JPS58147003A - Electric resistance element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to an electric resistance element, particularly a high voltage resistance element #ll, which is small in size and has good withstand voltage characteristics.

For example, in high-voltage resistor voltage dividers used with continuous ratings, in order to keep temperature errors to a minimum, it is necessary to keep the temperature of the two resistors, and therefore the amount of heat generated during one energization, to a minimum. It is necessary to select a resistance element having a resistance value.゛One problem in such a case is the stability of the resistor, which requires consideration of stability against overvoltage and stability over temperature life, but in general, the stability of the resistor material must be considered. As the resistivity increases, their stability tends to decrease. Therefore, in order to obtain a high resistance value, K can be obtained by reducing the cross-sectional area of the resistor as much as possible.
This is K too.

There are limitations due to the material itself and processing, and as a result, there is a drawback that the length of the resistor must be considerably long.

Next, an example of a conventionally used high resistance element is shown.
As shown in FIG. 7 of the accompanying drawings, in FIG. 6, which is an example in which resistor paste is used, the reference numeral 0 indicates an insulating substrate made of alumina porcelain or the like.

After 21 is printed on an insulating substrate 0, the resistor 21 of the conventional high-resistance element configured in this way is
To obtain high resistance values, e.g.

As shown in the figure, it is shaped like a broken line □.

The length is ensured. However, in the case of such a shape, the withstand voltage between the P section and the y section becomes a problem.

That is, a high voltage is applied between this P-y portion in the creeping direction of the insulating substrate col.
The gap between the parts must be set to a required dimension from the viewpoint of withstand voltage, and as a result, the external dimensions of the insulating substrate 21 have to be larger than necessary.

An object of the present invention is to eliminate the drawbacks of conventional electrical resistance elements as described above, and to provide an electrical resistance element that is small and has excellent withstand voltage characteristics.

The present invention aims to achieve these objectives.

A resistor is formed on one surface of a flat insulating substrate, and one end of the resistor is provided with a first electrode terminal that penetrates the insulating substrate and has contacts on both sides, and the other end of the resistor is provided with the insulating substrate. A plurality of unit resistance element substrates provided with second electrode terminals that do not penetrate through the unit resistance element substrates are stacked, and the desired first and second electrical terminals of the adjacent unit resistance element substrates are brought into contact with each other, and the unit resistance element at one end is The device is characterized in that it is electrically connected for Km from the substrate to the unit resistance element substrate at the other end.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the accompanying drawings 7 to 9 illustrating embodiments thereof.

In the figure, the symbol l is an insulating substrate made of alumina porcelain, etc., the resistor is fired and formed on one surface of the insulating substrate, similar to conventional resistance elements, and J is in contact with one end of the resistor. The first electrode terminal DA, which is fixed through the insulating substrate l and has contacts on both sides of the insulating substrate l, contacts the other end of the resistor 2 without penetrating the insulating substrate l. Fixed to an insulating substrate. The second electrode terminal has a contact point only on the surface of the insulating substrate l on the resistor 2 side.

These insulating substrates 1. A unit resistance element substrate 3 is constituted by the resistor, the first electrode terminal 3, and the second electrode terminal DA,
This unit resistance element board! For example 2.

As shown in Fig. D, one electric resistance element 6 of the present invention is constructed by laminating a plurality of elements.

Moreover, as shown in FIG. Resistor cores a, cores b, Jc, .
... face in the same direction, and the entire structure is assembled in one piece with the insulation struts (not shown) tightened in the stacking direction to ensure contact between the electrodes. It constitutes a resistance element 6.

Since the present invention is configured as described above, one energization is carried out in the second energization.
Electrode terminal fa → resistor 2a → first electrode terminal ja → second electrode terminal 4Ib → resistor Kob → first electrode terminal 3b → second electrode terminal aC → resistor 2c → first electrode terminal 3c...・
Therefore, the overall length can be easily made very long, and if the insulating substrate 1 is used, for example, a 1 m 9 degree substrate.

The overall size can also be easily kept small.

The voltage between the p and p' portions shown in the conventional example, that is, between the broken lines, is also applied in the penetrating direction of the substrate, so it is more , a sufficiently high yield strength can be expected. for example,
If aluminum porcelain is used for this insulating substrate, the one-penetration proof strength will be t! r KV/m, and it can be said that the proof stress is sufficiently high compared to the creepage proof stress.

