JPS56122157A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56122157A
JPS56122157A JP2542480A JP2542480A JPS56122157A JP S56122157 A JPS56122157 A JP S56122157A JP 2542480 A JP2542480 A JP 2542480A JP 2542480 A JP2542480 A JP 2542480A JP S56122157 A JPS56122157 A JP S56122157A
Authority
JP
Japan
Prior art keywords
line
variation
axis
center
respect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2542480A
Other languages
Japanese (ja)
Inventor
Katsuhiko Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2542480A priority Critical patent/JPS56122157A/en
Publication of JPS56122157A publication Critical patent/JPS56122157A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To cancel the variation in the characteristics of a semiconductor device due to strain caused thereat when sealing the device with plastic by so disposing circuit elements symmetricall with respect to a point or a linear line on a plane. CONSTITUTION:Elements 6 for determining circuit parameters at ratio of the characteristics (such as, for example, resistors R1-R4, R5-R8) are so disposed in parallel and symmetrically with respect to a vertical line (X-axis or Y-axis) passing the center of each side and the center (point 0) of a semiconductor integrated circuit chip in a dual line and in line type package in which a semiconductor chip 1 and a mount 2 are covered with plastic resin 3. Thus, all of the rates of change in the resistance thereof due to symmetrical strain become equal. Accordingly, the variation in the characteristics of the rate can be completely cancelled or reduced extremely.
JP2542480A 1980-02-29 1980-02-29 Semiconductor device Pending JPS56122157A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2542480A JPS56122157A (en) 1980-02-29 1980-02-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2542480A JPS56122157A (en) 1980-02-29 1980-02-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56122157A true JPS56122157A (en) 1981-09-25

Family

ID=12165570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2542480A Pending JPS56122157A (en) 1980-02-29 1980-02-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56122157A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998024122A1 (en) * 1996-11-28 1998-06-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US7091595B2 (en) * 2003-11-11 2006-08-15 Infineon Technologies, Ag Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
JP2011249411A (en) * 2010-05-24 2011-12-08 Seiwa Electric Mfg Co Ltd Semiconductor light-emitting element, light-emitting device, illumination device, display device, signal light unit and road information device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336488A (en) * 1976-09-17 1978-04-04 Hitachi Ltd Semiconductor device
JPS5434787A (en) * 1977-08-24 1979-03-14 Hitachi Ltd Formation of resistance of semiconductor integrated circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336488A (en) * 1976-09-17 1978-04-04 Hitachi Ltd Semiconductor device
JPS5434787A (en) * 1977-08-24 1979-03-14 Hitachi Ltd Formation of resistance of semiconductor integrated circuit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998024122A1 (en) * 1996-11-28 1998-06-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US6002166A (en) * 1996-11-28 1999-12-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US7091595B2 (en) * 2003-11-11 2006-08-15 Infineon Technologies, Ag Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
US7883993B2 (en) 2003-11-11 2011-02-08 Infineon Technologies Ag Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
JP2011249411A (en) * 2010-05-24 2011-12-08 Seiwa Electric Mfg Co Ltd Semiconductor light-emitting element, light-emitting device, illumination device, display device, signal light unit and road information device

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