JPS54146990A - Production of elastic surface wave device - Google Patents
Production of elastic surface wave deviceInfo
- Publication number
- JPS54146990A JPS54146990A JP5451278A JP5451278A JPS54146990A JP S54146990 A JPS54146990 A JP S54146990A JP 5451278 A JP5451278 A JP 5451278A JP 5451278 A JP5451278 A JP 5451278A JP S54146990 A JPS54146990 A JP S54146990A
- Authority
- JP
- Japan
- Prior art keywords
- production
- substrate
- photo resistor
- photo
- piezo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
PURPOSE:To improve the quality of the production process dependent upon automatization by adding a process where a metallic film is formed on the surface, the reverse face and the side face of a piezo-electric substrate and eliminating completely the surface charge of the wafer and improving yield in photo resistor pattern formation. CONSTITUTION:Metallic thin film 4 of a prescribed thickness is formed on the surface, the reverse face and the side face of piezo-electric substrate 1, and next, a photo resistor is applied to the surface of substrate 1 where an electrode should be formed, and photo resistor film 5 having a desired shape is formed by the photo lithography technique. Further, a phosphoric acid-system etching liquid is used to remove a needless metal on the surface, thereby forming desired IDT electrode 6. By this production process, the charge on the surface of substrate 1 is eliminated completely, and the photo resistor pattern is formed easily, so that yield in production can be improved, and the quality of products in automatic production can be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53054512A JPS5910085B2 (en) | 1978-05-10 | 1978-05-10 | Manufacturing method of surface acoustic wave device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53054512A JPS5910085B2 (en) | 1978-05-10 | 1978-05-10 | Manufacturing method of surface acoustic wave device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54146990A true JPS54146990A (en) | 1979-11-16 |
JPS5910085B2 JPS5910085B2 (en) | 1984-03-07 |
Family
ID=12972686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53054512A Expired JPS5910085B2 (en) | 1978-05-10 | 1978-05-10 | Manufacturing method of surface acoustic wave device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5910085B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61206316U (en) * | 1985-06-14 | 1986-12-26 | ||
JPH02260907A (en) * | 1989-03-31 | 1990-10-23 | Hoya Corp | Manufacture of surface acoustic wave device |
JPH0653768A (en) * | 1980-11-17 | 1994-02-25 | British Technol Group Ltd | Manufacture of sound-wave device |
WO2002031974A1 (en) * | 2000-10-12 | 2002-04-18 | Fujitsu Limited | Surface acoustic wave device and method of producing the same |
US7389570B2 (en) * | 2004-06-28 | 2008-06-24 | Kyocera Corporation | Surface acoustic wave device manufacturing method, surface acoustic wave device, and communications equipment |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5057559A (en) * | 1973-09-20 | 1975-05-20 |
-
1978
- 1978-05-10 JP JP53054512A patent/JPS5910085B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5057559A (en) * | 1973-09-20 | 1975-05-20 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0653768A (en) * | 1980-11-17 | 1994-02-25 | British Technol Group Ltd | Manufacture of sound-wave device |
JPH0856133A (en) * | 1980-11-17 | 1996-02-27 | British Technol Group Ltd | Manufacture of surface elastic wave device |
JPS61206316U (en) * | 1985-06-14 | 1986-12-26 | ||
JPH02260907A (en) * | 1989-03-31 | 1990-10-23 | Hoya Corp | Manufacture of surface acoustic wave device |
WO2002031974A1 (en) * | 2000-10-12 | 2002-04-18 | Fujitsu Limited | Surface acoustic wave device and method of producing the same |
US7389570B2 (en) * | 2004-06-28 | 2008-06-24 | Kyocera Corporation | Surface acoustic wave device manufacturing method, surface acoustic wave device, and communications equipment |
Also Published As
Publication number | Publication date |
---|---|
JPS5910085B2 (en) | 1984-03-07 |
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