JPS5439812B2 - - Google Patents

Info

Publication number
JPS5439812B2
JPS5439812B2 JP7558873A JP7558873A JPS5439812B2 JP S5439812 B2 JPS5439812 B2 JP S5439812B2 JP 7558873 A JP7558873 A JP 7558873A JP 7558873 A JP7558873 A JP 7558873A JP S5439812 B2 JPS5439812 B2 JP S5439812B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7558873A
Other versions
JPS4953133A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4953133A publication Critical patent/JPS4953133A/ja
Publication of JPS5439812B2 publication Critical patent/JPS5439812B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
JP7558873A 1972-07-11 1973-07-03 Expired JPS5439812B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27086172A 1972-07-11 1972-07-11

Publications (2)

Publication Number Publication Date
JPS4953133A JPS4953133A (ja) 1974-05-23
JPS5439812B2 true JPS5439812B2 (ja) 1979-11-30

Family

ID=23033117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7558873A Expired JPS5439812B2 (ja) 1972-07-11 1973-07-03

Country Status (12)

Country Link
JP (1) JPS5439812B2 (ja)
AT (1) AT328248B (ja)
AU (1) AU473729B2 (ja)
CA (1) CA1000453A (ja)
CH (1) CH599350A5 (ja)
DE (1) DE2335497C3 (ja)
DK (1) DK143609C (ja)
ES (1) ES416804A1 (ja)
FR (1) FR2192189B1 (ja)
GB (1) GB1426462A (ja)
IT (1) IT989827B (ja)
NL (1) NL179491C (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1058457A (en) * 1973-10-18 1979-07-17 Francis J. Nuzzi Process for sensitizing surface of nonmetallic article for electroless deposition
US4632857A (en) * 1974-05-24 1986-12-30 Richardson Chemical Company Electrolessly plated product having a polymetallic catalytic film underlayer
US4265942A (en) 1974-10-04 1981-05-05 Nathan Feldstein Non-noble metal colloidal compositions comprising reaction products for electroless deposition
US4321285A (en) 1974-10-04 1982-03-23 Surface Technology, Inc. Electroless plating
US4136216A (en) * 1975-08-26 1979-01-23 Surface Technology, Inc. Non-precious metal colloidal dispersions for electroless metal deposition
US4297397A (en) * 1976-01-22 1981-10-27 Nathan Feldstein Catalytic promoters in electroless plating catalysts in true solutions
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
US4259376A (en) * 1977-09-16 1981-03-31 Nathan Feldstein Catalytic promoters in electroless plating catalysts applied as an emulsion
US4233344A (en) * 1978-07-20 1980-11-11 Learonal, Inc. Method of improving the adhesion of electroless metal deposits employing colloidal copper activator
US4339476A (en) 1978-08-17 1982-07-13 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
US4282271A (en) * 1978-08-17 1981-08-04 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
GB8613960D0 (en) * 1986-06-09 1986-07-16 Omi International Gb Ltd Treating laminates
US5200272A (en) * 1988-04-29 1993-04-06 Miles Inc. Process for metallizing substrate surfaces

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR824356A (fr) * 1936-10-21 1938-02-07 Saint Gobain Procédé de métallisation par voie humide
US2968578A (en) * 1958-04-18 1961-01-17 Corning Glass Works Chemical nickel plating on ceramic material
US3561995A (en) * 1967-04-03 1971-02-09 M & T Chemicals Inc Method of activating a polymer surface and resultant article

Also Published As

Publication number Publication date
DE2335497C3 (de) 1978-08-24
DE2335497A1 (de) 1974-02-07
AU5673073A (en) 1974-12-12
NL7309650A (ja) 1974-01-15
ES416804A1 (es) 1976-02-16
DK143609B (da) 1981-09-14
CA1000453A (en) 1976-11-30
JPS4953133A (ja) 1974-05-23
NL179491C (nl) 1986-09-16
GB1426462A (en) 1976-02-25
AU473729B2 (en) 1976-07-01
DE2335497B2 (de) 1977-05-05
NL179491B (nl) 1986-04-16
CH599350A5 (ja) 1978-05-31
ATA601873A (de) 1975-05-15
FR2192189A1 (ja) 1974-02-08
AT328248B (de) 1976-03-10
IT989827B (it) 1975-06-10
DK143609C (da) 1982-02-22
FR2192189B1 (ja) 1976-06-18

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