JPS5775491A - Plating treatment device - Google Patents
Plating treatment deviceInfo
- Publication number
- JPS5775491A JPS5775491A JP15144180A JP15144180A JPS5775491A JP S5775491 A JPS5775491 A JP S5775491A JP 15144180 A JP15144180 A JP 15144180A JP 15144180 A JP15144180 A JP 15144180A JP S5775491 A JPS5775491 A JP S5775491A
- Authority
- JP
- Japan
- Prior art keywords
- treatment device
- plating treatment
- plating
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15144180A JPS594503B2 (en) | 1980-10-30 | 1980-10-30 | Plating processing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15144180A JPS594503B2 (en) | 1980-10-30 | 1980-10-30 | Plating processing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5775491A true JPS5775491A (en) | 1982-05-12 |
JPS594503B2 JPS594503B2 (en) | 1984-01-30 |
Family
ID=15518667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15144180A Expired JPS594503B2 (en) | 1980-10-30 | 1980-10-30 | Plating processing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS594503B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002298999A (en) * | 2001-03-30 | 2002-10-11 | Molex Inc | Socket for semiconductor package, and sliding method to semiconductor package |
WO2012102062A1 (en) * | 2011-01-25 | 2012-08-02 | 東京エレクトロン株式会社 | Plating apparatus, plating method, and recording medium |
WO2012102098A1 (en) * | 2011-01-25 | 2012-08-02 | 東京エレクトロン株式会社 | Plating apparatus, plating method, and storage medium |
-
1980
- 1980-10-30 JP JP15144180A patent/JPS594503B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002298999A (en) * | 2001-03-30 | 2002-10-11 | Molex Inc | Socket for semiconductor package, and sliding method to semiconductor package |
WO2012102062A1 (en) * | 2011-01-25 | 2012-08-02 | 東京エレクトロン株式会社 | Plating apparatus, plating method, and recording medium |
WO2012102098A1 (en) * | 2011-01-25 | 2012-08-02 | 東京エレクトロン株式会社 | Plating apparatus, plating method, and storage medium |
Also Published As
Publication number | Publication date |
---|---|
JPS594503B2 (en) | 1984-01-30 |
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