JPS5325350A - Dicing method of semiconductor substrates - Google Patents

Dicing method of semiconductor substrates

Info

Publication number
JPS5325350A
JPS5325350A JP9969376A JP9969376A JPS5325350A JP S5325350 A JPS5325350 A JP S5325350A JP 9969376 A JP9969376 A JP 9969376A JP 9969376 A JP9969376 A JP 9969376A JP S5325350 A JPS5325350 A JP S5325350A
Authority
JP
Japan
Prior art keywords
semiconductor substrates
dicing method
substrate
dicing
simply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9969376A
Other languages
Japanese (ja)
Inventor
Shinichi Yamashita
Takefumi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9969376A priority Critical patent/JPS5325350A/en
Publication of JPS5325350A publication Critical patent/JPS5325350A/en
Pending legal-status Critical Current

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Landscapes

  • Dicing (AREA)

Abstract

PURPOSE:At the same instant of deeply etching the exposed surface of a semiconductor substrate, cracking grooves are formed in said substrate surface, whereby the dicing of said substrate is performed easily and simply.
JP9969376A 1976-08-23 1976-08-23 Dicing method of semiconductor substrates Pending JPS5325350A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9969376A JPS5325350A (en) 1976-08-23 1976-08-23 Dicing method of semiconductor substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9969376A JPS5325350A (en) 1976-08-23 1976-08-23 Dicing method of semiconductor substrates

Publications (1)

Publication Number Publication Date
JPS5325350A true JPS5325350A (en) 1978-03-09

Family

ID=14254112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9969376A Pending JPS5325350A (en) 1976-08-23 1976-08-23 Dicing method of semiconductor substrates

Country Status (1)

Country Link
JP (1) JPS5325350A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507090A (en) * 1981-01-27 1985-03-26 Yamaha Hatsudoki Kabushiki Kaisha Propelling unit support structure for outboard engines
US4822755A (en) * 1988-04-25 1989-04-18 Xerox Corporation Method of fabricating large area semiconductor arrays

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507090A (en) * 1981-01-27 1985-03-26 Yamaha Hatsudoki Kabushiki Kaisha Propelling unit support structure for outboard engines
US4822755A (en) * 1988-04-25 1989-04-18 Xerox Corporation Method of fabricating large area semiconductor arrays

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