、また密度か(4+;/+・(:)と軽
tiiであった。。Example 2 An insulating thin layer of iron oxide was formed on the surface of carbonyl iron powder, and colloidal silica (particle size: 1', l''2 in aqueous solution) was added to 2 g of carbonyl iron powder as a coupling agent.
It contains 30% by weight of SiO2 of 0 Illμ, density 1.211, viscosity Gc: 1+s) of 20e
Add C in proportion, knead, and make! ζ! After that, the press was completed. Then, the 111 molded 1j, S, 1 piece was fired for about 2 hours at G 11 fl T,', and the solidified molded 1j, S, conductivity (1 + E' - I +
1' Ωf: Ill ) and a high-resistance element ', -no heat (jk conductivity force (1-1t1~'/+n ・K I do J
(I entered B, and the density was (4+;/+・(:)), which was light tii.
な第3、金属粉に酸化物薄層を形成するがわりに絶縁耐
熱コーティングによる絶縁、71層を形成してもよい。Third, instead of forming a thin oxide layer on the metal powder, an insulation layer 71 may be formed using an insulating and heat-resistant coating.
また、連結剤としては、コロイド状シリカの代りに低融
点ガラスを用いて力゛ラス溶3゛fシてもよい。さらに
は連結剤としてイ」磯金属を用いる、二トモでト1、二
の場合には公属のアルコオキシ1!等は熱処理により分
11イし、金属粉体間に微11シの金属添加物(金属酸
化物、炭化物)を残炉ことが〔゛きる。また、金属粉体
との間で化合物比させることも考えられる。Further, as a coupling agent, a low melting point glass may be used in place of colloidal silica and may be subjected to forceful glass melting. Furthermore, in the case of two cases, a metal is used as a linking agent, and in the case of two cases, a public alkoxy group is used. etc. can be separated by heat treatment, leaving a fine amount of metal additives (metal oxides, carbides) between the metal powders. It is also conceivable to make a compound ratio between the metal powder and the metal powder.
1・記実施例1,2によ’) i:iられた絶縁1・゛
ト良熱1!;導木は次のような特長を↓゛(備している
1、(1) ドリル加工ができ、セラミック笠より加1
−性がよい。1. Based on Examples 1 and 2) i: Insulated insulation 1.Good heat 1! ; Guide wood has the following features ↓
- Good quality.
(2)電気抵抗が高く、比抵抗が数1(ΩII+以1で
ある。(2) Electrical resistance is high, with a specific resistance of several 1 (ΩII+ or higher).
(3)熱伝導度はセラミック等よりがなり良好て゛ある
。(3) Thermal conductivity is better than ceramics, etc.
(’l)I!引戒的強度は充分大きく、金属よりも軽い
。('l)I! It has sufficient repellent strength and is lighter than metal.
(5)ベースト状での混練木として用意することにより
良熱伝導性、絶縁性の光」眞4・4料とすることができ
る。(5) By preparing it as a kneaded wood in the form of a base, it can be made into a material with good thermal conductivity and insulation properties.
また、製法、]二の特長としては、成型が容易で゛あり
、押出成型も可能でハニカム状や線状に形成て′bる点
があけられる。The second feature of the manufacturing method is that it is easy to mold, and can be extruded and formed into a honeycomb shape or a linear shape.
本発明による絶縁性良熱伝導体の用途としては、!¥S
2図の如外パワートランジスタ10を装着するヒートシ
ンク11、第2(図の如き1cパツケージ12、あるい
は第4図の如くトランス、モーター等の熱が加わる所の
端子−板13等がある。。The uses of the insulating good thermal conductor according to the present invention are as follows! ¥S
There is a heat sink 11 to which the power transistor 10 is mounted as shown in FIG. 2, a second 1C package 12 as shown in the figure, or a terminal plate 13 to which heat is applied from a transformer, motor, etc. as shown in FIG.
以−1−説明したように、本発明によれば、熱伝導性と
絶縁性とを兼ね備えていてヒートシンク、放熱容器等に
使用するのに適した絶縁性良熱伝導体を得ることができ
、実Jr月二の効果は極めて太きい。As explained below-1-, according to the present invention, it is possible to obtain an insulating good thermal conductor that has both thermal conductivity and insulation properties and is suitable for use in heat sinks, heat dissipation containers, etc. The effect of Real Jr. Month 2 is extremely strong.
