JPS59152662A - Ic for photosensor - Google Patents

Ic for photosensor

Info

Publication number
JPS59152662A
JPS59152662A JP58026691A JP2669183A JPS59152662A JP S59152662 A JPS59152662 A JP S59152662A JP 58026691 A JP58026691 A JP 58026691A JP 2669183 A JP2669183 A JP 2669183A JP S59152662 A JPS59152662 A JP S59152662A
Authority
JP
Japan
Prior art keywords
light
region
wirings
type diffusion
shielded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58026691A
Other languages
Japanese (ja)
Other versions
JPS6139744B2 (en
Inventor
Naomi Kawaguchi
河口 直巳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58026691A priority Critical patent/JPS59152662A/en
Publication of JPS59152662A publication Critical patent/JPS59152662A/en
Publication of JPS6139744B2 publication Critical patent/JPS6139744B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14681Bipolar transistor imagers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Bipolar Transistors (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To enable to effectively obtain a desired output of a sensor without occurrence of an erroneous operation by shielding a light to a circuit element which is feasibly affected by the effect of a light at least in a peripheral circuit. CONSTITUTION:This IC has a p type silicon substrate 2, an n-type collector region 30a formed by epitaxial growth thereon, a collector region 3b formed by n type diffusion, isolating regions 4, 4 formed by p type diffusion, a base region 5 formed similarly by p type diffusion, an emitter region 6 formed by n type diffusion, oxidized films 7, 7 and emitter aluminum deposited wirings 8. The wirings 8 have a pattern capable of shielding a light by covering the left half 5a of the region 5. The right half 5b of the region 5 is also covered with a base aluminum deposited wirings 8' to be shielded from the light. Therefore, the right and left halves 5a, 5b of the region 5 are shielded from the light by the wirings 8, 8'.

Description

【発明の詳細な説明】 本発明は、フォト感知素子と、このフォト感知素子の受
光動作に関与する周辺回路とを備えてなるフォトセンサ
ー用lc(集積回路)に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photosensor LC (integrated circuit) comprising a photosensing element and peripheral circuits involved in the light receiving operation of the photosensing element.

このようなフォトセンサー用ICに使用されるフォトト
ランジスタやフォトダイオード等のフォト感知素子に光
が照射された場合、その周辺回路にもその光が照射され
る場合がある。この場合、その周辺回路に例えばトラン
ジスタが含まれていると、このトランジスタのベース領
域にその光が照射されることになる。ところが、゛トラ
ンジスタのベース領−に対して光が照射されると1、該
トランジスタが誤動作をすることがあり、フォトセンサ
ー、から所定のセンサー出力を確実に得ることが困難に
なる。
When a photosensing element such as a phototransistor or a photodiode used in such a photosensor IC is irradiated with light, its peripheral circuits may also be irradiated with the light. In this case, if the peripheral circuit includes, for example, a transistor, the light will be irradiated onto the base region of this transistor. However, if the base region of the transistor is irradiated with light, the transistor may malfunction, making it difficult to reliably obtain a predetermined sensor output from the photosensor.

本発明は、このような誤動作が生じないようにして所定
のセンサー出力が確実に得られるようにすることを目的
とする。
An object of the present invention is to prevent such malfunctions from occurring and ensure that a predetermined sensor output is obtained.

本発明は、このような目的を達成するため、周辺回路の
少なくとも光の影響を受は易い回路素子、例えばトラン
ジスタのベース領域には、遮光性を有する゛配線層によ
り遮光を施こすようにしている。
In order to achieve such an object, the present invention provides a structure in which at least a circuit element in a peripheral circuit that is easily affected by light, such as a base region of a transistor, is shielded from light by a wiring layer having a light-shielding property. There is.

以下、本発明を図面に示す一実施例に基ついて詳細に説
明する。
Hereinafter, the present invention will be described in detail based on an embodiment shown in the drawings.

′S1図はこの実施例の平面図であり、第2図は第1図
の切断線■−■に沿う構造的断5面図である。
'S1 is a plan view of this embodiment, and FIG. 2 is a structural cross-sectional view taken along section line 1--2 in FIG.

これらの図においては、フォト感知素子の図示は簡単化
のため省略され、また周辺回路の内、光の影響を受は易
い回路素子としてトランジスタが代表的に図示される。
In these figures, illustration of the photo-sensing element is omitted for the sake of simplicity, and a transistor is typically illustrated as a circuit element that is easily affected by light among the peripheral circuits.

このトランジスタ1は、通常の半導体集積回路の製法に
より作られる。図において、2はP形シリコン基板、3
aはP形シリコン基板2上にエピタキシャル成長により
形成されたn形のコレクタ領域、3bはn形拡散により
形成されたコレクタ領域、4,4はP形拡散により形成
された分離領域、5は同じくP形拡散により形成された
ベース領域、6はn形拡散により形成されたエミッタ領
域、7,7は酸化膜である。
This transistor 1 is manufactured by a normal semiconductor integrated circuit manufacturing method. In the figure, 2 is a P-type silicon substrate, 3
a is an n-type collector region formed by epitaxial growth on a P-type silicon substrate 2, 3b is a collector region formed by n-type diffusion, 4, 4 is an isolation region formed by P-type diffusion, and 5 is also a P-type collector region. A base region is formed by type diffusion, 6 is an emitter region formed by n-type diffusion, and 7 is an oxide film.

8はエミッタ用アルミニウム蒸着配線である。8 is an aluminum vapor-deposited wiring for an emitter.

