JPS59102580A - Robot hand - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention The present invention relates to a robot hand used in semiconductor manufacturing processes, and a robot hand that can accurately and quickly store, pick up, and transfer wafers to a process chamber in each step of processing wafers. We aim to provide the following.

Conventionally, in a semiconductor wafer processing process, chemical and physical surface treatments, photolithographic processing such as photo 1 to resist 1 coating and development are performed many times. Each process consists of a manufacturing line by combining the respective process chambers, and the entire manufacturing line is housed in a clean room (dust-free room). Each process chamber in the above manufacturing line is equipped with an attached device for storing, amplifying, and transferring wafers, but conventionally, it has been customary to use a conveyor-type attached device using a belt or other means, and this device must be used carefully. It has a moving part, and there is a drawback that dust generated from the moving part adheres to the wafer and adversely affects the circuit.

Moreover, the above-mentioned apparatus cannot meet the demand for increasing the storage, pick-up and transfer speeds in each process chamber in order to increase the production speed.

Therefore, the present invention aims to provide a robot hand suitable for increasing the speed of automated equipment in the manufacturing process of two (6) conductors. and a second gripping member held by the arm so as to be movable forward and backward with respect to the first gripping member and having no contact portion with the first gripping member, the first gripping member and a second gripping member are built into the arm.

An embodiment of the present invention will be described below with reference to the drawings. / is a base with a built-in drive mechanism, and columns - are erected on the top surface at three corners. Reference numeral 3 denotes a screw that is supported by the support column and the flat f1, and is rotationally driven by the motor 9. This screw 3 is screwed into a female screw part B provided on the work table 6 at the upper part thereof, and the movement of the work table J is freely controlled by a motor.

A rotating shaft 8 driven by a motor 7 built into one working table 6 is rotatably supported on the working table j. An arm saw is fixed horizontally on this rotating shaft 8,
At the tip of the arm 2, a first gripping member // and a second gripping member //, 2, which can move forward and backward with respect to the first gripping member, are further held.

At a predetermined height above the work table j, the rotation axis 8
An angle pin /3 is provided to protrude in the horizontal direction, and the sensor 3 on the sensor support part /da is integrally fixed to the work table 6.
The rotation is controlled by detecting the rotation angle by the 9"-2 angle pin/3, which is supported so as to be able to rise and fall along with the sensor support part/da, and its rotation angle is controlled by detecting the rotation angle by the can be measured and detected. Furthermore, the rotation angle can be accurately measured and detected.

On the arm 2, guides /A, /2 connected by guide shafts /, 5 are installed at predetermined intervals, and a first hand holding shaft /7 for advancing and retracting the first gripping member // is inserted. . guide/
A guide /8 fixed on the guides 1 to 15 is installed in the middle of the second hand holding shaft /'.
? A second hand holding shaft 2o for moving the second gripping member 2 forward and backward is fitted therein.

There is a frame c on the guide shaft 7.5 between guide/O and 78.
2/ is slidably inserted into the first hand holding shaft /7, the rear end of which is fixed to the cylinder 2, which is fixed on the guide /8. 2 to operate the first gripping member //.

A rotating ring, 23 driven by a motor J is attached to the rear of the rotating shaft 8 of the arm, and is a drive actuator that moves the second hand holding shaft 20 forward and backward through a link lever 2. Each mechanism is attached. Second
The hand holding shaft 20 is connected to the link lever 2 through the frame, and is inserted through the large diameter through hole 22 provided in the guide 8 and the first gripping member. The other end is fixed to the second gripping member/2. , :28
is a wafer stopper protruding from the lower end of the first gripping portion (O//).

Next, the operation of the robot hand 3/ of the present invention will be explained. The robot handles 1 to 37 are arranged in parallel in a process chamber 362 that performs chemical and physical surface treatments, photoresist coating and development in photolithographic processing, and the like. Reference numeral 33 denotes a transfer device that loads and transfers the wafer carrier 3. The robot hand 3/ grips and picks up the carrier 3 at a predetermined position after transfer, and transfers it to the process chamber 3. ．． Send it to 2. After that, the carrier 3 after wafer processing is picked up by the robot hand 3/,
Return to transport equipment 'faJJ.

This process chamber 3. ．． The operation of the robot hand 3/ when storing, picking up, and transferring a wafer to the robot hand 2 will be explained. When the carrier 311t is on the transfer device 33, the motor 2 built into the work table 6 is activated to rotate the tool 11 onto the carrier 3da, and then the motor is activated to move the arm 7 and the second gripping member //, /, 2 are lowered to be located on the side of the carrier 3da.Here, the motor 2.5 at the rear of the arm is activated, and the link lever 2a is used to move the second The carrier 3 is clamped by pulling the gripping member.

After that, the motor is reversed to raise the arm 7, and the motor 2 is driven to move the tip of the arm into the process chamber 3,
2 Rotate up. Then, lower the arm saw again and move to the second position.
When the gripping members /, 2 are opened, the carrier 31I is stored in the process chamber Jc2 and subjected to a predetermined process. The same operation can be used when returning the carrier 3 to the transfer device 33).

Since the robot hand of the present invention has the following configuration, it can be suitably used for handling such as transferring semiconductor wafers in various semiconductor manufacturing processes, and can also be used for storing and picking up wafers in process chambers 3 and 21\. And, the carrier 3 can be accurately transferred while controlling its attitude.

In addition, when each gripping member //, /c2 is operated, the sliding part with other parts is built into the arm saw, which prevents dust from scattering onto the wafer. Since the transport device can be eliminated, the cleanliness of the entire semiconductor manufacturing equipment can be dramatically improved by using it in conjunction with a conventional clean room.

[Brief explanation of the drawing]

The drawings show embodiments of the robot hand of the present invention.
The figure is a perspective view of the robot hand, and Figure 2 is a perspective view of the robot hand installed in the process chamber. 13. arm//, first gripping member/, 2. , second gripping member

Claims (1)

[Scope of Claims] 1. An arm rotatably supported, a first gripping member held at the tip of the arm, and a first gripping member that can move forward and backward with respect to the first gripping member. a second gripping member held by the arm without having a contact portion, and a driving portion for the first gripping member and the second gripping member is built into the arm. hand. 2. The robot hand according to claim 1, wherein the rotatable arm is supported so as to be movable up and down together with an angle pin protruding from the rotation axis thereof and a sensor support part fixed on the bearing part.