JPS52117066A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS52117066A
JPS52117066A JP3395376A JP3395376A JPS52117066A JP S52117066 A JPS52117066 A JP S52117066A JP 3395376 A JP3395376 A JP 3395376A JP 3395376 A JP3395376 A JP 3395376A JP S52117066 A JPS52117066 A JP S52117066A
Authority
JP
Japan
Prior art keywords
semiconductor device
metal
leaching
conductor
treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3395376A
Other languages
Japanese (ja)
Inventor
Takeyumi Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3395376A priority Critical patent/JPS52117066A/en
Publication of JPS52117066A publication Critical patent/JPS52117066A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: In treating a ceramic package with a conductor of a metal, it is intended to avoid the leaching of such a metal by making thicker a Ni-plated layer formed on the treated surface.
COPYRIGHT: (C)1977,JPO&Japio
JP3395376A 1976-03-27 1976-03-27 Semiconductor device Pending JPS52117066A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3395376A JPS52117066A (en) 1976-03-27 1976-03-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3395376A JPS52117066A (en) 1976-03-27 1976-03-27 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS52117066A true JPS52117066A (en) 1977-10-01

Family

ID=12400846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3395376A Pending JPS52117066A (en) 1976-03-27 1976-03-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS52117066A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544749A (en) * 1978-09-25 1980-03-29 Nec Corp Substrate for mounting semiconductor device
JPS59173992U (en) * 1983-05-09 1984-11-20 日本碍子株式会社 ceramic heater
JPS6139560A (en) * 1984-07-30 1986-02-25 Hitachi Ltd Lead attaching method
US6225569B1 (en) 1996-11-15 2001-05-01 Ngk Spark Plug Co., Ltd. Wiring substrate and method of manufacturing the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544749A (en) * 1978-09-25 1980-03-29 Nec Corp Substrate for mounting semiconductor device
JPS6226185B2 (en) * 1978-09-25 1987-06-08 Nippon Electric Co
JPS59173992U (en) * 1983-05-09 1984-11-20 日本碍子株式会社 ceramic heater
JPS6345760Y2 (en) * 1983-05-09 1988-11-28
JPS6139560A (en) * 1984-07-30 1986-02-25 Hitachi Ltd Lead attaching method
JPH038114B2 (en) * 1984-07-30 1991-02-05 Hitachi Ltd
US6225569B1 (en) 1996-11-15 2001-05-01 Ngk Spark Plug Co., Ltd. Wiring substrate and method of manufacturing the same

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