JPS52144099A - Epoxy resin compositions - Google Patents

Epoxy resin compositions

Info

Publication number
JPS52144099A
JPS52144099A JP6013776A JP6013776A JPS52144099A JP S52144099 A JPS52144099 A JP S52144099A JP 6013776 A JP6013776 A JP 6013776A JP 6013776 A JP6013776 A JP 6013776A JP S52144099 A JPS52144099 A JP S52144099A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin compositions
hardeners
hardness
whose
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6013776A
Other languages
Japanese (ja)
Inventor
Masahiro Kitamura
Yasuo Miyadera
Toyoichi Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6013776A priority Critical patent/JPS52144099A/en
Publication of JPS52144099A publication Critical patent/JPS52144099A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain epoxy resin compositions with excellent moldability, capable of forming cured products with excellent characteristics (hardness), by using phenolic novolaks whose diphenol content is 1% or less as hardeners.
COPYRIGHT: (C)1977,JPO&Japio
JP6013776A 1976-05-26 1976-05-26 Epoxy resin compositions Pending JPS52144099A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6013776A JPS52144099A (en) 1976-05-26 1976-05-26 Epoxy resin compositions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6013776A JPS52144099A (en) 1976-05-26 1976-05-26 Epoxy resin compositions

Publications (1)

Publication Number Publication Date
JPS52144099A true JPS52144099A (en) 1977-12-01

Family

ID=13133440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6013776A Pending JPS52144099A (en) 1976-05-26 1976-05-26 Epoxy resin compositions

Country Status (1)

Country Link
JP (1) JPS52144099A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387329A (en) * 1977-01-10 1978-08-01 Sumitomo Chem Co Ltd Preparation of hydroperoxide
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS56112924A (en) * 1980-02-13 1981-09-05 Matsushita Electric Works Ltd Epoxy resin composition
JPS5757722A (en) * 1980-09-24 1982-04-07 Shin Kobe Electric Mach Co Ltd Production of laminated sheet
JPS57109642A (en) * 1980-12-27 1982-07-08 Toshiba Chem Prod Copper plated laminated board
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
JPS59113020A (en) * 1982-12-20 1984-06-29 Sumitomo Bakelite Co Ltd Thermosetting resin composition
JPS6013841A (en) * 1983-07-04 1985-01-24 Toray Silicone Co Ltd Epoxy resin composition for molding
JPH0641262A (en) * 1985-01-11 1994-02-15 Dow Chem Co:The Novolac resin and its preparation
JPH09165566A (en) * 1995-12-14 1997-06-24 Sumitomo Bakelite Co Ltd Die bonding material
JP2010195998A (en) * 2009-02-27 2010-09-09 Panasonic Electric Works Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387329A (en) * 1977-01-10 1978-08-01 Sumitomo Chem Co Ltd Preparation of hydroperoxide
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS56112924A (en) * 1980-02-13 1981-09-05 Matsushita Electric Works Ltd Epoxy resin composition
JPS6150970B2 (en) * 1980-02-13 1986-11-06 Matsushita Electric Works Ltd
JPS5757722A (en) * 1980-09-24 1982-04-07 Shin Kobe Electric Mach Co Ltd Production of laminated sheet
JPS6115889B2 (en) * 1980-09-24 1986-04-26 Shin Kobe Electric Machinery
JPS634701B2 (en) * 1980-12-10 1988-01-30 Hitachi Seisakusho Kk
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
JPS616786B2 (en) * 1980-12-27 1986-02-28 Toshiba Chem Prod
JPS57109642A (en) * 1980-12-27 1982-07-08 Toshiba Chem Prod Copper plated laminated board
JPS59113020A (en) * 1982-12-20 1984-06-29 Sumitomo Bakelite Co Ltd Thermosetting resin composition
JPS6013841A (en) * 1983-07-04 1985-01-24 Toray Silicone Co Ltd Epoxy resin composition for molding
JPH0236148B2 (en) * 1983-07-04 1990-08-15 Toray Silicone Co
JPH0641262A (en) * 1985-01-11 1994-02-15 Dow Chem Co:The Novolac resin and its preparation
JPH09165566A (en) * 1995-12-14 1997-06-24 Sumitomo Bakelite Co Ltd Die bonding material
JP2010195998A (en) * 2009-02-27 2010-09-09 Panasonic Electric Works Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device

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