このアルミニウム蒸着配線8は、ベース領域5の図上、
左半部5aを覆って遮光できるパターンを有している。
This aluminum vapor-deposited wiring 8 is
It has a pattern that can cover the left half portion 5a and block light.

このベース領域5の図」二、右半部5bもベース用アル
ミニウム蒸着配線8′により覆われて遮光される。した
がって、ベース領域5の左・右半部5a、5bはこのよ
うにしてアルミニウム蒸着配線8,8′により遮光され
ることになる。また、両アルミニウム蒸着配線8,8′
の電気的な短絡を防止するためベース領域の左・右半部
5a、5bは残余の部分5Cを介して連設されているが
、この残余の部分5Cは、光の影響を極力なくすために
その面積を狭くされている。8″はコレクタ用アルミニ
ウム蒸着配線である。なお、上述の実施例ではnpn形
のトランジスタについて説明したが、PnP形のものに
ついても同様に適用することができる。また、この実施
例では遮光される周辺回路の回路素子としてトランジス
タを用いて説明したが、フォト感知素子を除き、光の影
響が排除されるべき回路素子についても同様にアルミニ
ウム蒸着配線などの遮光性を有する配線層により遮光す
るとよい。
The right half 5b of the base region 5 is also covered with the base aluminum vapor-deposited wiring 8' and is shielded from light. Therefore, the left and right halves 5a and 5b of the base region 5 are thus shielded from light by the aluminum vapor-deposited wirings 8 and 8'. In addition, both aluminum vapor deposited wirings 8, 8'
The left and right halves 5a and 5b of the base area are connected via the remaining portion 5C to prevent electrical short circuits. Its area has been narrowed down. 8'' is an aluminum vapor-deposited wiring for the collector.Although the above embodiment describes an npn type transistor, the same can be applied to a pnp type transistor.Also, in this embodiment, a light shielded Although transistors have been described as circuit elements of the peripheral circuit, circuit elements other than photo-sensing elements that should be protected from the influence of light may be similarly shielded from light by a wiring layer having a light-shielding property such as aluminum vapor-deposited wiring.

以上のように、本発明によれば、周辺回路の少なくとも
光の影響を受は易い回路素子には遮光を施こしたので、
フォト感知素子に光を照射させてもこの光が前記回路素
子に影響を及はすことがな(なる。したがって、回路素
子が前記光の照射により誤動作をひきおこすおそれがな
り、所望のセ、ンサー出力を確実に得ることができる。
As described above, according to the present invention, at least the circuit elements of the peripheral circuit that are easily affected by light are shielded from light.
Even if the photo-sensing element is irradiated with light, this light will not affect the circuit element.Therefore, there is a risk that the circuit element will malfunction due to the irradiation of the light, and the desired sensor or sensor will not be affected. Output can be reliably obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の一実施例を示し、第1図は平面図、第2
図は第1図の切断線l−Hに沿う断面図である。 1−1−ランジスタ、5・ベース領域、sa・・ベース
領域5の左半部、5b・・ベース領域5の右半部、5c
・°・ベース領域5の残余の部分、6・・酸化膜、8゜
8’−°°アルミニウム蒸着配線 特許出願人 ローム株式会社 代理人 弁理士岡田和秀
The drawings show one embodiment of the present invention, with FIG. 1 being a plan view and FIG.
The figure is a sectional view taken along section line l-H in FIG. 1. 1-1-Transistor, 5 Base area, sa...Left half of base area 5, 5b...Right half of base area 5, 5c
・°・Remaining portion of base region 5, 6...Oxide film, 8°8'-°° Aluminum evaporated wiring patent applicant ROHM Co., Ltd. Agent Patent attorney Kazuhide Okada

Claims (1)

【特許請求の範囲】[Claims] (1)  フォト感知素子と、フォト感知素子の受光動
作に関与する周辺回路とを備えてなるフォトセンサー用
ICにおいて、前記周辺回路の少なくとも光の影響を受
は易い回路素子には、遮光性を有する配線層により遮光
を施こしてなるフォトセンサー用IC0
(1) In a photosensor IC comprising a photo-sensing element and a peripheral circuit involved in the light-receiving operation of the photo-sensing element, at least a circuit element of the peripheral circuit that is easily affected by light has a light shielding property. IC0 for photosensors that is shielded from light by a wiring layer with
JP58026691A 1983-02-20 1983-02-20 Ic for photosensor Granted JPS59152662A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58026691A JPS59152662A (en) 1983-02-20 1983-02-20 Ic for photosensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58026691A JPS59152662A (en) 1983-02-20 1983-02-20 Ic for photosensor

Publications (2)

Publication Number Publication Date
JPS59152662A true JPS59152662A (en) 1984-08-31
JPS6139744B2 JPS6139744B2 (en) 1986-09-05

Family

ID=12200412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58026691A Granted JPS59152662A (en) 1983-02-20 1983-02-20 Ic for photosensor

Country Status (1)

Country Link
JP (1) JPS59152662A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743955A (en) * 1985-05-01 1988-05-10 Canon Kabushiki Kaisha Photoelectric converting device
JP2006281806A (en) * 2005-03-31 2006-10-19 Mazda Motor Corp Arranging structure of engine auxiliary instrument for vehicle

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743955A (en) * 1985-05-01 1988-05-10 Canon Kabushiki Kaisha Photoelectric converting device
JP2006281806A (en) * 2005-03-31 2006-10-19 Mazda Motor Corp Arranging structure of engine auxiliary instrument for vehicle

Also Published As

Publication number Publication date
JPS6139744B2 (en) 1986-09-05

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