JPS57121028A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS57121028A
JPS57121028A JP757881A JP757881A JPS57121028A JP S57121028 A JPS57121028 A JP S57121028A JP 757881 A JP757881 A JP 757881A JP 757881 A JP757881 A JP 757881A JP S57121028 A JPS57121028 A JP S57121028A
Authority
JP
Japan
Prior art keywords
novolak
epoxy resin
mixed
component
resorcinol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP757881A
Other languages
Japanese (ja)
Other versions
JPS6351446B2 (en
Inventor
Katsumi Watanabe
Kichiya Fukuyama
Yasuhisa Saito
Makoto Ando
Yasuteru Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP757881A priority Critical patent/JPS57121028A/en
Priority to US06/285,979 priority patent/US4368299A/en
Priority to DE19813131412 priority patent/DE3131412A1/en
Publication of JPS57121028A publication Critical patent/JPS57121028A/en
Publication of JPS6351446B2 publication Critical patent/JPS6351446B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To prepare a non-toxic epoxy resin giving a cured product having improved heat resistance, durability, etc., by compounding an epoxy resin with a curing agent comprising a mixed novolak composed of a resorcinol novolak and a monohydric phenol.
CONSTITUTION: The objective composition is prepared by compounding (A) an epoxy resin with (B) a mixed novolak obtained by mixing (i) a resorcinol novolak and (ii) a monohydric phenol novolak, and if necessary adding a cure accelerator (e.g. morpholine) to the mixture. The content of the component (i) in the mixed novolak is ≥10wt%, and the sum of the unreacted resorcinol and the unreacted monohydric phenol in the mixed novolak is ≤8%. The number of the phenolic OH groups in the component B is pref. 0.5W1.5 per one epoxy group in the component A.
COPYRIGHT: (C)1982,JPO&Japio
JP757881A 1980-08-07 1981-01-20 Epoxy resin composition Granted JPS57121028A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP757881A JPS57121028A (en) 1981-01-20 1981-01-20 Epoxy resin composition
US06/285,979 US4368299A (en) 1980-08-07 1981-07-23 Epoxy resin compositions
DE19813131412 DE3131412A1 (en) 1980-08-07 1981-08-07 EPOXY RESIN

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP757881A JPS57121028A (en) 1981-01-20 1981-01-20 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS57121028A true JPS57121028A (en) 1982-07-28
JPS6351446B2 JPS6351446B2 (en) 1988-10-14

Family

ID=11669689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP757881A Granted JPS57121028A (en) 1980-08-07 1981-01-20 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57121028A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001329049A (en) * 2000-05-19 2001-11-27 Nippon Kayaku Co Ltd Epoxy resin composition
JP2016011410A (en) * 2014-06-05 2016-01-21 信越化学工業株式会社 Thermosetting resin composition

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2801014B2 (en) * 1988-06-17 1998-09-21 アドヴァンスド、セミコンダクター・マテリアルズ・アメリカ・インコーポレーテッド Wafer handling system with Bernoulli pickup
JP2868073B2 (en) * 1995-11-28 1999-03-10 イートン コーポレーション Heating equipment for semiconductor wafers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001329049A (en) * 2000-05-19 2001-11-27 Nippon Kayaku Co Ltd Epoxy resin composition
JP4562241B2 (en) * 2000-05-19 2010-10-13 日本化薬株式会社 Epoxy resin composition
JP2016011410A (en) * 2014-06-05 2016-01-21 信越化学工業株式会社 Thermosetting resin composition

Also Published As

Publication number Publication date
JPS6351446B2 (en) 1988-10-14

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