JPS573831A - Vacuum metallizing method - Google Patents
Vacuum metallizing methodInfo
- Publication number
- JPS573831A JPS573831A JP7860980A JP7860980A JPS573831A JP S573831 A JPS573831 A JP S573831A JP 7860980 A JP7860980 A JP 7860980A JP 7860980 A JP7860980 A JP 7860980A JP S573831 A JPS573831 A JP S573831A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- deposited
- evaporated
- metal
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To enable a thick film layer of a high-melting metal or an oxide semiconductor to be formed on a substrate, by a method wherein a high-molecular molded article substrate previously converted into an electret is moved along a metal surface, and a film layer is vacuum-deposited on the opposite surface to the metal surface. CONSTITUTION:For example, within a vacuum tank 3 kept under vacuum by means of an exhaust system 10, a material 4' (e.g. Ti) to be evaporated (which is charged in a water-cooled copper hearth 7) is heated and evaporated by an electron beam source 8. The evaporated material 4' is deposited on the surface of a high-molecular molded article substrate 2 (e.g. a polycarbonate film) which is supplied from an unwinding shaft 5 and reaches a metal rotating drum 1. If necessary, the non-metallized surface of the substrate is exposed to glow discharge generated by applying AC voltage to a flat electrode 14 in the presence of Ar gas. Then the metallized substrate is wound up around a winding shaft 11. EFFECT:An NiCr layer of 0.6mu in thickness can be deposited on the surface of a polycarbonate film of 2-3mu in thickness.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7860980A JPS573831A (en) | 1980-06-10 | 1980-06-10 | Vacuum metallizing method |
DE8181302513T DE3172124D1 (en) | 1980-06-10 | 1981-06-05 | A method of vacuum depositing a layer on a plastics film substrate |
EP81302513A EP0041850B2 (en) | 1980-06-10 | 1981-06-05 | A method of vacuum depositing a layer on a plastics film substrate |
US06/272,119 US4393091A (en) | 1980-06-10 | 1981-06-10 | Method of vacuum depositing a layer on a plastic film substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7860980A JPS573831A (en) | 1980-06-10 | 1980-06-10 | Vacuum metallizing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS573831A true JPS573831A (en) | 1982-01-09 |
JPS6112992B2 JPS6112992B2 (en) | 1986-04-11 |
Family
ID=13666616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7860980A Granted JPS573831A (en) | 1980-06-10 | 1980-06-10 | Vacuum metallizing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS573831A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58189371A (en) * | 1982-04-28 | 1983-11-05 | Teijin Ltd | Sputtering device |
JPS5953680A (en) * | 1982-09-21 | 1984-03-28 | Teijin Ltd | Sputtering device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07119671A (en) * | 1993-10-20 | 1995-05-09 | Matsushita Refrig Co Ltd | Refrigerating air conditioner |
-
1980
- 1980-06-10 JP JP7860980A patent/JPS573831A/en active Granted
Non-Patent Citations (1)
Title |
---|
HANDBOOK OF THIN FILM TECHNOLOGY=1970 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58189371A (en) * | 1982-04-28 | 1983-11-05 | Teijin Ltd | Sputtering device |
JPH034621B2 (en) * | 1982-04-28 | 1991-01-23 | Teijin Ltd | |
JPS5953680A (en) * | 1982-09-21 | 1984-03-28 | Teijin Ltd | Sputtering device |
JPS6335710B2 (en) * | 1982-09-21 | 1988-07-15 | Teijin Ltd |
Also Published As
Publication number | Publication date |
---|---|
JPS6112992B2 (en) | 1986-04-11 |
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