JPS51112273A - Lead frame for resin mold type semiconductor device - Google Patents

Lead frame for resin mold type semiconductor device

Info

Publication number
JPS51112273A
JPS51112273A JP3671275A JP3671275A JPS51112273A JP S51112273 A JPS51112273 A JP S51112273A JP 3671275 A JP3671275 A JP 3671275A JP 3671275 A JP3671275 A JP 3671275A JP S51112273 A JPS51112273 A JP S51112273A
Authority
JP
Japan
Prior art keywords
semiconductor device
lead frame
type semiconductor
resin mold
mold type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3671275A
Other languages
Japanese (ja)
Other versions
JPS6034263B2 (en
Inventor
Kunihiro Tsubosaki
Tomio Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50036712A priority Critical patent/JPS6034263B2/en
Publication of JPS51112273A publication Critical patent/JPS51112273A/en
Publication of JPS6034263B2 publication Critical patent/JPS6034263B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To obtain a lead frame with which a semiconductor device with high moisture resistivity can be produced.
COPYRIGHT: (C)1976,JPO&Japio
JP50036712A 1975-03-28 1975-03-28 Manufacturing method of resin mold type semiconductor device Expired JPS6034263B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50036712A JPS6034263B2 (en) 1975-03-28 1975-03-28 Manufacturing method of resin mold type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50036712A JPS6034263B2 (en) 1975-03-28 1975-03-28 Manufacturing method of resin mold type semiconductor device

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP58037402A Division JPS58194361A (en) 1983-03-09 1983-03-09 Resin molded semiconductor device
JP59040330A Division JPS59167042A (en) 1984-03-05 1984-03-05 Manufacture of lead frame

Publications (2)

Publication Number Publication Date
JPS51112273A true JPS51112273A (en) 1976-10-04
JPS6034263B2 JPS6034263B2 (en) 1985-08-07

Family

ID=12477362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50036712A Expired JPS6034263B2 (en) 1975-03-28 1975-03-28 Manufacturing method of resin mold type semiconductor device

Country Status (1)

Country Link
JP (1) JPS6034263B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553642A (en) * 1978-06-23 1980-01-11 Hitachi Ltd Manufacturing semiconductor device
JPS58161351A (en) * 1982-03-18 1983-09-24 Fujitsu Ltd Glass sealed semiconductor device
JPS58194361A (en) * 1983-03-09 1983-11-12 Hitachi Ltd Resin molded semiconductor device
JPS59167042A (en) * 1984-03-05 1984-09-20 Hitachi Ltd Manufacture of lead frame

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144385A (en) * 1974-10-14 1976-04-15 Toshiba Machine Co Ltd GUNKANRIKOSAKUKIKAIYOWAAKUHANSOSOCHINIOKERU SHATORUDAISHA
JPS5151281A (en) * 1974-10-31 1976-05-06 Tokyo Shibaura Electric Co

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144385A (en) * 1974-10-14 1976-04-15 Toshiba Machine Co Ltd GUNKANRIKOSAKUKIKAIYOWAAKUHANSOSOCHINIOKERU SHATORUDAISHA
JPS5151281A (en) * 1974-10-31 1976-05-06 Tokyo Shibaura Electric Co

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553642A (en) * 1978-06-23 1980-01-11 Hitachi Ltd Manufacturing semiconductor device
JPS58161351A (en) * 1982-03-18 1983-09-24 Fujitsu Ltd Glass sealed semiconductor device
JPS58194361A (en) * 1983-03-09 1983-11-12 Hitachi Ltd Resin molded semiconductor device
JPS59167042A (en) * 1984-03-05 1984-09-20 Hitachi Ltd Manufacture of lead frame

Also Published As

Publication number Publication date
JPS6034263B2 (en) 1985-08-07

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