JPS5337522A - Method of making high conductivity copper castings - Google Patents
Method of making high conductivity copper castingsInfo
- Publication number
- JPS5337522A JPS5337522A JP11176276A JP11176276A JPS5337522A JP S5337522 A JPS5337522 A JP S5337522A JP 11176276 A JP11176276 A JP 11176276A JP 11176276 A JP11176276 A JP 11176276A JP S5337522 A JPS5337522 A JP S5337522A
- Authority
- JP
- Japan
- Prior art keywords
- high conductivity
- making high
- conductivity copper
- copper castings
- castings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacture And Refinement Of Metals (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11176276A JPS6053089B2 (en) | 1976-09-20 | 1976-09-20 | Manufacturing method for highly conductive copper castings |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11176276A JPS6053089B2 (en) | 1976-09-20 | 1976-09-20 | Manufacturing method for highly conductive copper castings |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5337522A true JPS5337522A (en) | 1978-04-06 |
JPS6053089B2 JPS6053089B2 (en) | 1985-11-22 |
Family
ID=14569533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11176276A Expired JPS6053089B2 (en) | 1976-09-20 | 1976-09-20 | Manufacturing method for highly conductive copper castings |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6053089B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6120012U (en) * | 1984-07-10 | 1986-02-05 | ティーディーケイ株式会社 | core |
JPS62211331A (en) * | 1986-03-12 | 1987-09-17 | Mitsubishi Metal Corp | Production of extra soft copper material |
JP2009099443A (en) * | 2007-10-18 | 2009-05-07 | Fukuda Metal Foil & Powder Co Ltd | Cooper alloy powder for conductive material paste |
-
1976
- 1976-09-20 JP JP11176276A patent/JPS6053089B2/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6120012U (en) * | 1984-07-10 | 1986-02-05 | ティーディーケイ株式会社 | core |
JPH0534089Y2 (en) * | 1984-07-10 | 1993-08-30 | ||
JPS62211331A (en) * | 1986-03-12 | 1987-09-17 | Mitsubishi Metal Corp | Production of extra soft copper material |
JPH0776390B2 (en) * | 1986-03-12 | 1995-08-16 | 三菱マテリアル株式会社 | Manufacturing method of ultra-soft copper material for bonding wire of semiconductor device |
JP2009099443A (en) * | 2007-10-18 | 2009-05-07 | Fukuda Metal Foil & Powder Co Ltd | Cooper alloy powder for conductive material paste |
Also Published As
Publication number | Publication date |
---|---|
JPS6053089B2 (en) | 1985-11-22 |
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