JPS5570080A - Preparation of luminous display device - Google Patents

Preparation of luminous display device

Info

Publication number
JPS5570080A
JPS5570080A JP14396678A JP14396678A JPS5570080A JP S5570080 A JPS5570080 A JP S5570080A JP 14396678 A JP14396678 A JP 14396678A JP 14396678 A JP14396678 A JP 14396678A JP S5570080 A JPS5570080 A JP S5570080A
Authority
JP
Japan
Prior art keywords
resin board
pellet
lead
hole
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14396678A
Other languages
Japanese (ja)
Inventor
Fumio Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14396678A priority Critical patent/JPS5570080A/en
Publication of JPS5570080A publication Critical patent/JPS5570080A/en
Pending legal-status Critical Current

Links

Landscapes

  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE: To facilitate manufacture the titled device by admitting a conductor with elasticity and a pellet of a luminous diode into a hole of a resin board in order, and by pressing down the conductor and the pellet by means of a transparent sheet with a lead protruding from the upper portion.
CONSTITUTION: A resin board 2 is pasted on a substrate 1 with a pattern-like lead 9. The resin board 2 has a truncated cone-like hole 4, and lead pins 5 are buried at fixed locations. A rubbery conductor electrode 6 and a pellet 3 of a luminous diode are introduced into the hole 4 of the resin board together in turn in shapes that the directions of electrodes are properly arranged. And a transparent resin sheet 7 with a transparent electrode lead 8 is sticked to the resin board 2 in a shape that the sheet holds down the pellet 3.
COPYRIGHT: (C)1980,JPO&Japio
JP14396678A 1978-11-21 1978-11-21 Preparation of luminous display device Pending JPS5570080A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14396678A JPS5570080A (en) 1978-11-21 1978-11-21 Preparation of luminous display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14396678A JPS5570080A (en) 1978-11-21 1978-11-21 Preparation of luminous display device

Publications (1)

Publication Number Publication Date
JPS5570080A true JPS5570080A (en) 1980-05-27

Family

ID=15351188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14396678A Pending JPS5570080A (en) 1978-11-21 1978-11-21 Preparation of luminous display device

Country Status (1)

Country Link
JP (1) JPS5570080A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0236830A2 (en) * 1986-03-07 1987-09-16 Circuitgraph, S.L. Base plate for electrical current circuits
JPS63101987U (en) * 1986-12-22 1988-07-02
WO2005050746A2 (en) * 2003-11-17 2005-06-02 Osram Opto Semiconductors Gmbh Economic miniaturized construction technique and connection technique for light emitting diodes and other opto-electronic modules
WO2004077578A3 (en) * 2003-02-28 2005-07-21 Osram Opto Semiconductors Gmbh Lighting module based on light-emitting diodes and method for the production thereof
US7304418B2 (en) 2003-10-24 2007-12-04 Seiko Epson Corporation Light source apparatus with light-emitting chip which generates light and heat
JP2008118127A (en) * 2006-11-07 2008-05-22 Korai Kagi Kofun Yugenkoshi Light-emitting diode and its manufacturing method
US7884380B2 (en) 2007-06-06 2011-02-08 Epistar Corporation Semiconductor light emitting device
US8283683B2 (en) 2006-11-07 2012-10-09 Opto Tech Corporation Chip-bonding light emitting diode chip
EP2259351A3 (en) * 2004-03-29 2017-01-04 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0236830A3 (en) * 1986-03-07 1988-09-14 Circuitgraph, S.L. Base plate for electrical current circuits
EP0236830A2 (en) * 1986-03-07 1987-09-16 Circuitgraph, S.L. Base plate for electrical current circuits
JPS63101987U (en) * 1986-12-22 1988-07-02
JPH046056Y2 (en) * 1986-12-22 1992-02-19
WO2004077578A3 (en) * 2003-02-28 2005-07-21 Osram Opto Semiconductors Gmbh Lighting module based on light-emitting diodes and method for the production thereof
US7560741B2 (en) 2003-02-28 2009-07-14 Osram Opto Semiconductors Gmbh Lighting module and method for the production thereof
US7304418B2 (en) 2003-10-24 2007-12-04 Seiko Epson Corporation Light source apparatus with light-emitting chip which generates light and heat
WO2005050746A2 (en) * 2003-11-17 2005-06-02 Osram Opto Semiconductors Gmbh Economic miniaturized construction technique and connection technique for light emitting diodes and other opto-electronic modules
JP2007511914A (en) * 2003-11-17 2007-05-10 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング Economy, miniaturized construction and connection technology for light emitting diodes and other photoelectric modules
WO2005050746A3 (en) * 2003-11-17 2005-07-28 Siemens Ag Economic miniaturized construction technique and connection technique for light emitting diodes and other opto-electronic modules
US7759754B2 (en) 2003-11-17 2010-07-20 Osram Opto Semiconductors Gmbh Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules
EP2259351A3 (en) * 2004-03-29 2017-01-04 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same
EP1730791B1 (en) * 2004-03-29 2019-08-28 Cree, Inc. Semiconductor light emitting device including flexible film having therein an optical element, and method of assembling the same
JP2008118127A (en) * 2006-11-07 2008-05-22 Korai Kagi Kofun Yugenkoshi Light-emitting diode and its manufacturing method
US8283683B2 (en) 2006-11-07 2012-10-09 Opto Tech Corporation Chip-bonding light emitting diode chip
US8592234B2 (en) 2006-11-07 2013-11-26 Opto Tech Corporation Method for manufacturing a LED
US7884380B2 (en) 2007-06-06 2011-02-08 Epistar Corporation Semiconductor light emitting device
US8148196B2 (en) 2007-06-06 2012-04-03 Epistar Corporation Semiconductor light emitting device
USRE47892E1 (en) 2007-06-06 2020-03-03 Epistar Corporation Semiconductor light emitting device

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