・・[1図面の簡1)lな2況明
第1図()\)、(1旬、((ニ)は本発明の製造I程
の一部を示す説明図、第2図は本発明による絶縁性良熱
fj;導木の用途の例であっ′ζヒー1ン〕・りを4図
成した場合の側面図、第S(図は1(:パラケル〕を構
成した場合の斜視図、第・・1図は端J′根を(Nj成
した場合の!1:而図面゛ある。... [Simplification of 1 drawing 1) 2 conditions Figure 1 ()\), (1), ((D) is an explanatory diagram showing a part of the manufacturing step I of the present invention, Figure 2 is an illustration of the present invention. This is an example of the use of the insulating good heat fj; guide wood according to the invention. Figure 1 shows the case where the end J' root is formed by (Nj!1: Figure 1).
1・・・金属粉本、2・・・絶#&薄層、j(・・連結
剤、。1... Metal powder book, 2... Absolute # & thin layer, J (... Connecting agent,.
特3′1出願人
東東電気比学1−業株式会ネ1
代j111〕(ナト理 1・ 4・1 月
1;;[第1図Special 3'1 Applicant: Toto Electric Co., Ltd.
1;; [Figure 1
Claims (1)
結剤中に分散されてなる絶縁・1−1良熱イl;導f4
c 、。 (2) 1iij記絶縁薄層か、1jii記金属粉の
酸1ヒ物薄層であって1iii記連結剤か力゛ラス、金
属酸1ヒ物の少なくとも ・つである特許ifl”l求
の範囲第1項記1代の絶縁111.良熱伝導体。 (:() nij記金属粉かほぼ連続する如く密東し
−ζ分分散れてなる特許ifl’l求の化1川第1 」
l:j記i1;uの絶H−ド1゜良熱fバ導木。 (4)金属粉本の表面に絶縁性ivi層を形成し、その
後連結剤と混練し、更に191定の形状に成JTi9後
加熱して固化させたことを特徴とする絶縁性良熱0、導
体の製造方法。 (5) 前記オ色H薄1苦か1iif記金hjスネ分
1本の酸1ヒ薄六4て・あり、前記連結剤としてフロイ
ト′状1?属酸化物を用いる1、′f許請求の範囲第・
1項記Ji!Qの絶縁−t!l:良熱fl;導体の製造
方法。[Claims] (1) Insulation made of metal powder or a coupling agent having an absolute layer on the surface; 1-1 good thermal insulation;
c. (2) The insulating thin layer described in 1iii, or the acid-monomer thin layer of the metal powder described in 1jii, and at least the coupling agent or the metal powder described in 1iii, and the metal acid. Range No. 1 Insulation 111. Good thermal conductor. ”
l:j i1; u's absolute H-do 1° good heat f-ba guide tree. (4) Insulating iv layer formed on the surface of the metal powder book, then kneaded with a coupling agent, further formed into a certain shape, heated and solidified. Method of manufacturing conductors. (5) The above-mentioned O-color H thin 1 bitter or 1 iif recording gold hj shank 1 acid 1 hi 6-4 te and the above-mentioned coupling agent are Freud's-like 1? 1,'f Claims No. 1 using oxides of
Item 1 Ji! Insulation of Q-t! l: good heat fl; manufacturing method of conductor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15170582A JPS5942703A (en) | 1982-09-02 | 1982-09-02 | Insulative thermal conductor and method of producing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15170582A JPS5942703A (en) | 1982-09-02 | 1982-09-02 | Insulative thermal conductor and method of producing same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5942703A true JPS5942703A (en) | 1984-03-09 |
Family
ID=15524460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15170582A Pending JPS5942703A (en) | 1982-09-02 | 1982-09-02 | Insulative thermal conductor and method of producing same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5942703A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03185741A (en) * | 1989-12-14 | 1991-08-13 | Toshiba Corp | Semiconductor device and manufacture thereof |
-
1982
- 1982-09-02 JP JP15170582A patent/JPS5942703A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03185741A (en) * | 1989-12-14 | 1991-08-13 | Toshiba Corp | Semiconductor device and manufacture thereof |
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