JPS5596648A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPS5596648A
JPS5596648A JP424879A JP424879A JPS5596648A JP S5596648 A JPS5596648 A JP S5596648A JP 424879 A JP424879 A JP 424879A JP 424879 A JP424879 A JP 424879A JP S5596648 A JPS5596648 A JP S5596648A
Authority
JP
Japan
Prior art keywords
frame
island
arm
wire bonding
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP424879A
Other languages
Japanese (ja)
Inventor
Kiyokata Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP424879A priority Critical patent/JPS5596648A/en
Publication of JPS5596648A publication Critical patent/JPS5596648A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To improve the wire bonding yield of a wire bonding apparatus by preventing an island for placing the pellets of lead frames via an arm interlocked with a carrier feeder from floating.
CONSTITUTION: When a lead frame 4 is supplied to predetermined position, a shaft 7 is raised to contact the end of a heater 9 with one side surface of an island 3 of the frame. Simultaneously, an electromagnet 17 provided through a metal plate 17a at the other end of an arm 15 is operated to attract a plate 17a. Thus, the arm 15 urges the end of the island 3 around the shaft 19 as a fulcrum. The position of the pellet is inspected optically in this state to carry out improper frame without bonding and to heat the heater 9 for the proper frame to bond the electrode of the pellet 2 to the terminal 1c of the frame. In the meantime, the island 3 is contacted with the heater 9 by the arm 15 to be thus sufficiently heated. Accordingly, the island 3 is rigidly connected. When completing the bonding of the wire of the frame, the electromagnet 17 is deenergized and the frame 4 is carried out. This configuration can improve the detecting accuracy of the position of the pellet and also the wire bonding yield.
COPYRIGHT: (C)1980,JPO&Japio
JP424879A 1979-01-18 1979-01-18 Wire bonding apparatus Pending JPS5596648A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP424879A JPS5596648A (en) 1979-01-18 1979-01-18 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP424879A JPS5596648A (en) 1979-01-18 1979-01-18 Wire bonding apparatus

Publications (1)

Publication Number Publication Date
JPS5596648A true JPS5596648A (en) 1980-07-23

Family

ID=11579229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP424879A Pending JPS5596648A (en) 1979-01-18 1979-01-18 Wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPS5596648A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225440A (en) * 1984-04-23 1985-11-09 Shinkawa Ltd Positioning device for film carrier
US4635838A (en) * 1984-01-16 1987-01-13 Peter Urban Bonder for lead frames
US5181646A (en) * 1991-02-15 1993-01-26 Kabushiki Kaisha Shinkawa Lead frame holding apparatus for use in wire bonders

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4635838A (en) * 1984-01-16 1987-01-13 Peter Urban Bonder for lead frames
JPS60225440A (en) * 1984-04-23 1985-11-09 Shinkawa Ltd Positioning device for film carrier
JPH021372B2 (en) * 1984-04-23 1990-01-11 Shinkawa Kk
US5181646A (en) * 1991-02-15 1993-01-26 Kabushiki Kaisha Shinkawa Lead frame holding apparatus for use in wire bonders

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