JPS5766654A - Ebullition type cooling module - Google Patents

Ebullition type cooling module

Info

Publication number
JPS5766654A
JPS5766654A JP14312480A JP14312480A JPS5766654A JP S5766654 A JPS5766654 A JP S5766654A JP 14312480 A JP14312480 A JP 14312480A JP 14312480 A JP14312480 A JP 14312480A JP S5766654 A JPS5766654 A JP S5766654A
Authority
JP
Japan
Prior art keywords
module
large number
cooling module
type cooling
cylindrical projections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14312480A
Other languages
Japanese (ja)
Other versions
JPH0157503B2 (en
Inventor
Kishio Yokouchi
Nobuo Kamehara
Koichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14312480A priority Critical patent/JPS5766654A/en
Publication of JPS5766654A publication Critical patent/JPS5766654A/en
Publication of JPH0157503B2 publication Critical patent/JPH0157503B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To form a compact and lightweight ebullition type coolihg module, by using a thin container having a large number of cylindrical projections as the parts corresponding to inner and outer fins of the module. CONSTITUTION:A substrate 5 mounted with semiconductor elements 6 and a container 8 having a large number of cylindrical projections a are sealed with each other through a packing 9 to form a cooling type module 10. A coolant 11 is enclosed in the module 10. Because the thin container having a large number of cylindrical projections is used as the parts corresponding to inner and outer fins of the module 10, it is possible to obtain a module inexpensive and excellent in cooling efficiency.
JP14312480A 1980-10-14 1980-10-14 Ebullition type cooling module Granted JPS5766654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14312480A JPS5766654A (en) 1980-10-14 1980-10-14 Ebullition type cooling module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14312480A JPS5766654A (en) 1980-10-14 1980-10-14 Ebullition type cooling module

Publications (2)

Publication Number Publication Date
JPS5766654A true JPS5766654A (en) 1982-04-22
JPH0157503B2 JPH0157503B2 (en) 1989-12-06

Family

ID=15331468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14312480A Granted JPS5766654A (en) 1980-10-14 1980-10-14 Ebullition type cooling module

Country Status (1)

Country Link
JP (1) JPS5766654A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002011506A2 (en) * 2000-08-02 2002-02-07 Incep Technologies, Inc. Vapor chamber with integrated pin array
WO2002071479A1 (en) * 2001-02-28 2002-09-12 Intel Corporation Heat dissipation device
US6490160B2 (en) 1999-07-15 2002-12-03 Incep Technologies, Inc. Vapor chamber with integrated pin array
US6801431B2 (en) 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
JP2016072604A (en) * 2014-09-30 2016-05-09 旭徳科技股▲ふん▼有限公司 Heat radiation module
JP2023513716A (en) * 2020-02-11 2023-04-03 アイスオトープ・グループ・リミテッド Housing for immersion cooling of multiple electronics

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7352848B2 (en) * 2019-05-21 2023-09-29 株式会社ロータス・サーマル・ソリューション A heat exchange structure for extracting heat from a coolant in a cooling device, and a cooling device equipped with the heat exchange structure

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6490160B2 (en) 1999-07-15 2002-12-03 Incep Technologies, Inc. Vapor chamber with integrated pin array
US6801431B2 (en) 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
WO2002011506A2 (en) * 2000-08-02 2002-02-07 Incep Technologies, Inc. Vapor chamber with integrated pin array
WO2002011506A3 (en) * 2000-08-02 2002-04-04 Incep Technologies Inc Vapor chamber with integrated pin array
WO2002071479A1 (en) * 2001-02-28 2002-09-12 Intel Corporation Heat dissipation device
JP2016072604A (en) * 2014-09-30 2016-05-09 旭徳科技股▲ふん▼有限公司 Heat radiation module
JP2023513716A (en) * 2020-02-11 2023-04-03 アイスオトープ・グループ・リミテッド Housing for immersion cooling of multiple electronics

Also Published As

Publication number Publication date
JPH0157503B2 (en) 1989-12-06

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