JPS54138083A - Metal clad laminate for printed circuit board, and its manufacturing - Google Patents

Metal clad laminate for printed circuit board, and its manufacturing

Info

Publication number
JPS54138083A
JPS54138083A JP4701678A JP4701678A JPS54138083A JP S54138083 A JPS54138083 A JP S54138083A JP 4701678 A JP4701678 A JP 4701678A JP 4701678 A JP4701678 A JP 4701678A JP S54138083 A JPS54138083 A JP S54138083A
Authority
JP
Japan
Prior art keywords
resin composition
resin
circuit board
printed circuit
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4701678A
Other languages
Japanese (ja)
Other versions
JPS5824268B2 (en
Inventor
Masao Hasegawa
Junichi Okamoto
Kunio Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP53047016A priority Critical patent/JPS5824268B2/en
Publication of JPS54138083A publication Critical patent/JPS54138083A/en
Publication of JPS5824268B2 publication Critical patent/JPS5824268B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)

Abstract

PURPOSE: To manufacture a metal clad laminate having excellent electrcal property, peeling strength of the metal foil, and heat resistance, and useful as a flexible printed circuit board, by coating a metal foil with a resin composition containing an unsaturated polyester resin and an isocyanate compound, laminating the foil to a substrate, and curing the resin composition.
CONSTITUTION: A metal foil is coated with a resin composition comprising (A) a resin mixture composed of 100 parts by weight of an unsaturated polyester resin and ≥ 3 parts of a vinylphenol resin, an OH-terminated diene polymer, or an OH- terminated polyolefin, and (B) an isocyanae compound such as toluene diisocyanate, polymethylene polyphenyl isocyanate, etc. The coated foil is laminated to a substrate, and the resin composition is cured to obtain the objective laminate.
COPYRIGHT: (C)1979,JPO&Japio
JP53047016A 1978-04-19 1978-04-19 Metal foil cladding for printed wiring and its manufacturing method Expired JPS5824268B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53047016A JPS5824268B2 (en) 1978-04-19 1978-04-19 Metal foil cladding for printed wiring and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53047016A JPS5824268B2 (en) 1978-04-19 1978-04-19 Metal foil cladding for printed wiring and its manufacturing method

Publications (2)

Publication Number Publication Date
JPS54138083A true JPS54138083A (en) 1979-10-26
JPS5824268B2 JPS5824268B2 (en) 1983-05-20

Family

ID=12763368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53047016A Expired JPS5824268B2 (en) 1978-04-19 1978-04-19 Metal foil cladding for printed wiring and its manufacturing method

Country Status (1)

Country Link
JP (1) JPS5824268B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56144151A (en) * 1980-04-11 1981-11-10 Kanegafuchi Chemical Ind Continuous manufacture of laminated board
EP0202488A2 (en) * 1985-04-23 1986-11-26 Hitachi, Ltd. Thermosetting resin composition and laminate and process for the production thereof
JPH03158231A (en) * 1989-11-15 1991-07-08 Matsushita Electric Works Ltd Manufacture of laminate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3393117A (en) * 1964-02-13 1968-07-16 Cincinnati Milling Machine Co Copper-clad glass reinforced thermoset resin panel
JPS4922439A (en) * 1972-06-23 1974-02-27
JPS4966792A (en) * 1972-10-30 1974-06-28

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3393117A (en) * 1964-02-13 1968-07-16 Cincinnati Milling Machine Co Copper-clad glass reinforced thermoset resin panel
JPS4922439A (en) * 1972-06-23 1974-02-27
JPS4966792A (en) * 1972-10-30 1974-06-28

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56144151A (en) * 1980-04-11 1981-11-10 Kanegafuchi Chemical Ind Continuous manufacture of laminated board
JPS6058031B2 (en) * 1980-04-11 1985-12-18 鐘淵化学工業株式会社 Continuous manufacturing method for laminates
EP0202488A2 (en) * 1985-04-23 1986-11-26 Hitachi, Ltd. Thermosetting resin composition and laminate and process for the production thereof
JPH03158231A (en) * 1989-11-15 1991-07-08 Matsushita Electric Works Ltd Manufacture of laminate

Also Published As

Publication number Publication date
JPS5824268B2 (en) 1983-05-20

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