Furthermore, its relative dielectric constant εB is large, about 9, and when looking at the resistive element as a whole, its so-called series capacitance is significantly increased compared to conventional ones, which is advantageous for equalizing voltage sharing when applying high-frequency voltage such as impulses. becomes.

Next, what is shown in FIG. 3 of the accompanying drawings is another embodiment of the unit resistance element substrate of the present invention, which will be described here.

The resistor l is its unit resistance element substrate l! insulating substrate l
A semicircular arc shape is formed between the first and second electrode terminals 1 and 3, 79 installed at /, and the adjacent unit resistance element substrate 1
The resistor formed on the insulating substrate/15L of 5a is like the resistor/Ja indicated by a dotted line.

It has a semicircular arc shape that bulges on the opposite side, and in this way, the unit resistance element substrate /! , /ka, .

The resistor is formed and constructed so that its projected shape is a perfect circle.

The electrical resistance element configured and laminated in this manner is as follows.

Since the resistor is connected like a circular spiral coil, the electric field on the surface of the resistor can be significantly relaxed when high voltage is applied, and the electrical resistance element has better withstand voltage characteristics. can be realized.

As stated above, according to the present invention, the resistor can be formed and its length can be made very long, and it is also possible to sufficiently downsize the resistor.

It is possible to obtain an electric resistance element 1 having excellent withstand voltage characteristics, for example, a high voltage resistance element.

Note that in all of the above embodiments, the electric resistance element is constructed by the unit resistance element substrate pressure.

The stacking is performed such that all the unit resistance element substrates face in the same direction, that is, the surfaces on which the resistor is formed face the same direction, and the unit resistance element substrates that are adjacent to each other have a first electrode terminal on one side and a terminal on the other side. Although the structure is such that the second electrode terminal is in contact with the second electrode terminal, if necessary, other types of substrates may be sandwiched between the substrates. Laminated to face each other or even.

Lamination Q - It is also possible to laminate the parts so that the first electrode terminals or the second electrode terminals are in contact with each other.

[Brief explanation of the drawing]

FIG. 1 is a plan view of an example of a conventional high resistance element, FIG. 2 is a plan view of an embodiment of a unit resistance element substrate constituting the electrical resistance element of the present invention, and FIG. FIG. 3 is a partially cut-away sectional view of an embodiment of the electrical resistance element of the present invention in which the unit resistance element substrates shown in FIGS. 2 and 3 are laminated. /, //, //&”insulating substrate, 2.λfi~koC,/
ko, lλa--resistor, , 7, J a~j c. i, y・-first electrode terminal, 4I, daa-pc, zp-・
No. 1 electrode terminal,! ,! Ra~! rc, tk, tkra・
・Unit resistance element substrate, A, /A... Electric resistance element. Agent Shin Kuzuno −

Claims (1)

[Scope of Claims] (1) A resistor is formed on one surface of a flat insulating substrate, and a seventh electrode terminal that penetrates the insulating substrate and has contacts on both sides of the resistor at one end of the resistor, and the resistor. Do not penetrate the above insulating board at the other end! A plurality of unit resistance element substrates each provided with a co-electrode terminal are stacked, and the desired seventh and first electrode terminals of the adjacent unit resistance element substrates are brought into contact with each other, so that one end of the unit resistance element substrate is connected to the other. An electric resistance element characterized in that it is configured such that it is electrically connected to the unit resistance element substrate at the end. (v) The electrical resistance element according to claim 1, wherein the plurality of unit resistance element substrates are stacked such that the surfaces on which the resistors are formed are in the same direction. (j) Desired contact between the first and second electrode terminals of the adjacent unit resistance element substrates is such that at least one set of the adjacent unit resistance element substrates contacts the first and second electrode terminals of the adjacent unit resistance element substrates. The electrical resistance element according to claim 1 or 2, wherein one electrode terminal is in contact with the first electrode terminal of the other unit resistance element substrate. (41) A resistor is formed on one surface of a planar insulating substrate. Forms a semicircular arc shape in its planar shape, and. The unit resistance element substrates according to any one of claims 1 to 3, wherein the unit resistance element substrates adjacent to each other in a stacked state are stacked so that their projected planar shapes form a complete circular arc. electrical resistance element.