JPS5635451A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5635451A
JPS5635451A JP11119079A JP11119079A JPS5635451A JP S5635451 A JPS5635451 A JP S5635451A JP 11119079 A JP11119079 A JP 11119079A JP 11119079 A JP11119079 A JP 11119079A JP S5635451 A JPS5635451 A JP S5635451A
Authority
JP
Japan
Prior art keywords
electrodes
semiconductor device
predetermined position
lead frame
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11119079A
Other languages
Japanese (ja)
Inventor
Toshinobu Banjo
Osamu Nakagawa
Koichi Nakagawa
Hideo Hamamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11119079A priority Critical patent/JPS5635451A/en
Publication of JPS5635451A publication Critical patent/JPS5635451A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To contrive the easy connection of a wire in the semiconductor device by providing a connector provided with a conductor on an insulator at predetermined position on a lead frame and using the connected as an intermediate point of the connecting wire between the electrodes of a pellet. CONSTITUTION:Metal is deposited on a heat resistive film 3b made of polyimide or the like, and a conductive film 3a is selectively formed thereon. A sheet 2a thus formed is bonded at predetermined position on the lead frame with a heat-curable adhesive. According to this configuration it is not necessary to connect directly between the electrodes of two or more pellets, and a working efficiency can be accordingly improved.
JP11119079A 1979-08-30 1979-08-30 Semiconductor device Pending JPS5635451A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11119079A JPS5635451A (en) 1979-08-30 1979-08-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11119079A JPS5635451A (en) 1979-08-30 1979-08-30 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5635451A true JPS5635451A (en) 1981-04-08

Family

ID=14554772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11119079A Pending JPS5635451A (en) 1979-08-30 1979-08-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5635451A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6012329U (en) * 1983-07-05 1985-01-28 株式会社日立ホームテック electric rice cooker
JPS6376217U (en) * 1987-10-31 1988-05-20
JPS63153016A (en) * 1987-11-10 1988-06-25 株式会社東芝 Electric rice cooker

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6012329U (en) * 1983-07-05 1985-01-28 株式会社日立ホームテック electric rice cooker
JPS6376217U (en) * 1987-10-31 1988-05-20
JPH0430968Y2 (en) * 1987-10-31 1992-07-27
JPS63153016A (en) * 1987-11-10 1988-06-25 株式会社東芝 Electric rice cooker
JPH0253043B2 (en) * 1987-11-10 1990-11-15 Tokyo Shibaura Electric Co

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