JPS573831A - Vacuum metallizing method - Google Patents

Vacuum metallizing method

Info

Publication number
JPS573831A
JPS573831A JP7860980A JP7860980A JPS573831A JP S573831 A JPS573831 A JP S573831A JP 7860980 A JP7860980 A JP 7860980A JP 7860980 A JP7860980 A JP 7860980A JP S573831 A JPS573831 A JP S573831A
Authority
JP
Japan
Prior art keywords
substrate
deposited
evaporated
metal
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7860980A
Other languages
Japanese (ja)
Other versions
JPS6112992B2 (en
Inventor
Koichi Shinohara
Takashi Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7860980A priority Critical patent/JPS573831A/en
Priority to DE8181302513T priority patent/DE3172124D1/en
Priority to EP81302513A priority patent/EP0041850B2/en
Priority to US06/272,119 priority patent/US4393091A/en
Publication of JPS573831A publication Critical patent/JPS573831A/en
Publication of JPS6112992B2 publication Critical patent/JPS6112992B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To enable a thick film layer of a high-melting metal or an oxide semiconductor to be formed on a substrate, by a method wherein a high-molecular molded article substrate previously converted into an electret is moved along a metal surface, and a film layer is vacuum-deposited on the opposite surface to the metal surface. CONSTITUTION:For example, within a vacuum tank 3 kept under vacuum by means of an exhaust system 10, a material 4' (e.g. Ti) to be evaporated (which is charged in a water-cooled copper hearth 7) is heated and evaporated by an electron beam source 8. The evaporated material 4' is deposited on the surface of a high-molecular molded article substrate 2 (e.g. a polycarbonate film) which is supplied from an unwinding shaft 5 and reaches a metal rotating drum 1. If necessary, the non-metallized surface of the substrate is exposed to glow discharge generated by applying AC voltage to a flat electrode 14 in the presence of Ar gas. Then the metallized substrate is wound up around a winding shaft 11. EFFECT:An NiCr layer of 0.6mu in thickness can be deposited on the surface of a polycarbonate film of 2-3mu in thickness.
JP7860980A 1980-06-10 1980-06-10 Vacuum metallizing method Granted JPS573831A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP7860980A JPS573831A (en) 1980-06-10 1980-06-10 Vacuum metallizing method
DE8181302513T DE3172124D1 (en) 1980-06-10 1981-06-05 A method of vacuum depositing a layer on a plastics film substrate
EP81302513A EP0041850B2 (en) 1980-06-10 1981-06-05 A method of vacuum depositing a layer on a plastics film substrate
US06/272,119 US4393091A (en) 1980-06-10 1981-06-10 Method of vacuum depositing a layer on a plastic film substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7860980A JPS573831A (en) 1980-06-10 1980-06-10 Vacuum metallizing method

Publications (2)

Publication Number Publication Date
JPS573831A true JPS573831A (en) 1982-01-09
JPS6112992B2 JPS6112992B2 (en) 1986-04-11

Family

ID=13666616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7860980A Granted JPS573831A (en) 1980-06-10 1980-06-10 Vacuum metallizing method

Country Status (1)

Country Link
JP (1) JPS573831A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189371A (en) * 1982-04-28 1983-11-05 Teijin Ltd Sputtering device
JPS5953680A (en) * 1982-09-21 1984-03-28 Teijin Ltd Sputtering device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07119671A (en) * 1993-10-20 1995-05-09 Matsushita Refrig Co Ltd Refrigerating air conditioner

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HANDBOOK OF THIN FILM TECHNOLOGY=1970 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189371A (en) * 1982-04-28 1983-11-05 Teijin Ltd Sputtering device
JPH034621B2 (en) * 1982-04-28 1991-01-23 Teijin Ltd
JPS5953680A (en) * 1982-09-21 1984-03-28 Teijin Ltd Sputtering device
JPS6335710B2 (en) * 1982-09-21 1988-07-15 Teijin Ltd

Also Published As

Publication number Publication date
JPS6112992B2 (en) 1986-04-11

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