JPS5383581A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5383581A
JPS5383581A JP15814076A JP15814076A JPS5383581A JP S5383581 A JPS5383581 A JP S5383581A JP 15814076 A JP15814076 A JP 15814076A JP 15814076 A JP15814076 A JP 15814076A JP S5383581 A JPS5383581 A JP S5383581A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
solder plate
positioning
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15814076A
Other languages
Japanese (ja)
Inventor
Takaharu Matsui
Seiji Imanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15814076A priority Critical patent/JPS5383581A/en
Publication of JPS5383581A publication Critical patent/JPS5383581A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To eliminate use of the tool such as the positioning plate and to facilitate an easy assembly, by placing a solder plate containing a surface protrusion onto the substrate and positioning the semiconductor pellet on the solder plate and then welding the solder plate and the pellet through hear and pressure application.
COPYRIGHT: (C)1978,JPO&Japio
JP15814076A 1976-12-29 1976-12-29 Manufacture of semiconductor device Pending JPS5383581A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15814076A JPS5383581A (en) 1976-12-29 1976-12-29 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15814076A JPS5383581A (en) 1976-12-29 1976-12-29 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5383581A true JPS5383581A (en) 1978-07-24

Family

ID=15665132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15814076A Pending JPS5383581A (en) 1976-12-29 1976-12-29 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5383581A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534944A (en) * 1978-09-05 1980-03-11 Teijin Ltd Laminated body and method of producing same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4975274A (en) * 1972-11-24 1974-07-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4975274A (en) * 1972-11-24 1974-07-19

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534944A (en) * 1978-09-05 1980-03-11 Teijin Ltd Laminated body and method of producing same
JPS629416B2 (en) * 1978-09-05 1987-02-28 Teijin Ltd

Similar Documents

Publication Publication Date Title
JPS5380966A (en) Manufacture of electrode fdr semiconductor device
JPS5230162A (en) Semiconductor device
JPS5383581A (en) Manufacture of semiconductor device
JPS5230167A (en) Method for production of semiconductor device
JPS5380985A (en) Semiconductor device
JPS53141573A (en) Pellet dividing method of semiconductor wafer
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5339067A (en) Production of semiconductor device
JPS5228262A (en) Process for assembling semiconductor device
JPS534469A (en) Semiconductor device
JPS5218173A (en) Soldering method of semiconductor element
JPS53128283A (en) Semiconductor device
JPS5380184A (en) Manufacture of semiconductor device
JPS52143186A (en) Taping device
JPS5258370A (en) Semiconductor device
JPS5345969A (en) Schottky barrier semiconductor device
JPS5397367A (en) Semiconductor device and its manufacture
JPS52119067A (en) Semiconductor device
JPS5336467A (en) Semiconductor pellet fixture to metal substrate
JPS52128087A (en) Semiconductor display unit
JPS5311577A (en) Soldering method for wafers of semiconductor devices
JPS5338978A (en) Manufacture of semiconductor device
JPS5383578A (en) Manufacture of full pressure welding type semiconductor device
JPS542663A (en) Positioning method for mounting semiconductor chip
JPS51118965A (en) Insulation film of semiconductor device